I lllll llllllll Ill lllll lllll lllll lllll lllll 111111111111111111111111111111111
`US009537071B2
`
`c12) United States Patent
`Ichikawa et al.
`
`(IO) Patent No.:
`(45) Date of Patent:
`
`US 9,537,071 B2
`*Jan. 3, 2017
`
`(54) LIGHT EMITTING DEVICE, RESIN
`PACKAGE, RESIN-MOLDED BODY, AND
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`RESIN-MOLDED BODY
`
`(71) Applicant: NICHIA CORPORATION, Anan-shi,
`Tokushima (JP)
`
`(72)
`
`Inventors: Hirofumi Ichikawa, Komatsushima
`(JP); Masaki Hayashi, Anan (JP);
`Shimpei Sasaoka, Tokushima (JP);
`Tomohide Miki, Tokushima (JP)
`
`(73) Assignee: NICHIA CORPORATION, Anan-Shi
`(JP)
`
`( * ) Notice:
`
`Subject to any disclaimer, the term ofthis
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`This patent is subject to a terminal dis(cid:173)
`claimer.
`
`(21) Appl. No.: 14/928,550
`
`(22) Filed:
`
`Oct. 30, 2015
`
`(65)
`
`Prior Publication Data
`
`US 2016/0056357 Al
`
`Feb. 25, 2016
`
`(52) U.S. Cl.
`CPC ........... HOJL 33162 (2013.01); B29C 4510055
`(2013.01); B29C 45114655 (2013.01);
`(Continued)
`(58) Field of Classification Search
`CPC .... HOlL 33/0033; HOlL 33/385; HOlL 24/97;
`H01L 33/62; HOlL 33/60; HOlL 33/486;
`HOlL 33/641; HOlL 2924/48091; H01L
`2924/3025; HOlL 2924/12041; H01L
`2924/12035; HOlL 2924/00012; H01L
`2924100; HOlL 2924/00014; B29C
`45/0055; B29C 45/14655; B29C 45/0066
`(Continued)
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`5,302,849 A
`5,428,248 A
`
`411994 Cavasin
`6/1995 Cha
`(Continued)
`
`FOREIGN PATENT DOCUMENTS
`
`EP
`EP
`
`8/1999
`0 936 683 Al
`2 100 908 Al
`9/2009
`(Continued)
`
`OTHER PUBLICATIONS
`
`Translation of JP 2007-235085A (Urashaki) Sep. 13, 2007, 16
`pages.*
`
`Related U.S. Application Data
`
`(Continued)
`
`(63) Continuation of application No. 13/969,182, filed on
`Aug. 16, 2013, which is a continuation of application
`(Continued)
`
`(30)
`
`Foreign Application Priority Data
`
`Sep. 3, 2008
`
`(JP) ................................. 2008-225408
`
`(51)
`
`Int. Cl.
`HOJL 33160
`HOJL 33162
`
`(2010.01)
`(2010.01)
`(Continued)
`
`Primary Examiner - Caridad Everhart
`(74) Attorney, Agent, or Firm - Foley & Lardner LLP
`
`(57)
`ABSTRACT
`A method of manufacturing a light emitting device having a
`resin package which provides an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, and in which a resin part and a lead
`are formed in a substantially same plane in an outer side
`surface, includes a step of sandwiching a lead frame pro-
`(Continued)
`
`120c
`
`125}120
`122
`
`VIZIO Ex. 1001 Page 0001
`
`

