(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT)
`
`(19) World Intellectual Proper ty Organization
`International Bureau
`
`(43) International Publication Date
`18 May 2007 (18.05.2007)
`
`PCT
`
`(51) lnternational Patent Classification:
`HOJL 33100 (2006.0 l)
`
`(21) lnternalional Applkation Number:
`PCT /KR2006/00444 7
`
`(22) lnternational Filin g Dale: 30 October2006 (30. 10.2006)
`
`(25) Filing Language:
`
`(26) Publication Language:
`
`(30) Priority Data:
`I 0-2005-0 L069 I 6
`
`Korean
`
`English
`
`9 Novero ber 2005 (09. I l.2005) KR
`
`(71) Applicant (for all designa1ed States except US):
`ALTl-ELECTRONICS CO., LTD. [KR/KR]; 90-1
`Bongmyeong-ri, Namsa-myeon, Cheoin-gu, Yongin-si,
`Gyeonggi-do 449-882 (KR).
`
`(72) lnventors; and
`(75) rnventors/Applicanl~ (for US only): PARK, Ik-Seong
`(KR/KRI;
`!08-2304 Dongah Apts.,
`Bongcheon
`2-dong, Gwanak-gu, Seoul 151-052
`(KR). LEE,
`Jin-Won
`[KRIKRl;
`107-501 Yewonmaeul Ferien
`Apls., Gorim-dong, Yongin-si, Gyeonggi-do 449-010
`(KR). CN, Chi-Ok [KR/KR] ; 9 L9- l Geumcheon-ri,
`Sinpyeong-myeon, Dangjin-gun, Chungcheongnam-do
`
`11111111111111 1111111111111 11111 111111111 111111111111111111111111111111111111111111111111111111
`
`(10) International Publication Number
`WO 2007/055486 Al
`343-8 12 (KR). KIM, Sun-Hong [KR/KR] ; 25-88 Juan
`5-dong, Nam-gu, lncheon 402-205 (KR).
`(74) Agent: LEE, Kycoog-Ran; 502, BYC Bldg., 648- 1 Yeok(cid:173)
`sam I-dong, Kangnam-ku, Seoul 135-081 (KR).
`(81) Designated States (unless othenvise indicated. for every
`kind of national protection ai1ailable): AB, AG, AL, AM,
`AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN,
`CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, Fl,
`GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS,
`JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT,
`LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MY, MZ,
`NA, NG, Nl, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU,
`SC, SD, SE, SG, SK, SL, SM, SY, SY, TJ, TM, TN, TR,
`rr, TZ, UA, UG, us, uz. vc, VN, ZA, ZM, zw.
`(84) Designated States (unless othenvise i11dicaied. for every
`kind of regional protection available): ARlPO (BW, Gl-1,
`GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM,
`ZW), Eurasian (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM),
`European (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, Fl,
`FR, GB, GR, I fU , IE, IS, IT, LT, LU, LY, MC, NL, PL, PT,
`RO, SE, S I, SK, TR), OAPl (BF, BJ, CF, CG, CI, CM, GA,
`GN, GQ, GW, Ml~. MR, NE, SN, TD, TG).
`P ublished :
`with inrematio11al search report
`
`(54) Title: LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACllJRlNG Tl-IE SAME
`
`{Continued on next page/
`
`provide lead frames
`
`form reflector
`
`die-attach LED chip
`
`wire-bond LED chip
`
`form lens part
`
`saw lead frames and wal Is
`
`S1
`
`S2
`
`S3
`
`S4
`
`S5
`
`S6
`
`(57) Abstract: A side view type
`light emitting diode and a method
`of manufacturing
`the
`same are
`disclosed. A method including (a)
`providing lead frames which include
`a cathode terminal and an anode
`termi nal; (b) forming a reflector which
`surrounds the lead frames, such that
`portions of the cathode 1erminal and
`anode terminal protrude from both
`sides, and which includes a groove
`open in
`the upward direction and
`a wall surrounding the groove; (c)
`die-anaching an LED chip onto the
`lead frames inside the groove; (d)
`bonding the LED chip 10 the cathode
`terminal or to the anode terminal with
`a conductive wire; (e) dispensing a
`liquid curable resin into the groove
`to form a lens part; and (f) sawing
`the walls facing each other using
`that
`the
`a sawing machine such
`thicknesses at the upper surfaces are
`0.04 to 0.05 mm, provides a side view
`type light emitting diode in which the
`thicknesses of the walls of the reflector
`are made to be 0.04 to 0.05 mm, for an
`overall thickness of 0.5 mm or lower.
