IAP03Rec'd PCT .o 2 MAR 2011
`12/73794.0
`
`DESCRIPTION
`
`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY,
`
`AND METHODS FOR MANUFACTURING LIGHT EMITTING DEVICE,
`
`RESIN PACKAGE AND RESIN-MOLDED BODY
`
`TECHNICAL FIELD
`
`[0001]
`
`The present invention relates to a light emitting device used for light
`
`equipment, a display, a backlight of a mobile telephone, a movie lighting
`
`auxiliary light source, and other general consumer light sources, and to a
`
`method for manufacturing a light emitting device.
`
`BACKGROUND ART
`
`[0002]
`
`A light emitting device using light emitting elements is small, provides
`
`good power efficiency, and emits light of bright color. Further, the light
`
`emitting elements are semiconductor elements, and therefore there is no
`
`concern for blowout. The light emitting elements have characteristics of good
`
`initial driving performance and are robust against vibration and repetition of
`
`on and off of lighting. The light emitting elements have these good
`
`characteristics, and therefore light emitting devices using light emitting
`
`elements such as light emitting diodes (LEDs) and laser diodes (LDs) are
`
`utilized as various light sources.
`
`[0003]
`
`FIG. 14 is a perspective view illustrating a method for manufacturing a
`
`conventional light emitting device. FIG. 15 is a perspective view illustrating
`
`an intermediate of the conventional light emitting device. FIG. 16 is a
`NICHIA EXHIBIT 2023
`Vizio, Inc. v. Nichia Corp.
`Case IPR2018-00437
`
`1
`
`IPR Page 1
`
`
`12/73794.0
`
`DESCRIPTION
`
`LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY,
`
`AND METHODS FOR MANUFACTURING LIGHT EMITTING DEVICE,
`
`RESIN PACKAGE AND RESIN-MOLDED BODY
`
`TECHNICAL FIELD
`
`[0001]
`
`The present invention relates to a light emitting device used for light
`
`equipment, a display, a backlight of a mobile telephone, a movie lighting
`
`auxiliary light source, and other general consumer light sources, and to a
`
`method for manufacturing a light emitting device.
`
`BACKGROUND ART
`
`[0002]
`
`A light emitting device using light emitting elements is small, provides
`
`good power efficiency, and emits light of bright color. Further, the light
`
`emitting elements are semiconductor elements, and therefore there is no
`
`concern for blowout. The light emitting elements have characteristics of good
`
`initial driving performance and are robust against vibration and repetition of
`
`on and off of lighting. The light emitting elements have these good
`
`characteristics, and therefore light emitting devices using light emitting
`
`elements such as light emitting diodes (LEDs) and laser diodes (LDs) are
`
`utilized as various light sources.
`
`[0003]
`
`FIG. 14 is a perspective view illustrating a method for manufacturing a
`
`conventional light emitting device. FIG. 15 is a perspective view illustrating
`
`an intermediate of the conventional light emitting device. FIG. 16 is a
`NICHIA EXHIBIT 2023
`Vizio, Inc. v. Nichia Corp.
`Case IPR2018-00437
`
`1
`
`IPR Page 1
`
`
`
`.,
`
`perspective view illustrating the conventional light emitting device.
`
`[0004]
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`Conventionally, as a method for manufacturing a light emitting device,
`
`a method is disclosed for insert-molding a lead frame with a non-translucent,
`
`light reflecting white resin, and molding a resin-molded body which has
`
`concave cups at predetermined intervals through the lead frame (e.g., refer to
`
`Patent Document 1). Although quality of a material of a white resin is not
`
`clearly described, as is insertion-molding performed and as is clear from the
`
`figures, a general thermoplastic resin is used. As a general thermoplastic
`
`resin, for example, a thermoplastic resin such as liquid crystal polymer, PPS
`
`(polyphenylene sulfide), and nylon is often used as a light blocking
`
`resin-molded body (e.g., refer to Patent Document 2).
