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INTEGRATED CIRCUIT CHIP ASSEMBLY HAVING ARRAY OF THERMALLY CONDUCTIVE FEATURES ARRANGED IN APERTURE OF CIRCUIT SUBSTRATE

11/562,537 | U.S. Patent Application

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Location ELECTRONIC

Filed Nov. 22, 2006

Examiner ALEXANDER O WILLIAMS

Class 257

Art Group 2826

Patent No. 7,982,307

Case Type Utility - 257/712000

Status Patented Case

Last Updated: 2 years, 4 months ago

Date	#	Transaction
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INTEGRATED CIRCUIT CHIP ASSEMBLY HAVING ARRAY OF THERMALLY CONDUCTIVE FEATURES ARRANGED IN APERTURE OF CIRCUIT SUBSTRATE

11/562,537 | U.S. Patent Application

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