throbber

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`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`____________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________
`
`NICHIA CORPORATION,
`
`Petitioner,
`
`v.
`
`DOCUMENT SECURITY SYSTEMS, INC.,
`
`Patent Owner.
`
`_______________
`
`Case IPR2018-00966
`Patent 7,652,297
`
`____________
`
`
`DECLARATION OF THOMAS L. CREDELLE
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`Patent Owner's Exhibit 2009
`Page 1 of 23
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`I, Thomas L. Credelle, do hereby declare as follows:
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`A. QUALIFICATIONS
`1.
`I have more than 40 years of deep and extensive experience in the
`
`research and development, product development and marketing of Liquid Crystal
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`Display (LCD) technology, other flat panel display technologies, Light Emitting
`
`Diode (LED) technology, and optical systems.
`
`2.
`
`I received my M.S. degree in Electrical Engineering from the
`
`Massachusetts Institute of Technology in 1970, with an emphasis on Electro-optics
`
`and Solid-State Materials. I received my B.S. degree in Electrical Engineering in
`
`1969 from Drexel University.
`
`3.
`
`I was employed by RCA at Sarnoff Labs in Princeton, NJ from 1970
`
`through 1986 at first as a Member of the technical Staff and later as a Group
`
`Manager in charge of all Active Matrix LCD research. During my time at RCA, I
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`participated in research and development projects relating to optical materials and
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`flat panel displays, including LCD devices. I researched optical materials for
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`photodetectors and holography before joining a team developing flat panel
`
`displays. In 1983, I established the Thin-Film Transistor (TFT) LCD Program at
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`Sarnoff Labs. As a Group Manager, I led a project that resulted in the
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`development of the first poly-Silicon TFT LCD at Sarnoff Labs. I received the
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`Sarnoff Outstanding Achievement Award for Large-Area Flat Panel TV
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`Developments.
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`4.
`
`From 1986 to 1991, I was employed by GE as the Manager of TFT
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`LCD Research and Development at the GE Research and Development Center in
`
`Schenectady, NY. My duties included managing research and development efforts
`
`relating to TFT and LCD technology for avionics applications. While employed
`
`by GE, I led the team that built the world’s first 1-million-pixel color LCD. I also
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`led development of numerous other display devices utilizing LCD technology. As
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`with the earlier work at RCA, a key part of this effort was the development of drive
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`electronics for both the LCD and the backlighting system, including ruggedization
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`for military use.
`
`5.
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`From 1991 to 1994, I was employed by Apple Computer as the
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`Manager of Display Engineering. In my role at Apple, I supervised all LCD
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`design, engineering, and qualification for the first PowerBook notebook computers
`
`introduced to market in the United States.
`
`6.
`
`From 1994 to 1996, I was employed as the Director of Advanced
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`Product Marketing by Allied Signal, where I was involved with the design and
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`engineering of optical films and custom focusing backlight designs for improving
`
`the viewing angle performance of LCD devices.
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`7.
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`From 1996 to 1999, I was employed as the Director of Product
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`Marketing for Motorola’s Flat Panel Display Division, where I worked in the
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`development of new flat panel technology, and I also worked closely with
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`Motorola groups responsible for integrating LCD technology into mobile phone
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`products, which were some of the first products to incorporate LED devices into
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`the backlight system.
`
`8.
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`From 1999 to 2001, I served as the Vice President of Operations of
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`Alien Technology Corporation. During my time at Alien Technology, I was
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`involved with the design and architecture of drive-electronics and LED packaging
`
`technology suitable for flexible display devices.
`
`9.
`
`From 2001 to 2007, I served as the Vice President of Engineering for
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`Clairvoyante, Inc. My responsibilities as the VP of Engineering included
`
`managing research, development, engineering, and marketing of technologies for
`
`improving the resolution and power consumption of color flat panel displays.
`
`During my time at Clairvoyante, I was heavily involved with the design of LCD
`
`driving circuitry and image processing circuitry, including image processing
`
`algorithms. My work resulted in the issuance of multiple patents relating to
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`display technology.
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`10. From 2007 to 2008, I served as the Senior VP of Engineering for
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`Puredepth, Inc. My responsibilities included the design of hardware and software
`
`to create 3D images on LCDs.
`
`11.