`

`US 9,537,071 B2
`Page 2
`
`vided with a notch part, by means of an upper mold and a
`lower mold, a step of transfer-molding a thermosetting resin
`containing a light reflecting material in a mold sandwiched
`by the upper mold and the lower mold to form a resin(cid:173)
`molded body in the lead frame and a step of cutting the
`resin-molded body and the lead frame along the notch part.
`
`26 Claims, 13 Drawing Sheets
`
`Related U.S. Application Data
`
`No. 12/737,940, filed as application No. PCT/JP2009/
`004170 on Aug. 27, 2009, now Pat. No. 8,530,250.
`
`(51)
`
`(2010.01)
`(2006.01)
`(2006.01)
`(2006.01)
`(2010.01)
`
`Int. Cl.
`HOJL 33148
`B29C 45100
`B29C 45114
`HOJL 23100
`HOJL 33164
`(52) U.S. Cl.
`CPC ............ HOJL 24197 (2013.01); HOJL 331486
`(2013.01); HOJL 33160 (2013.01); HOJL
`331641 (2013.01); B29C 27931009 (2013.01);
`HOlL 2224148091 (2013.01); HOlL
`2224148247 (2013.01); HOlL 2224148257
`(2013.01); HOlL 2924112035 (2013.01); HOlL
`2924112041 (2013.01); HOlL 2924112042
`(2013.01); HOlL 29241181 (2013.01); HOlL
`292413025 (2013.01); HOlL 293310033
`(2013.01); HOlL 293310066 (2013.01)
`( 58) Field of Classification Search
`USPC ....... 361/820; 438/26; 257/99, 100, E23.066
`See application file for complete search history.
`
`(56)
`
`References Cited
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`
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`
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`* 1112005
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`
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`
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`
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`
`VIZIO Ex. 1001 Page 0002
`
`

`

`US 9,537,071 B2
`Page 3
`
`(56)
`
`References Cited
`
`FOREIGN PATENT DOCUMENTS
`
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`
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`
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`
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`Office Action issued in U.S. Appl. No. 13/969,182 dated Dec. 4,
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`Office Action issued in U.S. Appl. No. 13/969,182 dated Mar. 5,
`2014.
`Translation of JP2007-29760 lA (Yuasa et al, Hitachi Chemical Co.
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`Office Action issued in Japanese Patent Application No. 2015-
`200794 mailed Sep. 13, 2016.
`* cited by examiner
`
`VIZIO Ex. 1001 Page 0003
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 1 of 13
`
`US 9,537,071 B2
`
`Fig. 1
`
`100
`~
`
`"
`
`-rr
`22
`
`22
`
`10
`
`~ 20a
`
`VIZIO Ex. 1001 Page 0004
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 2 of 13
`
`US 9,537,071 B2
`
`Fig. 2
`
`27
`
`27a
`
`27b
`
`30
`
`100
`
`I
`r - 20b
`
`26
`
`25
`
`22
`
`20
`
`20a
`
`VIZIO Ex. 1001 Page 0005
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`

`

`U.S. Patent
`
`Jan. 3, 2017
`
`Sheet 3 of 13
`
`US 9,537,071 B2
`
`Fig. 3
`
`OCu . -~~ 21
`
`~J ~-- ---~21a
`~
`
`u
`
`VIZIO Ex. 1001 Page 0006
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 4of13
`
`US 9,537,071 B2
`
`Fig. 4
`
`2la
`
`21
`
`61} 60
`
`62
`
`61}
`
`62
`
`60
`
`VIZIO Ex. 1001 Page 0007
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`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 5of13
`
`US 9,537,071 B2
`
`Fig. 5
`
`• • • • • 0-==.:.==c...c=~==-t-------··· .... ~124
`
`I m
`
`~--26
`
`----/ 27
`
`VIZIO Ex. 1001 Page 0008
`
`

`

`U.S. Patent
`
`Jan.3,2017
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`Sheet 6of13
`
`US 9,537,071 B2
`
`Fig. 6
`
`120c
`
`125} 120
`122
`
`VIZIO Ex. 1001 Page 0009
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`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 7of13
`
`US 9,537,071 B2
`
`Fig. 7
`
`121b
`
`0
`
`0
`
`0
`
`~
`~
`~
`
`0
`
`0
`
`0
`
`0
`
`~
`u
`u
`
`0
`
`0
`
`0
`
`0
`
`~r~r~
`. -= 0
`r-~- _____ 12la
`~
`u
`~
`u
`
`------------ 12 1
`
`- -~ 0
`
`0
`
`0
`
`0
`
`~
`
`0
`
`VIZIO Ex. 1001 Page 0010
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`