`
`-------
`---------
`
`--
`
`----
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`VIZIO Ex. 1011 Page 0001
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`

`

`W 0 2007 /05 5486 A 1
`
`I lllll llllllll II llllll lllll lllll lllllllll I II Ill lllll lllll lllll 111111111111111111111 111111111111
`
`For 1wo-le11e r codes and other abbre11iatio11s. refer 10 the "Guid(cid:173)
`ance Notes on Codes and Abbreviations" appearing at the begin(cid:173)
`ning of each regular issue of the PCf Gazelle.
`
`VIZIO Ex. 1011 Page 0002
`
`

`

`WO 2007/055486
`
`PCT/KR2006/004.U7
`
`(DESCRIPTION]
`
`(Invention Title]
`
`LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACTURING
`
`THE SAME
`
`5
`
`[Technical Field]
`
`The present invention relates to a method of manufacturing a diode, more
`
`particularly to a method of manufacturing a side view type light emitting diode.
`
`10
`
`[Background Art]
`
`Witjl reference to Figs. 1 and 2, the composition of a backlight device in a liquid
`
`crystal display (LCD) in a mobile communication equipment is typically as illustrated in
`
`Fig. 1. That is, in a backlight device 10, a flat light guide plate 14 is arranged on the board,
`
`and side light emitting diodes, i.e. LED:s 20, are arranged at the sides of this light guide
`
`15
`
`plate 14. Typically, a plurality of LED's 20 are arranged in the fopn of arrays. The light L
`
`from the LED's 20 incident on the light guide plate 14 is reflected upwards by means of
`
`minute reflective patterns or a reflective sheet 16 arranged at the bottom surface of the
`
`light guide plate 14, and is emitted from the light guide plate 14 to provide a back.light for
`
`the LCD panel 18 above the light guide plate 1.4.
`
`20
`
`Fig. 2 is a front view showing an example of a conventional LED 20 such as that
`1
`
`VIZIO Ex. 1011 Page 0003
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`illustrated in Fig. 1. Referring to Fig. 2, an LED 20 includes a cup-shaped groove 28
`
`housing an LED chip 22 (see Fig. 1) within, and a package body 23 having thin walls 24
`
`at the top and bottom and relatively thick walls 26 to the left and right of the groove 28. In
`
`order to guide the light generated at the LED chip 22 to the exterior, the cup-shaped
`
`5
`
`groove 28 is open towards the front of the drawing to form an LED window, which is
`
`filled with a transparent resin to seal the LED chip from the exterior. Here, a fluorescent
`
`element, etc., may be included in the resin for converting a s~gle color light into white
`
`light. Also, a pair of terminals 29 are installed on both sides of the package body 23 to
`
`electrically connect the LED chip 22 to an exterior power source.
`
`10
`
`With this composition, the terminals 29 are not superposed with the groove 28, so
`
`that the overall thickness of the LED 20 is reduced.
`
`In particular, there is currently a demand for the reduction of thickness in LCD
`
`backlight devices, and a thickness reduction in the LED's is advantageous for the
`
`thickness reduction in backlight .devices. At present, there is a demand for a thickness of
`
`15
`
`about 0.6 mm or lower for side view type light emitting diodes (LED's) in LCD backlight
`
`devices, and it is expected that the demand will be for thicknesses of 0.5mm or lower in
`
`the future.
`
`However, with the LED 20 having a structure such as that illustrated in Figs. 1
`
`and 2, it is difficult to ensure a package thickness, i.e. fitted height, of 0.5 mm or lower.
`
`20
`
`This is becaus~ the opening of the groove 28, i.e. the LED window, requires a certain
`2
`
`VIZIO Ex. 1011 Page 0004
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`amount of width for guiding the light generated at the LED chip 22 to the exterior, the
`
`walls 24 at the top and bottom of the LED window also require a certaill' amount of
`
`thickness to ensure a desired strength, and it is difficult to make this thickness go be\ow a
`
`certain amount with only the injection-molding type of manufacturing method.
