`United States Patent No. 9,537,071
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`United States Patent No.: 9,537,071
`Inventors: Hirofumi Ichikawa,
`Masaki Hayashi, Shimpei Sasaoka,
`Tomohide Miki
`Formerly Application No.: 14/928,550
`Issue Date: January 3, 2017
`PCT Filing Date: August 27, 2009
`Filing Date: October 30, 2015
`Former Group Art Unit: 2895
`Former Examiner: Caridad Everhart
`
`§
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`§
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`Attorney Docket No.:
`112868-0001-656
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`Customer No.: 28120
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`Petitioner: VIZIO, Inc.
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`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED
`For:
`BODY, AND METHODS FOR MANUFACTURING LIGHT EMITTING
`DEVICE, RESIN PACKAGE AND RESIN-MOLDED BODY
`
`MAIL STOP PATENT BOARD
`Patent Trial and Appeal Board
`United States Patent and Trademark Office
`Post Office Box 1450
`Alexandria, Virginia 22313-1450
`
`PETITION FOR INTER PARTES REVIEW OF
`UNITED STATES PATENT NO. 9,537,071
`
`NICHIA EXHIBIT 2005
`Vizio, Inc. v. Nichia Corporation
`Case IPR2018-00386
`
`
`
`Inter Partes Review
`United States Patent No. 9,537,071
`TABLE OF CONTENTS
`
`INTRODUCTION ............................................................................................ 1
`I.
`II. MANDATORY NOTICES (§ 42.8) ................................................................ 5
`III. STANDING (§ 42.104(A)) ............................................................................... 6
`IV. GROUNDS (§§ 42.22 AND 42.104(B)) ........................................................... 6
`V. THE ’071 PATENT .......................................................................................... 7
`Overview of ’071 ................................................................................... 7
`A.
`’071 Prosecution History ..................................................................... 11
`B.
`VI. DETAILED REASONS FOR RELIEF ....................................................... 12
`Claim Construction ............................................................................. 12
`A.
`B.
`Level of Ordinary Skill ....................................................................... 13
`C.
`Summary of Cited Prior Art ................................................................ 13
`U.S. Patent Publication No. 2008/0012036 (“Loh”) ................ 13
`1.
`2.
`U.S. Patent Publication No. 2005/0211991 (“Mori”) ............... 17
`3.
`U.S. Patent Publication No. 2008/0073662 (“Wang”) ............. 19
`U.S. Patent Publication No. 2005/0280017 (“Oshio”) ............. 20
`4.
`Claims 1, 4, 8-9, 11-12, 15-18, and 25 are unpatentable under §§ 102
`and 103 over Loh (Grounds 1 and 2) .................................................. 21
`1.
`Invalidity of Claim 1 Over Loh ................................................ 21
`Invalidity of Claim 4 Over Loh: “The light emitting device
`2.
`according to claim 1, wherein at least a portion of the light
`emitting element is exposed from the resin part” ..................... 34
`Invalidity of Claim 8 Over Loh: “The light emitting device
`according to claim 1, wherein the resin part contains a light
`reflecting material” ................................................................... 35
`Invalidity of Claim 9 Over Loh: “The light emitting device
`according to claim 8, wherein the light reflecting material is
`titanium dioxide” ....................................................................... 35
`Invalidity of Claim 11 Over Loh: “The light emitting device
`according to claim 1, wherein the resin part is made using a
`thermosetting resin” .................................................................. 36
`Invalidity of Claim 12 Over Loh: “The light emitting device
`according to claim 1, wherein the metal part has a step portion,
`a concave portion, and/or a convex portion” ............................ 36
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`D.
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`3.
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`4.
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`5.
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`6.
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`i
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`E.
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`F.
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`7.
`8.
`9.
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`10.
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`11.
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`Inter Partes Review
`United States Patent No. 9,537,071
`Invalidity of Claim 15 Over Loh .............................................. 37
`Invalidity of Claim 16 Over Loh .............................................. 39
`Invalidity of Claim 17 Over Loh: “The light emitting device
`according to claim 16, wherein the resin part is made using a
`thermosetting resin” .................................................................. 42
`Invalidity of Claim 18 Over Loh: “The light emitting device
`according to claim 16, wherein the metal part has a step portion,
`a concave portion, and/or a convex portion” ............................ 43
`Invalidity of Claim 25 Over Loh: “The light emitting device
`according to claim 16, wherein the resin part contains a light
`reflecting material” ................................................................... 43
`Claims 2 and 19 are obvious under § 103 over Loh and Mori (Ground
`3) .......................................................................................................... 43
`Invalidity of Claim 2 Over Loh and Mori: “The light emitting
`1.