`
`[0005]
`
`However, the thermoplastic resin has little adhesion with a lead frame ,
`
`and the resin part and lead frame are likely to be detached. Further, the
`
`thermosetting resin has lower resin fluidity of the resin and therefore is not
`
`adequate to mold a resin-molded body of a complicated shape, and has little
`
`light resistance. In recent years in particular, the output of a light emitting
`
`element is remarkably improved and, as the output of a light emitting element
`
`is increased, light deterioration of a package made of a thermoplastic resin
`
`becomes more distinct.
`
`[0006]
`
`In order to solve the above problems, a light emitting device using a
`
`thermosetting resin for a material of a resin-molded body is disclosed (e.g., refer
`
`to Patent Document 3). FIG. 17 is a perspective view and sectional view
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`2
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`IPR Page 2
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`
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`illustrating a conventional light emitting device. FIG. 18 is a schematic
`
`sectional view illustrating a method for manufacturing the conventional light
`
`emitting device.
`
`It is disclosed that, with this light emitting device, metal
`
`. wires are formed from a metal foil by a common method such as punching or
`
`etching and are further arranged in a mold of a predetermined shape, and a
`
`thermosetting resin is filled in a mold resin inlet to transfer-mold.
`
`[0007]
`
`However, this manufacturing method has difficulty in manufacturing
`
`multiple light emitting devices in a short time. Further, there is a problem
`
`that a great amount of a resin of a runner part is discarded per one light
`
`emitting device .
`
`. [0008]
`
`As a different light emitting device and manufacturing method therefor,
`
`an optical semiconductor element mounting package substrate which has a
`
`light reflecting thermosetting resin composition layer on the wiring substrate,
`
`and manufacturing method therefor are disclosed (e.g., refer to Patent
`
`Document 4). FIG. 19 is a schematic view illustrating steps of manufacturing
`
`a conventional light emitting device. This optical semiconductor element
`
`mounting package substrate is manufactured as an optical semiconductor
`
`element mounting package substrate of a matrix pattern which has a plurality
`
`of concave parts, by attaching a printed-wiring board having a flat plate shape
`
`to a mold, filling a light reflecting thermosetting resin composition in the mold,
`
`and heating and pressuring molding the light reflecting thermosetting resin by
`
`means of a transfer-molding machine. Further, it is also disclosed that a lead
`
`frame is used instead of a printed ·wiring board.
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`3
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`IPR Page 3
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`[0009]
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`However, these wiring board and lead frame have a flat plate shape and
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`have a small adhering area because a thermosetting resin composition is
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`arranged on this flat shape, and therefore there is a problem that, for example,
`
`a lead frame and thermosetting resin composition are likely to be detached
`
`upon singulation.
`
`[0010]
`
`Patent Document 1: Japanese Patent Application Laid-Open No.
`
`2007-35794 (paragraph [0033] in particular)
`
`Patent Document 2: Japanese Patent Application Laid-Open No.
`
`11-087780
`
`Patent Document 3: Japanese Patent Application Laid-Open No.
`
`2006-140207 (paragraph [0028] in particular)
`
`Patent Document 4: Japanese Patent Application Laid-Open No.
`
`2007-235085
`
`DISCLOSURE OF THE INVENTION
`
`PROBLEMS TO BE SOLVED BY THE INVENTION
`
`[0011]
`
`In view of the above problems, an object of the present invention is to
`
`provide a simple and low-cost method for manufacturing, in a short time,
`
`multiple light emitting devices which has high adhesion between a lead frame
`
`and a thermosetting resin composition.
`
`MEANS FOR SOLVINGTHEPROBLEMS
`
`[0012]
`
`The present invention is earnestly studied and as a result is finally
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`IPR Page 4
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`completed.
`
`[0013]
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`In this description, terms such as leads, a resin part, and resin package
`
`are used for a singulated light emitting device, and terms such as a lead frame
`
`and resin-molded body are used in the stage prior to singulation.