`

`U.S. Patent
`
`Jan.3,2017
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`Sheet 8of13
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`US 9,537,071 B2
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`Fig. 8
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`121b
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`VIZIO Ex. 1001 Page 0011
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`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 9of13
`
`US 9,537,071 B2
`
`Fig. 9
`
`Fig. 10
`
`220c
`
`220a
`
`221
`
`221c
`
`VIZIO Ex. 1001 Page 0012
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`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 10 of 13
`
`US 9,537,071 B2
`
`Fig. 11
`
`320c
`
`~;~~}320
`c::.::
`'\
`
`320b
`
`320a
`
`Fig. 12
`
`420c
`
`425} 420
`422
`
`420b
`
`VIZIO Ex. 1001 Page 0013
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`

`

`U.S. Patent
`
`Jan.3,2017
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`Sheet 11 of 13
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`US 9,537,071 B2
`
`Fig. 13
`
`Fig. 14 (Prior Art)
`
`520c
`
`520a
`
`(a)
`
`(b)
`
`(c)
`
`(d)
`
`(e)
`
`Fig. 1 5 (Prior Art)
`
`~~
`
`VIZIO Ex. 1001 Page 0014
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`U.S. Patent
`
`Jan.3,2017
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`Sheet 12 of 13
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`US 9,537,071 B2
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`Fig. 1 6 (Prior Art)
`
`Fig. 1 7 (Prior Art)
`
`Fig. 1 8 (Prior Art)
`
`(a)
`
`I ._I -~
`
`(b)
`
`(c) ~
`
`VIZIO Ex. 1001 Page 0015
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`U.S. Patent
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`Jan.3,2017
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`Sheet 13 of 13
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`US 9,537,071 B2
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`Fig. 1 9 (Prior Art)
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`(a)
`
`(b)
`
`(c)
`
`(d)
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`VIZIO Ex. 1001 Page 0016
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`

