[19]
`United States E’atent
`Fujizaki et al.
`
`[11] Patent Number:
`
`4,954,883
`
`[45] Date of Patent:
`
`Sep. 4, 1990
`
`[54] SOCKET FOR MOUNTING AN IC CHIP
`PACKAGE ON A PRINTED CIRCUIT BOARD
`
`[75]
`
`Inventors: Tsutomu Fujizaki, Yokohama;
`Minoru Shibata, Matsuzaka, both of
`Japan
`
`[73] Assignee: Matsushita Electric Works, Ltd.,
`Japan
`
`[21] Appl. No.: 480,908
`
`[22] Filed:
`
`Feb. 16, 1990
`
`Foreign Application Priority Data
`[30]
`Feb. 23, 1989 [JP]
`Japan .................................... 1-44611
`Sep. 26, 1989 [JP]
`Japan ............................. 1-112424[U]
`
`Int. Cl.5 ............................................... H01R 9/09
`[51]
`[52] US. Cl. ........................................ 439/73; 439/81;
`439/83; 439/828
`[58] Field of Search ....................... 439/72, 73, 78, 81,
`439/83, 826, 828
`
`[56]
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`439/83
`9/1978 Le Grelle ......
`4,110,917
`
`
`439/73
`4,252,390 2/1981 Bowling
`4,417,777 11/1983 Barnford ............
`.. 339/17 CF
`
`4,422,128 12/1983 Zurlinden et a1.
`........ 439/83
`. 339/17 CF
`4,491,377
`1/1985 Pfaff ..................
`........ 439/81
`4,555,153 11/1985 Bricaud et a1.
`439/83
`
`4,682,829
`7/1987 Kunkle et al.
`439/73
`..........
`4,758,176
`7/1988 Abe et al.
`
`439/73
`4,824,392 4/1989 Billman et a1.
`
`Primary Examiner—Paula A. Bradley
`Attorney, Agent, or Firm—Stevens, Davis, Miller &
`Mosher
`
`[57]
`
`,
`
`ABSTRACT
`
`A socket for mounting IC chip package on a printed
`circuit board has an elongated socket body having a
`plurality of contact elements aligned along the length of
`the socket body for contact with corresponding one of
`leads extending laterally from the IC chip package. A
`cover frame is fitted over the socket body to press the
`IC chip leads against the corresponding contact ele-
`ments for positive electrical connection therebetween.
`The socket body carries between the longitudinal ends
`thereof the contact elements and is engaged at the longi-
`tudinal ends with the cover frame. Each contact ele-
`ment is struck from a metal strip to include a base and an
`anchor leg extending from one end of the base to be
`bent into the socket body, the other end of the base
`extending laterally and being bifurcated to form a verti-
`cally spaced pair of a spring leg for contact with the
`corresponding one of the IC chip leads and a terminal
`leg for connection with a circuit on the printed board.
`The socket body formed in its laterally central portion
`with a plurality of slots which opens to a bottom surface
`of the socket body and into which the anchor leg is
`press-fitted such that the spring leg and the terminal leg
`project laterally outwardly of the socket body to leave
`therebetween an open space available for soldering the
`terminal legs on the printed circuit board.
`
`9 Claims, 5 Drawing Sheets
`
`
`
`KINGSTON 1013
`
`Kingston v. Polaris
`|PR2016-01622
`
`1
`
`KINGSTON 1013
`Kingston v. Polaris
`IPR2016-01622
`
`

`

`US. Patent
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`Sep. 4, 1990
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`Sheet 1 of 5
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`Sheet 2 of5
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`Hflllllllllllllllllllllllllllll!lll!!l!!llIllII!III!III!I§R ..
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`3 34 2
`‘
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`3
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`US. Patent
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`Sep.4, 1990
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`Sheet 3 of 5
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`US. Patent
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`Sep.4, 1990
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`Sheet 4 of 5
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`US. Patent
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`Sep.4, 1990
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`Sheet 5 of 5
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`1
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`4,954,088
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`SOCKET FOR MOUNTING AN IC CHIP PACKAGE
`ON A PRINTED CIRCUIT BOARD
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`The present invention is directed to a socket for
`mounting an IC chip package on a printed circuit board,
`and more particularly to such a socket fitted with a
`cover frame for pressing IC chip leads against corre-
`sponding contact elements of the socket.