`
`In 2008, I founded TLC Display Consulting, a company that provides
`
`technical consulting in the areas of flat panel displays, liquid crystal displays,
`
`LEDs, and related electronics as well as expert reports for patent litigation. One of
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`my key technical consulting projects (Display Engineering, Inc.) was the design
`
`and development of high-brightness LED-backlit LCDs for digital signage and
`
`other outdoor applications. A key issue with LEDs in this application was heat
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`management; our team made significant advancements in heat flow and
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`weatherproofing for these products. We also developed controllable-brightness
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`circuits for LEDs using commercial LED driver circuits and upgraded power
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`supplies.
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`12. From 2012 through 2015, I served as the VP of Application
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`Engineering and Device Performance for Innova Dynamics, Inc., a nanotechnology
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`company developing materials to be used in LCDs and touch sensors.
`
`13.
`
`I have been a member of the Society for Information Display for over
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`40 years. I was a member of the Society for Information Display’s Program
`
`Committee for 15 years, and the Director of the Society for Information Display’s
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`Symposium Committee for 10 years. In 1984, I was awarded the title of Society
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`for Information Display Fellow in recognition of my achievements and
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`contributions to flat panel display technology.
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`14.
`
`I am a named inventor on over 80 patents relating to flat panel display
`
`and LCD technology. I have also authored a number of articles relating to LCD
`
`technology and flat panel displays that were published by industry periodicals such
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`as Information Display and peer-reviewed journals such as the Society for
`
`Information Display’s Digest of Technical Papers.
`
`15. A copy of my current CV, publications, and prior testimonial or
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`litigation-related activities as an expert is filed herewith as Exhibit 2010.
`
`B.
`
`BACKGROUND
`16. The ‘297 Patent discloses an improvement to existing LED packages
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`wherein notches are added to prevent delamination of the encapsulant used to
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`protect LEDs. “Encapsulants tend to delaminate or pull away from the reflector
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`walls. Once the delamination has started on a small section of the wall, the
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`delamination typically continues rapidly. The delaminated areas may enable
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`contaminants to enter the light-emitting device and either cause failure or a
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`reduction in the efficiency of the light-emitting device. The delamination may also
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`adversely affect the light pattern proximate the delaminated wall, which may
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`reduce or diffract the emitted light. Eventually, the delamination may spread to the
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`LED, which may cause damage to the LED and failure of the light-emitting
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`device.” Ex. 1001 at 1:10-20.
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`1.
`Substrate
`17. The ‘297 Patent further discloses an LED structure with a substrate
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`and a reflector (“The light-emitting device 100 includes a substrate 110 on which a
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`Light Emitting Diode (LED) 112 and a reflector 114 are mounted.” Ex. 1001 at
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`1:39-41.) These components are shown in Fig.1 (reproduced below). The
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`substrate (colored in green) is a physical part to which the reflector and LED are
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`directly mounted with no interleaving materials shown. In addition, the substrate
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`has a gap 152 that “exists between the reflector 114 and the LED 112. The
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`gap 152 may contain contacts used to supply power to the LED 112.” Ex. 1001 at
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`2:33-35. An example wire bond is shown connecting the LED to the substrate 110
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`in the figure below.
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`2.
`Reflector with notches
`18. The reflector 114 is mounted to the substrate and is therefore a
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`separate part, as shown in Fig. 1 (colored red). Two notches are shown in Fig. 1
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`above, 134 and 146. The notches are added to prevent delamination of the
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`encapsulant within the cavity 118. The ‘297 Patent teaches that the location of the
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`notches are important to prevent delamination; “the reflector 114 has many
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`recessed portions and the like that secure the encapsulant. These recessed portions
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`also reduce delamination and the probability of delamination between the
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`reflector 114 and the encapsulant… The portion of the reflector 114 proximate the
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`upper edge 124 is sometimes referred to as the upper portion. Light emitted from
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`the light-emitting device exits the opening in the reflector 114 located proximate
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`the upper portion.” Ex. 1001 at 1:55-68, emphasis added. Merriam-Webster’s Web
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`Dictionary1 defines “proximate” as “very near”, which is consistent with the
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`teachings of the ‘297 Patent. The ‘297 Patent also discloses that an “upper
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`portion” is proximate i.e. “very near” the upper edge 124 of the LED device (“[a]n
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`upper edge 124 extends around the circumference of the reflector 114 and may
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`form the highest point of the light-emitting device 100. The portion of the reflector
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`114 proximate the upper edge 124 is sometimes referred to as the upper portion.
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`Light emitted from the light-emitting device exits the opening in the reflector 114
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`                                                            
`1https://www.merriamwebster.com/dictionary/proximate (Ex. 2013).