`device according to claim 1, wherein the light emitting device
`further comprises a sealing member that contains two or more
`kinds of phosphors .................................................................... 43
`Invalidity of Claim 19 Over Loh and Mori: “The light emitting
`device according to claim 16, wherein the light emitting device
`further comprises a sealing member that contains two or more
`kinds of phosphors” .................................................................. 45
`Motivation to Combine Loh and Mori ...................................... 45
`3.
`Claims 5-7 and 21-23 are obvious under § 103 over Loh and Wang
`(Ground 4), and, alternatively, Loh, Wang, and Oshio (Ground 5) .... 47
`Invalidity of Claim 5 Over Loh and Wang, and, alternatively,
`1.
`Loh, Wang, and Oshio: “The light emitting device according to
`claim 1, wherein the metal part includes a base portion and a
`metal layer disposed on each of an upper surface and a lower
`surface of the base portion, the metal layers being made of a
`material that is different from that of the base portion” ........... 47
`Invalidity of Claim 6 Over Loh and Wang, and, alternatively,
`Loh, Wang, and Oshio: “The light emitting device according to
`claim 5, wherein the metal layer is disposed at all surfaces of
`the metal part except a portion of an outer lateral surface of the
`metal part” ................................................................................. 50
`Invalidity of Claim 7 Over Loh and Wang, and, alternatively,
`Loh, Wang and Oshio: “The light emitting device according to
`claim 5, wherein: the resin part is disposed over a first portion
`of the metal layer at the upper surface of the metal part, and a
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`2.
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`2.
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`3.
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`ii
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`4.
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`Inter Partes Review
`United States Patent No. 9,537,071
`second portion of the metal layer at the upper surface of the
`metal part is exposed from the resin part” ................................ 53
`Invalidity of Claim 21 Over Loh and Wang, and, alternatively,
`Loh, Wang, and Oshio: “The light emitting device according to
`claim 16, wherein the metal part includes a base portion and a
`metal layer disposed on each of an upper surface and a lower
`surface of the base portion, the metal lavers being made of a
`material that is different from that of the base portion” ........... 56
`Invalidity of Claim 22 Over Loh and Wang, and, alternatively,
`Loh, Wang, and Oshio: “The light emitting device according to
`claim 21, wherein the metal layer is disposed at all surfaces of
`the metal part except an outer lateral surface of the metal part”
` ................................................................................................... 56
`Invalidity of Claim 23 Over Loh and Wang, and, alternatively,
`Loh, Wang, and Oshio: “The light emitting device according to
`claim 21, wherein: the resin part is disposed over a first portion
`of the metal layer at the upper surface of the metal part, and a
`second portion of the metal layer on the upper surface of the
`metal part is exposed from the resin part” ................................ 57
`Motivation to Combine Loh and Wang .................................... 58
`7.
`Motivation to Combine Loh, Wang, and Oshio ....................... 62
`8.
`No Secondary Considerations of Nonobviousness ............................. 67
`G.
`VII. CONCLUSION .............................................................................................. 68
`CLAIM LISTING APPENDIX
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`5.
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`6.
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`iii
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`Inter Partes Review
`United States Patent No. 9,537,071
`LIST OF EXHIBITS
`
`Description
`Exhibit
`Ex. 1001 U.S. Patent No. 9,537,071
`Ex. 1002 U.S. Patent No. 9,537,071 File History
`Ex. 1003 Declaration of Dr. Stanley R. Shanfield
`Ex. 1004 U.S. Patent Publication No. 2008/0012036 (“Loh”)
`Ex. 1005 U.S. Patent Publication No. 2005/0211991 (“Mori”)
`Ex. 1006 U.S. Patent Publication No. 2008/0073662 (“Wang”)
`Ex. 1007 U.S. Patent Publication No. 2005/0280017 (“Oshio”)
`Ex. 1008 U.S. Patent Publication No. 2008/0261339 (“Koung”)
`Ex. 1009
`Japanese Patent Publication No. JP2006-093697 (“Park ’697”) with
`Certified English Translation
`Ex. 1010 U.S. Patent Publication No. 2007/0126020 (“Lin”)
`Ex. 1011
`PCT Patent Publication No. WO2007/055486 (“Park ’486”)
`Ex. 1012
`Nichia Corp. v. VIZIO, Inc., No. 2:16-cv-01453-JRG, D.I.152,
`Plaintiff Nichia Corporation’s P.R. 4-5(a) Opening Claim
`Construction Brief (E.D. Tex. Nov. 22, 2017)
`Nichia Corp. v. VIZIO, Inc., No. 2:16-cv-01453-JRG, D.I.186,
`Defendants’ Responsive Claim Construction Brief (E.D. Tex. Dec.