`
`[0014]
`
`The present invention relates to a method of manufacturing a light
`
`emitting device having a resin package which provides an optical reflectivity
`
`equal to or more than 70% at a wavelength between 350 nm and 800 nm after
`
`thermal curing, and in which a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface. The method comprises: a
`
`step of sandwiching a lead frame provided with a notch part, by means of an
`
`upper mold and a lower mold; a step of transfer-molding a thermosetting resin
`
`containing a light reflecting material in a mold sandwiched by the upper mold
`
`and the lower mold to form a resin-molded body in the lead frame; and a step of
`
`cutting the resin-molded body and the lead frame along the notch part. With
`
`the configuration, the thermosetting resin is filled in the notch parts, and
`
`therefore an adhering area between the lead frame and the thermosetting resin
`
`becomes large, so that it is possible to improve adhesion between the lead frame
`
`and the thermosetting resin. Further, a thermosetting resin having lower
`
`viscosity than a thermoplastic resin is used, so that it is possible to fill the
`
`thermosetting resin in the notch parts without leaving a gap. Further, it is
`
`possible to manufacture multiple light emitting devices at one time and greatly
`
`improve productive efficiency. Furthermore, it is possible to reduce runners
`
`which are discarded, and provide light emitting devices at low cost.
`
`5
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`IPR Page 5
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`[0015]
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`Preferably, plating processing is applied to the lead frame before the
`
`lead frame is sandwiched by the upper mold and the lower mold.
`
`In this case,
`
`in the manufactured light emitting device, plating processing is not applied to a
`
`cut surface and is applied to parts other than the cut surface.
`
`It is not
`
`necessary to apply plating processing per singulated light ·emitting device and
`
`it is possible to simplify a manufacturing method.
`
`[0016]
`
`Preferably, the notch part in a cut part of the lead frame is about half
`
`the entire surrounding periphery. By this means, it is possible to reduce the
`
`weight of the lead frame and provide light emitting devices at low cost.
`
`Further, the part of the lead frame to be cut decreases, so that it is possible to
`
`better prevent the lead frame and the thermosetting resin from detaching.
`
`[0017]
`
`In addition, the difference is that, while the thermosetting resin is filled
`
`in the notch parts, the thermosetting resin is not filled in hole parts which are
`
`described later. While the notch parts and hole parts penetrate the lead frame,
`
`grooves which are described later do not penetrate the lead frame.
`
`[0018]
`
`Preferably, a hole part is provided in the lead frame before the lead
`
`frame is sandwiched by the upper mold and the lower mold. By this means, it
`
`is possible to reduce the weight of the lead frame more, and provide light
`
`emitting devices at low cost.
`
`It is possible to apply the plating processing to
`
`the hole parts, and consequently prevent exposure of the lead frame.
`
`[0019]
`
`6
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`IPR Page 6
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`
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`Preferably, a groove is provided in the lead frame before the lead frame
`
`is sandwiched by the upper mold and the lower mold. By this means, it is
`
`possible to reduce the weight of the lead frame more, and provide light emitting
`
`devices at low cost.
`
`It is possible to apply plating processing to the grooves,
`
`and consequently prevent exposure of the lead frame.
`
`[0020]
`
`Preferably, the upper mold and the lower mold sandwich a part of the
`
`lead frame where a light emitting element is placed or near a hole part. By
`
`this means, it is possible to prevent the lead frame from flip-flopping and
`
`reduce burrs.
`
`[0021]
`
`The present invention relates to a light emitting device having a resin
`
`package having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, wherein a resin
`
`part and a lead are formed in a substantially same plane in an outer side
`
`surface, and wherein at least one surface of a bottom surface and an upper
`
`surface of a lead is plated and the outer side surface of the lead is not plated.
`
`By this means, it is possible to prevent exposure of leads to which plating
`
`processing is not applied, and provide multiple light emitting devices at one
`
`time. Further, by applying plating processing to only the part which reflects
`
`light from a light emitting element, it is possible to improve the efficiency to
`
`extract light from the light emitting device.
`
`[0022]
`
`Preferably, the lead is exposed at four corners of the resin package.