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`located proximate the upper portion.” Ex. 1001 at 1:61-67, emphasis added.
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`Further, the ‘297 Patent teaches that “[t]he portion of the reflector 114 located
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`proximate the substrate 110 is sometimes referred to as the lower portion.” Ex.
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`1001 at 1:42-44, emphasis added. Thus, is would have been obvious to a POSITA
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`in 2007 that the upper portion and lower portion are distinct regions located very
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`near the top of the LED device and very near the substrate of the LED device,
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`respectively (see annotated Fig. 2 below). Further, Merriam-Webster’s Web
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`Dictionary defines “portion” as “an individual’s part or share of something, such as
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`a share received by gift or inheritance.2” Thus, a POSITA would reject the notion
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`proposed by Dr. Shealy that the upper and lower portions can “overlap.” For
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`example, if a person receives a portion of an inheritance, it belongs to that person
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`and isn’t shared with another.
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`19. The upper notch 134 (colored blue below) is located proximate, i.e.
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`very near, the upper edge of the LED device (see Figure 1, 2, reproduced below)
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`and is located in the upper portion of the LED device. (“The combination of the
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`first inner wall 126, the first platform 128 and the second inner wall 130 forms a
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`first notch 134. The first notch 134 extends axially around the reflector 114.” Ex.
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`1001 at 2:6-9) The notch 134 is clearly proximate (very near) the outer and upper
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`                                                            
`2 https://www.merriam-webster.com/dictionary/portion (Ex. 2012).
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`edge of the LED 100. The lower notch 146 (colored in purple) is clearly proximate,
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`i.e. very near, the substrate and is located in the lower portion of the LED device.
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`Upper portion
`
`Lower portion
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`
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`20. The ‘297 Patent teaches that the reason for these locations on either
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`side of the slanted portion of the reflector is to prevent delamination.
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`“Delamination between the reflector and the encapsulant may start near the top of
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`the reflector and continue down the reflector toward the substrate. Delamination
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`near the top of the light emitting device will adversely affect the brightness and
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`beam pattern of the light emitting device.” Ex. 1001 at 2:43-47, emphasis added.
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`Since delamination that adversely affects the brightness and beam pattern occurs
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`on the reflector walls, the notch 134 must be located proximate (very near) the
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`upper edge of the LED 100, where delamination begins. This would be obvious to
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`a POSITA in 2007 since he/she would know that delamination begins at the
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`exposed junction between the encapsulant in the cavity and the reflector wall (see
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`Fig. 1, annotated below). Further, the shape of the notch 134 e.g. with parallel side
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`walls will enhance adhesion of the encapsulant and be more effective in stopping
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`delamination.
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`Start of
`delamination
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`Notch stops
`delamination
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`
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`21. Likewise, the second notch 146 must be proximate (very near) the
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`substrate to prevent delamination starting at the substrate. Further, the location of
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`the lower notch 146 is at the intersection of the slanted wall 140 and the platform
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`148, which is proximate (very near) the substrate 110. A POSITA in 2007 would
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`realize that the notch should be at the intersection (not just near) to best prevent
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`delamination since the added surface area at the intersection will better stop
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`delamination from the substrate. With respect to the phrase “at the intersection,”
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`which is used in claims 6, 9, and 15, I disagree with the analysis put forth in the
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`Petition and by Dr. Shealy (Shealy Declaration at ¶¶49-54). He claims that “at”
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`means “near” and that the ‘297 Patent only depicts a notch 146 “near the
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`intersection” since he points to two surfaces (red and yellow dotted lines), not two
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`solid elements in his annotated Fig 1 (Shealy Declaration at ¶49) reproduced
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`below. A POSITA in 2007 would understand that a “platform” is a solid element
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`with a non-zero thickness and a reflector slanted portion is a solid element with a
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`non-zero thickness. The correct interpretation of the notch 146 is that it is “at the
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`intersection” of two solid surfaces; see illustration below.
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`Notch at intersection
`of slanted portion and
`platform
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`Shealy annotated Fig. 1
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`Credelle annotated Fig. 1
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`Notch stops
`delamination
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`Start of
`delamination
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`22.
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`In summary, the ‘297 Patent teaches a new reflector 114 with at least
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`one notch that “serves to prevent delamination or stop delamination after it has
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`started. If delamination starts proximate the top or upper edge 124 of the
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`reflector 114, the delamination may progress down the first inner wall 126, but it
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`will be stopped by the first notch 134. Therefore, the delamination will not be able
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`to proceed down the slanted wall 140. The first notch 134 also serves to anchor the
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`encapsulant to the reflector 114, which further serves to prevent delamination.
