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SEMICONDUCTOR DEVICE PACKAGE INCLUDING A SUBSTRATE HAVING BONDING FINGERS WITHIN AN ELECTRICALLY CONDUCTIVE RING SURROUNDING A DIE AREA AND A COMBINED POWER AND GROUND PLANE TO STABILIZE SIGNAL PATH IMPEDANCES

09/6,356 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Jan. 13, 1998
Examiner LUAN C THAI
Class 257
Art Group 2811
Patent No. 6,064,113
Case Type Utility - 257/691000
Status Patented Case
Child 09/428,164 Patented
Child 09/618,143 Abandoned
Last Updated: 2 years, 2 months ago
Date # Transaction