[0005] On the other hand, in the above-mentioned ferromagnetic tunnel junction, it has recently been revealed that a large magnetoresistive ratio can be obtained as compared with a GMR material such as a spin valve film.
, Ta/Pd, Al2 O3, amorphous alloy, etc., can be used as the underlayer to flatten the upper laminated structure and change the crystal growth, so that the exchange bias of the antiferromagnetic film/ferromagnetic layer interface is strong.
[0032] Specific constituent materials of the tunnel barrier layers 3, 12, and 14 include insulators (dielectrics) such as Al2O3, AlOx, SiO2, SiOx, AlN, NiO, CoO, MgO, and HfO2, FeSi, GeSb, and PbSe.
In addition, current-voltage characteristics are measured, and assuming that the voltage applied per layer is half, S and Φ are obtained using the Simmons equation, and S/(Φ)1 The relationship between the temperature dependence of the magnetoresistance ratio and S/(Φ) 1/2 can also be determined by calculating /2.
[0071] First, at the initial degree of vacuum of 2×10 −7 Torr, the above-mentioned laminated film was formed into a lower wiring shape with a width of 50 μm by using ordinary photolithography technology and ion milling