`
`The exposed parts of the leads are reduced compared to leads which are
`
`7
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`IPR Page 7
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`
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`provided on the one entire side surface of a resin package, so that it is possible
`
`to improve adhesion between the resin part and the leads. Further, the
`
`insulating resin part is provided between a positive lead and a negative lead, so
`
`that it is possible to prevent short-circuiting.
`
`[0023]
`
`Preferably, four corners of the resin package are formed in an arc shape
`
`seen from a bottom surface side·.
`
`It is also possible to employ a configuration
`
`where plating processing is applied to a part which is formed in an arc shape
`
`and is not applied to the cut surface. By this means, it is possible to expand a
`
`bonding area with, for example, a solder, and improve the boding strength.
`
`[0024]
`
`Preferably, a step is provided in the lead. The differences in level are
`
`preferably provided in the bottom surface of the resin package.
`
`It is also
`
`possible to employ a configuration where plating processing is applied to a part
`
`in which differences in level are formed and is not applied to the cut surface.
`
`By this means, it is possible to expand a bonding area with, for example, a
`
`solder, and improve the boding strength.
`
`[0025]
`
`The present invention relates to a method for manufacturing a resin
`
`package having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, wherein a resin
`
`part and a lead are formed in a substantially same plane in an outer side
`
`surface. The method comprising: a step of sandwiching a lead frame provided
`
`with a notch part, by means of an upper mold and a lower mold; a step of
`
`transfer-molding a thermosetting resin containing a light reflecting material in
`
`8
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`IPR Page 8
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`
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`a mold sandwiched by the upper mold and the lower mold to form a
`
`resin-molded body in the lead frame; and a step of cutting the resin-molded
`
`body and the lead frame along the notch part. With.the configuration, the
`
`thermosetting resin is filled in the notch parts, and therefore an adhering area
`
`between the lead frame and the thermosetting resin becomes large, so that it is
`
`possible to improve adhesion between the lead frame and the thermosetting
`
`resin. Further, a thermosetting resin having lower viscosity than a
`
`thermoplastic resin is used, so that it is possible to fill the thermosetting resin
`
`in the notch parts without leaving a gap. Further, it is possible to
`
`manufacture multiple resin packages at one time and greatly improve
`
`productive efficiency. Furthermore, it is possible to reduce runners which are
`
`discarded, and provide resin packages at low cost.
`
`[0026]
`
`Preferably, plating processing is applied to the lead frame before the
`
`lead frame is sandwiched by the upper mold and the lower mold.
`
`In this case,
`
`in the manufactured resin package, plating processing is not applied to a cut
`
`surface and is applied to parts other than the cut surface.
`
`It is not necessary
`
`to apply plating processing per singulated resin package and it is possible to
`
`simplify a manufacturing method.
`
`[0027]
`
`The present invention relates to a resin package having an optical
`
`reflectivity equal to or more than 70% at a wavelength between 350 nm and 800
`
`nm after thermal curing, wherein a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface, and wherein at least one
`
`surface of a bottom surface and an upper surface of a lead is plated and the
`
`9
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`IPR Page 9
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`
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`outer side surface of the lead is not plated. By this means, it' is possible to
`
`prevent exposure of leads to which plating processing is not applied, and
`
`provide multiple resin packages at one time. Further, by applying plating
`
`processing to only the part which reflects light from a light emitting element, it
`
`is possible to improve the efficiency to extract light from the light emitting
`
`device.
`
`[0028]
`
`The present invention relates to a method of manufacturing a
`
`resin-molded body having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm afterthermal curing, wherein a
`
`plurality of concave parts are formed, and in which a part of a lead frame is
`
`exposed in inner bottom surfaces of the concave parts. The method
`
`comprises: a step of sandwiching the lead frame by means of an upper mold
`
`which has convex parts in positions where the concave parts adjacent in the
`
`resin-molded body are molded and a lower mold, the lead frame being provided
`
`with notch parts; a step of transfer-molding a thermosetting resin containing a
`
`light reflecting material in a mold sandwiched by the upper mold and the lower
`
`mold to fill the thermosetting resin in the notch parts, and forming the
`
`resin-molded body in the lead frame. With this configuration, it is possible to
`
`manufacture multiple light emitting devices at one time and greatly impizove
`
`productive efficiency.