`13, 2017)
`Nichia Corp. v. VIZIO, Inc., No. 2:16-cv-01453-JRG, D.I.211, Joint
`Claim Construction Chart P.R. 4-5(D) (E.D. Tex. Jan. 8, 2018)
`Ex. 1015 Declaration of Mary Oros in Support of Petition for Inter Partes
`Review of U.S. Patent No. 9,537,071
`
`Ex. 1013
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`Ex. 1014
`
`iv
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`Inter Partes Review
`United States Patent No. 9,537,071
`
`Pursuant to §§ 311-319 and § 42,1 VIZIO, Inc. (“Petitioner”) petitions for
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`IPR of Claims 1, 2, 4-9, 11-12, 15-19, 21-23, and 25 (“Claims”) of U.S. Patent No.
`
`9,537,071 (“’071”), assigned to Nichia Corporation (“Patent Owner”/“PO”). There
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`is a reasonable likelihood at least one Claim is unpatentable and Petitioner requests
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`review of, and judgment against, the Claims as unpatentable under §§ 102 and/or
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`103.
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`I.
`
`INTRODUCTION
`’071 claims a light emitting diode (LED) package comprising a resin part
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`and metal part with notches on four sides is new. E.g., Ex. 1001, 3:51-55. It is
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`not. Before ’071, it was well-known to manufacture LED packages comprising a
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`resin part and metal part with notches on four sides, and the Claims were well-
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`known and obvious prior to the claimed priority date.
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`Indeed, LEDs, and methods of manufacturing LEDs, were well-known
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`before ’071. Ex. 1004 ¶ 2; Ex. 1005 ¶¶ 2, 45; Ex. 1006 ¶ 2; Ex. 1007 ¶¶ 2, 83; Ex.
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`1003 ¶¶ 21-22. It was further well-known to, e.g.,
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` form a resin package comprising a resin part and metal part including
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`first and second metal plates (e.g., Ex. 1004, Abstract, ¶¶ 60, 73, 76,
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`1 Section cites are to 35 U.S.C. or 37 C.F.R. as context indicates, and all
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`emphasis/annotations added and internal quotations/citations omitted unless noted.
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`1
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`Inter Partes Review
`United States Patent No. 9,537,071
`96, Figs. 5-8; Ex. 1005 ¶¶ 5-7, Figs. 1-3, 8-9; Ex. 1007 ¶ 49, Figs. 1-
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`10);
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` form a resin package having four outer lateral surfaces and a concave
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`portion having a bottom surface (e.g., Ex. 1004 ¶¶ 79, 96, Figs. 5, 7;
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`Ex. 1007 ¶ 61, Figs. 1-4, 5A, 6-10, 16-17; Ex. 1008 ¶ 21, Figs. 2A-C);
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` mount a light emitting element on a bottom surface of the concave
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`portion and electrically connect the light emitting element (e.g., Ex.
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`1004 ¶ 81, Figs. 5, 7; Ex. 1005 ¶¶ 5, 7-8, 13, Figs. 8-9; Ex. 1007 ¶ 61-
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`63, Figs. 1-2);
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` form a resin package where a portion of an outer lateral surface of the
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`resin part and portion of an outer lateral surface of the metal part are
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`coplanar at four outer lateral surfaces (e.g., Ex. 1004 ¶¶ 60, 73, 76, 96,
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`Fig. 7; Ex. 1008 ¶¶ 20-21, 24, Fig. 2C; Ex. 1010 ¶¶ 9, 25, Figs. 2a-2f,
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`3a-3b, 4a-4g);
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` form a notch in the metal part at four outer lateral surfaces (e.g., Ex.
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`1004 ¶¶ 60, 73, 76, 96, Figs. 6-7; Ex. 1008 ¶¶ 20-21, 24, Figs. 2B-C,
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`3A-B, 4B-F; Ex. 1010 ¶¶ 9, 25, Figs. 2a-2f, 3a-3b, 4a-4g);
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` form a resin package where the resin part is at left and right sides of a
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`portion of the metal part at two outer lateral surfaces (e.g., Ex. 1004
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`2
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`Inter Partes Review
`United States Patent No. 9,537,071
`¶¶ 60, 73, 76, 96, Fig. 7; Ex. 1008 ¶¶ 20-21, 24, Figs. 2B-C; Ex. 1010
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`¶¶ 9, 25, Figs. 2a-2f, 3a-3b, 4a-4g);
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` use substantially flat metal plates having coplanar upper edges (e.g.,
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`Ex. 1004 ¶ 73, Figs. 5-7; Ex. 1006 ¶ 9, Figs. 3-5; Ex. 1008 ¶ 20, Figs.
