APPENDIX CC19
`
`wirings;
`
`Abstract, Figs 1, 5-6.
`
`Forming pixel electrodes,
`and
`
`Tomoyuki discloses pixel
`electrodes 12. See, e.g.,
`Tomoyuki, Figs 1, 5-6.
`forming dummy conductive
`Tomoyuki discloses dummy film
`patterns, the dummy
`5 and 5a is located between the
`gate and drain drivers and the
`patterns comprising at least
`about 30% of the area of the pixel electrodes 12 and not in
`insulating substrate, the
`contact with the gate lines GLs
`dummy conductive patterns
`and drain lines DLs. See, e.g.,
`situated between the
`Tomoyuki, Abstract, Figures 1,
`5-6. Further, the dummy 5 and
`connection pads and the
`pixel electrodes such that
`5a can be continuous or can be a
`the dummy patters are not in shape corresponding to a pixel
`contact with any of the
`electrode. See, e.g., Tomoyuki,
`wiring.
`Abstract, 132, Figures 1, 5-6.
`The dummy film 5 and 5a would
`comprise at least 30% of the area
`or a specified region.
`
`CLAIM 10
`The method for forming an
`array substrate for display
`according to claim 9,
`wherein at least one of the
`wirings comprises at least an
`upper layer and a lower
`layer of conductive
`materials.
`CLAIM 11
`The method for forming an
`array substrate for display
`according to claim 10
`wherein the lower layer
`wiring material is selected
`from the group consisting of
`aluminum and aluminum
`alloys.
`CLAIM 12
`The method for forming an
`array substrate for display
`according to claim 10
`wherein the upper layer
`wiring material is selected
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`
`CC19-4
`
`Page 501 of 1919
`
`

`
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`CLAIM 13
`The method for forming an
`array substrate for display
`according to claim 11,
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`CLAIM 14
`The method for forming an
`array substrate for display
`according to claim 13
`wherein the upper wiring
`material is selected from the
`group consisting of
`molybdenum, and alloys
`thereof.
`CLAIM 15
`The method for forming an
`array substrate for display
`according to claim 12
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIM 16
`The method for forming an
`array substrate for display
`according to claim 13
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`DC:50680696.1
`
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`.to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g., the
`'629 patent, col. 1,11. 26-39.
`
`The '629 APA discloses a
`lower layer wiring material of
`aluminum and an upper layer
`wiring material that is harder
`to oxidize such as chromium,
`tantalum, titanium or
`molybdenum. See e.g:, the
`'629 patent, col. 1,11. 26-39.
`
`APPENDIX CC19
`
`CC19-5
`
`Page 502 of 1919
`
`

`
`APPENDIX CC20
`
`U.S. PATENT NO. 6.689.629 - TOMOYUKI IN VIEW OF KUBOTA
`
`Japanese Pub. No. 2000-098909 to Tomoyuki in view of U.S. Patent No. 6,157,430 to
`
`Kubota renders obvious Claims 2-8 and 10-16 of the '629 patent.
`
`PRIOR ART DISCLOSURE -
`KUBOTA
`
`CLAIM 1
`
`An array substrate for
`display, comprising:
`
`a layer of an insulating
`substrate, having an area;
`
`a thin film transistor array
`formed on the insulating
`substrate;
`
`a plurality of wiring
`arranged on the insulating
`substrate, each wiring
`having a first end, the
`wiring in communication
`with at least one of the
`transistors in the thin film
`array;
`connections pads, each
`connection pad contacting
`the first end of at most one
`of the plurality of wirings;
`
`pixel electrodes, and
`
`Dummy conductive
`patterns, the dummy
`patterns comprising at least
`about 30% of the area of the
`insulating substrate, the
`dummy conductive patterns
`situated between the
`connection pads and the
`pixel electrodes such that
`the dummy patters are not in
`
`PRIOR ART DISCLOSURE -
`TOMOYUKI *909
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1,5-6.
`Tomoyuki discloses TFT array
`substrate including wiring, drain
`lines DLs and gate lines GLs.
`See, e.g., Tomoyuki, Abstract,
`Figs 1, 5-6.
`
`Tomoyuki discloses that the gate
`driver and drain driver connect to
`the gate lines GLs and drain lines
`DLs. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses pixel
`electrodes 12. See, e.g..
`Tomoyuki, Figs 1, 5-6.
`Tomoyuki discloses dummy film
`5 and 5 a is located between the
`gate and drain drivers and the
`pixel electrodes 12 and not in
`contact with the gate lines GLs
`and drain lines DLs. See, e.g.,
`Tomoyuki, Abstract, Figures 1,
`5-6. Further, the dummy 5 and
`5a can be continuous or can be a
`shape corresponding to a pixel
`
`CC20 - 1
`
`Page 503 of 1919
`
`