`2. Description of the Prior Art
`For mounting on a printed circuit board an IC chip
`package having a row or rows of leads extending later-
`ally from the package, a socket is generally utilized to
`have a corresponding number of electrical contact ele-
`ments each connected at its end to the corresponding
`'one of the IC package leads and at the other end with a
`corresponding pad of the circuit on the surface of
`printed board. In known sockets designed for the above
`IC chip package, for example, SIP (single-in—line pack-
`age) or DIP (dual-in-line package) and including a
`cover frame for pressing IC package leads against the
`corresponding contact elements, the contact elements
`are carried on an elongated socket body to be aligned
`along the. length thereof with its one end positioned
`upward for contact with the leads and with the other
`end positioned downward for connection with the cir-
`cuit of the printed board. For coupling with the cover
`frame, the socket body of the prior socket is configured
`to include catch members on its top laterally outwardly
`of the upper end of the contact elements, i.e. outwardly
`of the IC package leads thus adding an extra width
`dimension to the socket. Further, the contact elements
`utilized in the prior socket are each in the form of a
`generally U-shaped configuration inserted or embedded
`in the socket bodyl with its bent portion positioned later-
`ally inwardly of the socket body so as to project one
`arm of the U-shape on the upper surface of the socket
`body to define itself a spring leg for contact with the IC
`package lead and to project the other arm on the bot-
`tom of the socket body to define a terminal leg for
`connection with the printed board. Due to the require-
`ment that the terminal legs be readily accessible from
`upward for soldering on the printed board, the terminal
`legs must project laterally outwardly of the socket
`body,
`i.e., beyond the catch member formed at the
`lateral end of the socket body, which is also responsible
`for unduly increasing width dimension of the socket.
`Therefore, the prior socket fitted with the cover frame
`is found. unsatisfactory for providing a compact ar-
`rangement particularly with respect to the width di-
`mension.
`-
`
`SUMMARY OF THE INVENTION
`
`The above problem has been eliminated in the present
`invention which provides an improved socket
`for
`mounting an IC chip package on a printed circuit board.
`The socket of the present invention has an elongated
`socket body having a plurality of contact elements
`aligned along the length thereof for contact with corre-
`sponding ones of leads extending laterally from the IC
`chip package. A cover frame is fitted over the socket
`body to press the IC chip leads against the correspond-
`ing contact elements for positive electrical connection
`therebetween. The socket body carries between the
`longitudinal ends thereof the contact elements and is
`formed at
`the longitudinal ends respectively with
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`catches for fixing the cover frame on the socket body.
`Each contact element comprises a base and an anchor
`leg extending from one end of the base into the socket
`body, the other end of the base extending laterally and
`being bifurcated to form a vertically spaced pair of a
`spring leg for contact with the corresponding one of the
`IC chip leads and a terminal leg for connection with a
`circuit on the printed board. The contact elements are
`supported to the socket body with the anchor leg se-
`cured to the lateral center portion of the socket body so
`as to project the spring leg and terminal legs laterally
`outwardly of the socket body and to form between the
`spring and terminal legs an open space available for
`soldering the terminal legs on the surface of the printed
`board. Thus, the socket body can be designed to have
`no part or portion projecting laterally outwardly of the
`spring legs for coupling with the cover frame, the termi-
`nal legs can be positioned well within the lateral extrem-
`ity of the spring legs while leaving the open space be-
`tween the vertically spaced spring and terminal legs for
`assuring easy soldering of the terminal
`legs on the
`printed board, and the cover frame can be designed to
`have a lateral member only positioned above the IC
`package leads, i.e., the spring leg and not required to
`extend laterally further therebeyond, all of which con-
`tribute to reduce the width dimension of the socket.
`It is therefore a primary object of the present inven-
`tion to provide an improved socket for IC chip package
`which is capable of reducing the width dimension to a
`minimum advantageous for close mounting of the pack-
`age on the printed board.
