throbber

`United States Patent
`[19J
`
`Miller et al.
`
`[11]Patent Number:
`
`5,841,078
`*Nov. 24, 1998
`[45]Date of Patent:
`
`I 1111111111111111 11111 111111111111111 1111111111 1111111111 111111111111111111
`
`US005841078A
`
`[54]
`OBJECT POSITION DETECTOR
`
`Inventors: Robert J. Miller, San Jose; Stephen J.
`
`
`
`[75]
`
`
`Bisset, Los Altos, both of Calif.
`
`3/1995 Japan .............................. G06F 3/033
`
`7-072976
`
`11/1984 United Kingdom ............ G06F 3/033
`2 139 762
`
`10/1993 United Kingdom ............ G06F 3/033
`2 266 038
`
`4/1995 United Kingdom ........... G06K 11/12
`2 288 665
`
`3/1991 WIPO .............................. G09G 3/02
`91/03039
`
`4/1991 WIPO .............................. G09G 3/02
`91/05327
`
`
`3/1996 WIPO ............................. G06F 3/033
`96/07966
`
`4/1996 WIPO ............................. G06F 3/033
`96/11435
`Notice: The term of this patent shall not extend
`
`
`
`6/1996 WIPO ............................ G08C 21/00
`[ * l
`96/18179
`
`beyond the expiration date of Pat. No.
`5,648,642.
`
`
`[73]
`
`
`
`Assignee: Synaptics, Inc., San Jose, Calif.
`
`OTHER PUBLICATIONS
`
`Appl. No.: 739,607
`[21]
`
`Filed: Oct. 30, 1996
`[22]
`
`
`
`
`
`Related U.S. Application Data
`
`"Double-Click Generation Method for Pen Operations",
`
`
`
`
`
`IBM Technical Disclosure Bulletin, Nov. 1992, vol. 35, No.
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`"Three-Axis Touch-Sensitive Pad", IBM Technical Disclo­
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`
`
`sure Bulletin, Jan. 1987, vol. 29, No. 8, pp. 3451-3453.
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`
`Chun, et al., "A High-Performance Silicon Tactile Imager
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`
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`Based on a Capacitive Cell", IEEE Transactions on Electron
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`Continuation of Ser. No. 329,809, Oct. 25, 1994, Pat. No.
`
`
`Devices, Jul. 1985, vol. ED-32, No. 7, pp. 1196-1201.
`
`
`5,648,642, which is a continuation of Ser. No. 895,934, Jun.
`
`
`
`"Pressure-Sensitive Icons", IBM Technical Disclosure Bul­
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`Apr. 1993, vol. 36, No. 4, pp. 399-403.
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`
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`
`Wilton, Microsoft Windows 3 Developer's Workshop, 1991,
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`Field of Search ..................................... 345/173, 174;
`[58]
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`
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`
`
`341/33; 178/18.01, 18.03, 18.06, 19.03
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`
`
`
`
`
`& Messtechnik 97, No. 7, Munchen, DE, Jul. 1989, pp.
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`
`. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
`
`[56]
`
`
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`Re. 23,030 8/1948 Holt .
`
`
`2,219,497 10/1940 Stevens et al. .
`
`Primary Examiner-Vijay Shankar
`
`
`
`
`or Firm--D' Alessandro & Ritchie
`Attorney, Agent,
`
`[57]
`
`ABSTRACT
`
`
`
`(List continued on next page.)
`
`A proximity sensor system includes a sensor matrix array
`
`
`
`
`
`
`
`
`having a characteristic capacitance between horizontal and
`FOREIGN PATENT DOCUMENTS
`
`
`
`
`vertical conductors connected to sensor pads. The capaci­
`
`
`
`European Pat. Off ........... G0lB 7/00
`12/1985
`0 187 372
`
`
`
`
`tance changes as a function of the proximity of an object or
`
`
`
`European Pat. Off. . ....... G06F 3/033
`10/1990
`0 394 614
`
`
`
`
`objects to the sensor matrix. The change in capacitance of
`
`
`
`European Pat. Off. . ....... G06F 3/033
`6/1992
`0 490 001
`
`
`each node in both the X and Y directions of the matrix due
`
`European Pat. Off. G06K 11/16
`12/1993
`0 574 213
`
`
`
`to the approach of an object is converted to a set of voltages
`
`European Pat. Off. G06K 11/16
`3/1994
`0 589 498
`
`
`
`in the X and Y directions. These voltages are processed by
`
`European Pat. Off. G06K 11/16
`8/1994
`0 609 021
`
`
`
`
`analog circuitry to develop electrical signals representative
`
`France ........................... G06K 11/16
`5/1990
`2 662 528
`
`Japan ................................ G06F 3/03
`10/1985
`60-205625
`
`
`
`
`of the centroid of the profile of the object, i.e, its position in
`
`Japan .............................. G06F 3/033
`6/1987
`62-126429
`
`
`
`the X and Y dimensions. The profile of position may also be
`
`Japan .............................. G06F 3/033
`4/1988
`63-073415
`
`
`
`
`integrated to provide Z-axis (pressure) information.
`2/1990
`
`Japan ............................. G02G 1/133
`2-040614
`1/1992
`
`Japan .............................. G06F 3/033
`4-015725
`
`6 Claims, 17 Drawing Sheets
`5/1994
`
`Japan .............................. G06F 3/033
`6-139022
`
`Samsung EX1013 Page 1
`
`