`

`US 9,537,071 B2
`
`1
`LIGHT EMITTING DEVICE, RESIN
`PACKAGE, RESIN-MOLDED BODY, AND
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`RESIN-MOLDED BODY
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`This application is a continuation of U.S. patent applica- 10
`tion Ser. No. 13/969,182, filed Aug. 16, 2013, which in tum
`is a continuation of U.S. patent application Ser. No. 12/737,
`940, filed on May 13, 2011, which issued as U.S. Pat. No.
`8,530,250 on Sep. 10, 2013.
`
`15
`
`2
`ment 3). FIG. 17 is a perspective view and sectional view
`illustrating a conventional light emitting device. FIG. 18 is
`a schematic sectional view illustrating a method for manu(cid:173)
`facturing the conventional light emitting device. It is dis(cid:173)
`closed that, with this light emitting device, metal wires are
`formed from a metal foil by a common method such as
`punching or etching and are further arranged in a mold of a
`predetermined shape, and a thermosetting resin is filled in a
`mold resin inlet to transfer-mold.
`However, this manufacturing method has difficulty in
`manufacturing multiple light emitting devices in a short
`time. Further, there is a problem that a great amount of a
`resin of a runner part is discarded per one light emitting
`device.
`As a different light emitting device and manufacturing
`method therefor, an optical semiconductor element mount(cid:173)
`ing package substrate which has a light reflecting thermo(cid:173)
`setting resin composition layer on the wiring substrate, and
`manufacturing method therefor are disclosed (e.g., refer to
`20 Patent Document 4). FIG. 19 is a schematic view illustrating
`steps of manufacturing a conventional light emitting device.
`This optical semiconductor element mounting package sub(cid:173)
`strate is manufactured as an optical semiconductor element
`mounting package substrate of a matrix pattern which has a
`25 plurality of concave parts, by attaching a printed-wiring
`board having a flat plate shape to a mold, filling a light
`reflecting thermosetting resin composition in the mold, and
`heating and pressuring molding the light reflecting thermo(cid:173)
`setting resin by means of a transfer-molding machine. Fur-
`30 ther, it is also disclosed that a lead frame is used instead of
`a printed-wiring board.
`However, these wiring board and lead frame have a flat
`plate shape and have a small adhering area because a
`thermosetting resin composition is arranged on this flat
`35 shape, and therefore there is a problem that, for example, a
`lead frame and thermosetting resin composition are likely to
`be detached upon singulation.
`Patent Document 1: Japanese Patent Application Laid(cid:173)
`Open No. 2007-35794
`Patent Document 2: Japanese Patent Application Laid(cid:173)
`Open No. 11-087780
`Patent Document 3: Japanese Patent Application Laid(cid:173)
`Open No. 2006-140207
`Patent Document 4: Japanese Patent Application Laid-
`45 Open No. 2007-235085
`
`TECHNICAL FIELD
`
`The present invention relates to a light emitting device
`used for light equipment, a display, a backlight of a mobile
`telephone, a movie lighting auxiliary light source, and other
`general consumer light sources, and to a method for manu(cid:173)
`facturing a light emitting device.
`
`BACKGROUND ART
`
`A light emitting device using light emitting elements is
`small, provides good power efficiency, and emits light of
`bright color. Further, the light emitting elements are semi(cid:173)
`conductor elements, and therefore there is no concern for
`blowout. The light emitting elements have characteristics of
`good initial driving performance and are robust against
`vibration and repetition of on and off of lighting. The light
`emitting elements have these good characteristics, and there(cid:173)
`fore light emitting devices using light emitting elements
`such as light emitting diodes (LEDs) and laser diodes (LDs)
`are utilized as various light sources.
`FIG. 14 is a perspective view illustrating a method for
`manufacturing a conventional light emitting device. FIG. 15
`is a perspective view illustrating an intermediate of the
`conventional light emitting device. FIG. 16 is a perspective 40
`view illustrating the conventional light emitting device.
`Conventionally, as a method for manufacturing a light
`emitting device, a method is disclosed for insert-molding a
`lead frame with a non-translucent, light reflecting white
`resin, and molding a resin-molded body which has concave
`cups at predetermined intervals through the lead frame (e.g.,
`refer to Patent Document 1 ). Although quality of a material
`of a white resin is not clearly described, as is insertion(cid:173)
`molding performed and as is clear from the figures, a general
`thermoplastic resin is used. As a general thermoplastic resin, 50
`for example, a thermoplastic resin such as liquid crystal
`polymer, PPS (polyphenylene sulfide), and nylon is often
`used as a light blocking resin-molded body (e.g., refer to
`Patent Document 2).
`However, the thermoplastic resin has little adhesion with 55
`a lead frame, and the resin part and lead frame are likely to
`be detached. Further, the thermosetting resin has lower resin
`fluidity of the resin and therefore is not adequate to mold a
`resin-molded body of a complicated shape, and has little
`light resistance. In recent years in particular, the output of a 60
`light emitting element is remarkably improved and, as the
`output of a light emitting element is increased, light dete(cid:173)