`
`contact with any of the
`wiring.
`
`CLAIM 2
`The array substrate for
`display according to claim
`1, wherein at least one of
`the wirings comprises at
`least an upper layer and a
`lower layer of conductive
`materials.
`
`CLAIM 3
`The array substrate for
`display according to claim 2
`wherein the lower layer
`wiring material is selected
`from the group consisting of
`aluminum and aluminum
`alloys.
`
`CLAIM 4
`The array substrate for
`display according to claim 2
`wherein the upper layer-
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`
`CLAIM 5
`The array substrate for
`display according to claim
`3, wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`
`APPENDIX CC20
`
`electrode. See, e.g., Tomoyuki,
`Abstract, 132, Figures 1, 5-6.
`The dummy film 5 and 5 a would
`comprise at least 30% of the area
`or a specified region.
`
`Kubota discloses a lower
`layer .wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g..
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`
`CC20 - 2
`
`Page 504 of 1919
`
`

`
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`APPENDIX CC20
`
`tantalum, titanium and
`alloys thereof.
`
`CLAIM 6
`The array substrate for
`display according to claim
`5, wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum and alloys
`thereof.
`
`CLAIM?
`The array substrate for
`display according to claim 4
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIMS
`The array substrate for
`display according to claim 5
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIM 9
`A meted for forming an
`array substrate for display,
`comprising:
`
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`
`CC20 - 3
`
`Page 505 of 1919
`
`

`
`forming a layer of an
`insulating substrate, having
`an area;
`
`forming a thin film
`transistor array formed on
`the insulating substrate;
`
`each wiring having a first
`end, the wiring in
`communication with at least
`on of the transistors in the
`thin film array;
`forming connections pads,
`each connection pad
`contacting the first end of at
`most one of the plurality of
`wirings;
`Forming pixel electrodes.
`and
`
`forming dummy conductive
`patterns, the dummy
`patterns comprising at least
`about 30% of the area of the
`insulating substrate, the
`dummy conductive patterns
`situated between the
`connection pads and the
`pixel electrodes such that
`the dummy patters are not in
`contact with any of the
`wiring.
`
`CLAIM 10
`The method for forming an
`array substrate for display
`according to claim 9,
`wherein at least one of the
`wirings comprises at least an
`upper layer and a lower
`layer of conductive
`materials.
`
`APPENDIX CC20
`
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses a TFT array
`substrate 11 including display
`pixels. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses TFT array
`substrate including wiring, drain
`lines DLs and gate lines GLs.
`See, e.g., Tomoyuki, Abstract,
`Figs 1, 5-6.
`Tomoyuki discloses that the gate
`driver and drain driver connect to
`the gate lines GLs and drain lines
`DLs. See, e.g., Tomoyuki,
`Abstract, Figs 1, 5-6.
`Tomoyuki discloses pixel
`electrodes 12. See, e.g.,
`Tomoyuki, Figs 1, 5-6.
`Tomoyuki discloses dummy film
`5 and 5 a is located between the
`gate and drain drivers and the
`pixel electrodes 12 and not in
`contact with the gate lines GLs
`and drain lines DLs. See, e.g.,
`Tomoyuki, Abstract, Figures 1,
`5-6. Further, the dummy 5 and
`5a can be continuous or can be a
`shape corresponding to a pixel
`electrode. See, e.g., Tomoyuki,
`Abstract, ^ 32, Figures 1, 5-6.
`The dummy film 5 and 5a would
`comprise at least 30% of the area
`or a specified region.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g..
`
`CC20 - 4
`
`Page 506 of 1919
`
`