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`“The same occurs with the second notch 146.” Ex. 1001 at 2:52-61, emphasis
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`added. The at least one notch must therefore be located very near the top edge of
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`the device or very near the substrate of the LED device to prevent delamination of
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`the encapsulant 118 from the reflector 114. A POSITA in 2007 would know that
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`any other location of a notch, e.g. in the middle of the reflector, will not have the
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`desired effect of stopping adverse delamination.
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`C. Loh ‘842 (Ex. 1004)
`23. Loh ‘842 describes a stacked LED device structure with a substrate,
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`an intermediate layer, a lens coupler, and a lens. Notches are added to align a lens
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`assembly. Figures 8A, B, C, F, and G show two intermediate layers between lens
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`coupler 106 and substrate 102. These are additional layers added on top of the
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`substrate after the substrate has been fabricated. The Loh ‘842 patent states that
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`“[m]ounting pad 109 may be mounted to substrate 102 with electrical connections
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`being made to LED 110 for applying an electrical bias.” Loh ‘842 at 5:27-31.
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`This indicates that even layers such as a mounting pad located on top of a substrate
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`are not part of the substrate. The slanted sidewalls have little or no effect on beam
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`formation as they are hidden by the edge of the lens coupler 106. Instead, the
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`depressions in the slanted sidewalls are used to shape the encapsulant deposited
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`thereon (Ex. 1004 at 6:40-51) and lens 104 is the main beam shaping element.
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`Figures 8D and 8E show one intermediate layer (e.g. conductors) between the lens
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`coupler and substrate. Thus, the reflector does not extend from the substrate;
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`instead it extends from adhesive layers and/or conductive layers. Further Loh ‘842
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`discloses that the “substrate may also include traces or metal leads…” Ex. 1004 at
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`1:37-38. A POSITA in 2007 would not consider adhesive layers and/or conductive
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`layers “the substrate” because they are deposited on the substrate after it has been
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`fabricated. A POSITA in 2007 would not consider any layer grown, deposited or
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`formed on the substrate to be part of the substrate. Also, Loh ‘842 at 5:5-15 says
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`the substrate may be formed of many different materials, but focuses on insulating
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`materials. A POSITA in 2007 would assume that the substrate is the insulating
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`component since it has conductors deposited on it (e.g. Loh ‘842, Fig.6).
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`24. All the various notches shown are midway between the substrate and
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`upper edge of lens coupler 106. A POSITA in 2007 would know that this would
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`not prevent harmful delamination, e.g. delamination that affects reliability or beam
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`shape (Ex. 1001 at 1:10-20). This can be seen more clearly by comparing the
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`structure of the ‘297 Patent LED device shown in Fig. 1 with that of Loh ‘842
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`(excerpt of Fig. 8B annotated by Dr. Shealy (Ex. 1003 at ¶104)). The notch 406 or
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`408 of Loh ‘842 will not stop delamination along the sloped portion or at the
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`platform and thus will not prevent harmful delamination effects on beam
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`formation.
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`25. Moreover, claims 3 and 4 of the ‘297 patent require that “at least one
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`first notch [is] located proximate said upper portion” and “at least one first notch
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`[is] located proximate said lower portion,” respectively. The Petition cites to Loh
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`‘842’s Figure 8B as disclosing the subject matter of claims 3 and 4. But the
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`depressions in Figure 8B are vertically located in the middle of lens coupler 106.
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`The Petition makes this same point. Petition at 37. As a result, neither depression
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`is “located proximate said upper portion,” or “located proximate said lower
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`portion,” as required by the claims. The Petition also cites to other, distinct
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`embodiments from Loh ‘842 as support. Those embodiments are from Figures 8C,
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`8D, 8E, and 8F. Petition at 37-41. But none of those embodiments disclose the
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`subject matter of claims 3 and 4. Even though the center points of the depressions
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`are vertically spaced, the depressions are located closer to the vertical center line,
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`and not proximate the upper or the lower portions of the lens coupler.
