PLASTIC:
`ENCAPSULATED
`MICROELECTRONICS
`
`-ii
`
`Nichia Exhibit 1016
`Page 1
`
`

`

`
`
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`This text is printed on acid-free paper,
`
`Copyright © 1995 by John Wilcy & Sons, Inc.
`
`All rights reserved. Published simultaneously in Canada.
`
`Reproduction or translation of any part of this work beyond
`that permitted by Section 107 or 108 ofthe 1976 United
`States Copyright Act withoutthe permissionof the copyright
`owner is unlawful. Requests for permission or further
`information should be addressed to the Permissions Department,
`John Wiley & Sons, Inc., 605 Third Avenue, NewYork, NY
`10158-0012.
`
`This publication is designed to provide accurate and
`authoritative information in regard to the subject
`matter covered. It is sold with the understanding that
`the publisher is not engaged in rendering legal, accounting.
`or other professional services. If legal advice or other
`expert assistance is required, the services of a competent
`professional person should be sought.
`
`Library of Congress Cataloging-in-Publication Data:
`
`Pecht, Michael.
`Plastic encapsulated microelectronics: materials, processes,
`quality, reliability, and applications / Michael G, Pecht, Luu T.
`Nguyen, Edward B. Hakim.
`p.
`cm.
`Includes index.
`ISBN 0-471-30625-8 (cloth ; alk. paper)
`1. Microelectronic packaging--Materials. 2. Mictoencapsulation.
`3. Plastics in packaging.
`I. Nguyen, Luu T.
`Il. Hakim, Edward B.
`Ill. Title.
`TK7874.P428 1995
`
`621.381'046--dc20
`
`94-46528
`
`Printed in the United States of America
`
`0987654321
`
`
`
`Nichia Exhibit 1016
`Page 2
`
`Nichia Exhibit 1016
`Page 2
`
`

`

` 466
`
`GLOSSARY
`i.¢., the quantity of heat required to raise the temperature of| 8 of a substance by
`
`GLO
`
`
`
`temperature;
`THE
`and ¢
`FG;
`
`
`
`
`STITCH BOND:Abond in which a capillary tube is used for feeding the wire and forming the THi
`bond sequentially in a stitch pattern. The wire is not formed into a ball prior to bonding.
`temp,
`
`
`STORAGE TEMPERATURE: The temperature at which a device, without any power applied,
`THE}
`
`is stored,
`mater.
`}
`|
`
`STRESS: Caused by thermal mismatch between the various materials of construction in the
`THE}
`
`device.
`In a plastic-encapsulated device, part of the stress is also due to the curing of the epoxy
`shape,
`
`polymer network which shrinks during the polymerization. Also often referred to a8 packaging
`plastic
`
`stress, shrinkage stress, molding stress, or encapsulating stress.
`|
`
`THEE
`
`STRESS RELAXATION:|The time-dependent decrease in stress in a solid under given means,
`constraint conditions.
`}
`THRE
`SUBSTRATE:A supporting platform for an active or passiveelectrical or electronic component.
`are ing
`proteus
`SURFACE-MOUNT TECHNOLOGY (SMT): The general category ofexpertise for mounting
`i
`surface mount components onto substrates,
`TRANo
`holding
`SURFACE RESISTIVITY: The resistance io a current flow along the surface of a material:
`t
`TRAN{
`TAPE AUTOMATED BONDING (TAB): The utilization ofa metal tape material as a support
`amount
`and carrier of a microelectronic component
`in a gang bonding process.
`i
`ULTRA
`TEMPERATURE CYCLING: An environmental
`test in which the specimen is subjected to
`join twe
`several changes from one temperature to another over a period of time.
`i
`USEFU:
`TENSILE STRENGTH: The pulling stress that has to be applied fo a material
`to be sai
`usually measured in Pa.
`:
`VAPOR
`THERMAL CONDUCTIVITY: The amount of heat per unit time per unit area that can be
`The sole
`conducted through a unit thickness of a material.
`
`
`
`
`
`
`
`
`
`
`
`to break it,
`
`
`
`
`THERMAL EXPANSION: The expansion ofa material when subjected to temperature change
`(usually a temperature increase),
`THERMAL GRADIENT:
`The plot of temperature change across the surface or the bulk
`thickness of a material being heated.
`THERMAL MISMATCH: Difference ofthermalcoefficients ofexpansion ofmaterials thatare
`bonded together.
`
`VIA: A
`made ¢o!
`i
`VIA Ae
`conductiy
`4
`VISCOS)
`toa she
`
`Viscosity,
`
`Nichia Exhibit 1016
`Page 3
`
`Nichia Exhibit 1016
`Page 3
`
`