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`2A-2B, 4B);
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` use a metal part having a step, concave, and/or convex portion (e.g.,
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`Ex. 1004 ¶¶ 73, 76, Fig. 5; Ex. 1007 ¶¶ 52, 61, Figs 1-3; Ex. 1006 ¶ 9,
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`Figs. 3-5; Ex. 1008 ¶¶ 30, 32, Figs. 2A, 2D);
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` plate the metal part on upper and lower surfaces (e.g., Ex. 1006 ¶¶ 9,
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`13, 39, 41, 53-54; Figs. 2-5; Ex. 1007 ¶ 69, Figs. 1-4);
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` cut the metal part after plating, so a metal layer (of plating) is
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`disposed at all surfaces of the metal part except an outer lateral
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`surface (and a portion thereof) of the metal part (e.g., Ex. 1006 ¶¶ 9,
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`13, 39, 41, 53-54, Figs. 2-5; Ex. 1007 ¶¶ 69, 114, Figs. 4, 18B);
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` use a thermosetting resin (e.g., Ex. 1004 ¶¶ 88, 96-100; Ex. 1009 ¶¶
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`13, 1, 12, Abstract, Figs. 1-7);
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` use titanium dioxide (a light reflecting material) in the resin part, (e.g.,
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`Ex. 1004 ¶¶ 103, 80; Ex. 1009 ¶¶ 13, 1, 12, Abstract, Figs. 1-7);
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` use a sealing member containing two or more phosphors (e.g., Ex.
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`1005 ¶ 5; Ex. 1010 ¶ 29);
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`United States Patent No. 9,537,071
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` expose a lower surface of the metal part from the resin part directly
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`under the light emitting element (e.g., Ex. 1004 ¶ 77, Figs. 5, 8; Ex.
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`1007 ¶ 50, Figs. 1, 3; Ex. 1008 ¶ 21, Fig. 2A);
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` expose a portion of the light emitting element from the resin part (e.g.,
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`Ex. 1004 ¶¶ 81, 96, Fig. 5; Ex. 1005 ¶¶ 5-7, Fig. 9; Ex. 1007 ¶ 61, Fig.
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`1);
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` dispose the resin part over a first portion of a metal layer (of plating)
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`at an upper surface of the metal part, and expose a second portion of
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`the metal layer at (and on) the upper surface of the metal part from the
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`resin part (e.g., Ex. 1006 ¶¶ 9, 41, 44, Figs. 2-5; Ex. 1007 ¶¶ 69, 71,
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`Figs. 1, 4; Ex. 1008 ¶¶ 26, 20-21, Figs. 2A, 2D; Ex. 1009 ¶¶ 1, 12,
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`Figs. 1a-c); and
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` form a resin package where a portion of an outer surface of the resin
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`part and portion of an outer surface of the metal part are coplanar at an
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`outer bottom surface (e.g., Ex. 1004 ¶ 77, Figs. 5, 8; Ex. 1008 ¶ 21,
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`Fig. 2A; Ex. 1007 ¶ 50, Figs. 1, 3); see also Ex. 1003 ¶¶ 21-37.
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`Each element of the Claims was disclosed in the prior art, and the Claims are,
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`at most, nothing more than a routine, predictable combination of these well-known
`
`elements. Petitioner requests the Board institute trial and find the Claims
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`unpatentable under §§ 102 and/or 103.
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`4
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`Inter Partes Review
`United States Patent No. 9,537,071
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`II. MANDATORY NOTICES (§ 42.8)
`Petitioner and Real Parties in Interest: VIZIO, Inc. is the sole petitioner.
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`Under § 42.8(b)(1), the real party-in-interest is VIZIO, Inc. No unnamed entity is
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`funding, controlling, or directing the Petition.
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`Related Matters Under Rule § 42.8(b)(2): PO asserted ’071 claims 1, 2, 4-
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`9, 11-12, 15-19, 21-23, and 25 of ’071 against Petitioner in Nichia Corp. v. VIZIO,
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`Inc., No. 2:16-cv-1453-JRG (E.D. Tex.) (lead), consolidated with Nos. 2:16-cv-
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`1452-JRG, 2:16-cv-1454-JRG, 2:16-cv-1455-JRG, 2:16-cv-616-JRG, 2:16-cv-875-
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`JRG, 2:16-cv-00246-JRG, 2:16-cv-00613-JRG, 2:16-cv-00615-JRG, 2:16-cv-
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`00616-JRG, and 2:16-cv-00875-JRG (“copending litigation”). PO also asserted
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`related U.S. Patent 8,530,250 (“’250”) against a different party in Nichia Corp. v.