`
`[0029]
`
`The present invention relates to a resin-molded body having an optical
`
`reflectivity equal to or more than 70% at a wavelength between 350 nm and 800
`
`nm after thermal curing, wherein a plurality of concave parts are formed and a
`
`10
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`IPR Page 10
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`
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`part of a lead frame is exposed in inner bottom surfaces of the concave parts,
`
`and
`
`wherein the lead frame has notch parts and a thermosetting resin
`
`which becomes the resin·molded body is filled, the resin·molded body having a
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`sidewall between adjacent concave parts. By this means, it is possible to
`
`provide a resin-molded body of good thermal resistance and light resistance.
`
`EFFECTS OF THE INVENTION
`
`[0030]
`
`The light emitting device and manufacturing method therefor according
`
`to the present invention can provide a light emitting device which provides high
`
`adhesion between a lead frame and a resin-molded body. Further, it is
`
`possible to provide multiple light emitting devices in a short time and greatly
`
`improve production efficiency. Furthermore, it is possible to reduce runners
`
`which are discarded, and provide light emitting devices at low cost.
`
`BEST MODE FOR CARRYING OUT THE INVENTION
`
`[0031]
`
`Hereinafter, the preferred embodiments of a method for manufacturing
`
`a light emitting device and a light emitting device according to the present
`
`invention will be described in detail with drawings. However, the present
`
`invention is not limited to this embodiment.
`
`[0032]
`
`<First Embodiment>
`
`(Light Emitting Device)
`
`A light emitting device according to a first embodiment will be
`
`described. FIG. 1 is a perspective view illustrating a light emitting device
`
`according to the first embodiment. FIG. 2 is a sectional view illustrating a
`
`11
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`IPR Page 11
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`light emitting device according to the first embodiment. FIG. 2 is a sectional
`
`view taken along line II-II illustrated in FIG. 1. FIG. 3 is a plan view
`
`illustrating a lead frame used in the first embodiment.
`
`[0033]
`
`A light emitting device 100 according to the first embodiment provides
`
`an optical reflectivity equal to or greater than 70% at the wavelength between
`
`350 nm and 800 nm after thermal curing, and has a resin package 20 in which
`
`a resin part 25 and leads 22 are formed in the substantially same plane in outer
`
`side surfaces 20b. Plating processing is applied to at least one surface of the
`
`bottom surface (an outer bottom surface 20a of the resin package 20) and the
`
`upper surface (an inner bottom surface 27a of a concave part 27) of the leads 22.
`
`By contrast with this, plating processing is not applied to the side surfaces of
`
`the leads 22 (the outer side surfaces 20b of the resin package 20). The resin
`
`part 25 occupies a large area in the outer side surfaces 20b of the resin package
`
`20, and leads 22 are exposed from corner parts.
`
`[0034]
`
`The resin package 20 is formed with the resin part 25 which mainly
`
`contains a light reflecting material 26, and the leads 22. The resin package 20
`
`has the outer bottom surface 20a in which the leads 22 are arranged, outer side
`
`surfaces 20b in which part of the leads 22 are exposed, and the outer upper
`
`surface 20c in which an opening concave part 27 is formed. In the resin
`
`package 20, the concave part 27 having an inner bottom surface 27a and inner
`
`side surface 27b is formed. The leads 22 are exposed in the inner bottom
`
`surface 27a of the resin package 20 and the light emitting element 10 is placed
`
`on the leads 22. In the concave part 27 of the resin package 20, a sealing
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`IPR Page 12
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`member 30 which covers the light emitting element 10 is arranged. The
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`sealing member 30 contains a fluorescent material 40. The light emitting
`
`element 10 is electrically connected with the leads 22 through wires 50. The
`
`leads 22 are not arranged on the outer upper surface 20c of the resin package
`
`20.