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`Start of
`delamination
`
`Notch stops
`delamination
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`
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`‘297 Patent, Fig. 1 (annotated in red)
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`Start of
`delamination
`
`Notch
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`
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`Loh ‘842 Fig. 8B (annotated by Dr. Shealy with added comments by
`Credelle)
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`D. Loh ‘819 (Ex. 1006)
`26. Loh ‘819 discloses an LED device with one or more LEDs mounted
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`on a lead frame and surrounded by an injection molded part. The Petition asserts
`
`that Loh ‘819 discloses “a substrate” and “a reflector extending from said
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`substrate.” The Petition states “Loh ’819 teaches ‘leadframe 200’ that ‘may be
`
`made of metal having a low resistance such as copper’ with a ‘package body …
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`formed on/around the lead frame’ (purple in Figure 8 below), which a POSITA in
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`2007 would have understood to constitute the claimed substrate.” Petition at 61.
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`What Petitioner has highlighted includes leadframe 200 and only part of the
`
`package body 230. But neither the Petitioner nor Dr. Shealy explains how the
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`highlighted “substrate” meets any of its purported definitions.
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`27.
`
`Indeed, Loh ’819 consistently describes the leadframe as being
`
`constructed of electrical leads made of metal (e.g., copper). Ex. 1006 at 9:52-62.
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`The package body 230 is formed around the leadframe by, for example, transfer or
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`injection molding. Ex. 1006 at 10:8-10. Figure 8 from Loh ’819 has been
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`highlighted to show the leadframe 200 in yellow, and the package body 230 in
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`green.
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`28. Package body 230 is a single structure. Ex. 1006 at 10:8-53. If it is part of
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`the substrate, as Petitioner contends, then the entire package body 230 is part of the
`
`substrate. The ‘297 patent consistently refers to the substrate and the reflector as
`
`two different structures. According to the ‘297 patent, “[t]he light-emitting device
`
`100 includes a substrate 110 on which a Light Emitting Diode (LED) 112 and a
`
`reflector 114 are mounted.” Ex. 1001 at 1:39-41. The reflector 114 is mounted on
`
`substrate 110. The claims refer to the reflector and the substrate as two different
`
`structures in which the reflector extends from the substrate. Ex. 1001 at 3:37-39.
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`Petitioner alleges that Loh ‘819’s package body 230 corresponds to the substrate.
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`Because upper sidewalls 234 are part of the package body 230, there is no
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`“reflector” that extends from the substrate. Ex. 1006 at 10:43-45 (“The package
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`body 230 may include opposing upper sidewalls 234 that define an optical cavity
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`250 above the die mounting regions 202.”). Therefore it is my opinion that Loh
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`‘819 does not disclose a reflector extending from a substrate.
`
`29. The Petition also asserts that Loh ‘819 discloses the subject matter of
`
`claims 3 and 4. Claim 3 requires a notch to be located proximate or very near the
`
`upper portion of the reflector (see annotated Fig. 2 after ¶19). Claim 4 requires a
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`notch to be located proximate or very near the lower portion of the reflector (see
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`annotated Fig. 2 after ¶19). Petitioner claims that a single moat, located midway
`
`up what Petitioner calls the “reflector,” is located both proximate the upper portion
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`and proximate the lower portion. Petition at 68-69. This is obviously wrong.
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`Even Petitioner admits “[t]hese claims differ … by notch location.” Petition at 68.
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`The notch in Loh ’819 does not move—it is in a single location—and, thus, cannot
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`satisfy claims reciting different notch locations.
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`30. Moreover, the Petition contends that the moat “approximately bisects
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`the reflector vertically.” Petition at 69. Being in the middle, the moat is not very
`
`near the upper portion of the so-called reflector, nor is it very near the lower
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`portion. Accordingly, the notch of Loh ’819 satisfies neither claim 3 nor claim 4.
`
`31. With respect to claim 6, the following image, which was taken from
`
`the Petition at page 71, allegedly shows a platform located proximate the substrate,
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`and a notch located “at the intersection” of the slanted portion and the platform.
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`32. According to Petitioner, the platform is at the blue dashed line. But
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`that “platform” is clearly not “proximate (i.e. very near) said substrate,” even
`
`assuming that Loh ’819 discloses a “substrate.” As Petitioner admitted with
`
`respect to claims 3 and 4, the alleged notch “approximately bisects the reflector
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`vertically.” Petition at 69. Thus, the “platform” is neither proximate the substrate
`
`nor proximate the top of 234. It is in the middle.
`
`33.
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`In addition, the “notch” is not “at the intersection” of the slanted wall
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`and the “platform.” For a notch to be “at the intersection” means that the notch has
`
`to overlap the point of intersection. That plainly does not occur, even based on
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`Petitioner’s graphical depiction above.