`rioration of a package made of a thermoplastic resin
`becomes more distinct.
`In order to solve the above problems, a light emitting 65
`device using a thermosetting resin for a material of a
`resin-molded body is disclosed (e.g., refer to Patent Docu-
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is a perspective view illustrating a light emitting
`device according to a first embodiment.
`FIG. 2 is a sectional view illustrating the light emitting
`device according to the first embodiment.
`FIG. 3 is a plan view illustrating a lead frame used in the
`first embodiment.
`FIG. 4 is a schematic sectional view illustrating a method
`for manufacturing a light emitting device according to the
`first embodiment.
`FIG. 5 is a plan view illustrating a resin-molded body
`according to the first embodiment.
`FIG. 6 is a perspective view illustrating a light emitting
`device according to a second embodiment.
`FIG. 7 is a plan view illustrating a lead frame used in the
`second embodiment.
`FIG. 8 is a plan view illustrating a resin-molded body
`according to the second embodiment.
`FIG. 9 is a perspective view illustrating a light emitting
`device according to a third embodiment.
`
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`US 9,537,071 B2
`
`3
`FIG. 10 is a plan view illustrating a lead frame used in the
`third embodiment.
`FIG. 11 is a perspective view illustrating a light emitting
`device according to a fourth embodiment.
`FIG. 12 is a perspective view illustrating a light emitting
`device according to a fifth embodiment.
`FIG. 13 is a perspective view illustrating a resin package
`according to a sixth embodiment.
`FIG. 14 is a perspective view illustrating a method for
`manufacturing a conventional light emitting device.
`FIG. 15 is a perspective view illustrating an intermediate
`of a conventional light emitting device.
`FIG. 16 is a perspective view illustrating a conventional
`light emitting device.
`FIG. 17 is a perspective view and a sectional view
`illustrating a conventional light emitting device.
`FIG. 18 is a schematic sectional view illustrating a
`method for manufacturing a conventional light emitting
`device.
`FIG. 19 is a schematic diagram illustrating steps of
`manufacturing a conventional light emitting device.
`
`DETAILED DESCRIPTION
`
`4
`is not necessary to apply plating processing per singulated
`light emitting device and it is possible to simplify a manu(cid:173)
`facturing method.
`Preferably, the notch part in a cut part of the lead frame
`is about half the entire surrounding periphery. By this means,
`it is possible to reduce the weight of the lead frame and
`provide light emitting devices at low cost. Further, the part
`of the lead frame to be cut decreases, so that it is possible to
`better prevent the lead frame and the thermosetting resin
`10 from detaching.
`In addition, the difference is that, while the thermosetting
`resin is filled in the notch parts, the thermosetting resin is not
`filled in hole parts which are described later. While the notch
`parts and hole parts penetrate the lead frame, grooves which
`15 are described later do not penetrate the lead frame.
`Preferably, a hole part is provided in the lead frame before
`the lead frame is sandwiched by the upper mold and the
`lower mold. By this means, it is possible to reduce the
`weight of the lead frame more, and provide light emitting
`20 devices at low cost. It is possible to apply the plating
`processing to the hole parts, and consequently prevent
`exposure of the lead frame.
`Preferably, a groove is provided in the lead frame before
`the lead frame is sandwiched by the upper mold and the
`25 lower mold. By this means, it is possible to reduce the
`weight of the lead frame more, and provide light emitting
`devices at low cost. It is possible to apply plating processing
`to the grooves, and consequently prevent exposure of the
`lead frame.
`Preferably, the upper mold and the lower mold sandwich
`a part of the lead frame where a light emitting element is
`placed or near a hole part. By this means, it is possible to
`prevent the lead frame from flip-flopping and reduce burrs.
`The present invention relates to a light emitting device
`having a resin package having an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, wherein a resin part and a lead are
`formed in a substantially same plane in an outer side surface,
`and wherein at least one surface of a bottom surface and an
`upper surface of a lead is plated and the outer side surface
`of the lead is not plated. By this means, it is possible to
`prevent exposure of leads to which plating processing is not
`applied, and provide multiple light emitting devices at one
`time. Further, by applying plating processing to only the part
`which reflects light from a light emitting element, it is
`possible to improve the efficiency to extract light from the
`light emitting device.
`Preferably, the lead is exposed at four comers of the resin
`package. The exposed parts of the leads are reduced com(cid:173)
`pared to leads which are provided on the one entire side
`surface of a resin package, so that it is possible to improve
`adhesion between the resin part and the leads. Further, the
`insulating resin part is provided between a positive lead and
`a negative lead, so that it is possible to prevent short
`circuiting.
`Preferably, four corners of the resin package are formed in
`an arc shape seen from a bottom surface side. It is also