`
`CLAIM 11
`The method for forming an
`array substrate for display
`according to claim 10
`wherein the lower layer
`wiring material is selected
`from the group consisting-of
`aluminum and aluminum
`alloys.
`
`CLAIM 12
`The method for forming an
`array substrate for display
`according to claim 10
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`
`CLAIM 13
`The method for forming an
`array substrate for display
`according to claim 11,
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`
`CLAIM 14
`The method for forming an
`array substrate for display
`according to claim 13
`wherein the upper wiring
`material is selected from the
`group consisting of
`molybdenum, and alloys
`thereof.
`
`APPENDIX CC20
`
`CC20 - 5
`
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium,
`tantalum, molybdenum or
`alloys thereof. See e.g..
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium.
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Page 507 of 1919
`
`

`
`APPENDIX CC20
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium.
`tantalum, molybdenum or
`alloys thereof. See e.g.,
`Kubota, col. 4,11. 39-55.
`
`Kubota discloses a lower
`layer wiring material is
`aluminum or aluminum alloy
`and the upper layer wiring
`material is selected from a
`group consisting of
`chromium, titanium.
`tantalum, molybdenum or
`alloys thereof. See e.g..
`Kubota, col. 4,11. 39-55.
`
`CLAIM 15
`The method for forming an
`array substrate for display
`according to claim 12
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIM 16
`The method for forming an
`array substrate for display
`according to claim 13
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`DC:50680698.1
`
`CC20-6
`
`Page 508 of 1919
`
`

`
`APPENDIX CC21
`
`U.S. PATENT NO. 6.689.629 - ZHANG
`
`U.S. Patent No. 5,995,189 to Zhang anticipates Claims 1-5, 7-13, and 15-16 of the '629
`
`patent.
`
`CLAIM 1
`An array substrate for display,
`comprising:
`a layer of an insulating substrate,
`having an area;
`
`a thin film transistor array formed on
`the insulating substrate;
`
`a plurality of wiring arranged on the
`insulating substrate, each wiring having
`a first end, the wiring in
`communication with at least one of the
`transistors in the thin film array;
`connections pads, each connection pad
`contacting the first end of at most one
`of the plurality of wirings;
`pixel electrodes, and
`
`dummy conductive patterns, the
`dummy patterns comprising at least
`about 30% of the area of the insulating
`substrate, the dummy conductive
`patterns situated between the
`connection pads and the pixel
`electrodes such that the dummy patters
`are not in contact with any of the
`wiring.
`
`PRIOR ART DISCLOSURE - ZHANG
`Zhang discloses a liquid crystal display device. See,
`e.g., Zhang, Title, Figs. 1 and 16-17.
`Zhang discloses a substrate 1 made of glass or quartz,
`including an area. See, e.g., Zhang, 1:35-36, Figs. 1
`and 16-17.
`Zhang discloses scan lines 2 and signal lines 3 are
`formed on the element substrate 1 and 101 in a matrix
`with TFTs and pixel electrodes at the crossover points
`of the scan and signal lines. See, e.g., Zhang, 1:34-40,
`6:40-44, Figs. 1 and 16-17.
`Zhang discloses scan lines 2 and signal lines 3 and are
`connected to the TFTs. See, e.g., Zhang, 1:34-40,
`3:32-40, Figs. 1 and 16-17.
`
`Zhang discloses that the signal lines 2 and scan lines 3
`also connect to extension terminals 6. See, e.g.,
`Zhang, 1:45-47, 6:51-60, Figs. 1 and 16-17.
`Zhang discloses a pixel section 12. See, e.g., Zhang,
`Figs. 1 and 16-17.
`
`Zhang discloses dummy wirings 304 located in the
`sealing material formation region patterns which can
`be located between the pixel section and the extension
`terminals. See, e.g., Zhang, Figs. 4, 8 and 16. Further,
`the dummy wirings are not in contact with the wiring.
`
`Zhang also discloses that, for example, the distance
`between wiring is 50 [xm and that the dummy wirings
`are 30 [im leaving only 10 pim between the wiring and
`dummy wiring. See, e.g., Zhang, 10:7-17. Thus, the
`dummy patterns would comprise at least 30% of the
`area.
`
`CC21 - 1
`
`Page 509 of 1919
`
`

