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Inventors

Stanford W. Crane, JR.Jennifer Colegrove Zsolt Horvath Myoung-soo Jeon Joshua Nickel Lei-Ming Yang

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SILICON BANDWIDTH, INC.

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MODULAR SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURING THEREOF

10/81,146 | U.S. Patent Application

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Location ELECTRONIC

Filed Feb. 25, 2002

Examiner DAVID A ZARNEKE

Class 257

Art Group 2827

Patent No. 6,700,138

Case Type Utility - 257/099000

Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362

Child PCT/US03/05534 Published

Child 10/636,754 Abandoned

Last Updated: 5 years, 4 months ago

Date	#	Transaction
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MODULAR SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURING THEREOF

10/81,146 | U.S. Patent Application

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