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Inventors

Yong-Won Cha Kyu-Tae Na Yong-Soon Choi Eunkee Hong Ju-Seon Goo

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SAMSUNG ELECTRONICS CO., LTD.

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METHODS OF FORMING TRENCH ISOLATION LAYERS USING HIGH DENSITY PLASMA CHEMICAL VAPOR DEPOSITION

11/149,307 | U.S. Patent Application

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Location ELECTRONIC

Filed June 9, 2005

Examiner TONIAE M THOMAS

Class 438

Art Group 2822

Patent No. 7,332,409

Case Type Utility - 438/435000

Status Patented Case

Child 2004-43172

Child 2004-94758

Last Updated: 4 years, 3 months ago

Date	#	Transaction
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METHODS OF FORMING TRENCH ISOLATION LAYERS USING HIGH DENSITY PLASMA CHEMICAL VAPOR DEPOSITION

11/149,307 | U.S. Patent Application

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