`In a preferred embodiment, the socket body includes
`its longitudinal ends laterally extending flanges
`at
`which support corresponding end portions of the cover
`frame and which have the catches for coupling the
`cover frame in a position to press the IC package leads
`against the spring legs. The contact elements are formed
`on the socket body between the opposed flanges to
`project the spring and terminal legs into a recess con-
`fined between the longitudinally opposed flanges such
`that these legs do not project laterally beyond the lat-
`eral end of the flanges. The cover frame is dimensioned
`to have the width dimension substantially equal to the
`lateral dimension of the flanges as it is not required to be
`coupled to the socket body at a portion laterally out-
`wardly of the spring legs. Thus, the cover frame width
`can be reduced to a minimum so as to reduce the width
`dimension of the entire socket assembly, which is there-
`fore another object of the present invention.
`The contact elements are preferred to have the an-
`chor legs bent upwardly for insertion into correspond.
`ing slots formed in the socket body. The slots are open
`to the bottom surface of the socket body so that the
`contact elements can be secured by press-fitting the
`anchor legs from below. Since the anchor leg is formed
`at one end of the base opposite from the spring leg, the
`spring leg can be kept substantially from deformative
`stress which the anchor leg may encounter when being
`inserted into the slots. Whereby the spring leg can be
`prevented from any substantial warping or deflection,
`and therefore be assured of consistent spring character-
`istic as desired for reliable electrical connection with
`the IC package leads.
`It is therefore a further object of the present invention
`to provide an improved socket for IC chip package
`which is capable of effecting an easy assembly of the
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`3
`contact elements to the socket body, yet assuring reli-
`able spring characteristic for the spring legs.
`The spring legs and the terminal legs are preferred to
`be staggered in the lengthwise direction of the socket
`body so that the terminal legs can be exposed, without
`being interfered by the spring legs, to an infrared radia-
`tion which may be employed in reflow soldering the
`terminal legs on the printed board.
`It is therefore a still further object of the present
`invention to provide an improved socket for IC pack-
`age in which the spring leg and the terminal legs are
`staggered along the length of the socket body for facili-
`tating reflow soldering of the terminal
`legs on the
`printed board by directing an infrared radiation to the
`terminal legs.
`These and still other objects and advantages will
`become more apparent from the following description .
`of the preferred embodiments when taken in conjunc-
`tion with the attached drawings.
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 an exploded perspective view of a socket for
`IC chip package;
`FIG. 2 is a top View of the above socket with a cover
`frame shown as being removed in the right half of the
`figure;
`FIG. 3 is a side view partly in section of the above
`socket;
`FIG. 4 is an end view of the above socket;
`FIG. 5 is a sectional view of the above socket;
`FIG. 6 is a- top View of a contact element utilized in
`the above socket;
`FIG. 7 is a perspective view of the contact element;
`FIG. 8 is an exploded perspective view of a socket in
`accordance with another embodiment of the present
`invention;
`FIG. 9 is a perspective view of a contact element
`utilized in the socket of FIG. 8; and
`FIG. 10 is a plane view of the contact elements of
`FIG. 9 prior to being separated from a blank sheet.
`DESCRIPTION OF THE PREFERRED
`EMBODIMENTS
`
`First embodiment <FIGS. 1 to 7>
`
`Referring now to FIG. 1, there is shown a socket for
`mounting an IC chip package on a printed circuit board
`in accordance with a first preferred embodiment of the
`present invention. The socket comprises a socket body
`10 of electrically insulative plastic material carrying a
`plurality of contact elements 30 and a coVer frame 20
`also of like insulative material fitted over the socket
`body 10 to hold an IC chip package 40 therebetween. In
`the illustrated embodiment, the IC chip package 40 is
`shown as a DIP (dual-in—line package) have a plurality
`of leads 41 extending laterally therefrom to provide two
`parallel rows of the leads 41 at the opposite sides of the
`package. The socket body 10 is an elongated member
`provided at its longitudinal ends respectively with later-
`ally extending flanges 11 to present a generally I-shaped
`configuration. The longitudinally spaced flanges 11
`determine the width dimension of the socket body 10
`and define therebetween recesses 12 laterally outwardly
`of the socket body 10. The contacts elements 30 are
`supported on the socket body 10 between the flanges 11
`in such a manner as to form two parallel rows of contact
`elements 30 projecting respectively in the recesses 12.
`The cover frame 20 is a rectangular member compris-
`ing a pair of opposed end bars 21 connected by side bars
`
`4,954,088
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`22 and is placed over the socket body 10 to press the IC
`package leads 41 against
`the corresponding contact
`elements 30 so as to effect positive electrical connection
`therebetween and to hold the IC chip package 40 in
`place by the pressing engagement of the leads 41 with
`the contact elements 30, as shown in FIG. 5. As seen in
`the figure, the IC chip package 40 is supported on the
`socket body 10 while leaving a clearance therebetween.