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`Everlight Elecs. Co., No. 2:13-cv-702-JRG (E.D. Tex.); Appeal Nos. 16-1585, 16-
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`1618 (Fed. Cir.) (“Everlight litigation”). Related ’250 is also involved in VIZIO,
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`Inc. v. Nichia Corp., IPR2017-01608 (instituted), IPR2017-01623 (instituted).
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`Related ’250 is also involved in Lowe’s Companies, Inc. v. Nichia Corp., IPR2017-
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`02011, IPR2017-02014. Related U.S. Patent 9,490,411 is also involved in VIZIO,
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`Inc. v. Nichia Corp., IPR2018-00386.
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`Lead and Back-Up Counsel and Service Information Under §§
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`42.8(b)(3)-(4): Lead: Gabrielle E. Higgins (Reg. No. 38,916, ROPES & GRAY
`
`LLP, 1900 University Avenue, 6th Floor, East Palo Alto, CA 94303, P:650-617-
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`5
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`Inter Partes Review
`United States Patent No. 9,537,071
`4015/F:650-566-4131, gabrielle.higgins@ropesgray.com); Backup: Kathryn N.S.
`
`Hong (Reg. No. 63,693, ROPES & GRAY LLP, P:650-617-4006/F:650-566-
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`4124). Mailing address for all PTAB correspondence: ROPES & GRAY LLP,
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`IPRM–Floor 43, Prudential Tower, 800 Boylston Street, Boston, MA 02199-3600.
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`III. STANDING (§ 42.104(A))
`Petitioner certifies ’071 is eligible for, and Petitioner is not barred or
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`estopped from requesting, IPR. Petitioner was served with a Complaint asserting
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`infringement of ’071 on or after February 21, 2017. Neither Petitioner nor any
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`other real party-in-interest or privy was served with a complaint asserting
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`infringement of ’071 before that date, or has initiated a civil action challenging the
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`’071’s validity.
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`IV. GROUNDS (§§ 42.22 AND 42.104(B))
`Petitioner requests IPR of claims 1, 2, 4-9, 11-12, 15-19, 21-23, and 25 as
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`unpatentable under §§ 102 and/ 103 (see also Ex. 1003 ¶¶ 62, 176-177, 62-180):
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`Ground
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`Prior Art
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`Basis Claims Challenged
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`Ground 1 Loh
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`Ground 2 Loh
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`Ground 3 Loh and Mori
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`Ground 4 Loh and Wang
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`Ground 5 Loh, Wang, and Oshio
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`1, 4, 8-9, 11-12, 15-18, 25
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`1, 4, 8-9, 11-12, 15-18, 25
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`2, 19
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`5-7, 21-23
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`5-7, 21-23
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`102
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`103
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`103
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`103
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`103
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`6
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`Inter Partes Review
`United States Patent No. 9,537,071
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`
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`Loh, Mori, and Wang were not considered by the Examiner during ’071’s
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`prosecution; Oshio was cited but not discussed. Ex. 1002. The prior art grounds
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`presented herein are new and not cumulative of the art previously considered
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`during prosecution. E.g., Ex. 1004 ¶¶ 74-82, Figs. 5-7.
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`§ VI specifies how the prior art renders the Claims unpatentable. The
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`Declaration of technical expert, Dr. Stanley R. Shanfield, is attached in support
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`(Ex. 1003 ¶¶ 1-182).
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`V. THE ’071 PATENT
`The Claim Listing Appendix provides a listing of Challenged Claims 1, 2, 4-
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`9, 11-12, 15-19, 21-23, and 25.
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`A. Overview of ’071
`’071 describes the known technique of molding a resin onto a leadframe
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`with notches to produce an LED package. Ex. 1001, 3:26-30, 3:38-4:10; see
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`generally Ex. 1003 ¶¶ 38-46. ’071 discloses a “resin package” for an LED
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`comprising a “resin part” (green in Figure 12, item 425) and a pair of “leads”
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`formed from “a metal plate” (i.e., “metal part,” blue in Figure 12, item 422). Ex.
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`1001, 8:15-16, 9:25-26, 9:51-53, 16:53-17:9, Figs. 12, 1, 3; see also id., 13:43-60,
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`Figs. 6-7. The “resin part” can be “thermosetting resin” containing a “light
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`reflecting member” such as “titanium dioxide.” Id., 8:59-67, 14:27-30. “The lead
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`frame is formed by…punching or etching a metal plate of a flat plate shape.” Id.,
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`7
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`United States Patent No. 9,537,071
`9:25-26. Figure 12 shows metal plates that are substantially flat where all upper
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`edges are coplanar. Id., 9:25-26, Figs. 12, 2. The metal part may have
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`“differences in level or concavity and convexity.” Id., 9:22-24. A “light emitting
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`element” (orange in Figure 12) is mounted on the metal part and “electrically
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`connected” with the leads through wires. Id., 6:57-64, Fig. 12; see also id., 13:52-
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`54, Fig. 6.
