June 8, 2018
`
`Certification
`
`TRANSLATION REVIEWER'S DECLARATION:
`
`I, Hiroki Fukuyama, hereby declare:
`
`That I possess advanced knowledge of the Japanese and English languages. I
`reviewed and edited the attached Japanese into English translation and, to the best
`of my knowledge and belief, it is a true and accurate translation of:
`
`JP(Tokugan)2008-225408
`
`In signing this declaration, I understand that the declaration will be filed as
`evidence in a contested case before the Patent Trial and Appeal Board of the
`United States Patent and Trademark Office. I acknowledge that I may be subject
`to cross examination in the case and that cross examination will take place within
`the United States. If cross examination is required of me, I will appear for cross
`examination within the United States during the time allotted for cross
`examination.
`
`I hereby declare that all statements made herein of my own knowledge are true,
`and that all statements made on information and belief are believed to be true; and
`further that these statements were made with the knowledge that willful false
`statements and the like so made are punishable by fine and/or imprisonment under
`Section 1001 of Title 18 of the United States Code, and that such willful false
`statements may jeopardize the validity of the patent which is under review in this
`proceeding.
`
`r.
`
`)�* ·-1Lt,ruys htU\
`
`Hiroki Fukuyama
`
`NICHIA EXHIBIT 2022
`Vizio, Inc. v. Nichia Corp.
`Case IPR2018-00437
`
`IPR Page 1
`
`

`

`[Document] Patent Application
`
`[File Number] 12008077
`
`[Filing Date] September 3, 2008
`
`[Recipient] Commissioner, Japan Patent Office
`
`[International Patent Classification]
`
`[Inventor]
`
`[Address or Domicile]
`
`491-100 Oka, Kaminaka-cho, Anan City,
`
`[Name]
`
`[Inventor]
`
`Tokushima Prefecture, c/o Nichia Corporation
`
`Hirofumi Ichikawa
`
`[Address or Domicile]
`
`491-100 Oka, Kaminaka-cho, Anan City,
`
`[Name]
`
`[Inventor]
`
`Tokushima Prefecture, c/o Nichia Corporation
`
`Masaki Hayashi
`
`[Address or Domicile]
`
`491-100 Oka, Kaminaka-cho, Anan City,
`
`[Name]
`
`[Inventor]
`
`Tokushima Prefecture, c/o Nichia Corporation
`
`Shimpei Sasaoka
`
`[Address or Domicile]
`
`491-100 Kaminaka-cho, Anan City, Tokushima
`
`[Name]
`
`[Applicant]
`
`Prefecture, c/o Nichia Corporation
`
`Tomohide Miki
`
`[Identification Symbol]
`
`000226057
`
`[Name]
`
`Nichia Corporation
`
`[Representative]
`
`Eiji Ogawa
`
`[Fee Notation]
`
`[Prepayment Ledger Number] 010526
`
`[Prepayment Amount]
`
`15,000 yen
`
`[Catalogue of Exhibits]
`
`[Exhibit]
`
`[Exhibit]
`
`[Exhibit]
`
`[Exhibit]
`
`Claims
`
`Specification
`
`Drawings
`
`Abstract
`
`1
`
`1
`
`1
`
`1
`
`IPR Page 2
`
`

`

`[Document] Claims
`
`[Claim 1]
`
`A method of manufacturing a light emitting device having a resin package
`
`which provides an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, and in which
`
`a resin part and a lead are formed in a substantially same plane in an outer
`
`side surface,
`
`the method comprising: a step of sandwiching a lead frame provided with
`
`notch parts, by means of an upper mold and a lower mold; a step of
`
`transfer-molding a thermosetting resin containing a light reflecting material
`
`in a mold sandwiched by the upper mold and the lower mold to form a
`
`resin-molded body on the lead frame; and
`
`a step of cutting the resin-molded body and the lead frame along the notch
`
`parts.
`
`[Claim 2]
`
`The method of manufacturing a light emitting device according to claim 1,
`
`wherein plating processing is applied to the lead frame before the lead frame
`
`is sandwiched by the upper mold and the lower mold.
`
`[Claim 3]
`
`The method of manufacturing a light emitting device according to claim 1 or
`
`2, wherein the notch parts in a cut part of the lead frame is about half the
`
`entire surrounding periphery or greater.
`
`[Claim 4]
`
`The method of manufacturing a light emitting device according to any one of
`
`claims 1 to 3, wherein a hole part is provided in the lead frame before the
`
`lead frame is sandwiched by the upper mold and the lower mold.
`
`[Claim 5]
`
`The method of manufacturing a light emitting device according to any one of
`
`claims 1 to 4, wherein a groove is provided in the lead frame before the lead
`
`frame is sandwiched by the upper mold and the lower mold.
`
`[Claim 6]
`
`The method of manufacturing a light emitting device according to any one of
`
`claims 1 to 5, wherein the upper mold and the lower mold sandwich a part of
`
`the lead frame where a light emitting element is placed or near a hole part.
`
`[Claim 7]
`
`IPR Page 3
`
`