`
`5
`
`Another problem in the conventional LED applied to LCD backlight devices is
`
`that the opening of the groove 28, i.e. the LED window is separated upwards by a
`
`thickness th of the lower wall 24 from the bottom of the light guide plate 14. Thus, the
`
`light L generated at the LED chip 22 and emitted downwards towards the exterior of the
`
`groove 28 proceeds along a predetermined length before reaching the reflective sheet 16
`
`10
`
`at.the bottom of the light guide plate 14. This creates first dark spots 33, in which the light
`
`Lis dim, on the reflective sheet 16, to degrade the overall efficiency of the LCD backlight
`
`device.
`
`Meanwhile, with the miniaturization of mobile communication equipment on
`
`which the LCD backlight device is equipped, there is also a trend of reducing the
`
`15
`
`thickness of the light guide plate for the LCD backlight device. That is, the thickness of
`
`the light guide plate is being reduced to 0.5 mm and lower.
`
`In this case, another problem occurs in the LCD backlight device that employs
`
`conventional LED's, as described below with reference to Fig. 3. As illustrated in Fig. 3,
`
`when .the thickness of the light guide plate 14a is 0.5 mm or lower, the thickness of the
`
`20
`
`LED's 20a is made greater than that of the light guide plate 14a. Then, a substantial
`3
`
`VIZIO Ex. 1011 Page 0005
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`amount of light generated at the LED chip 22a within the LED 20a does not reach the
`
`light guide plate l 4a, and light loss occurs. Thus, to prevent this problem, an LCD
`
`backlight device lOa has reflectors 35 installed at the upper ends of the sides of the light
`
`guide plate 14a to guide the light to the inside of the light guide plate l 4a and prevent
`
`5
`
`light loss.
`
`However, this further complicates the composition of the LCD backlight device
`
`1 Oa, as well as its manufacturing process, which in turn increases the work times and
`
`costs.
`
`Moreover, as illustrated in Fig. 4, there are a plurality of side view type light
`
`·10
`
`emitting diodes, i.e. LED 's 20, arranged in the form of arrays on the board 12 at the sides
`
`of the light guide plate 14, where second dark spots 36, in which the light generated at the
`
`LED chips 22 are dim, exist between the plurality of LED's 20, to also degrade the overali
`
`efficiency of the LCD backlight device.
`
`Furthermore, as the depth of the groove 28 of the LED 20 (i.e. the distance from
`
`15
`
`the surface of the terminal 29 on which the LED chip 22 is mounted to the upper surface
`
`of the wall 24) is typically 0.6 mm or greater, the number of times the light emitted from
`
`LED chip 22 is reflected between the inner surfac.es of the walls 24 is high, so that light
`
`loss is increased.
`
`20
`
`[Disclosure]
`
`4
`
`VIZIO Ex. 1011 Page 0006
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`[Technical Problem]
`
`An aspect of the present invention is to provide a side view type light emitting
`
`diode and a method of manufacturing the same, in which, with a low cost, the thicknesses
`
`of the walls are made to be 0.04 to 0.05 mm for an overall thickness of 0.5 mm or lower,
`
`5
`
`according to the trend of the thickness of the light guide plate in a backlight device
`
`decreasing to 0.5 mm or lower.
`
`Another aspect of the present invention is to provide a side view type light
`
`emitting diode and a method of manufacturing the same, in which the manufacturing
`
`process is simplified by forming straight type electrodes without additional processes of
`
`10
`
`folding or bending, etc., when forming the lead frames, and in which the electrical contact
`
`between the lead frames and· the conductive pattern on the PCB and the supply of
`
`electricity are made more efficient by providing cutting-grooves on the lead frames (at the
`
`ends of the lead frames), when mounting the side view type light emitting diode on the
`
`PCB.
`
`15
`
`Yet another aspect of the present invention is to provide a side view type light
`
`emitting diode and a method of manufacturing the same, in which the height of the walls
`
`forming the reflectors is minimized, so that the total quantity of light emitted is increased,
`
`and the occurrence of dark spots is minimized when fitting onto a backlight device of an
`
`LCD.