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`Id., Fig. 12.
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`
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`’071 discloses the “lead frame” has “notch parts” (red in Figures 3, 12) that
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`“penetrate the lead frame.” Id., 5:55-64, 4:13-15, 17:6-9, 9:51-58, Figs. 1, 12; see
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`also id., 14:3-5, Figs. 6-7. During molding, resin fills the notches. Id., 5:17-21,
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`8:14-15, 14:27-30. After molding, the resin and leadframe are cut along the
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`notches to form a resin part and metal part that are coplanar at four outer lateral
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`surfaces. Id., 5:9-17, 6:34-39, 13:24-41, 14:27-30, 14:37-38, Figs. 3, 12, 6-7.
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`8
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`
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`Id., Figs. 3, 12.
`Figure 12 shows the resin part is located at left and right sides of a portion of
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`the metal part at two outer lateral surfaces. The resin package has a concave
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`portion with a bottom surface. Id., 6:55-58, 7:10-12, Fig. 12; see also id., 13:10-
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`13, 13:52-54; Fig. 6.
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`Id., Fig. 12.
`As shown in Figure 2, a portion of an outer surface of the resin part and a
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`portion of an outer surface of the metal part are coplanar at an outer bottom
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`surface. Id., Fig. 2. A lower surface of the metal part is exposed from the resin
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`part in a region directly under the light emitting element. Id. A sealing member is
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`filled in the concave portion, containing “two or more kinds” of phosphors to
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`“realize” different colors of light. Id., 10:9-11:34, 13:20-23, Figs. 1-2.
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`
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`Id., Fig. 2.
`Metal plating “can be applied to the lead frame.” Id., 9:65-10:9. When
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`cutting occurs after plating and molding, “plating processing is not applied to a cut
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`surface” of the leadframe. Id., 3:63-67.
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`As discussed herein, the alleged invention is no more than a collection of
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`well-known LED packaging features already disclosed in the art before the claimed
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`priority date.
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`Inter Partes Review
`United States Patent No. 9,537,071
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`B.
`’071 Prosecution History
`The application leading to ’071 was filed October 30, 2015 as U.S. Pat. App.
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`No. 14/928,550 (“’550 application”), claiming priority to JP2008-225408, filed
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`September 3, 2008. Ex. 1003 ¶¶ 47-52.
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`The ’550 application underwent brief prosecution, with only one Office
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`Action. Ex. 1002, 137-46. The Office Action rejected prosecution claims 1-10,
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`12-13, 15-26 and 28-29 as anticipated and/or obvious over the prior art, including
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`U.S. Patent Pub. 2008/0224161, U.S. Patent Pub. 2007/0138697, U.S. Patent Pub.
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`2008/0044934, U.S. Patent Pub. 2001/0009301, and U.S. Patent 6,252,254. Ex.
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`1002, 137-48. The Examiner found it was known and obvious to use plated
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`leadframes to protect the metal plate “from oxidation” and that cutting the leads
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`after plating “results in the lateral surfaces of the lead frame exposed.” Id., 142-
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`143. The Examiner found using two phosphors was known and obvious “to obtain
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`the benefit of the desired emission.” Id., 145-46. In response, Applicants amended
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`prosecution claims 1, 17-18 (issued as Claims 1, 15-16) to include the limitation
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`“wherein a notch is formed in the metal part at each of the four outer lateral
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`surfaces of the resin package.” Id., 162, 162-70. The claims were allowed. Id.,
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`176-184.
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`United States Patent No. 9,537,071
`VI. DETAILED REASONS FOR RELIEF
`There is at least a reasonable likelihood Petitioner will prevail with respect
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`to at least one of the Claims (§ 314(a)), as they are unpatentable under §§ 102
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`and/or 103.
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`A. Claim Construction
`For purposes of this review, Petitioner construes the claims under the
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`broadest reasonable interpretation (“BRI”) in light of the specification. 2 §
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`42.100(b). Under this standard, while an inventor may rebut that presumption by
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`defining the term in the specification with reasonable clarity, deliberateness, and
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`precision, claim terms are given their ordinary and customary meaning as
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`understood by one of ordinary skill at the time of the invention. Vibrant Media,
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`Inc. v. Gen. Elec. Co., IPR2013-00170, Pap. 14 at 5.