`

`A light emitting device having a resin package having an optical reflectivity
`
`equal to or more than 70% at a wavelength between 350 nm and 800 nm
`
`after thermal curing, wherein a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface, and wherein at least one
`
`surface of a bottom surface and an upper surface of a lead is plated and a
`
`part of the outer side surface of the lead is not plated.
`
`[Claim 8]
`
`The light emitting device according to claim 7, wherein the lead is exposed at
`
`four corners of the resin package.
`
`[Claim 9]
`
`The light emitting device according to claim 7 or 8, wherein four corners of
`
`the resin package are formed in an arc shape seen from a bottom surface
`
`side.
`
`[Claim 10]
`
`The light emitting device according to any one of claims 7 to 9, wherein a
`
`step which is lower than the outer side surface and the outer bottom surface
`
`of the lead is provided in the lead.
`
`[Claim 11]
`
`A method of manufacturing a resin package having an optical reflectivity
`
`equal to or more than 70% at a wavelength between 350 nm and 800 nm
`
`after thermal curing, wherein a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface, the method comprising:
`
`a step of sandwiching a lead frame provided with notch parts, by means of an
`
`upper mold and a lower mold;
`
`a step of transfer-molding a thermosetting resin containing a light reflecting
`
`material in a mold sandwiched by the upper mold and the lower mold to form
`
`a resin-molded body on the lead frame; and
`
`a step of cutting the resin-molded body and the lead frame along the notch
`
`parts.
`
`[Claim 12]
`
`The method of manufacturing a resin package according to claim 11, wherein
`
`plating processing is applied to the lead frame before the lead frame is
`
`sandwiched by the upper mold and the lower mold.
`
`[Claim 13]
`
`A resin package having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, wherein a
`
`IPR Page 4
`
`

`

`resin part and a lead are formed in a substantially same plane in an outer
`
`side surface, and wherein at least one surface of a bottom surface and an
`
`upper surface of the lead is plated, and the outer side surface of the lead is
`
`not plated.
`
`[Claim 14]
`
`A method of manufacturing a resin-molded body having an optical
`
`reflectivity equal to or more than 70% at a wavelength between 350 nm and
`
`800 nm after thermal curing, wherein a plurality of concave parts are formed,
`
`and in which a part of a lead frame is exposed in inner bottom surfaces of the
`
`concave parts, the method comprises:
`
`a step of sandwiching the lead frame by means of an upper mold which has
`
`convex parts in positions where the concave parts adjacent in the
`
`resin-molded body are molded and a lower mold, the lead frame being
`
`provided with notch parts;
`
`a step of transfer-molding a thermosetting resin containing a light reflecting
`
`material in a mold sandwiched by the upper mold and the lower mold to fill
`
`the thermosetting resin in the notch parts, and
`
`forming the resin-molded body on the lead frame.
`
`[Claim 15]
`
`A resin-molded body having an optical reflectivity equal to or more than 70%
`
`at a wavelength between 350 nm and 800 nm after thermal curing, wherein
`
`a plurality of concave parts are formed, and in which a part of a lead frame is
`
`exposed in inner bottom surfaces of the concave parts, wherein the lead
`
`frame is provided with notch parts in which a thermal curing resin forming a
`
`resin-molded body is filled, and wherein a side wall portion is provided
`
`between the adjoining concave parts.
`
`IPR Page 5
`
`