`
`APPENDIX CC21
`
`CLAIM 2
`The array substrate for display
`according to claim 1, wherein at least
`one of the wirings comprises at least an
`upper layer and a lower layer of
`conductive materials.
`CLAIM 3
`The array substrate for display
`according to claim 2 wherein the lower
`layer wiring material is selected from
`the group consisting of aluminum and
`aluminum alloys.
`CLAIM 4
`The array substrate for display
`according to claim 2 wherein the upper
`layer wiring material is selected from
`the group consisting of molybdenum,
`chromium, tantalum, titanium and
`alloys thereof.
`CLAIM 5
`The array substrate for display
`according to claim 3, wherein the upper
`layer wiring material is selected from
`the group consisting of molybdenum,
`chromium, tantalum, titanium and
`alloys thereof.
`CLAIM 7
`The array substrate for display
`according to claim 4 wherein the upper
`layer wiring material does not become
`insoluble in an acid or alkaline etchant.
`CLAIM 8
`The array substrate for display
`according to claim 5 wherein the upper
`layer wiring material does not become
`insoluble in an acid or alkaline etchant.
`CLAIM 9
`A meted for forming an array substrate
`for display, comprising:
`forming a layer of an insulating
`substrate, having an area;
`
`forming a thin film transistor array
`formed on the insulating substrate;
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`The upper layer of titanium would inherently meet this
`limitation. See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`The upper layer of titanium would inherently meet this
`limitation. See, e.g., Zhang, 9:29-33.
`
`Zhang discloses a liquid crystal display device. See,
`e.g., Zhang, Title, Figs. 1 and 16-17.
`Zhang discloses a substrate 1 made of glass or quartz,
`including an area. See, e.g., Zhang, 1:35-36, Figs. 1
`and 16-17.
`Zhang discloses scan lines 2 and signal lines 3 are
`formed on the element substrate 1 and 101 in a matrix
`
`CC21 - 2
`
`Page 510 of 1919
`
`

`
`APPENDIX CC21
`
`each wiring having a first end, the
`wiring in communication with at least
`on of the transistors in the thin film
`array;
`forming connections pads, each
`connection pad contacting the first end
`of at most one of the plurality of
`wirings;
`forming pixel electrodes, and
`
`^
`
`forming dummy conductive patterns,
`the dummy patterns comprising at least
`about 30% of the area of the insulating
`substrate, the dummy conductive
`patterns situated between the
`connection pads and the pixel
`electrodes such that the dummy patters
`are not in contact with any of the
`wiring.
`
`CLAIM 10
`The method for forming an array
`substrate for display according to claim
`9, wherein at least one of the wirings
`comprises at least an upper layer and a
`lower layer of conductive materials.
`CLAIM 11
`The method for forming an array
`substrate for display according to claim
`10 wherein the lower layer wiring
`material is selected from the group
`consisting of aluminum and aluminum
`alloys.
`CLAIM 12
`The method for forming an array
`substrate for display according to claim
`10 wherein the upper layer wiring
`material is selected from the group
`consisting of molybdenum, chromium.
`
`with TFTs and pixel electrodes at the crossover points
`of the scan and signal lines. See, e.g., Zhang, 1:34-40,
`6:40-44, Figs. 1 and 16-17.
`Zhang discloses scan lines 2 and signal lines 3 and are
`connected to the TFTs. See, e.g., Zhang, 1:34-40,
`3:32-40, Figs. 1 and 16-17.
`
`Zhang discloses that the signal lines 2 and scan lines 3
`also connect to extension terminals 6. See, e.g.,
`Zhang, 1:45-47, 6:51-60, Figs. 1 and 16-17.
`
`Zhang discloses a pixel section 12. See, e.g., Zhang,
`Figs. 1 and 16-17.
`
`Zhang discloses dummy wirings 304 located in the
`sealing material formation region patterns which can
`be located between the pixel section and the extension
`terminals. See, e.g., Zhang, Figs. 4, 8 and 16. Further,
`the dummy wirings are not in contact with the wiring,
`
`Zhang also discloses that, for example, the distance
`between wiring is 50 (xm and that the dummy wirings
`are 30 [Am leaving only 10 [xm between the wiring and
`dummy wiring. See, e.g., Zhang, 10:7-17. Thus, the
`dummy patterns would comprise at least 30% of the
`area.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`CC21-3
`
`Page 511 of 1919
`
`