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`With respect to the term “a notch is formed in the metal part” (claims 1, 15,
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`16), this term should be given its plain and ordinary meaning consistent with the
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`specification. While the parties have proposed constructions for this term in
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`copending litigation, no construction is necessary here, as the cited prior art
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`discloses this limitation under either parties’ proposed construction. Vivid Techs.
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`2 Because the standard for claim construction for unexpired patents at the PTO is
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`different than used in litigation, Petitioner reserves the right to argue in litigation
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`different claim constructions and to assert invalidity under §§ 101 and/or 112.
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`United States Patent No. 9,537,071
`Inc. v. Am. Sci. & Eng’g Inc., 200 F.3d 795, 803 (Fed. Cir. 1999); Ex. 1014 (Ex. A,
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`3); Ex. 1013, 16-18; Ex. 1012, 16-20; Ex. 1003 ¶¶ 55, 53-54. Alternatively, if
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`construed, this term means “there is an opening that penetrates the metal part.” Ex.
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`1001, 4:13-15 (“notch parts … penetrate the lead frame”), Figs. 3, 5, 7, 8, 10.
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`B.
`Level of Ordinary Skill
`A person of ordinary skill in the art (“POSITA”) on or before September 3,
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`2008, would have a minimum of a Bachelor’s degree in Physics, Electrical
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`Engineering, Material Science, or a related field, and approximately 5 years of
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`professional experience in the field of semiconductor technology, including
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`manufacturing and packaging processes for light emitting devices. Ex. 1003 ¶¶ 16-
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`18, 4-15. Additional graduate education could substitute for professional
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`experience, or significant experience in the field could substitute for formal
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`education. A POSITA is presumed to have knowledge of all relevant prior art, and
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`would thus have been familiar with each of the references cited herein, as well as
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`the background knowledge in the art discussed in § I supra, and the full range of
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`teachings they contain. Id.
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`C.
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`Summary of Cited Prior Art
`1.
`U.S. Patent Publication No. 2008/0012036 (“Loh”)
`Loh (Ex. 1004), published January 17, 2008, is prior art under at least §§
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`102(b), (a), (e). Loh discloses a light emitting device comprising a resin package
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`United States Patent No. 9,537,071
`(e.g., Figure 7, item 260) with a resin part (green in Figure 7, item 230), a metal
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`part (blue in Figure 7, items 200, 204, 206), and a light emitting element (orange in
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`Figure 7, item 214). E.g., Ex. 1004 ¶¶ 74-76, 81, 90-91, 94, 96, 103, Figs. 5-7; see
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`generally Ex. 1003 ¶¶ 63-68. Loh discloses “lighting package 260” (see Figures 5-
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`7) comprises “package body 230” made of a “thermoset” such as “epoxy or
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`phenolic resin.” Ex. 1004 ¶¶ 74, 76, 90-91, 94, 96, 103, 74-82, Figs. 5, 7. Package
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`260 includes “leadframe 200” “made of a metal” having a “plurality of electrical
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`leads 204, 206.” Id. ¶¶ 74-75. Figures 5-7 show the leadframe (metal part) is
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`substantially flat and all upper edges of the metal part are coplanar. Id. ¶¶ 75, 66,
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`74, Figs. 5-7. The leadframe may have differences in level. Id. ¶¶ 75-76, Fig. 5.
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`“[L]ight emitting device[] 214” is mounted on the metal part and “electrically
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`connected” with the leads. Id. ¶ 81.
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`Id., Fig. 7.
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`As shown in red in Figures 6-7, Loh discloses the leadframe includes
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`notches at four outer lateral surfaces. Id. ¶ 75, Fig. 6. During “molding,” resin is
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`filled in the notches to form “package body 230” “on/around the leadframe.” Id.
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`¶¶ 76, 78, 69. “By filling the recesses 226 with the package body 230, the package
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`body 230 may form a strong mechanical connection to the leadframe 200 without
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`the necessity of an adhesive.” Id. ¶ 78, Figs. 5-7. After “molding,” the resin and
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`leadframe are cut along the notches to trim off external frame 201, thus forming a
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`resin part and metal part that are coplanar at four outer lateral surfaces. Id. ¶¶ 75,
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`76, cl. 5, Figs. 6-7.
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`Id., Figs. 6, 7.
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`
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`Figure 7 shows a portion of an outer lateral surface of the resin part (in
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`green) and portion of an outer lateral surface of the metal part (in blue) are
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`coplanar at four outer lateral surfaces (outlined in red). Figure 7 also shows the
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`United States Patent No. 9,537,071
`resin part is located at left and right sides of a portion of the metal part at at least
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`two outer lateral surfaces. Figures 7 and 5 show the resin package has a concave
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`portion with a bottom surface. Id. ¶ 79.