`
`20
`
`5
`
`VIZIO Ex. 1011 Page 0007
`
`

`

`WO 2007/055486
`
`PCT/KR2006/004447
`
`[Technical Solution]
`
`One aspect of the present invention provides a method of manufacturing a side
`
`view type light emitting diode comprising: (a) providing lead frames which include a
`
`cathode terminal and an anode terminal; (b) forming a ref).ector which surrounds the lead
`
`5
`
`frames, such that portions of the cathode tenninal and anode terminal protrude from both
`
`sides, and which includes a groove open in the upward direction and a wall surrounding
`
`the groove; ( c) die-attaching an LED chip onto the lead frames inside the groove; ( d)
`
`bonding the LED_ chip to the cathode terminal or to the anode terminal with a conductive
`
`wire; (e) dispensing a liquid curable resin into the groove to form a lens part; and (f)
`
`10
`
`sawing the walls facing each other using a sawing machine, such that the thicknesses at
`
`the upper surfaces are 0.04 to 0.05 mm.
`
`Here, the lead frames may be formed by punching a copper (Cu) board plated
`
`with silver (Ag) using a press cast, and may include cutting-grooves on both side portions
`
`of the outer ends of the cathode terminal and the anode terminal.
`
`15
`
`Meanwhile, the reflector may be formed by plastic injection molding such that
`
`the width of the groove is 0.3 to 0.35 mm. Also, the inner surface of the wall may be
`
`formed to have a predefined inclination with respect to the bottom surface.
`
`Anyone of the (b) forming, the (c) die-attaching, and the (d) bonding may further
`
`include coating a reflective substance or joining a reflective plate of a metal material on
`
`·20
`
`the inner surface of the wall.
`
`6
`
`VIZIO Ex. 1011 Page 0008
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`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`The liquid curable resin may include liquid epoxy with a fluorescent substance
`
`mixed in, which may be in correspondence with the color of the LED chip.
`
`Another aspect of the present invention provides a side view type light emitting
`
`diode comprising: a pair of lead frames; a reflector which surrounds the lead frames and
`
`5 which includes a groove that is open in an upward direction and a wall that surrounds the
`
`groove; an LED chip mourited in the groove and electrically connected by wire bonding
`
`to the lead frame; and a lens part filled in the groove, where the walls facing each other
`
`have thicknesses of 0.04 to 0.05 mm at the upper surfaces.
`
`The pair oflead frames may be in the form of a strip, and the lead frames facing
`
`10
`
`each other may be arranged in a straight type configuration and separated by a predefined
`
`gap, and may have portions protruding out of the reflector. Here, the portions protruding
`
`out of the reflector may have a tapered shape, such that the width is narrower towards the
`
`end. Also, the height of the wall maybe 0.25 to 0.35 mm.
`
`Still another aspect of the present invention provides a side view type light
`
`15
`
`emitting diode comprising: a pair of lead frames; a reflector which surrounds the lead
`
`frames and which includes a groove that is open in an upward direction and a wall that
`
`surrounds the groove; an LED chip mounted in the groove and electrically connected by
`
`wire bonding to the lead frame; and a lens part filled in the groove, where .the height of the
`
`wall is 0.25 to 0.35 mm. The reflector may include a plastic material, the side view type
`
`20
`
`light emitting diode may ~e formed by injection molding, and the inner surface of the wall
`7
`
`VIZIO Ex. 1011 Page 0009
`
`

`

`WO 2007/055486
`
`PCT/KR2006/004447
`
`may be fonned to have a predefined inclination with respect to the bottom surface of the
`
`groove.
`
`The lens part may be formed by curing liquid epoxy that includes a fluoresc~nt
`
`substance in correspondence with the color of the light emitted by the LED chip.
`
`5
`
`Also, the pair of lead frames may be in the form of a strip, and the lead frames
`
`facing each other may be arranged in a straight type configuration and separated by a
`
`predefined gap, and may have portions protruding out of the reflector. Here, the portions
`
`protruding out of the reflector may have a tapered shape, such that the width is narrower
`
`towards the end.