`
`APPENDIX CC21
`
`tantalum, titanium and alloys thereof.
`CLAIM 13
`The method for forming an array
`substrate for display according to claim
`11, wherein the upper layer wiring
`material is selected from the group
`consisting of molybdenum, chromium,
`tantalum, titanium and alloys thereof.
`CLAIM 15
`The method for forming an array
`substrate for display according to claim
`12 wherein the upper layer wiring
`material does not become insoluble in
`an acid or alkaline etchant.
`CLAIM 16
`The method for forming an array
`substrate for display according to claim
`13 wherein the upper layer wiring
`material does not become insoluble in
`an acid or alkaline etchant.
`
`DC:50680699.1
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`The upper layer of titanium would inherently meet this
`limitation. See, e.g., Zhang, 9:29-33.
`
`Zhang discloses that the wiring can comprise of a
`three layer film of titanium, aluminum, and titanium.
`The upper layer of titanium would inherently meet this
`limitation. See, e.g., Zhang, 9:29-33.
`
`CC21-4
`
`Page 512 of 1919
`
`

`
`APPENDIX CC22
`
`U.S. PATENT NO. 6.689.629 - ZHANG IN VIEW OF SONG
`
`U.S. Patent No. 5,995,189 to Zhang in view of U.S. Patent No. 6,163,356 to Song renders
`
`obvious Claims 2-8 and 10-16 of the '629 patent.
`
`PRIOR ART DISCLOSURE -
`SONG
`
`CLAIM 1
`
`An array substrate for
`display, comprising:
`
`a layer of an insulating
`substrate, having an area;
`
`a thin film transistor array
`formed on the insulating
`substrate;
`
`a plurality of wiring
`arranged on the insulating
`substrate, each wiring
`having a first end, the
`wiring in communication
`with at least one of the
`transistors in the thin film
`array;
`connections pads, each
`connection pad contacting
`the first end of at most one
`of the plurality of wirings;
`
`pixel electrodes, and
`
`Dummy conductive
`patterns, the dummy
`patterns comprising at least
`about 30% of the area of the
`insulating substrate, the
`dummy conductive patterns
`
`PRIOR ART DISCLOSURE -
`ZHANG
`Zhang discloses a liquid crystal
`display device. See, e.g., Zhang,
`Title, Figs. 1 and 16-17.
`Zhang discloses a substrate 1
`made of glass or quartz,
`including an area. See, e.g.,
`Zhang, 1:35-36, Figs. 1 and 16-
`17.
`Zhang discloses scan lines 2 and
`signal lines 3 are formed on the
`element substrate 1 and 101 in a
`matrix with TFTs and pixel
`electrodes at the crossover points
`of the scan and signal lines. See,
`e.g., Zhang, 1:34-40, 6:40-44,
`Figs. 1 and 16-17.
`Zhang discloses scan lines 2 and
`signal lines 3 and are connected
`to the TFTs. See, e.g., Zhang,
`1:34-40, 3:32-40, Figs. 1 and 16-
`17.
`
`Zhang discloses that the signal
`lines 2 and scan lines 3 also
`connect to extension terminals 6.
`See, e.g., Zhang, 1:45-47, 6:51­
`60, Figs. 1 and 16-17.
`Zhang discloses a pixel section
`12. See, e.g., Zhang, Figs. 1 and
`16-17.
`Zhang discloses dummy wirings
`304 located in the sealing
`material formation region
`patterns which can be located
`between the pixel section and the
`extension terminals. See, e.g..
`
`CC22- 1
`
`Page 513 of 1919
`
`

`
`situated between the
`connection pads and the
`pixel electrodes such that
`the dummy patters are not in
`contact with any of the
`wiring.
`
`CLAIM 2
`The array substrate for
`display according to claim
`1, wherein at least one of
`the wirings comprises at
`least an upper layer and a
`lower layer of conductive
`materials.
`CLAIM 3
`The array substrate for
`display according to claim 2
`wherein the lower layer
`wiring material is selected
`from the group consisting of
`aluminum and aluminum
`alloys.
`CLAIM 4
`The array substrate for
`display according to claim 2
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`CLAIM 5
`The array substrate for
`display according to claim
`3, wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`
`APPENDIX CC22
`
`Zhang, Figs. 4, 8 and 16.
`Further, the dummy wirings are
`not in contact with the wiring.
`
`Zhang also discloses that, for
`example, the distance between
`wiring is 50 [Am and that the
`dummy wirings are 30 [im
`leaving only 10 [im between the
`wiring and dummy wiring. See,
`e:g., Zhang, 10:7-17. Thus, the
`dummy patterns would comprise
`at least 30% of the area.
`
`'
`
`CC22 - 2
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g..
`Song col 4,11. 30-50; col. 811.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g..
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g.,
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g.,
`Song col 4,11. 30-50; col. 8 11.
`
`Page 514 of 1919
`
`