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`Id., Fig. 7.
`Figure 5 shows a portion of an outer surface of the resin part and a portion of
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`
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`an outer surface of the metal part are coplanar at an outer bottom surface, and a
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`lower surface of the metal part is exposed from the resin part in a region directly
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`under the light emitting element. Id., Fig. 5. A sealing member is filled in the
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`concave portion of the resin package and may contain “a phosphor.” Id. ¶ 79.
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`Id., Fig. 5.
`Loh is analogous art to ’071—it is in the same field of endeavor relating to
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`
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`“semiconductor” technology, including manufacturing and packaging processes for
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`an LED and is reasonably pertinent to ’071’s purported problem of providing an
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`LED that “is small, provides good power efficiency, and emits light of bright
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`color” and “improve[d] adhesion.” Ex. 1001, 1:18-36, 2:32-37, 5:17-21, 3:26-
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`4:10; Ex. 1004 ¶¶ 2, 7, 37, 66, 99, 85, 78, Abstract; Ex. 1003 ¶ 68.
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`2.
`U.S. Patent Publication No. 2005/0211991 (“Mori”)
`Mori (Ex. 1005), published September 29, 2005, is prior art under at least §§
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`102(b), (a), (e). Mori discloses a light emitting device comprising a resin package
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`(e.g., Figure 9, item 111) with a resin part (green in Figure 9, item 113), metal part
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`(e.g., “lead terminal made of copper (Cu)”), and a light emitting element (orange in
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`Figure 9, item 114). E.g., Ex. 1005 ¶¶ 5-10, 59-66, 70, 87-91, Figs. 1-3, 8-9; see
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`generally Ex. 1003 ¶¶ 69-71. Mori discloses it is “conventional” to use a sealing
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`member (e.g., “light transmitting member”) containing “two kinds of phosphors”
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`in the concave portion of the resin package to “perform wavelength conversion on
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`the light emitted from the light-emitting element.” Ex. 1005 ¶¶ 5, 71, Figs. 9, 3.
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`“The phosphors…may be formed of…a mixture of two or more different
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`substances” and “the mixing ratio of the phosphors” can be “adjust[ed],” making it
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`“possible to set a color temperature without restraint.” Id. ¶¶ 10-12; see also, e.g.,
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`id. ¶¶ 91, 87, Figs. 1-3, 8-9.
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`Id., Fig. 9.
`Mori is analogous art to ’071—it is in the same field of endeavor relating to
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`
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`“semiconductor” technology, including manufacturing and packaging processes for
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`an LED and is reasonably pertinent to ’071’s purported problem of providing an
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`LED that “is small, provides good power efficiency, and emits light of bright
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`color” and “realiz[ing]” different colors of light. Ex. 1001, 1:18-36, 2:32-37, 10:9-
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`11:34; Ex. 1005 ¶¶ 2, 37, 70, 4, 87, 84, 38, 10-13, Abstract, Figs. 3, 9; Ex. 1003 ¶
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`71.
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`3.
`U.S. Patent Publication No. 2008/0073662 (“Wang”)
`Wang (Ex. 1006), published March 27, 2008, is prior art under at least §§
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`102(b), (a), (e). Wang discloses an LED package (e.g., Figure 4) comprising a
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`metal part (blue in Figure 4, items 1, 11, 12), a molded encapsulant forming a
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`reflector cup (green in Figure 4, item 5), and light emitting element (orange in
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`Figure 4, item 4). E.g., Ex. 1006 ¶¶ 9, 13, 39, 40, 43, 44, Figs. 3-5; see generally
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`Ex. 1003 ¶¶ 72-76. Wang discloses the leads are made of metal and all surfaces of
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`the leadframe are electroplated with a metal layer, shown in pink. Ex. 1006 ¶¶ 41,
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`9, 39, Figs. 2-5. After electroplating, molding is performed, and the leadframe is
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`cut to separate the light emitting device. Ex. 1006 ¶¶ 9, 39, 49, Figs. 2-5.
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`Ex. 1006, Fig. 4.
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`Wang is analogous art to ’071—it is in the same field of endeavor relating to
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`“semiconductor” technology, including manufacturing and packaging processes for
`
`an LED and is reasonably pertinent to ’071’s purported problem of providing an
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`LED that “is small, provides good power efficiency, and emits light of bright
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`color.” Ex. 1001, 1:18-36, 2:32-37, 3:26-30; Ex. 1006 ¶¶ 6-7, 2, 8-9, Figs. 2-5; Ex.
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`1003 ¶ 76.
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`4.
`U.S. Patent Publication No. 2005/0280017 (“Oshio”)
`Oshio (Ex. 1007), published December 22, 2005, is p