`
`10
`
`[Adv!iJltageous Effects]
`
`.According to an aspect of the present invention, a side view type light emitting
`
`diode and a method of manufacturing the same can be provided which has an overall
`
`thickness of 0.5 mm or lower, by sawing the mold that surrounds the lead frames and
`
`15
`
`forms the reflector using blades, such that the thickness of the walls is 0.04 to 0.05 mm.
`
`Also, an aspect of the present invention can provide a side view type light
`
`emitting diode and a method of manufacturing the same, in which the manufacturing
`
`process is simplified by forming straight type electrodes without additional processes of
`
`folding or bending, etc., when forming the lead frames, and in which the electrical contact
`
`20
`
`between the lead frames and the conductive pattern on the PCB and the supply of
`8
`
`VIZIO Ex. 1011 Page 0010
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`electricity are made more efficient by providing cutting-grooves on the lead frames (at the
`
`ends of the lead frames), when mounting the side view type light emitting diode on the
`
`PCB.
`
`Also, an aspect of the present invention can provide a side view type light
`
`5
`
`emitting diode with which the total quantity oflight emitted is improved, by minimizing
`
`the height of the walls forming the reflector.
`
`Also, as the height of the walls fonning the reflector is minimized, the angle of
`
`the light emitted may be increased, whereby the forming of dark spots can be minimized
`
`when fitting onto the backlight device of an LCD.
`
`10
`
`[Description ofD~awings]
`
`Fig. 1 is a cross-sectional view for describing a problem in a conventional LED
`
`applied to an LCD backlight device.
`
`Fig. 2 is a front-elevational view illustrating an example of a conventional LED.
`
`15
`
`Fig. 3 is a cross-sectional view for describing another problem in a conventional
`
`LED applied to an LCD backlight device.
`
`Fig. 4 is a plan view of a conventional side view type light emitting diode arrayed
`
`in an LCD backlight device.
`
`Fig. 5 is a flowchart schematically representing a method of manufacturing a side
`
`20
`
`view type light emitting diode according to an embodiment of the present invention.
`9
`
`VIZIO Ex. 1011 Page 0011
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`Fig. 6 is a plan view illustrating lead frames according to an embodiment of the
`
`present inventi.on.
`
`Fig. 7 is a plan view illustrating the lead frames of Fig. 6 after forming a reflector
`
`on the lead frames.
`
`5
`
`Fig. 8 is a cross-sectional view across line A-A' of Fig. 7.
`
`Fig. 9 is a cross-sectional view across line B-B' of Fig. 7.
`
`Fig. 10 is a cross-sectional view after mounting an LED chip and performing
`
`wire bonding.
`
`Fig. 11 is a perspective view illustrating a side view type light emitting diode
`
`10 manufactured according to an embodiment of the present invention.
`
`Fig. 12 is a perspective view of a side view type light emitting diode according to
`
`an embodiment of the present invention.
`
`Fig. 13 is a cross-sectional view across line C-C' of Fig. 12 for describing the
`
`arrangement of the lead frames.
`
`15
`
`Fig. 14 is a cross-sectional view across line D-D' of Fig. 12 with the walls of the
`
`reflector at a common height h1•
`
`Fig. 15 is a cross-sectional view across line D-D' of Pig. 12 with the walls of the
`
`reflector at an advantageous height h2•
`
`Fig. 16 is a cross-sectional view across line E-E' of Fig. 12.
`
`20
`
`Fig. 17 is a perspective view illustrating an exainple of the side view type light
`10
`
`VIZIO Ex. 1011 Page 0012
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`emitting diode of Fig. 12 applied to an LCD backlight device.
`
`Fig. 18 is a plan view of Fig. 17.
`
`<Description of Reference Numerals for Major Components>
`
`5
`
`100 : side view type light emitting diode
`
`110 : lead frame plate
`
`111 (11 la, l llb) : lead frame
`
`113 : connection piece
`
`115 : cutting-groove
`
`120 : reflector
`
`121(121a,121b, 123a, 123b): walls
`
`C : cutting lines
`
`10
`
`130 : LED chip
`
`133 : conductive paste
`
`135 : gold (Au) wire
`
`137 : lens part
`
`[Best Mode]
`
`Embodiments of the side view type light emitting diode and a method of
`'
`
`15 manufacturing the san_ie, according to the present invention, will be described below in
`
`more detail with reference to the accompanying drawings. In the description with
`
`reference to the accompanying drawings, those components are rendered the same
`
`reference number that are the same or are in correspondence regardless of the figure
`
`number, and redundant explanations are omitted.