`

`[Document] Specification
`
`[Title of Invention] Light Emitting Device, Resin Package, Resin-Molded
`
`Body and Manufacturing Method Thereof
`
` [Technical Field]
`
`[0001]
`
`The present invention relates to a light emitting device used for light
`
`equipment, a display, a backlight of a mobile telephone, a movie lighting
`
`auxiliary light source, and other general consumer light sources, and to a
`
`method for manufacturing such a light emitting device.
`
`[Background Art]
`
`[0002]
`
`A light emitting device using light emitting elements is small,
`
`provides good power efficiency, and emits light of bright color. Further, the
`
`light emitting elements are semiconductor elements, and therefore there is
`
`no concern for blowout. The light emitting elements have characteristics of
`
`good initial driving performance and are robust against vibration and
`
`repetition of on and off of lighting. The light emitting elements have these
`
`good characteristics, and therefore light emitting devices using light
`
`emitting elements such as light emitting diodes (LEDs) and laser diodes
`
`(LDs) are utilized as various light sources.
`
`[0003]
`
`FIG. 14 is a perspective view illustrating a method for manufacturing
`
`a conventional light emitting device. FIG. 15 is a perspective view
`
`illustrating an intermediate of the conventional light emitting device. FIG.
`
`16 is a perspective view illustrating the conventional light emitting device.
`
`[0004]
`
`Conventionally, as a method for manufacturing a light emitting device,
`
`a method is disclosed for insert-molding a lead frame with a non-translucent,
`
`light reflecting white resin, and molding a resin-molded body which has
`
`concave cups at predetermined intervals through the lead frame (e.g., refer
`
`to Patent Document 1). Although quality of a material of a white resin is not
`
`clearly described, as is insertion-molding performed and as is clear from the
`
`figures, a general thermoplastic resin is used. As a general thermoplastic
`
`resin, for example, a thermoplastic resin such as liquid crystal polymer, PPS
`
`(polyphenylene sulfide), and nylon is often used as a light blocking
`
`IPR Page 6
`
`

`

`resin-molded body (e.g., refer to Patent Document 2).
`
`[0005]
`
`However, the thermoplastic resin has little adhesion with a lead frame,
`
`and the resin part and lead frame are likely to be detached. Further, the
`
`thermosetting resin1 has lower resin fluidity of the resin and therefore is not
`
`adequate to mold a resin-molded body of a complicated shape and has little
`
`light resistance. In recent years in particular, the output of a light emitting
`
`element is remarkably improved and, as the output of a light emitting
`
`element is increased, light deterioration of a package made of a
`
`thermoplastic resin becomes more distinct.
`
`[0006]
`
`In order to solve the above problems, a light emitting device using a
`
`thermosetting resin for a material of a resin-molded body is disclosed (e.g.,
`
`refer to Patent Document 3). FIG. 17 is a perspective view and sectional view
`
`illustrating a conventional light emitting device. FIG. 18 is a schematic
`
`sectional view illustrating a method for manufacturing the conventional
`
`light emitting device. It is disclosed that, with this light emitting device,
`
`metal wires are formed from a metal foil by a common method such as
`
`punching or etching and are further arranged in a mold of a predetermined
`
`shape, and a thermosetting resin is filled in a mold resin inlet to
`
`transfer-mold.
`
`[0007]
`
`However, this manufacturing method has difficulty in manufacturing
`
`multiple light emitting devices in a short time. Further, there is a problem
`
`that a great amount of resin in a runner part is discarded per one light
`
`emitting device.
`
`[0008]
`
`As a different light emitting device and manufacturing method
`
`therefor, an optical semiconductor element mounting package substrate
`
`which has a light reflecting thermosetting resin composition layer on the
`
`wiring substrate, and manufacturing method therefor are disclosed (e.g.,
`
`refer to Patent Document 4). FIG. 19 is a schematic view illustrating steps of
`
`manufacturing a conventional
`
`light emitting device. This optical
`
`1 The term “thermosetting resin” appears to be a typographical error in the Japanese
`
`original for “thermoplastic resin.”
`
`IPR Page 7
`
`