`

`5,841,078
`Page 2
`
`U.S. PATENT DOCUMENTS
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`
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`
`
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`
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`
`
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`
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`
`
`
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`7/1993
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`
`
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`
`
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`
`
`
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`
`
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`
`
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`
`
`
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`5,365,254
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`
`
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`
`
`
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`
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`
`
`
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`5,373,118
`12/1994
`
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`
`
`
`
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`5,374,787
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`
`
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`
`
`
`
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`
`
`
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`
`
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`4/1995
`
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`
`Samsung EX1013 Page 2
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`

`

`U.S. Patent Nov. 24, 1998
`5,841,078
`
`Sheet 1 of 17
`
`141414141414141414141414141414
`
`
`
`♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦
`
`22
`
`♦ ♦ ♦ ♦ ♦ ♦ ♦♦ ♦ ♦ ♦ ♦ ♦ ♦
`
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`
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`16
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`12 ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦
`
`♦ ♦ ♦♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦
`
`FIG. 1A
`20
`
`22
`
`• • • • • • • • • • • •
`
`18
`18
`18
`18
`18
`18
`18
`18
`18
`-18
`18
`18
`18
`18
`18
`
`12
`
`• • • • • • • • • • • • • •
`
`FIG. 18
`
`Samsung EX1013 Page 3
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`

`

`U.S. Patent Nov. 24, 1998
`5,841,078
`
`Sheet 2 of 17
`
`14
`
`12
`
`18
`
`FIG. 1G
`
`. ========
`24
`12 � r:::=.==. ==========
`�� 6
`18
`
`!
`10
`
`FIG. 10
`
`Samsung EX1013 Page 4
`
`

`

`SAMPLE
`X1
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`X2
`32-2
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`Samsung EX1013 Page 5
`
`

`

`U.S. Patent Nov. 24, 1998
`17
`
`5,841,078
`Sheet 4 of
`
`ov-�����-�������=-----U.L.____._,_,_-'-'-'------'-'-'--....u.,_-
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`x1 X2 X3 X4 Xs x6 X7 Xs Xg X10 X11 X12 X13 X14 X15
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`
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`
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`
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`
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`
`Vour
`
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`1-90
`
`OFFSET ADJUST
`
`FIG. 4
`
`Samsung EX1013 Page 6
`
`

`

`U.S. Patent Nov. 24, 1998
`5,841,078
`
`Sheet 5 of 17
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`Samsung EX1013 Page 7
`
`

`

`U.S. Patent Nov. 24, 1998
`5,841,078
`
`Sheet 6 of 17
`
`74
`
`--
`
`RESET
`'----104 102
`SELECT(n)
`SELECT(n)
`78
`78
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`108
`76
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`
`74
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`78
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`
`130
`
`FIG. 7A
`
`Samsung EX1013 Page 8
`
`