`
`20
`
`Fig. 5 is a flowc~art schematically representing a method of manufacturing a side
`11
`
`VIZIO Ex. 1011 Page 0013
`
`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`view type light emitting diode according to an embodiment of the present invention. In
`
`describing the method of manufacturing a side view type light emitting diode, the
`
`respective operations will be described with reference to Figs. 6 to 11.
`
`Fig. 6 is a plan view illustrating lead frames according to an embodiment of the
`
`5
`
`present invention, Fig. 7 is a plan view illustrating the lead frames of Fig. 6 after f~rming
`
`a reflector on the lead fraines, Fig. 8 is a cross-sectional view across line A-A' of Fig. 7,
`
`Fig. 9 is a cross-sectional view across line B-B' of Fig. 7, Fig. 10 is a cross-sectional view
`
`after mounting an LED chip and performing wire bonding, and Fig. 11 is a perspective
`
`view illustrating a side view type light emitting diode manufactured according to an
`
`10
`
`embodiment of the present invention.
`
`First, lead frames 110 (see Fig. 6) are prepared (SI).
`
`In this embodiment, a lead frame plate 110 such as that in Fig. 6 is formed by
`
`punching a copper (Cu) board plated with silver (Ag) using a press cast. Here, it is given
`
`a thickness of 0.2 mm, so that it can release the heat generated in the LED chip to the
`
`15
`
`exterior.
`
`A pair of lead frames 111 in the form of a strip is arranged such that the ends on
`
`the inside facing each other are separated by a predefined gap G, and the ends on the
`
`outside are connected on both sides by connection pieces 113. One side of the pair of lead
`
`frames 111 becomes the cathode terminal 111 a, while the other side becomes the anode
`
`20.
`
`terminal lllb.
`
`12
`
`VIZIO Ex. 1011 Page 0014
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`

`

`WO 2007/055486
`
`PCT /KR2006/0044.J7
`
`Meanwhile, cutting-grooves 115 are fonned on the outer parts of the portions
`
`where the outer ends of the lead frames meet the connection pieces. The function of the
`
`cutting-grooves 115 will be described later.
`
`Second, a reflector 120 (see Figs. 7 to 9) is fonned on the lead frame plate 110
`
`5
`
`(82).
`
`A reflector 120 is fonned, which surrounds the pair of lead frames 111 such that
`
`the ends protrude out at both the left and right sides, and which has a cup-shaped
`
`elongated groove 125 that houses the LED chip 130 (see Fig. 10) within, and thin upper
`
`and lower walls 121a, 121b and relatively thick left and right walls 123a, 123b
`
`10
`
`surrounding it. The reflector 120 is fonned on the upper and lower parts of the pair oflead
`
`frames 111, and is fonned by a general plastic injection molding technique.
`
`In this embodiment, the upper and lower thin walls 121a, 121b are made with a
`
`thickness of 0.2 mm each, with the distance between the inner surfaces of the upper and
`
`lower thin walls 121a, 12lb being 0.3 mm (the thickness of the bottom surface on which
`
`15
`
`the LED chip is placed) at the bottom of the groove 125.
`
`However, with plastic injection molding, the thickness cannot be made under
`
`0.07 mm for the walls, especially the thin walls at the top and bottom, and the
`
`mai:iufacturing cost is increased the more the thickness is decreased, and even if the
`
`reflector is manufactured at a high cost with 0.07 mm for the thickness of the walls, there
`
`20
`
`are still problems remaining, in that the overall thickness of the . side view type light
`13
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`emitting diode is made greater than 0.5mm, to be unable to satisfy the trends for a light
`
`guide plate 14a (see Fig. 3) having a thickness of 0.5 mm or lower, and that reflectors 35
`
`(see Fig. 3) may have to be used. A technical solution to these problems is achieved by the
`
`final operation of the method of manufacturing a side view type light emitting diode
`
`5
`
`according to an aspect of the present invention, the sawing of the lead frames and walls
`
`(S6, see Fig. 5). Detailed descriptions on this will be provided later.