`

`semiconductor element mounting package substrate is manufactured as an
`
`optical semiconductor element mounting package substrate of a matrix
`
`pattern which has a plurality of concave parts, by attaching a printed-wiring
`
`board having a flat plate shape to a mold, filling a light reflecting
`
`thermosetting resin composition in the mold, and thermo-pressure molding
`
`the light reflecting thermosetting resin composition by means of a
`
`transfer-molding machine. Further, it also describes that a lead frame is
`
`used instead of a printed-wiring board.
`
`[0009]
`
`However, these wiring board and lead frame have a flat plate shape
`
`and have a small adhering area because a thermosetting resin composition is
`
`arranged on this flat shape, and therefore there is a problem that a lead
`
`frame and thermosetting resin composition are likely to be detached upon
`
`dicing.
`
`[0010]
`
`[Patent Document 1] Japanese Patent Application Laid-Open No.
`
`2007-35794 (paragraph [0033] in particular)
`
`[Patent Document 2]
`
`Japanese Patent Application Laid-Open No.
`
`H11-087780
`
`[Patent Document 3] Japanese Patent Application Laid-Open No.
`
`2006-140207 (paragraph [0028] in particular)
`
`[Patent Document 4] Japanese Patent Application Laid-Open No.
`
`2007-235085
`
`[Disclosure of the Invention]
`
`[Problems to be Solved by the Invention]
`
`[0011]
`
`In view of the above problems, an object of the present invention is to
`
`provide a simple and low-cost method for manufacturing, in a short time,
`
`multiple light emitting devices which has high adhesion between a lead
`
`frame and a thermosetting resin composition.
`
`[Means for Solving the Problems]
`
`[0012]
`
`The present invention is earnestly studied and as a result is finally
`
`completed.
`
`[0013]
`
`In this specification, terms such as leads, a resin part, and resin
`
`IPR Page 8
`
`

`

`package are used for a singulated light emitting device, and terms such as a
`
`lead frame and resin-molded body are used in the stage prior to singulation.
`
`[0014]
`
`The present invention relates to a method of manufacturing a light
`
`emitting device having a resin package which provides an optical reflectivity
`
`equal to or more than 70% at a wavelength between 350 nm and 800 nm
`
`after thermal curing, and in which a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface. The method comprises: a
`
`step of sandwiching a lead frame provided with notch parts, by means of an
`
`upper mold and a lower mold; a step of transfer-molding a thermosetting
`
`resin containing a light reflecting material in a mold sandwiched by the
`
`upper mold and the lower mold to form a resin-molded body on the lead
`
`frame; and a step of cutting the resin-molded body and the lead frame along
`
`the notch parts. With the configuration, the thermosetting resin is filled in
`
`the notch parts, and therefore an adhering area between the lead frame and
`
`the thermosetting resin becomes large, so that it is possible to improve
`
`adhesion between the lead frame and the thermosetting resin. Further, a
`
`thermosetting resin having lower viscosity than a thermoplastic resin is used,
`
`so that it is possible to fill the thermosetting resin in the notch parts without
`
`leaving a gap. Further, it is possible to manufacture multiple light emitting
`
`devices at one time and greatly improve production efficiency. Furthermore,
`
`it is possible to reduce [[the number of]]2 runners which will be discarded,
`
`and provide light emitting devices at low cost.
`
`[0015]
`
`Preferably, plating processing is applied to the lead frame before the
`
`lead frame is sandwiched by the upper mold and the lower mold. In this case,
`
`in the manufactured light emitting device, plating processing is not applied
`
`to a cut surface and is applied to parts other than the cut surface. It is not
`
`necessary to apply plating processing per singulated light emitting device
`
`and it is possible to simplify a manufacturing method.
`
`[0016]
`
`Preferably, the notch parts in the cut parts of the lead frame is about
`
`half the entire surrounding periphery or greater. By this means, it is possible
`
`to reduce the weight of the lead frame and provide light emitting devices at
`
`2 The words within the brackets are added by the translation editor for clarity.
`
`IPR Page 9
`
`

`

`low cost. Further, the areas of the lead frame to be cut decrease, so that it is
`
`possible to better prevent the lead frame and the thermosetting resin from
`
`detaching.
`
`[0017]
`
`It should be note that the difference is that, while the thermosetting
`
`resin is filled in the notch parts, the thermosetting resin is not filled in hole
`
`parts which are described later. While the notch parts and hole parts
`
`penetrate the lead frame, grooves which are described later do not penetrate
`
`the lead frame.
`
`[0018]
`
`Preferably, a hole part is provided in the lead frame before the lead
`
`frame is sandwiched by the upper mold and the lower mold. By this means, it
`
`is possible to reduce the weight of the lead frame, and provide light emitting
`
`devices at low cost. It is possible to apply the plating processing to the hole
`
`parts, and consequently reduce exposure of the lead frame.
`
`[0019]
`
`Preferably, a groove is provided in the lead frame before the lead
`
`frame is sandwiched by the upper mold and the lower mold. By this means, it
`
`is possible to reduce the weight of the lead frame, and provide light emitting
`
`devices at low cost. It is possible to apply plating processing to the grooves,
`
`and consequently reduce exposure of the lead frame.
`
`[0020]
`
`Preferably, the upper mold and the lower mold sandwich a part of the
`
`lead frame where a light emitting element is placed or near a hole part. By
`
`this means, it is possible to control flapping of the lead frame, thus reducing
`
`burrs.
`
`[0021]
`
`The present invention relates to a light emitting device having a
`
`resin package having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, wherein a
`
`resin part and a lead are formed in a substantially same plane in an outer
`
`side surface, and wherein at least one surface of a bottom surface and an
`
`upper surface of the lead is plated, and the outer side surface of the lead is
`
`not plated. By this means, it is possible to prevent exposure of leads to which
`
`plating processing is not applied, and obtain multiple light emitting devices
`
`at one time. Further, by applying plating processing to only the part which
`
`IPR Page 10
`
`