`possible to employ a configuration where plating processing
`is applied to a part which is formed in an arc shape and is
`not applied to the cut surface. By this means, it is possible
`to expand a bonding area with, for example, a solder, and
`improve the boding strength.
`Preferably, a step is provided in the lead. The differences
`in level are preferably provided in the bottom surface of the
`resin package. It is also possible to employ a configuration
`where plating processing is applied to a part in which
`differences in level are formed and is not applied to the cut
`
`35
`
`30
`
`In view of the above problems, an object of the present
`invention is to provide a simple and low-cost method for
`manufacturing, in a short time, multiple light emitting
`devices which has high adhesion between a lead frame and
`a thermosetting resin composition.
`The present invention is earnestly studied and as a result
`is finally completed.
`In this description, terms such as leads, a resin part, and
`resin package are used for a singulated light emitting device,
`and terms such as a lead frame and resin molded body are
`used in the stage prior to singulation.
`The present invention relates to a method of manufactur(cid:173)
`ing a light emitting device having a resin package which
`provides an optical reflectivity equal to or more than 70% at 40
`a wavelength between 350 nm and 800 nm after thermal
`curing, and in which a resin part and a lead are formed in a
`substantially same plane in an outer side surface. The
`method comprises: a step of sandwiching a lead frame
`provided with a notch part, by means of an upper mold and 45
`a lower mold; a step of transfer-molding a thermosetting
`resin containing a light reflecting material in a mold sand(cid:173)
`wiched by the upper mold and the lower mold to form a
`resin-molded body in the lead frame; and a step of cutting
`the resin molded body and the lead frame along the notch 50
`part. With the configuration, the thermosetting resin is filled
`in the notch parts, and therefore an adhering area between
`the lead frame and the thermosetting resin becomes large, so
`that it is possible to improve adhesion between the lead
`frame and the thermosetting resin. Further, a thermosetting 55
`resin having lower viscosity than a thermoplastic resin is
`used, so that it is possible to fill the thermosetting resin in the
`notch parts without leaving a gap. Further, it is possible to
`manufacture multiple light emitting devices at one time and
`greatly improve productive efficiency. Furthermore, it is 60
`possible to reduce runners which are discarded, and provide
`light emitting devices at low cost.
`Preferably, plating processing is applied to the lead frame
`before the lead frame is sandwiched by the upper mold and
`the lower mold. In this case, in the manufactured light 65
`emitting device, plating processing is not applied to a cut
`surface and is applied to parts other than the cut surface. It
`
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`US 9,537,071 B2
`
`5
`surface. By this means, it is possible to expand a bonding
`area with, for example, a solder, and improve the boding
`strength.
`The present invention relates to a method for manufac(cid:173)
`turing a resin package having an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, wherein a resin part and a lead are
`formed in a substantially same plane in an outer side surface.
`The method comprising: a step of sandwiching a lead frame
`provided with a notch part, by means of an upper mold and 10
`a lower mold; a step of transfer-molding a thermosetting
`resin containing a light reflecting material in a mold sand(cid:173)
`wiched by the upper mold and the lower mold to form a
`resin-molded body in the lead frame; and a step of cutting 15
`the resin-molded body and the lead frame along the notch
`part. With the configuration, the thermosetting resin is filled
`in the notch parts, and therefore an adhering area between
`the lead frame and the thermosetting resin becomes large, so
`that it is possible to improve adhesion between the lead 20
`frame and the thermosetting resin. Further, a thermosetting
`resin having lower viscosity than a thermoplastic resin is
`used, so that it is possible to fill the thermosetting resin
`in the notch parts without leaving a gap. Further, it is
`possible to manufacture multiple resin packages at one time 25
`and greatly improve productive efficiency. Furthermore, it is
`possible to reduce runners which are discarded, and provide
`resin packages at low cost.
`Preferably, plating processing is applied to the lead frame
`before the lead frame is sandwiched by the upper mold and 30
`the lower mold. In this case, in the manufactured resin
`package, plating processing is not applied to a cut surface
`and is applied to parts other than the cut surface. It is not
`necessary to apply plating processing per singulated resin
`package and it is possible to simplify a manufacturing 35
`method.
`The present invention relates to a resin package having an
`optical reflectivity equal to or more than 70% at a wave(cid:173)
`length between 350 nm and 800 nm after thermal curing,
`wherein a resin part and a lead are formed in a substantially
`same plane in an outer side surface, and wherein at least one
`surface of a bottom surface and an upper surface of a lead
`is plated and the outer side surface of the lead is not plated.