`Upstanding from the lateral centers of the opposite
`flanges 11 are catches 13 which are formed with inward
`latches 14 for snap engagement respectively with stops
`23 formed at the lateral centers of the opposed end bars
`21 of the cover frame 20 for detachably connecting the
`cover frame 20 on the socket body 10. Each stop 23 is
`recessed in the end bar 21 and formed at its lower outer
`end With a bevelled surface 24 which comes into
`contact with a like bevelled surface 15 at the upper
`inner end of the catch 13 as the cover frame 20 is placed
`down on the socket body 10, thereby flexing the catch
`13 outwardly enough to guide the stop 23 past the latch
`14, after which the catch 13 returns inwardly to effect
`the snap engagement between the latch 14 and the stop
`' 23. Each of the flanges 11 is formed with a pair of later-
`ally spaced upright ribs 16 which are engaged with the
`inner bottom periphery of the cover frame 20 at the
`corresponding corners thereof for exact positioning of
`the frame 20 on the socket body 10 in relation to the IC
`chip package 40. As shown in FIG. 5, the side bars 22 of
`the cover frame 20 are each formed at its inner lower
`end with an inclined edge 25 which conforms to curved
`portions of the leads 41 so that it may assist pressing the
`leads 41 against the contact elements 30 for firm holding
`of the leads 41 between the side bar 22 and the contact
`elements 30.
`As shown in FIGS. 6 and 7, each contact element 30
`is stamped and bent from a single elongated strip of
`electrically conductive material to comprise a flat base
`31 and an anchor leg 32 bent upward at a right angle
`from one end of the base 31. The other end of the base
`31 is bent upward and then bent horizontally to define a
`spring leg 33 which is a member for pressed contact
`with the IC package lead 41. Also extending from the
`other end of the base 31 is a terminal leg 34 which is
`somewhat bent downward and then horizontally in
`vertically spaced relation with the spring leg 33 for
`soldering connection on the circuit of the printed board.
`As shown in the figures, the terminal leg 34 is struck
`from the spring leg 33 to leave an elongated aperture 35
`dividing the spring legs 33 into two Spaced sections
`which are bridged together at the distal ends. The ter-
`minal leg 34 terminates at a point vertically aligned with
`the distal end of the spring leg 33 and can be exposed
`upwardly through the aperture 35 such that, when
`mounting the terminal leg 34 on the printed board by
`reflow soldering, an infrared radiation can be directed
`through the aperture 35 toward the terminal leg 34 from
`above the socket body 10 for enabling the reflow sol-
`dering by the infrared radiation.
`The contact elements thus formed are assembled to
`the socket body 10 by press-fitting the anchor legs 32
`into slots 17 formed in the lateral center of the socket
`body 10, as seen in FIG. 5, so that the spring legs 33
`project laterally outwardly of the socket body 10 and
`slightly upwardly of the upper end thereof and the
`terminal legs 34 also project laterally outwardly and
`slightly downwardly of the bottom of the socket body
`10. The slots 17 are open to depressions 18 respectively
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`4,954,988
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`formed in the bottom of the socket body 10 and ar-
`ranged along the length thereof so that the anchor leg
`32 can be inserted into the corresponding slots 17 from
`below the socket body 10 with the base 31 of each
`contact element 30 lying against the upper bottom of
`the depression 18. With this structure of providing the
`anchor leg 32 and the spring leg 33 at the opposite ends
`of the base 31, the spring leg 33 can be substantially free
`from a force which is applied to the anchor leg 32 for
`insertion thereof in the slot 17, thereby being prevented
`from undesirable stressing beyond elastic limit and
`therefore assured of consistent spring characteristic for
`reliable electrical contact with the IC package lead 41.
`The spring leg 33 and the terminal leg 34 are vertically
`spaced to define therebetween an open space enough to
`be readily available without being interfered with the
`socket body 10 for soldering the terminal leg 34 on the
`printed board. It is noted at this time, as shown in FIG.