`

`reflects light from a light emitting element, it is possible to improve the
`
`efficiency to extract light from the light emitting device.
`
`[0022]
`
`Preferably, the lead is exposed at four corners of the resin package.
`
`The exposed parts of the leads are reduced compared to leads which are
`
`provided on the one entire side surface of a resin package, so that it is
`
`possible to improve adhesion between the resin part and the leads. Further,
`
`the insulating resin part is provided between a positive lead and a negative
`
`lead, so that it is possible to prevent short-circuiting.
`
`[0023]
`
`Preferably, four corners of the resin package are formed in an arc
`
`shape seen from a bottom surface side. It is also possible to employ a
`
`configuration where plating processing is applied to a part which is formed
`
`in an arc shape and is not applied to the cut surface. By this means, it is
`
`possible to increase a bonding area with, for example, solder, and improve
`
`the bonding strength.
`
`[0024]
`
`Preferably, a step is provided in the lead. The step is preferably
`
`provided in the bottom surface of the resin package. It is also possible to
`
`employ a configuration where plating processing is applied to the part where
`
`the step is formed and is not applied to the cut surface. By this means, it is
`
`possible to increase a bonding area with, for example, solder, and improve
`
`the bonding strength.
`
`[0025]
`
`The present invention relates to a method for manufacturing a resin
`
`package having an optical reflectivity equal to or more than 70% at a
`
`wavelength between 350 nm and 800 nm after thermal curing, wherein a
`
`resin part and a lead are formed in a substantially same plane in an outer
`
`side surface. The method comprising: a step of sandwiching a lead frame
`
`provided with notch parts, by means of an upper mold and a lower mold; a
`
`step of transfer-molding a thermosetting resin containing a light reflecting
`
`material in a mold sandwiched by the upper mold and the lower mold to form
`
`a resin-molded body in the lead frame; and a step of cutting the resin-molded
`
`body and the lead frame along the notch parts. With the configuration, the
`
`thermosetting resin is filled in the notch parts, and therefore an adhering
`
`area between the lead frame and the thermosetting resin becomes large, so
`
`IPR Page 11
`
`

`

`that it is possible to improve adhesion between the lead frame and the
`
`thermosetting resin. Further, a thermosetting resin having lower viscosity
`
`than a thermoplastic resin is used, so that it is possible to fill the
`
`thermosetting resin in the notch parts without leaving a gap. Further, it is
`
`possible to obtain multiple resin packages at one time and greatly improve
`
`production efficiency. Furthermore, it is possible to reduce [[the number of]]3
`
`runners which will be discarded, and provide resin packages at low cost.
`
`[0026]
`
`Preferably, plating processing is applied to the lead frame before the
`
`lead frame is sandwiched by the upper mold and the lower mold. In this case,
`
`in the manufactured resin package, plating processing is not applied to a cut
`
`surface and is applied to parts other than the cut surface. It is not necessary
`
`to apply plating processing per singulated resin package and it is possible to
`
`simplify a manufacturing method.
`
`[0027]
`
`The present invention relates to a resin package having an optical
`
`reflectivity equal to or more than 70% at a wavelength between 350 nm and
`
`800 nm after thermal curing, wherein a resin part and a lead are formed in a
`
`substantially same plane in an outer side surface, and wherein at least one
`
`surface of a bottom surface and an upper surface of a lead is plated and a
`
`part of the outer side surface of the lead is not plated. By this means, it is
`
`possible to prevent exposure of leads to which plating processing is not
`
`applied, and provide multiple resin packages at one time. Further, by
`
`applying plating processing to only the part which reflects light from a light
`
`emitting element, it is possible to improve the efficiency to extract light from
`
`the light emitting device.
`
`[0028]
`
`The present invention relates to a method of manufacturing a
`
`resin-molded body having an optical reflectivity equal to or more than 70% at
`
`a wavelength between 350 nm and 800 nm after thermal curing, wherein a
`
`plurality of concave parts are formed, and in which a part of a lead frame is
`
`exposed in inner bottom surfaces of the concave parts. The method
`
`comprises: a step of sandwiching the lead frame by means of an upper mold
`
`which has convex parts in positions where the concave parts adjacent in the
`
`3 The words within the brackets are added by the translation editor for clarity.
`
`IPR Page 12
`
`