`

`U.S. Patent
`5,841,078
`Nov. 24, 1998
`
`Sheet 7 of 17
`
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`Samsung EX1013 Page 9
`
`

`

`U.S. Patent
`5,841,078
`Nov. 24, 1998
`
`Sheet 8 of 17
`
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`Samsung EX1013 Page 10
`
`

`

`U.S. Patent Nov. 24, 1998
`5,841,078
`
`Sheet 9 of 17
`
`Voo
`
`VB IAS o------cf
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`I n2 u-- ---+-
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`150
`
`170
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`FIG. 8
`
`Samsung EX1013 Page 11
`
`

`

`
`
`U.S. Patent Nov. 24, 1998 17 5,841,078
`Sheet 10 of
`
`Voo
`
`VLBIAS o---------a
`192
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`190
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`184
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`FIG. 9
`
`OUTPUT
`
`212
`
`Samsung EX1013 Page 12
`
`

`

`U.S. Patent
`
`
`17 5,841,078
`Nov. 24, 1998 Sheet 11 of
`
`Voo
`
`�222
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`V1N \
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`FIG. 13
`
`Samsung EX1013 Page 13
`
`

`

`U.S. Patent
`17 5,841,078
`Sheet 12 of
`Nov. 24, 1998
`
`Voo
`
`258__..r:;
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`FIG. 11
`
`244
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`VouT
`
`Samsung EX1013 Page 14
`
`

`

`
`U.S. Patent Nov. 24, 1998 17 5,841,078
`Sheet 13 of
`
`\
`314
`
`62
`
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`
`282....,/_
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`296
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`FIG. 12
`
`Samsung EX1013 Page 15
`
`

`

`U.S. Patent
`17 5,841,078
`Sheet 14 of
`Nov. 24, 1998
`
`XsELECT
`78x
`
`14 Cxy
`
`76x
`
`>-------oXouT
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`78y
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`y OUT
`
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`FIG. 14
`
`Samsung EX1013 Page 16
`
`

`

`d •
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`
`Samsung EX1013 Page 17
`
`

`

`U.S. Patent
`
`
`Nov. 24, 1998 16 of 17
`
`5,841,078
`Sheet
`
`362-1
`\
`
`•
`•
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`SENSOR
`ARRAY
`
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`
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`
`TO COMPUTER
`
`FIG. 16A
`
`Samsung EX1013 Page 18
`
`

`

`U.S. Patent
`Sheet 17 of 17
`Nov. 24, 1998
`
`5,841,078
`
`362-1
`
`•
`
`•
`
`•
`
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`
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`
`380 ,,.----"
`
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`IN
`
`382 ___r NEURAL NETWORK SYNAPTIC ARRAY
`
`OUT
`
`FIG. 16B
`
`Samsung EX1013 Page 19
`
`