`
`tantalum, titanium and
`alloys thereof.
`CLAIM 6
`The array substrate for
`display according to claim
`5, wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum and alloys
`thereof.
`CLAIM 7
`The array substrate for
`display according to claim 4
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIM 8
`The array substrate for
`display according to claim 5
`wherein the upper layer
`wiring material does not
`become insoluble in an acid
`or alkaline etchant.
`
`CLAIM 9
`A meted [sic] for forming
`an array substrate for
`display, comprising:
`forming a layer of an
`insulating substrate, having
`an area;
`
`forming a thin film
`transistor array formed on
`the insulating substrate;
`
`APPENDIX CC22
`
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g..
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g..
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g.,
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Zhang discloses a liquid crystal
`display device. See, e.g., Zhang,
`Title, Figs. 1 and 16-17.
`Zhang discloses a substrate 1
`made of glass or quartz,
`including an area. See, e.g.,
`Zhang, 1:35-36, Figs. 1 and 16-
`17.
`Zhang discloses scan lines 2 and
`signal lines 3 are formed on the
`element substrate 1 and 101 in a
`matrix with TFTs and pixel
`electrodes at the crossover points
`of the scan and signal lines. See,
`e.g., Zhang, 1:34-40, 6:40-44,
`Figs. 1 and 16-17.
`
`CC22 - 3
`
`Page 515 of 1919
`
`

`
`each wiring having a first
`end, the wiring in
`communication with at least
`on of the transistors in the
`thin film array;
`forming connections pads,
`each connection pad
`contacting the first end of at
`most one of the plurality of
`wirings;
`Forming pixel electrodes.
`and
`
`forming dummy conductive
`patterns, the dummy
`patterns comprising at least
`about 30% of the area of the
`insulating substrate, the
`dummy conductive patterns
`situated between the
`connection pads and the
`pixel electrodes such that
`the dummy patters are not in
`contact with any of the
`wiring.
`
`CLAIM 10
`The method for forming an
`array substrate for display
`according to claim 9,
`wherein at least one of the
`wirings comprises at least an
`upper layer and a lower
`layer of conductive
`materials.
`CLAIM 11
`The method for forming an
`array substrate for display
`according to claim 10
`
`APPENDIX CC22
`
`Zhang discloses scan lines 2 and
`signal lines 3 and are connected
`to the TFTs. See, e.g., Zhang,
`1:34-40, 3:32-40, Figs. 1 and 16-
`17.
`Zhang discloses that the signal
`lines 2 and scan lines 3 also
`connect to extension terminals 6.
`See, e.g., Zhang, 1:45-47, 6:51­
`60, Figs. 1 and 16-17.
`Zhang discloses a pixel section
`12. See, e.g., Zhang, Figs. 1 and
`16-17.
`Zhang discloses dummy wirings
`304 located in the sealing
`material formation region
`patterns which can be located
`between the pixel section and the
`extension terminals. See, e.g.,
`Zhang, Figs. 4, 8 and 16.
`Further, the dummy wirings are
`not in contact with the wiring.
`
`Zhang also discloses that, for
`example, the distance between
`wiring is 50 (am and that the
`dummy wirings are 30 jim
`leaving only 10 nm between the
`wiring and dummy wiring. See,
`e.g., Zhang, 10:7-17. Thus, the
`dummy patterns would comprise
`at least 30% of the area.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`molybdenum, tantalum or
`antimony on top. See e.g..
`Song col 4,11. 30-50; col. 8 11.
`5-18.
`
`Song discloses a dual layer
`wiring including aluminum
`with chromium,
`
`CC22 - 4
`
`Page 516 of 1919
`
`

`
`wherein the lower layer
`wiring material is selected
`from the group consisting of
`aluminum and aluminum
`alloys.
`CLAIM 12
`The method for forming an
`array substrate for display
`according to claim 10
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`CLAIM 13
`The method for forming an
`array substrate for display
`according to claim 11,
`wherein the upper layer
`wiring material is selected
`from the group consisting of
`molybdenum, chromium,
`tantalum, titanium and
`alloys thereof.
`CLAIM 14
`The method for forming an
`array substrate for display
`according to claim 13
`wherein the upper wiring
`material is selected from the
`group consisting of
`molybdenum, and alloys
`there