`

`resin-molded body are molded and a lower mold, the lead frame being
`
`provided with notch parts; a step of transfer-molding a thermosetting resin
`
`containing a light reflecting material in a mold sandwiched by the upper
`
`mold and the lower mold to fill the thermosetting resin in the notch parts,
`
`and forming the resin-molded body in the lead frame. With this configuration,
`
`it is possible to obtain multiple light emitting devices at one time and greatly
`
`improve production efficiency.
`
`[0029]
`
`The present invention relates to a resin-molded body having an
`
`optical reflectivity equal to or more than 70% at a wavelength between 350
`
`nm and 800 nm after thermal curing, wherein a plurality of concave parts
`
`are formed, and a part of a lead frame is exposed in inner bottom surfaces of
`
`the concave parts, and wherein the lead frame has notch parts to which a
`
`thermosetting resin to become the resin-molded body is filled, the
`
`resin-molded body having a sidewall between adjacent concave parts. By this
`
`means, it is possible to provide a resin-molded body of good thermal
`
`resistance and light resistance.
`
`[Effects of the Invention]
`
`[0030]
`
`The light emitting device and manufacturing method therefor
`
`according to the present invention can provide a light emitting device which
`
`provides high adhesion between a lead frame and a resin-molded body.
`
`Further, it is possible to obtain multiple light emitting devices in a short
`
`time and greatly improve production efficiency. Furthermore, it is possible to
`
`reduce [[the number of]]4 runners which will be discarded, and provide light
`
`emitting devices at low cost.
`
`[Preferred Embodiments of the Invention]
`
`[0031]
`
`Hereinafter,
`
`the preferred embodiments of a method
`
`for
`
`manufacturing a light emitting device and a light emitting device according
`
`to the present invention will be described in detail with drawings. However,
`
`the present invention is not limited to these embodiments.
`
`[0032]
`
`<First Embodiment>
`
`4 The words within the brackets are added by the translation editor for clarity.
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`IPR Page 13
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`(Light Emitting Device)
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`A light emitting device according to a first embodiment will be
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`described. FIG. 1 is a perspective view illustrating a light emitting device
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`according to the first embodiment. FIG. 2 is a sectional view illustrating a
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`light emitting device according to the first embodiment. FIG. 2 is a sectional
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`view taken along line II-II illustrated in FIG. 1. FIG. 3 is a plan view
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`illustrating a lead frame used in the first embodiment.
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`[0033]
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`A light emitting device 100 according to the first embodiment
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`provides an optical reflectivity equal to or greater than 70% at the
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`wavelength between 350 nm and 800 nm after thermal curing, and has a
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`resin package 20 in which a resin part 25 and leads 22 are formed in the
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`substantially same plane in outer side surfaces 20b. Plating processing is
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`applied to at least one surface of the bottom surface (an outer bottom surface
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`20a of the resin package 20) and the upper surface (an inner bottom surface
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`27a of a concave part 27) of the leads 22. By contrast with this, plating
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`processing is not applied to the side surfaces of the leads 22 (the outer side
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`surfaces 20b of the resin package 20). The resin part 25 occupies a large area
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`in the outer side surfaces 20b of the resin package 20, and leads 22 are
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`exposed from corner parts.
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`[0034]
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`The resin package 20 is formed with the resin part 25, which mainly
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`contains a light reflecting material 26, and the leads 22. The resin package
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`20 has the outer bottom surface 20a in which the leads 22 are arranged,
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`outer side surfaces 20b in which parts of the leads 22 are exposed, and the
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`outer upper surface 20c in which an opening concave part 27 is formed. In
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`the resin package 20, the concave part 27 having an inner bottom surface
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`27a and inner side surface 27b is formed. The leads 22 are exposed in the
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`inner bottom surface 27a of the resin package 20 and the light emitting
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`element 10 is placed on the leads 22. In the concave part 27 of the resin
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`package 20, a sealing member 30 which covers the light emitting element 10
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`is arranged. The sealing member 30 contains a fluorescent material 40. The
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`light emitting element 10 is electrically connected with the leads 20 5
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`5 The term “the leads 20” appears to be a typographical error in the Japanese original for
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`“the leads 22.”
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`IPR Page 14
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`through wires 50. The leads 206 are not arranged on the outer upper surface
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`20c of the resin package 20.
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`[0035]
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`Parts from which the leads 22 are exposed have the half or less
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`length than the entire surrounding length of the outer side surfaces 20b of
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`the resin package 20. In a method for manufacturing a light emitting device
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`which is described below, notch parts 21a are provided in a lead frame 21