`

`5,841,078
`
`1
`
`2
`infra-red matrix position detector consumes high power and
`
`
`
`
`
`OBJECT POSITION DETECTOR
`
`suffers from relatively poor resolution.
`CROSS-REFERENCE TO RELATED
`
`APPLICATIONS
`
`BRIEF DESCRIPTION OF THE INVENTION
`
`5
`The present invention comprises a position-sensing tech­
`
`
`
`
`This is a continuation of patent application Ser. No.
`
`
`
`nology particularly useful for applications where finger
`
`
`08/329,809, filed Oct. 25, 1994, now U.S. Pat. No. 5,648,
`
`
`
`position information is needed, such as in computer
`
`
`
`
`642 which is a file-wrapper continuation of patent applica­
`
`
`
`
`"mouse" or trackball environments. However the position­
`
`tion Ser. No. 07/895,934, filed Jun. 8, 1992, now abandoned.
`
`
`
`
`
`sensing technology of the present invention has much more
`
`
`
`
`
`10 general application than a computer mouse, because its
`BACKGROUND OF THE INVENTION
`
`
`
`
`sensor can detect and report if one or more points are being
`1.Field Of The Invention
`
`
`
`
`touched. In addition, the detector can sense the pressure of
`
`
`
`
`The present invention relates to object position sensing
`the touch.
`
`
`
`transducers and systems. More particularly, the present
`There are at least two distinct embodiments of the present
`
`
`
`
`
`
`
`invention relates to object position sensors useful in appli-15
`
`
`
`invention. Both embodiments of the present invention
`
`
`
`
`
`cations such as cursor movement for computing devices and
`
`
`
`include a sensor comprising a plurality of spaced apart
`other applications.
`
`
`
`
`generally parallel conductive lines disposed on a first sur­
`
`2. The Prior Art
`face.
`
`
`
`
`Numerous devices are available or have been proposed
`According to a first embodiment of the present invention,
`
`
`
`
`20
`
`
`for use as object position detectors for use in computer
`
`
`referred to herein as a "finger pointer" embodiment, a
`
`
`
`
`systems and other applications. The most familiar of such
`
`
`
`
`position sensing system includes a position sensing trans­
`
`
`
`
`devices is the computer "mouse". While extremely popular
`
`
`
`
`ducer comprising a touch-sensitive surface disposed on a
`
`
`as a position indicating device, a mouse has mechanical
`
`
`
`
`substrate, such as a printed circuit board, including a matrix
`
`parts and requires a surface upon which to roll its position
`
`
`
`
`of conductive lines. A first set of conductive lines runs in a
`
`
`ball. Furthermore, a mouse usually needs to be moved over 25
`
`
`first direction and is insulated from a second set of conduc­
`
`
`
`
`long distances for reasonable resolution. Finally, a mouse
`
`
`
`tive lines running in a second direction generally perpen­
`
`
`requires the user to lift a hand from the keyboard to make the
`
`
`
`dicular to the first direction. An insulating layer is disposed
`
`
`cursor movement, thereby upsetting the prime purpose,
`
`
`
`over the first and second sets of conductive lines. The
`
`
`which is usually typing on the computer keyboard.
`
`
`
`insulating layer is thin enough to promote significant capaci­
`30
`
`
`
`
`Trackball devices are similar to mouse devices. A major
`
`
`
`
`tive coupling between a finger placed on its surface and the
`
`
`
`
`difference, however is that, unlike a mouse device, a track­
`
`
`first and second sets of conductive lines.
`
`
`
`ball device does not require a surface across which it must
`
`
`
`
`Sensing electronics respond to the proximity of a finger to
`
`
`
`
`
`be rolled. Trackball devices are still expensive, have moving
`
`
`
`
`translate the capacitance changes between the conductors
`
`
`
`
`parts, and require a relatively heavy touch as do the mouse
`
`
`caused by finger proximity into position and touch pressure
`35
`
`devices. They are also large in size and do not fit well in a
`
`
`
`
`information. Its output is a simple X, Y and pressure value
`
`
`
