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METHOD AND STRUCTURE FOR REDUCING THE INCIDENCE OF VOIDING IN AN UNDERFILL LAYER OF AN ELECTRONIC COMPONENT PACKAGE

09/465,425 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Dec. 20, 1999
Examiner SHAWN RILEY
Class 174
Art Group 2838
Patent No. 6,320,127
Case Type Utility - 174/052200
Status Patented Case
Last Updated: 1 year, 10 months ago
Date # Transaction