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`and the lead frame 21 is cut along the notch parts 21a and, therefore, a cut
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`part of the lead frame 21 is a part which is exposed from the resin package
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`20.
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`[0036]
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`In the resin package 20, the leads 22 are exposed from the four
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`corners. The leads 22 are exposed on the outer side surfaces 20b, and are not
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`subjected to plating processing. Further, the leads 22 may be adapted to be
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`exposed on the outer bottom surface 20a and subjected to plating processing.
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`It should be noted that it is possible to apply plating processing to the outer
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`side surfaces 20b of the leads 22 after singulation.
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`[0037]
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`The light emitting device 100 provides the optical reflectivity equal
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`to or more than 70% at a wavelength between 350 nm and 800 nm after
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`thermal curing. This indicates that the optical reflectivity is high mainly in a
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`visible light region. The light emitting element 10 preferably has a light
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`emission peak wavelength between 360 nm and 520 nm, but one with a light
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`emission peak wavelength between 350 nm and 800 nm can be also used.
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`More preferably, the light emitting element 10 has a light emission peak
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`wavelength in a short wavelength region of visible light between 420 nm and
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`480 nm. This resin package 20 has good light resistance against light of a
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`short wavelength equal to or less than 480 nm, and is less likely to be
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`deteriorated. Further, this resin package 20 is not likely to be deteriorated
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`even when the light emitting element 10 generates heat by supplying the
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`current thereto, and has good thermal resistance.
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`[0038]
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`It is preferable to use as the resin package 20 a translucent
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`6 The term “the leads 20” appears to be a typographical error in the Japanese original for
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`“the leads 22.”
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`IPR Page 15
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`thermosetting resin highly filled with a light reflecting material. It is
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`preferable to use, for example, a thermosetting resin which provides the
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`optical transmittance equal to or more than 80% at 350 nm to 800 nm, and it
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`is more preferable to use a thermosetting resin which provides optical
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`transmittance equal to or more than 90%. This is so that deterioration of the
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`resin package 20 can be kept under control by reducing light which is
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`absorbed by the thermosetting resin. The light reflecting material 26
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`preferably reflects 90% or more light from the light emitting element 10, and
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`more preferably reflects 95% or more light. Further, the light reflecting
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`material 26 preferably reflects 90% or more light from the fluorescent
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`material 40, and more preferably reflects 95% or more light. By reducing the
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`amount of light which is absorbed by the light reflecting material 26, it is
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`possible to improve the efficiency to extract light from the light emitting
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`device 100.
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`[0039]
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`Although the light emitting device 100 may have any shape, the
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`light emitting device 100 may have a polygonal shape such as a generally
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`rectangular parallelepiped, generally cube, or generally hexagonal column.
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`The concave part 27 preferably splays out in the opening direction, but may
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`have a cylindrical shape. The concave part 27 can adopt a generally circular
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`shape, generally oval shape, or generally polygonal shape.
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`[0040]
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`Hereinafter, each member will be described below.
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`(Light Emitting Element)
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`Although a light emitting element, in which a semiconductor such as
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`GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN or
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`AlInGaN is formed on a substrate as a light emitting layer, is suitably used,
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`though such an element is not limited thereto. Although a light emitting
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`element which provides a light emission peak wavelength between 360 nm
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`and 520 nm is preferable, a light emitting element which provides a light
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`emission peak wavelength between 350 nm and 800 nm can be used. More
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`preferably, the light emitting element 10 has a light emission peak
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`wavelength in the short waveleng