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`E. Andrews (Ex. 1007)
`34. Andrews discloses an LED package with additional notches to act as
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`“moats” to capture excess encapsulant during fabrication of an LED device with a
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`lens. The notches are also described as affecting the shape of the meniscus formed.
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`The notches are not proximate or “very near” either the top of the LED device or
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`the substrate, they are not at the intersection of slanted portion and platform near
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`substrate, and they do not have parallel sidewalls. Further, the location of the
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`notches disclosed in Andrews have nothing to do with delamination, and a
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`POSITA in 2007 would not look to Andrews (or Loh ‘819) for proper notch size,
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`shape and location to prevent delamination. With respect to claim 1, Petitioner
`
`argues that if Loh ’819 does not disclose a “substrate,” Loh ’819 renders claims 1-
`
`6 obvious alone or in combination with Andrews. Petition at 72. Petitioner argues
`
`that it would have been obvious to substitute Loh ’819’s leadframe with Andrew’s
`
`substrate. Petition at 72.
`
`35. Petitioner’s proposed combination goes against the choice made by
`
`Loh ’819 to provide an improved leadframe package and instead proposes a slab
`
`substrate with a completely different fabrication. Indeed, Loh ’819 discusses the
`
`disadvantages of prior art, Loh ’819, 1:13-2:4, and discloses various embodiments
`
`of leadframe-based packages for solid state emitting devices. In fact, that is the
`
`title of Loh ’819.
`
`36. With these leadframe-based devices, Loh ’819 states that
`
`“[e]mbodiments of the invention may permit the formation of packages for solid
`
`state light emitting devices in which multiple high-power devices are arranged in
`

`
`Page 21 of 23
`
`Patent Owner's Exhibit 2009
`Page 21 of 23
`
`

`


`
`close proximity, which results in a higher optical quality emission with better color
`
`mixing. Furthermore, assembly of a package according to embodiments of the
`
`invention may be simplified, since the package body may be formed through
`
`injection molding techniques.” Ex. 1006 at 11:45-52.
`
`37. Loh ‘819 goes on to state that “[a]ccording to some embodiments of
`
`the invention, a leadframe-based package for one or more solid state light emitting
`
`devices may provide a short thermal path between the solid state light emitting
`
`devices and an external heatsink, since the light emitting devices are mounted on
`
`one side of the heatsink [sic: leadframe], while the opposite side of the leadframe is
`
`used to contact an external heatsink. Furthermore, the surface area of the
`
`leadframe through which heat is extracted may be larger than the die mounting
`
`area, which may improve heat extraction.” Ex. 1006 at 11:53-62.
`
`38. Loh ‘819’s focus on the advantages of its leadframe-based
`
`construction coupled with the advantages of heat extraction achieved using Loh
`
`‘819’s leadframe-based packages are not consistent with the substrate-based
`
`packages of Andrews. With Andrews’ package, the substrate has a substantial
`
`thickness that is the opposite of the “short thermal path” that Loh ‘819 touts as a
`
`significant advantage of its leadframe-based packages.
`
`39. Moreover, Loh ‘819’s leadframe-based package has the additional
`
`benefit that the package body 230, which holds the leadframe in place, also
`

`
`Page 22 of 23
`
`Patent Owner's Exhibit 2009
`Page 22 of 23
`
`

`

`conveniently form sidewalls, including upper sidewall 234, which hold the lens in
`
`place. All of this structure is formed in a single transfer or injection molding step.
`
`Ex. 1006 at 1028—10. Substituting Andrews” substrate in place of Loh ‘819’s
`
`leadframe would require at least two production steps to form the substrate and
`
`sidewalls. This is a disadvantage over Loh ‘819’s package, which can be
`
`fabricated in a single step. Thus, a POSITA in 2007 would not have looked to
`
`substitute the leadframe of Loh ‘8 19 with Andrews’ substrate.
`
`40.
`
`I declare that all statements made herein of my own knowledge are
`
`true and that all statements made on information and belief are believed to be true;
`
`and further that these statements were made with the knowledge that willful false
`
`statements and the like so made are punishable by fine or imprisonment, or both,
`
`under Section 1001 of Title 18 of the United States Code.
`
`Dated: February 12, 2019
`
`""157 ”/
`’
` ,
`
`1‘
`,2
`'5? // //l//L
`. Credelle
`
`Page 23 of 23
`
`Patent Owner's Exhibit 2009
`
`Page 23 of 23
`
`Patent Owner's Exhibit 2009
`Page 23 of 23
`
`

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