`volume sensitive application like a laptop computer.
`
`
`
`
`of the one object on its surface. The matrix of conductive
`
`There are several available touch-sense technologies
`
`
`
`lines are successively scanned, one at a time, with the
`
`
`
`which may be employed for use as a position indicator.
`
`
`
`capacitive information from that scan indicating how close
`
`
`
`are known and used in 40 Resistive-membrane position sensors
`
`
`a finger is to that node. That information provides a profile
`
`
`
`
`several applications. However, they generally suffer from
`
`
`
`of the proximity of the finger to the sensor in each dimen-
`
`
`
`
`poor resolution, the sensor surface is exposed to the user and
`
`
`
`sion. The centroid of the profile is computed with that value
`
`
`
`is thus subject to wear. In addition, resistive-membrane
`
`
`
`
`being the position of the finger in that dimension. The profile
`
`
`
`touch sensors are relatively expensive. A one-surface
`
`of position is also integrated with that result providing the Z
`
`
`
`
`approach requires a user to be grounded to the sensor for
`
`
`
`(pressure) information. The position sensor of the first
`45
`
`
`
`reliable operation. This cannot be guaranteed in portable
`
`
`
`embodiment of the invention can only detect the position of
`
`
`
`
`computers. An example of a one-surface approach is the
`
`
`
`
`one object on its sensor surface. If more than one object is
`
`
`
`UnMouse product by Micro Touch, of Wilmington, Mass. A
`
`
`
`present, the position sensor of this embodiment tries to
`
`
`
`two-surface approach has poorer resolution and potentially
`
`
`
`compute the centroid position of the combined set of objects.
`
`will wear out very quickly in time.
`
`
`According to a second embodiment of the present
`50
`
`
`
`Surface Acoustic Wave (SAW) devices have potential use
`
`
`
`invention, a position sensing system includes a position
`
`as position indicators. However, this sensor technology is
`
`
`
`
`
`
`
`
`sensing transducer as described herein. Sensing electronics
`expensive and is not sensitive to light touch. In addition,
`
`
`
`
`
`
`
`
`respond to the proximity of a finger to translate the capaci­
`SAW devices are sensitive to residue buildup on the touch
`
`
`
`
`
`
`
`tance changes between the conductors running in one direc-
`
`
`
`surfaces and generally have poor resolution.
`
`
`
`55 tion and those running in the other direction caused by finger
`
`
`
`
`Strain gauge or pressure plate approaches are an interest­
`
`
`
`
`proximity into position and touch pressure information. The
`
`ing position sensing technology, but suffer from several
`
`
`
`
`
`
`
`sensing electronics of the second embodiment of the inven­
`
`drawbacks. This approach may employ piezo-electric trans­
`
`
`
`
`tion saves information for every node in its sensor matrix
`
`
`
`
`ducers. One drawback is that the piezo phenomena is an AC
`
`
`
`and can thereby give the full X/Y dimension picture of what
`
`
`
`
`phenomena and may be sensitive to the user's rate of
`60
`
`
`
`
`it is sensing. It thus has much broader application for richer
`
`
`
`
`movement. In addition, strain gauge or pressure plate
`
`
`multi-dimensional sensing than does the first "finger
`
`
`approaches are somewhat expensive because special sensors
`
`
`
`
`pointer" embodiment. In this embodiment, referred to herein
`are required.
`
`
`
`
`
`as the "position matrix" approach, the x,y coordinate infor­
`
`
`
`
`
`
`
`
`Optical approaches are also possible but are somewhat mation can be used as input to a on-chip neural network
`
`
`
`
`
`
`
`
`
`limited for several reasons. All would require light genera-65 processor. This allows an operator to use multiple fingers,
`
`
`
`
`
`
`tion which will require external components and increase coordinated gestures, etc. for even more complex interac-
`
`
`cost and power drain. For example, a "finger-breaking" tions.
`
`Samsung EX1013 Page 20
`
`