`
`(0035]
`
`Parts from which the leads 22 are exposed have the half or less length
`
`than the entire surrounding length of the outer side surfaces 20b of the resin
`
`package 20.
`
`In a method for manufacturing a light emitting device which is
`
`described below, notch parts 21a are provided in a lead frame 21 and the lead
`
`frame 21 is cut along the notch parts 21a and, therefore, the cut part of the lead
`
`frame 21 is a part which is exposed from the resin package 20.
`
`(0036]
`
`In the resin package 20, the leads 22 are exposed from the four corners.
`
`The leads 22 are exposed in the outer side surfaces 20b, and are not subjected
`
`to plating processing. Further, the leads 22 may be adapted to be exposed in
`
`the outer bottom surface 20a and subjected to plating processing.
`
`In addition,
`
`it is possible to apply plating processing to the outer side surfaces 20b of the
`
`leads 22 after singualtion.
`
`(0037]
`
`The light emitting device 100 provides the optical reflectivity equal to
`
`or more than 70% at the wavelength between 350 nm and 800 nm after thermal
`
`curing. This means that the optical reflectivity in a visible light area is high.
`
`The light emitting element 10 preferably provides a light emission peak
`
`wavelength between 360 nm and 520 nm, and can also use a light emission
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`13
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`IPR Page 13
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`peak wavelength between 350 nm and 800 nm. More preferably, the light
`
`emitting element 10 has a light emission peak wavelength in a short
`
`wavelength region of visible light between 420 nm and 480 nm. This resin
`
`package 20 has good light resistance against light of a short wavelength equal
`
`to or less than 480 nm, and is less likely to be deteriorated. Further, this resin
`
`package 20 is not likely to be deteriorated even when the light emitting element
`
`10 generates heat by applying the current thereto, and has good thermal
`
`resistance.
`
`[0038]
`
`It is preferable to use as the resin package 20 a translucent
`
`thermosetting resin highly filled with a light reflecting material.
`
`It is
`
`preferable to use, for example, a thermosetting resin which provides the optical
`
`transmittance equal to or more than 80% at 350 nm to 800 nm, and it is more
`
`preferable to use a thermosetting resin which provides optical transmittance
`
`equal to or more than 90%. This is because it is possible to prevent
`
`deterioration of the resin package 20 by reducing light which is absorbed by the
`
`thermosetting resin. The light reflecting material 26 preferably reflects 90%
`
`or more light from the light emitting element 10, and more preferably reflects
`
`95% or more light. Further, the light reflecting material 26 preferably reflects
`
`90% or more light from the fluorescent material 40, and more preferably
`
`reflects 95% or more light. By reducing the amount of light which is absorbed
`
`by the light reflecting material 26, it is possible to improve the efficiency to
`
`extract light from the light emitting device 100.
`
`[0039]
`
`Although the light emitting device 100 may have any shape, the light
`
`14
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`IPR Page 14
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`
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`emitting device 100 may have a polygonal shape such as a generally
`
`rectangular parallelepiped, generally cube, or generally hexagonal column.
`
`The concave part 27 preferably expands in the opening direction, and may have
`
`a cylindrical shape. The concave part 27 can adopt a generally circular shape,
`
`generally oval shape, or generally polygonal shape.
`
`[0040]
`
`(
`
`Hereinafter, each member will be described below.
`
`(Light Emitting Element)
`
`Although a light emitting element is preferably used in which a
`
`semiconductor such as GaAIN, ZnS, SnSe, SiC, GaP, GaAIAs , AlN, InN,
`
`AllnGaP, InGaN, GaN or AllnGaN is formed on a substrate as a light emitting
`
`layer, the semiconductor is not limited to these. Although the light emitting
`
`element which provides a light emission peak wavelength between 360 nm and
`
`520 nm is preferable, and a light emitting element which provides a light
`
`emission peak wavelength between 350 nm and 800 nm can be used. More
`
`preferably, the light emitting element 10 has the light emission peak
`
`wavelength in the short wavelength region of visible light between 420 nm and
`
`480 nm.