`
`Meanwhile, in consideration of the light emission efficiency of the side view type
`
`light emitting diode, the inner surfaces of the walls 121a, 121 b, 121a, 121b are formed to
`
`have inclinations, while reflective substances may be coated on or a reflective plate of a
`
`IO metal material may be joined to the inner surfaces of the walls 121a, 121b, 121a, 12lb.
`
`Third, the LED CHIP 130 (see Fig. 9) is die-attached (S3).
`
`In this embodiment, the LED chip, 130 is attached onto the le~d frame 111 a inside
`
`the groove 125 using conductive paste 133, and an LED chip 130 of dimensions 0.24 x
`
`0.48 X 0.1 mm is used.
`
`15
`
`Fourth, the LED chip 130 is bonded to the lead frame 111 b with a conductive
`
`wire 135 (see Fig. 10) (S4). In this embodiment, a gold {Au) wire 135 was used.
`
`While in this embodiment, the LED chip 130 is attached to the lead frame 111 a of
`
`one side by means of conductive paste 133 and bonded afterwards to the lead frame 11 lb
`
`of the other side with a gold {Au) wire 135 for electrical connection, the case may also be
`
`20 . considered in which the LED chip is attached onto the mold of the reflector 120 between
`14
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`the opposing ends at the insides of the pair of lead frames 111 a, 111 b by means of
`
`non-conductive paste (not shown), with wire bonding respectively to the lead frames 111 a,
`
`111 b of both sides.
`
`Fifth, a lens part is formed in the groove 125 of the reflector (SS).
`
`5
`
`The lens part 137 is formed by dispensing liquid epoxy, mixed with a fluorescent
`
`substance in correspondence with the color of the LED chip 130, in the groove 125.
`
`Meanwhile, while in this embodiment, the lens part 137 was formed by mixing a
`
`fluorescent substance in liquid epoxy, the case may also be considered in which the lens
`
`part 137 is formed by potting the fluorescent substance on the LED chip 130 and
`
`10
`
`afterwards injecting a curable resin such as liquid epoxy into the groove 125 of the
`
`reflector.
`
`Finally, the lead frame plate and the walls are sawed (S6).
`
`Using a sawing machine that utilizes blades, both of the walls 121 a, 121 b facing
`
`each other are sawed along cutting lines C (see Figs. 7 and 8) such that the thickness of
`
`15
`
`each at the upper surface is 0.04 mm, whereby the side view type light emitting diode I 00
`
`and the method of manufacturing the same are completed.
`
`As described above, it is difficult to make the thicknesses of the walls be 0.07
`
`mm or lower with injection molding, so that in this embodiment, a sawing machine
`
`utilizing blades is used to make the thicknesses t2 of the walls 121a, 121b be 0.04 mm
`
`20
`
`each and to make the top width t3 of the groove of the reflector be 0.32 mm, whereby the
`15
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`overall thickness t (see Fig. 11) of the side view type light emitting diode is made 0.4 mm.
`
`By thus radically reducing the overall thickness of the side view type light
`
`emitting diode without incurring high costs, the thickness of the LCD backlight device
`
`employing the side view type light emitting diode may be reduced, to satisfy the trends of
`
`5
`
`using light guide plates of 0.5 mm or lower.
`
`Moreover, by reducing the thicknesses t2 of the walls 12la, 12lb to 0.4 mm each,
`
`the first dark spots 33 (see Fig. 1) may be minimized, to increase light emission efficiency
`
`when applying a .~ide view type light emitting diode based on an aspect of the present
`
`invention to an LCD backlight device.
`
`10
`
`Meanwhile, when the lead frames 110 (see Fig. 7) and the reflector 120 are sawed
`
`along the cutting lines C, the cutting-grooves 115 give the pair of lead .frames 11 la, 111 b
`
`a tapered shape such that the width is narrower towards the end, whereby the ends may be
`
`formed without sawing.