`5, that the spring legs 33 and the terminal legs 34 are
`within the width dimension of the socket body 10 or the
`flanges 11 and that the cover frame 20 has no substantial
`portion extending laterally beyond the contact elements
`30, the width of the entire socket can be reduced to as
`less as the width dimension of the IC package 4-0.
`
`Second embodiment <FIGS. 8 to 10>
`FIG. 8 shows a socket in accordance with a second
`embodiment of the present invention which is similar in
`structure to the above first embodiment. The socket
`comprises a generally rectangular socket body 50 of
`electrically insulating material and a rectangular cover
`frame 60 of like insulating material. The socket body 50
`is provided in its opposite sides respectively with longi-
`tudinally aligned slots 51 which are separated by comb-
`teeth members 52 respectively for receiving individual
`contact elements 70. The contact elements 70 are
`blanked from a metal sheet of conductive material and
`are separated therefrom at connections 71, as shown in
`FIG. 10, to form an upward bent spring leg 73 and a
`downward bent terminal leg 74 both extending from an
`anchor end 72. That is, the lengthwise portion of the
`contact element 70 except for the anchor end 72 is bifur-
`cated to provide the spring leg 73 and the terminal leg
`74 which are vertically spaced in the like manner as in
`the first embodiment and laterally offset, as shown in
`FIG. 9. The contact elements 70 thus formed are sup-
`ported to the socket body 50 with the anchor end 72
`embedded or inserted deep in the respective slots 51 so
`that the spring legs 73 project laterally outwardly and
`slightly upwardly of the socket body 50 and the termi-
`nal
`legs 74 project laterally outwardly and slightly
`downwardly of the socket base 50. Due to the offset
`arrangement structure of the spring leg 73 and the ter-
`minal leg 74 of each contact element 70, they are ar-
`ranged along the sides of the socket body 50 in stag-
`gered relation so that the terminal legs 74 can be ex-
`posed upwardly without being interfered by the spring
`legs 73, enabling to direct the infrared radiation from
`the above to the terminal legs 74 for reflow soldering of
`the terminal legs 74 on the printed board equally as in
`the first embodiment.
`Projecting on the upper surface of the socket body 70
`are grid posts 54 formed along the lateral edge over a
`limited region in alignment with the comb-teeth mem-
`bers 52 such that the IC package leads are exactly posi-
`tioned between the adjacent grid posts 54 for exact
`placement of the leads on the spring legs 73. The posts
`54 are also cooperative with end walls 55 upstanding on
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`the longitudinal ends of the socket body 50 to define an
`inside rim around which the cover frame 60 is posi-
`tioned. The cover frame 60 is formed on the inner pe-
`riphery of the opposite side bars 62 respectively with
`elongated protrusions 63 which are received into center
`breaks each formed between the far spaced grid posts 54
`for exact positioning of the cover frame 60 with respect
`to the lengthwise direction on the socket body 50. The
`cover frame 60 is detachably locked on the socket body
`50 to press the IC package leads against the spring legs
`73 of the contact elements 70 in the like manner as in the
`first embodiment
`for positive electrical connection
`therebetween. Depending from the opposed end bars 61
`of the cover frame 60 are hooks 64 for snap engagement
`respectively with corresponding catch projections 56 at
`the longitudinal ends of the socket body 50. It is noted
`at this time the contact element 70 can be modified to
`have a anchor leg bent upward for insertion into corre-
`spondingly formed slot in the socket body in the like
`manner as in the first embodiment. In such case, the
`contact element is preferred to have a horizontally ex-
`tending base from one end of which the anchor leg is
`bent upwardly and from the other end of which the
`spring and terminal legs are bent upwardly and down-
`wardly, respectively.
`What is claimed is:
`
`1. A socket adapted for mounting on a printed circuit
`board an IC chip package having a plurality of sideward
`extending leads comprising:
`an elongated socket body of electrically insulating
`material;
`a plurality of contact elements carried by said socket
`body to be aligned along the length thereof;
`a cover frame of electrically insulating material fitted
`on said socket body in order to press said IC chip
`leads against
`the corresponding ones of said
`contact elements for positive electrical connection
`therebetween;
`each of said contact elements comprising a base and
`an anchor leg at one end of said base, the other end
`of said base extending laterally and being bifur-
`cated to form a vertically spaced pair of a spring
`leg for contact with the corresponding one of said
`IC chip leads and a terminal leg for connection
`with a circuit on said printed board, said contact
`elements fixed to said socket body with said anchor
`leg fixed to the lateral center portion of said socket
`body in such a way as to project said spring leg and
`terminal legs laterally outwardly of said socket
`body and to form an open space between said
`spring and terminal legs; and
`said socket body provided at its longitudinal ends
`with catch means for detachably engagement with
`the corresponding ends of said cover frame for
`supporting said cover frame in position on said
`socket body.