`
`[0041]
`
`The light emitting element adopting a face-up structure can be used,
`
`and, in addition, the light emitting element adopting a face-down structure can
`
`also be used. The size of the light emitting element is not particularly limited,
`
`and light emitting elements having sizes of 350 µm (350-µm-square), 500 µm
`
`(500-µm-square) and 1 mm (I-mm-square) can be used. Further, a plurality
`
`of light emitting elements can be used, and all of the light emitting elements
`
`15
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`IPR Page 15
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`
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`may be the same type or may be different·types which emit emission colors of
`
`red, green and blue of three primary colors of light.
`
`(Resin Package)
`
`The resin package has and is made by integrally molding a resin part
`
`formed with a thermosetting resin and the leads. Although the resin package
`
`provides an optical reflectivity equal to or more than 70% at 350 nm to 800 nm,
`
`the resin package more preferably provides an optical reflectivity equal to or
`
`more than 80% at 420 nm to 520 nm. Further, the resin package preferably
`
`has a high reflectivity in a light emitting area of a light emitting element and a
`
`light emitting area of a fluorescent material.
`
`(0042]
`
`The resin package has an outer bottom surface, outer side surfaces and
`
`an outer upper surface. The leads are exposed from the outer side surfaces of
`
`the resin package. The resin part and leads are formed in the substantially
`
`same plane. This substantially same plane means that the resin part and
`
`leads are formed in the same cutting step.
`
`[0043]
`
`The outer shape of the resin package is not limited to a generally
`
`rectangular parallelepiped, and may have a generally cube, generally
`
`hexagonal shape or other polygonal shapes. Further, the resin package seen
`
`from the outer upper surface side can also adopt a generally triangular shape,
`
`generally square shape, generally pentagonal shape or generally hexagonal
`
`shape.
`
`(0044]
`
`The resin package forms a concave part having an inner bottom surface
`
`16
`
`IPR Page 16
`
`
`
`and an inner side surface. The leads are arranged in the inner bottom surface
`
`of the concave part. The concave part seen form the outer upper surface side
`
`can adopt various shapes such as a generally circular shape, generally oval
`
`shape, generally square shape, generally polygonal shape or combination of
`
`these. Although the concave part preferably has a shape expanding in the
`
`opening direction, the concave part may have a cylindrical shape. Although
`
`the concave part may be provided with a smooth inclination , the concave part
`
`may be formed in a shape which has a minute concavity and convexity in its
`
`surface and diffuses light.
`
`[0045]
`
`The leads are provided at predetermined intervals to form a pair of
`
`positive and negative leads. Plating processing is applied to the leads in the
`
`inner bottom surface of the concave part and the leads of the outer bottom
`
`surface of the resin package. Although this plating processing can be
`
`performed before a resin-molded body is cut out, it is preferable to use a lead
`
`frame to which plating processing is applied in advance. By contrast with this,
`
`plating processing is not applied to the side surfaces of the leads.
`
`(Resin Part and Resin-molded Body)
`
`As the material of the resin part and resin ·molded body, a triazine
`
`derivative epoxy resin, which is a thermosetting resin is preferably used.
`
`Further, the thermosetting resin can contain an acid anhydride, antioxidant,
`
`demolding member, light reflecting member, inorganic filler, curing catalyst,
`
`light stabilizer, and lubricant. The light reflecting member uses titanium
`
`dioxide and is filled with 10 to 60% by weight of titanium dioxide.
`
`[0046]
`
`17
`
`IPR Page 17
`
`
`
`The resin package is not limited to the above mode, and is preferably
`
`made of at least one selected from the group consisting of an epoxy resin,
`
`modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and
`
`urethane resin of a thermosetting resin. Particularly, the epoxy resin,
`
`modified epoxy resin, silicone resin or modified silicone resin is preferable.
