I IIIII IIIIIIII Ill lllll lllll lllll lllll lllll lllll lllll lllll 111111111111111111
`
`US009537071B2
`
`c12) United States Patent
`Ichikawa et al.
`
`(IO) Patent No.:
`(45) Date of Patent:
`
`US 9,537,071 B2
`*Jan. 3, 2017
`
`(54) LIGHT EMITTING DEVICE, RESIN
`PACKAGE, RESIN-MOLDED BODY, AND
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`RESIN-MOLDED BODY
`
`(71) Applicant: NICHIA CORPORATION, Anan-shi,
`Tokushima (JP)
`
`(72)
`
`Inventors: Hirofumi Ichikawa, Komatsushima
`(JP); Masaki Hayashi, Anan (JP);
`Shimpei Sasaoka, Tokushima (JP);
`Tomohide Miki, Tokushima (JP)
`
`(52) U.S. Cl.
`CPC ........... HOJL 33/62 (2013.01); B29C 45/0055
`(2013.01); B29C 45/14655 (2013.01);
`(Continued)
`(58) Field of Classification Search
`CPC .... HOlL 33/0033; HOlL 33/385; HOlL 24/97;
`H01L 33/62; HOlL 33/60; HOlL 33/486;
`HOlL 33/641; HOlL 2924/48091; H01L
`2924/3025; HOlL 2924/12041; H01L
`2924/12035; HOlL 2924/00012; H01L
`2924/00; HOlL 2924/00014; B29C
`45/0055; B29C 45/14655; B29C 45/0066
`(Continued)
`
`(73) Assignee: NICHIA CORPORATION, Anan-Shi
`(JP)
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`( *) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by O days.
`
`This patent is subject to a terminal dis­
`claimer.
`
`5,302,849 A
`5,428,248 A
`
`4/ 1994 Cavasin
`6/1995 Cha
`(Continued)
`
`FOREIGN PATENT DOCUMENTS
`
`(21) Appl. No.: 14/928,550
`
`(22) Filed:
`
`Oct. 30, 2015
`
`EP
`
`EP
`
`8/1999
`0 936 683 Al
`9/2009
`2 100 908 Al
`(Continued)
`
`(65)
`
`Prior Publication Data
`
`OTHER PUBLICATIONS
`
`US 2016/0056357 Al
`
`Feb. 25, 2016
`
`Translation of JP 2007-235085A (Urashaki) Sep. 13, 2007, 16
`pages.*
`
`Related U.S. Application Data
`
`(Continued)
`
`(63) Continuation of application No. 13/969,182, filed on
`Aug. 16, 2013, which is a continuation of application
`(Continued)
`
`Primary Examiner - Caridad Everhart
`(74) Attorney, Agent, or Firm - Foley & Lardner LLP
`
`(30)
`
`Foreign Application Priority Data
`
`(57)
`
`ABSTRACT
`
`Sep. 3, 2008
`
`(JP) ................................. 2008-225408
`
`(51)
`
`Int. Cl.
`
`HOJL 33/60
`
`HOJL 33/62
`
`(2010.01)
`(2010.01)
`(Continued)
`
`A method of manufacturing a light emitting device having a
`resin package which provides an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, and in which a resin part and a lead
`are formed in a substantially same plane in an outer side
`surface, includes a step of sandwiching a lead frame pro-
`(Continued)
`
`120c
`
`125}120
`122
`
`NICHIA EXHIBIT 2006
`Vizio, Inc. v. Nichia Corporation
`Case IPR2018-00386
`
`

`

`US 9,537,071 B2
`Page 2
`
`vided with a notch part, by means of an upper mold and a
`lower mold, a step of transfer-molding a thermosetting resin
`containing a light reflecting material in a mold sandwiched
`by the upper mold and the lower mold to form a resin­
`molded body in the lead frame and a step of cutting the
`resin-molded body and the lead frame along the notch part.
`
`26 Claims, 13 Drawing Sheets
`
`Related U.S. Application Data
`
`No. 12/737,940, filed as application No. PCT/JP2009/
`004170 on Aug. 27, 2009, now Pat. No. 8,530,250.
`
`(51)
`
`Int. Cl.
`
`HOJL 33/48
`
`B29C 45/00
`
`B29C 45/14
`
`HOJL 23/00
`
`(2010.01)
`(2006.01)
`(2006.01)
`(2006.01)
`(2010.01)
`
`HOJL 33/64
`(52) U.S. Cl.
`CPC ............ HOJL 24197 (2013.01); HOJL 33/486
`(2013.01); HOJL 33/60 (2013.01); HOJL
`33/641 (2013.01); B29C 2793/009 (2013.01);
`HOlL 2224/48091 (2013.01); HOlL
`2224/48247 (2013.01); HOlL 2224/48257
`(2013.01); HOlL 2924/12035 (2013.01); HOlL
`2924/12041 (2013.01); HOlL 2924/12042
`(2013.01); HOlL 2924/181 (2013.01); HOlL
`2924/3025 (2013.01); HOlL 2933/0033
`(2013.01); HOlL 2933/0066 (2013.01)
`( 58) Field of Classification Search
`USPC ....... 361/820; 438/26; 257/99, 100, E23.066
`See application file for complete search history.
`
`(56)
`
`References Cited
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`2002/0028525 Al
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`2004/0051171 Al
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`2004/0159850 Al
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`264/278
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`2/2008 Loh ................... B29C 45/14655
`438/21
`9/2008 Takada .................. HOlL 33/486
`257/98
`
`2009/0050925 Al
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`12/2010 Hayashi
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`FOREIGN PATENT DOCUMENTS
`
`JP
`JP
`JP
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`JP
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`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`
`WO
`
`WO
`
`WO
`
`WO
`
`WO
`
`S54-069068 A
`H08-037252
`Hll-045958
`Hll-087780
`Hll-1630007 A
`Hll-191562 A
`Hll-214754
`2000-174347 A
`2001-036154 A
`2001-077160 A
`2001-077235 A
`2001-267482 A
`2003-037236 A
`2003-110145 A
`2003-218398 A
`2003-304000 A
`2004-111964 A
`2005-243857 A
`2005-311137 A
`2005535135 W
`2006-060034 A
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`2006-140207 A
`2006-156704 A
`2006-278427 A
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`2007-035794 A
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`2007-235085 A
`2007235085 A *
`2007-294506 A
`2007-297601 A
`2007-329502 A
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`W0-2008/056813 Al
`
`6/1979
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`7 /1999
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`3/2001
`3/2001
`9/2001
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`10/2003
`4/2004
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`11/2005
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`3/2006
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`
`HOlL 21/4846
`
`HOlL 24/97
`
`HOlL 21/4868
`
`