`By this means, it is possible to prevent exposure of leads to
`which plating processing is not applied, and provide mul(cid:173)
`tiple resin packages at one time. Further, by applying plating
`processing to only the part which reflects light from a light
`emitting element, it is possible to improve the efficiency to
`extract light from the light emitting device.
`The present invention relates to a method of manufactur(cid:173)
`ing a resin-molded body having an optical reflectivity equal
`to or more than 70% at a wavelength between 350 nm and
`800 nm after thermal curing, wherein a plurality of concave
`parts are formed, and in which a part of a lead frame is
`exposed in inner bottom surfaces of the concave parts. The
`method comprises: a step of sandwiching the lead frame by
`means of an upper mold which has convex parts in positions
`where the concave parts adjacent in the resin molded body
`are molded and a lower mold, the lead frame being provided
`with notch parts; a step of transfer-molding a thermosetting 60
`resin containing a light reflecting material in a mold sand(cid:173)
`wiched by the upper mold and the lower mold to fill the
`thermosetting resin in the notch parts, and forming the
`resin-molded body in the lead frame. With this configura(cid:173)
`tion, it is possible to manufacture multiple light emitting 65
`devices at one time and greatly improve productive effi-
`ciency.
`
`6
`The present invention relates to a resin-molded body
`having an optical reflectivity equal to or more than 70% at
`a wavelength between 350 nm and 800 nm after thermal
`curing, wherein a plurality of concave parts are formed and
`a part of a lead frame is exposed in inner bottom surfaces of
`the concave parts, and wherein the lead frame has notch
`parts and a thermosetting resin which becomes the resin(cid:173)
`molded body is filled, the resin-molded body having a
`sidewall between adjacent concave parts. By this means, it
`is possible to provide a resin-molded body of good thermal
`resistance and light resistance.
`The light emitting device and manufacturing method
`therefor according to the present invention can provide a
`light emitting device which provides high adhesion between
`a lead frame and a resin-molded body. Further, it is possible
`to provide multiple light emitting devices in a short time and
`greatly improve production efficiency. Furthermore, it is
`possible to reduce runners which are discarded, and provide
`light emitting devices at low cost.
`Hereinafter, the preferred embodiments of a method for
`manufacturing a light emitting device and a light emitting
`device according to the present invention will be described
`in detail with drawings. However, the present invention is
`not limited to this embodiment.
`<First Embodiment>
`(Light Emitting Device)
`A light emitting device according to a first embodiment
`will be described. FIG. 1 is a perspective view illustrating a
`light emitting device according to the first embodiment. FIG.
`2 is a sectional view illustrating a light emitting device
`according to the first embodiment. FIG. 2 is a sectional view
`taken along line II-II illustrated in FIG. 1. FIG. 3 is a plan
`view illustrating a lead frame used in the first embodiment.
`A light emitting device 100 according to the first embodi(cid:173)
`ment provides an optical reflectivity equal to or greater than
`70% at the wavelength between 350 nm and 800 nm after
`thermal curing, and has a resin package 20 in which a resin
`part 25 and leads 22 are formed in the substantially same
`plane in outer side surfaces 20b. Plating processing is
`40 applied to at least one surface of the bottom surface (an outer
`bottom surface 20a of the resin package 20) and the upper
`surface (an inner bottom surface 27a of a concave part 27)
`of the leads 22. By contrast with this, plating processing is
`not applied to the side surfaces of the leads 22 (the outer side
`45 surfaces 20b of the resin package 20). The resin part 25
`occupies a large area in the outer side surfaces 20b of the
`resin package 20, and leads 22 are exposed from comer
`parts.
`The resin package 20 is formed with the resin part 25
`50 which mainly contains a light reflecting material 26, and the
`leads 22. The resin package 20 has the outer bottom surface
`20a in which the leads 22 are arranged, outer side surfaces
`20b in which part of the leads 22 are exposed, and the outer
`upper surface 20c in which an opening concave part 27 is
`55 formed. In the resin package 20, the concave part 27 having
`an inner bottom surface 27a and inner side surface 27b is
`formed. The leads 22 are exposed in the inner bottom surface
`27 a of the resin package 20 and the light emitting element
`10 is placed on the leads 22. In the concave part 27 of the
`resin package 20, a scaling member 30 which covers the
`light emitting element 10 is arranged. The sealing member
`30 contains a fluorescent material 40. The light emitting
`element 10 is electrically connected with the leads 22
`through wires 50. The leads 22 are not arranged on the outer
`upper surface 20c of the resin package 20.
`Parts from which the leads 22 are exposed have the half
`or less length than the entire surrounding length of the outer
`
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`US 9,537,071 B2
`
`7
`side surfaces 20b of the resin package 20. In a method for
`manufacturing a light emitting device which is described
`below, notch parts 2la are provided in a lead frame 21 and
`the le