`
`For example, it is possible to use as a solid epoxy resin composition, 100 parts
`
`by weight of a clear and colorless mixture in which the epoxy resin consisting of
`
`triglycidylisocyanuratem, bisphenol .hydride A glycidyl ether and so on, and an
`
`acid anhydride consisting of hexahydrophthalic anhydride,
`
`3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride
`
`and so on equivalent to the epoxy resin, have been dissolved and mixed, which
`
`has been added with: 0.5 parts by weight of DBU (1,8-Diazabicyclo(5,4,0)
`
`undecene-7) as a curing accelerator; 1 parts by weight of ethylene glycol as a
`
`promoter; 10 parts by weight of a titanium oxide pigment; and 50 parts by
`
`weight of a glass fiber, and which has entered the B stage by being heated and
`
`partially cured and reacted.
`
`(Lead and Lead Frame)
`
`Although a metal plate of a flat plate shape can be used for a lead frame,
`
`a metal plate in which differences in level or concavity and convexity are
`
`provided can be used.
`
`[0047]
`
`The lead frame is formed by, for example, punching or etching a metal
`
`plate of a flat plate shape. A concavity and convexity are formed in a sectional
`
`shape of the etched lead frame, so that it is possible to improve adhesion
`
`between the lead frame and resin-molded body. Particularly when a thin lead
`
`18
`
`IPR Page 18
`
`
`
`frame is used, although, with punching, differences in level or concave-convex
`
`shapes are formed to improve adhesion between a lead frame and resin ·molded
`
`body, the effect of improving adhesion is little because the differences in level or
`
`concave-convex shapes are small. . However, etching can form concave-convex
`
`shapes in the entire sectional (etched part) part of the lead frame, so that it is
`
`possible to increase a bonding area between the lead frame and resin-molded
`
`body and mold a resin package of better adhesion.
`
`[0048]
`
`By contrast with this, the method of punching a metal plate of a flat
`
`plate shape increases cost required for replacement parts due to friction of a
`
`mold resulting from the punching, and increases cost required for
`
`manufacturing the lead frame. By contrast with this, with etching, a
`
`punching mold is not used, so that it is possible to manufacture a lead frame
`
`per package at low cost when the number of packages cut from one frame is
`
`greater.
`
`[0049]
`
`The etching may be performed such that the lead frame is penetrated,
`
`or may be started from only one surface such that the lead frame is not
`
`penetrated.
`
`[0050]
`
`The notch parts are formed such that a pair of positive and negative
`
`leads are provided when the resin-molded body is singulated to the resin
`
`package. The notch parts are formed such that the area for cutting the leads
`
`is reduced when the resin-molded body is cut. For example, the notch parts
`
`are provided in a horizontal direction such that a pair of positive and negative
`
`19
`
`IPR Page 19
`
`
`
`leads are provided, and further notch parts are provided in positions
`
`corresponding to cut·out parts for singulating the resin-molded body.
`
`Meanwhile, part of the lead frame is jointed such that part of the lead frame
`
`does not drop or the leads are exposed in the outer side surfaces of the resin
`
`package. To singulate the resin-molded body using a singulation saw, the
`
`notch parts are preferably formed vertically and horizontally or linearly in an
`
`oblique direction.
`
`[0051)
`
`The lead frame is formed using an electrical good conductor such as iron,
`
`phosphor bronze or a copper alloy. Further, to increase the reflectivity with
`
`respect to light from the light emitting element, metal plating using silver,
`
`aluminum, copper, gold or the like can be applied to the lead frame. Although
`
`metal plating is preferably is applied to the lead frame before the lead frame is
`
`sandwiched by the upper mold and lower mold, that is, for example, after the
`
`notch parts are provided or etching processing is performed, metal plating can
`
`also be applied to the lead frame before the lead frame is integrally molded with
`
`the thermosetting resin.
`
`(Sealing Member)
`
`The material of a sealing member is a thermosetting resin. The
`
`sealing member is preferably made of at least one selected from the group
`
`consisting of an epoxy resin, modified epoxy resin, silicone resin, modified
`
`silicone resin, acrylate resin and urethane resin of a thermosetting resin, and is
`
`more preferably made of an epoxy resin, modified epoxy resin, silicone resin or
`
`modifie
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