`
`ENCAPSULATED
`
`MICROELECTRONICS
`
`EdwaraidB.Hkm
`
`Micah61G.Pcht
`
`Luuu.uTNgyen
`
`Nichia Exhibit 1016
`Page 1
`
`
`
`
`
`.-.---»--m-.w-ww—mqr—..-
`
`iE
`iL
`
`
`
`’rhtm
`encar
`technr
`materl
`reliabi
`devei
`ceived
`cases,
`wide rt
`cations
`to be a
`live re
`now,
`dotaile
`develoi
`ductior
`time br
`fession
`databas
`
`For the
`here is t
`of the ;
`assemb
`most tin
`vides pi
`sclentilk
`and reli
`manufat
`special .
`ment-spt
`importan
`
`° Encap
`tion. si
`
`. Fabric:
`depth J
`can or
`produc
`
`- Electrc
`using
`age of
`lnducet
`mg asst
`
`' Failure
`modes
`
`' Failure 2
`tlve strt
`each typ
`
`' The prot
`ing lecl't
`mance .'-i
`the claret]
`- Current
`techniqu
`slmttlallr
`
`PJ't'JstlrI-El‘lc
`an Indisper
`ers and pr
`trical engln
`ics, gems
`tries,
`in 5
`defense [m
`
`This text is primed on acid-free paper.
`
`Copyright © 1995 by John Wiley & Sons, Inc.
`
`All rights reserved. Published simultaneously in Canada.
`
`Reproduction or translation of any part of this work beyond
`that permitted by Section 107 or 108 of the 1976 United
`States Copyright Act without the peimission of the copyright
`owner is unlawful. Requests for permission or further
`information should be addressed to the Permissions Department,
`John Wiley & Sons, Inc., 605 Third Avenue, New York, NY
`10158-0012.
`
`This publication is designed to provide accurate and
`authoritative information in regard to the subject
`matter covered. It is sold with the understanding that
`the publisher is not engaged in rendering legal, accounting
`or other professional services. If legal advice or other
`expert assistance is required, the services of a competent
`professional person should be sought.
`
`Library of Congress Cataloging-in-Publicati0n Data:
`
`Pecht, Michael.
`Plastic encapsulated microelectronics: materials, processes,
`quality, reliability, and applications / Michael G. Pecht, Luu 'l'.
`Nguyen, Edward B. Hakim.
`p.
`cm.
`Includes index.
`ISBN 0-471-30625-8 (cloth ; alk. paper)
`1. Microelectronic packaging-Materials. 2. Microencapsulation.
`3. Plastics in packaging.
`I. Nguyen, Luu T. H. Hakim, Edward E,
`III. Title.
`TK7874.P428 1995
`
`621.38l'046--dc20
`
`94-46528
`
`Printed in the United States of America
`
`10987654321
`
`
`
`Nichia Exhibit 101 6
`
`Page 2
`
`Nichia Exhibit 1016
`Page 2
`
`
`
`
`
`
`
`
`
`
`466
`temperature;
`l"(_'.
`
`GLOSSARY
`i.e., the quantity of heat required to raise the temperature of I g of a substance by
`
`
`
`|
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`STITCH BOND: A bond in which a capillary tube is used for feeding the wire and forming the
`bond sequentially in a stitch pattern. The wire is not formed into a ball prior to bonding.
`STORAGE TEMPERATURE: The temperature at which a device, without any power applied,
`is stored.
`
`STRESS: Cnusetl by thermal mismatch between [he various materials of construction in the
`device.
`In a plastic—encapsulated device, part ofthe stress is also due to the curing of' the epoxy
`polymer netwurk which shrinks during the polymerization. Also often referred to at: packaging
`stress. shrinkage stress. molding stress, or encapsulating stress.
`
`STRESS RELAXATION:
`constraint conditions.
`
`The time-dependent decrease in stress in a solid under given
`
`SUBSTRATE: A supporting platform for an active or passive electrical or electronic component.
`SURFACE-MUUN‘I' TECHNOLOGY (SMT): The general category ofexpertise for mounting
`Surface mount components onto substrates.
`SURFACE RESISTIVITY: The resistance to a current flow along the surface of a material;
`TAPE AUTOMATED BONDING (TAB): The utilization of a metal tape material as a support
`and carrier of a microelectronic component
`in a gang bonding process
`
`test in which the specimen is subjected to
`TEMPERATURE CYCLING: An environmental
`several changes from one temperature to another over a period of time.
`
`TENSILE STRENGTH: The pulling stress that has to be applied to a material
`usually measured in Pa.
`
`to break it,
`
`THERMAL CONDUCTIVITY: The amount of heat per unit time per unit area that can be
`conducted through a unit thickness of a material.
`
`THERMAL EXPANSION: The expansion ofa material when subjected to temperature change
`(usually a temperature increase).
`
`The plot of temperature change across the surface or the bulk
`THERMAL GRADIENT:
`thickness of a material being heated.
`
`THERMAL MISMATCH: Difference ofthermal coefficients ofexpansion ofmaterials thatare
`bonded together.
`
`GLO
`
`THEE.
`and t
`
`TH Br
`[anle
`Tr11.1f-
`I“uteri.
`
`'l‘llEl
`sit-(I'm:
`plagiid—I
`i-
`THEE:
`means-E3
`
`11le
`are ins?
`pron-us:
`E
`TRA Ni
`holding:
`E
`'I'RANEE
`amount;
`
`ULTRE
`join [wé
`
`USEFUE
`to be ME
`
`VAPOIE
`The soli
`
`VIA: A
`made cui
`'g.
`VIA [ICE
`Boutiucu‘tf
`‘
`
`Viscosi
`to a “hf-{5
`Viscosily}
`
`
`
`
`
`Nichia Exhibit 101 6
`
`Page 3
`
`Nichia Exhibit 1016
`Page 3
`
`