`2. A socket as set forth in claim 1, wherein
`said contact element is stamped from a metal strip and
`bent to form said anchor, spring, and terminal legs.
`3. A socket as set forth in claim 1, wherein said
`contact elements are arranged in a row along the length
`of the socket body with the spring and terminal legs
`staggered with respect to the lengthwise direction of
`said socket body.
`4. A socket as set forth in claim 3, wherein said
`contact elements is formed from a strip of which half
`sections are bent upward and downward respectively to
`
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`7
`define said spring and terminal legs by the two offset
`half sections.
`
`4,954,088
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`8
`and terminating at a point within the lateral end of
`said flange.
`7. A socket as set forth in claim 5, wherein said
`contact elements are arranged in a row along the length
`of the socket body with the spring and terminal legs
`staggered with respect to the lengthwise direction of
`said socket body.
`8. A socket as set forth in claim 7, wherein each of
`said terminal
`legs is struck from the corresponding
`spring leg to form therein an aperture which divides the
`spring legs on the opposite sides of the aperture and
`through which the terminal leg is open upwardly so
`that the spring leg and the terminal legs are staggered in
`the lengthwise direction of the socket body.
`9. A socket adapted for mounting on a printed circuit
`board an IC chip package having a plurality of sideward
`extending leads comprising:
`an elongated socket body of electrically insulating
`. material;
`a plurality of contact elements carried by said socket
`body to be aligned along the length thereof;
`a cover frame of electrically insulating material fitted
`on said socket body in order to press said IC chip
`leads against
`the corresponding ones of said
`contact elements for positive electrical connection
`therebetween;
`each of said contact elements comprising a base and
`an anchor leg at one end of said base, the other end
`of said base extending laterally and being bifur-
`cated to form a vertically spaced pair of a spring
`leg for contact with the corresponding one of said
`IC chip leads and a terminal leg for connection
`with a circuit on said printed board, said contact
`elements fixed to said socket body with said anchor
`leg fixed to the lateral center portion of said socket
`body in such a way as to project said spring leg and
`terminal
`legs laterally outwardly of said socket
`body and to form an open space between said
`spring and terminal legs.
`*
`*
`*
`i
`t
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`5. A socket adapted for mounting on a printed circuit
`board an IC chip package having a plurality of sideward
`extending leads comprising:
`a socket body of electrically insulating material;
`a plurality of electrical contact elements supported by
`said socket body;
`a cover frame of electrically insulating material fitted
`on said socket body in order to press said IC chip
`leads against
`the corresponding ones of said
`contact elements for positive electric connection
`therebetween;
`each of said contact elements comprising a base and
`an anchor leg extending from one end of said base 15
`to be bent into said socket body, the other end of
`said base extending laterally and being bifurcated
`to form a vertically spaced pair of a spring leg for
`contact with the corresponding one of said IC chip
`leads and a terminal leg for connection with a cir- 20
`cuit on said printed board;
`said socket body formed in its center portion with a
`plurality of slots which open to a bottom surface of
`said socket body and into each of which said an-
`chor leg is press-fitted such that said spring leg and
`said terminal leg project generally laterally of said
`socket body in vertical spaced relation forming an
`open space between said spring and terminal legs;
`and
`
`25
`
`said socket body provided at its longitudinal ends
`with catch means for detachably engagement with
`the corresponding ends of said cover frame for
`supporting said cover frame in position on said
`socket body.
`6. A socket as set forth in claim 5, wherein
`said socket body is an elongated member provided at
`its longitudinal ends with laterally extending and
`longitudinally opposed flanges which define there-
`between recesses laterally outwardly of said socket
`body for receiving said contact elements therein,
`said spring and terminal legs extending laterally
`
`30
`
`35
`
`45
`
`50
`
`55
`
`60
`
`65
`
`10
`
`10
`
`