`

`5,841,078
`
`4
`3
`
`
`
`BRIEF DESCRIPTION OF THE DRAWINGS FIG. 14 is a schematic diagram of a combination driving­
`
`
`
`
`point impedance circuit and receiving-point impedance cir­
`
`FIG. la is a top view of an object position sensor
`
`
`
`
`cuit according to a presently preferred position matrix
`
`
`
`
`
`transducer according to a presently preferred embodiment of
`
`
`embodiment of the invention.
`the invention showing the object position sensor surface
`
`
`
`
`FIG. 15 is a block diagram of a structure of a portion of
`
`
`
`5
`layer including a top conductive trace layer and conductive
`
`
`
`
`
`
`a sample/hold array suitable for use in the present invention.
`
`
`pads connected to a bottom trace layer.
`
`
`FIG. 16a is a block diagram of a simple version of a
`
`
`
`
`FIG. lb is a bottom view of the object position sensor
`
`
`
`
`position matrix embodiment of the present invention in
`
`
`transducer of FIG. la showing the bottom conductive trace
`
`
`
`
`
`which the matrix of voltage information is sent to a com-
`layer.
`
`10 puter which processes the data.
`
`
`FIG. le is a composite view of the object position sensor
`
`
`FIG. 16b is a block diagram of a second version of a
`
`
`
`
`
`transducer of FIGS. la and lb showing both the top and
`
`
`
`position matrix embodiment of the present invention
`
`bottom conductive trace layers.
`
`
`
`
`employing a sample/hold array such as that depicted in FIG.
`
`
`
`FIG. ld is a cross-sectional view of the object position
`15.
`
`
`sensor transducer of FIGS. la-le.
`15
`DETAILED DESCRIPTION OF A PREFERRED
`
`
`
`
`FIG. 2 is a block diagram of sensor decoding electronics
`EMBODIMENT
`
`
`
`which may be used with the sensor transducer in accordance
`
`
`
`
`with a first embodiment of the present invention.
`Those of ordinary skill in the art will realize that the
`
`
`
`
`
`following description of the present invention is illustrative
`
`FIGS. 3a and 3b are graphs of output voltage versus
`20
`
`
`
`
`only and not in any way limiting. Other embodiments of the
`
`
`
`
`matrix conductor position which illustrate the effect of the
`
`
`
`
`invention will readily suggest themselves to such skilled
`minimum detector.
`persons.
`
`
`
`FIG. 4 is a simplified schematic diagram of an integrating
`The present invention brings together in combination a
`
`
`
`
`
`
`charge amplifier circuit suitable for use in the present
`
`
`number of unique features which allow for new applications
`invention.
`25
`
`
`
`
`not before possible. Because the object position sensor of the
`
`
`
`
`
`FIG. 5 is a timing diagram showing the relative timing of
`
`
`
`
`present invention has very low power requirements, it is
`
`
`
`
`control signals used to operate the object position sensor
`
`
`
`
`beneficial for use in battery operated or low power applica­
`
`
`
`system of the present invention with an integrating charge
`
`
`
`tions such as lap top or portable computers. It is also a very
`
`amplifier as shown in FIG. 4.
`
`
`and is therefore 30 low cost solution, has no moving parts (
`
`
`
`FIG. 6a is a schematic diagram of a first alternate embodi­
`
`
`
`virtually maintenance free), and uses the existing printed
`
`ment of an integrating charge amplifier circuit suitable for
`
`
`
`
`
`circuit board traces for sensors. The sensing technology of
`
`
`
`
`use in the present invention including additional compo­
`
`
`the present invention can be integrated into a computer
`
`
`
`nents to bring the circuit to equilibrium prior to integration
`
`
`motherboard to even further lower its cost in computer
`measurement.
`
`
`
`
`
`applications. Similarly, in other applications the sensor can
`35
`
`
`
`FIG. 6b is a timing diagram showing the control and
`
`be part of an already existent circuit board.
`
`
`
`
`timing signals used to drive the integrating charge amplifier
`
`
`
`Because of its small size and low profile, the sensor
`
`
`of FIG. 6a and the response of various nodes in the amplifier
`
`
`
`
`technology of the present invention is useful in lap top or
`to those signals.
`portable applications where volume is important consider-
`
`
`FIG. 7a is a schematic diagram of a second alternate
`
`
`
`
`invention of the present 40 ation. The sensor technology
`
`
`
`embodiment of an integrating charge amplifier circuit suit­
`
`
`
`requires circuit board space for only a single sensor interface
`
`
`
`
`able for use in the present invention including additional
`
`
`
`chip that can interface directly to a microprocessor, plus the
`
`
`
`components to bring the circuit to equilibrium prior to
`
`area needed on the printed circuit board for sensing.
`
`integration measurement.
`
`
`
`
`The sensor material can be anything that allows creation
`
`
`
`not only 45 of a conductive X/Y matrix of pads. This includes
`and FIG. 7b is a timing diagram showing the control
`
`
`
`
`
`
`standard PC board, but also flexible PC board, conductive
`
`
`
`
`timing signals used to drive the integrating charge amplifier
`
`
`
`elastomer materials, and piezo-electric Kynar plastic mate­
`
`
`
`of FIG. 7a and the response of various nodes in the amplifier
`
`
`
`
`rials. This renders it useful as well in any portable equipment
`to those signals.
`
`
`
`application or in human interface where the sensor needs to
`
`
`FIG. 8 is a schematic diagram of a minimum detector
`
`
`be molded to fit within the hand.
`
`
`
`
`
`circuit according to a presently preferred embodimen

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