`
`Thus, the problem in using a copper (Cu) board plated with silver (Ag), of having
`
`15
`
`~e plated silver (Ag) detached from the copper (Cu) board during sawing, such that the
`
`efficiency is degraded in electrical contact between the lead frames and the conductive
`
`patterns on the PCB and in the supply of electricity when mounting the side view type
`
`light emitting diode on the PCB, is resolved for the lead frames.
`
`Fig. 12 is a perspective view of a side view type light emitting diode according to
`
`20
`
`an embodiment of the present invention, Fig. 13 is a cross-sectional view across line C-C'
`16
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`of Fig. 12 for describing the arrangement of the lead frames, Fig. 14 is a cross-sectional
`
`view across line D-D' of Fig. 12 with the walls of the reflector at a common height h1, Fig.
`
`15 is a cross-sectional view across line D-D' of Fig. 12 with the walls of the reflector at an
`
`advantageous height h2, and Fig. 16 is a cross-sectional view across line E-E' of Fig. 12.
`
`5
`
`Referring to Figs. 12 and 13, a reflector 120' is comprised, which surrounds the
`
`pair of lead frames 111 ', such that an end portion protrudes on both sides, and which
`
`includes a cup-shaped groove housing the LED chip 130' (see Figs. 14 to 16) within, and
`
`thin walls 121'a,121 'bat the top and bottom and relatively thick walls 123'a, 123'b to the
`
`left and right of the groove 125' surrounding it. The reflector 120' is formed at the upper
`
`10
`
`and lower portions of the pair of lead frames 111 ', and is typically formed by a general
`
`plastic injection molding technique.
`
`As shown in Fig. 13, the pair of lead frames 111' in the form of a strip ~ave the
`
`ends facing each other separated by a predefined gap, and are arranged in a straight type
`
`configuration, without any folded or bent surfaces overall. One side of the pair of lead
`
`15
`
`frames 111' becomes the cathode terminal 111 'a, while the other side becomes the anode
`
`terminal 111 'b. The polarity of each terminal may be changed as necessary.
`
`Also, in order for the plastic mold forming the reflector 120' to surround the lead
`
`frames 111 ' and be vertically connected, such that the lead frames 111' are stably
`
`supported, a portion of the inner sides of the lead frames 111' is made to have a narrower
`
`20 width than that of either outer end.
`
`17
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`VIZIO Ex. 1011 Page 0019
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`The pair of lead frames 111' used in this embodiment are formed by punching a
`
`copper (Cu) board plated with silver (Ag) using a press cast, where the lead frames 111'
`
`have a thickness of 0.2 mm, so that they can emit the heat generated in the LED chip to
`
`the exterior of the side view type light emitting diode.
`
`5
`
`Also, each outer end of the pair of lead frames 111 'a, 111 'b may have a tapered
`
`shape, such that the width is narrower towards the end.
`
`This is because, this shape may solve the problem of the plated silver (Ag)
`
`becoming detached from the copper (Cu) board, when manufacturing the pair of lead
`
`frames 111 'a, 111 'b by sawing the lead frame plate made of a copper (Cu) board plated
`
`10 with silver (Ag); it may increase the efficiency of electrical contact with the conductive
`
`patterns on the PCB, by providing room for the solder between the PCB and the ends of
`
`the lead frames, when mounting a side view type light emitting diode 100' based on an
`
`aspect of the present invention on the PCB; and it may improve the heat-releasing effect
`
`throu~ the lead frames, by allowing the side view type light emitting diode to closely
`
`15
`
`adhere to the PCB.
`
`Referring to Fig. 16, the LED 130' (0.24 x 0.48 X 0.1 ~)is mounted on the le~d
`
`frame 111 'a of one side exposed through the inside of the groove 125' of the chip reflector
`
`120', where the LED chip 130' is attached by means of conductive paste 133' and is
`
`bonded with the lead frame 111 'b of the other side by a gold (Au) wire 135' to be
`
`20
`
`electrically connected.
`
`18
`
`VIZIO Ex. 1011 Page 0020
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`Also, instead of attaching the LED chip 130' onto the lead frame 111 ' a of one
`
`side by means of conductive paste 13 3' and afterwards bonding to the lead frame 111 'b of
`
`the other side by means of a gold (Au