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Multi-chip module having interconnect dies

10/194,074 | U.S. Patent Application

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Location ELECTRONIC
Filed July 15, 2002
Examiner ALEXANDER O WILLIAMS
Class 257
Art Group 2826
Case Type Utility - 257/723000
Status Abandoned -- Failure to Respond to an Office Action
Parent 09/903,699 Patented
Parent 09/484,047 Patented
Parent 08/970,379 Patented
Last Updated: 4 years, 9 months ago
Date # Transaction