`

`US 9,537,071 B2
`
`Page 3
`
`(56)
`
`References Cited
`
`
`
`Non-Final Office Action U.S. Appl. No. 12/737,940 dated Sep. 28,
`
`
`
`FOREIGN PATENT DOCUMENTS
`
`WO
`WO
`
`OTHER PUBLICATIONS
`
`
`
`Notice of Allowance issued in U.S. Appl. No. 13/969,182 dated Jul.
`
`
`
`
`
`Notice of Allowance issued in U.S. Appl. No. 12/737,940 dated
`
`
`
`Office Action issued in U.S. Appl. No. 13/969,182 dated Dec. 4,
`
`
`
`W0-2008/059856 Al 5/2008
`
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`
`2012.
`
`
`9, 2015.
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`
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`
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`
`2014.
`
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`2014.
`
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`
`EP Communication for application No. 09877246.9 dated Nov. 25,
`
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`
`
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`
`2013 with attached Supplementary European Search Report for EP
`
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`
`09 81 1246 dated Oct. 31, 2013.
`Written Opinion of the International Searching Authority in PCT/
`
`
`
`
`
`
`European Patent Office, Third Party Observation Concerning
`
`JP2009/004170 dated Nov. 24, 2009.
`
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`
`
`
`
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`
`Extended European Search Report for EP Application No. 09 811
`30, 2015.
`
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`
`
`246.9-1226 dated Nov. 25, 2013 submitted by Eisenfuhr Speiser in
`
`
`
`
`
`200794 mailed Sep. 13, 2016.
`
`
`a letter dated Dec. 10, 2013.
`
`
`
`International Search Report in PCT/JP2009/004170 dated Nov. 24,
`*cited by examiner
`2009.
`
`
`
`
`
`Office Action issued in U.S. Appl. No. 13/969,182 dated Mar. 5,
`
`
`
`Translation of JP2007-29760 lA (Yuasa et al, Hitachi Chemical Co.
`
`Notice of Allowance issued in U.S. Appl. No. 13/969, 182 dated Oct.
`
`Office Action issued in Japanese Patent Application No. 2015-
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 1 of 13
`
`US 9,537,071 B2
`
`Fig. 1
`
`4030 50
`
`27 II
`
`20c
`
`100 �
`~~ }20
`
`22
`
`·-
`-
`
`_ _ 20b
`
`10
`
`.,
`
`-rr
`22
`
`�
`
`22
`
`20a
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 2 of 13
`
`US 9,537,071 B2
`
`Fig. 2
`
`27a
`
`27b
`
`27
`
`50
`
`;o (
`
`100
`
`I
`
`30
`
`20c
`
`20b
`
`r-
`
`26
`
`25
`
`22
`
`20
`
`10
`
`20a
`
`

`

`U.S. Patent
`
`Jan. 3, 2017
`
`Sheet 3 of 13
`
`US 9,537,071 B2
`
`Fig. 3
`
`O[u . -�� 21
`�J �-- ---�21a
`�
`u
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 4 of 13
`
`US 9,537,071 B2
`
`Fig. 4
`
`21
`
`21
`
`21a
`
`21
`
`61} 60
`
`62
`
`61} 60
`62
`
`61}
`60
`62
`
`L10
`40 30 r 21 a
`' /
`
`26 24
`
`21
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 5 of 13
`
`US 9,537,071 B2
`
`Fig. 5
`
`/
`
`24
`
`�-- 26
`
`..... ;..==.:.==c...c=�==-i--------······· �1
`-+
`co ClD I ao CJD --------
`. C[) db:([) CI[)
`-
`CO ClD:CO u ·
`---/ 27
`
`........
`
`. ... ,.
`
`...- ... ., .. , .....
`
`21a
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 6 of 13
`
`US 9,537,071 B2
`
`Fig. 6
`
`120c
`
`125} 120
`
`122
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 7 of 13
`
`US 9,537,071 B2
`
`Fig. 7
`
`121b
`
`------ 121
`
`�r�r�
`�
`[t--- _____ 121a
`u
`�
`�
`
`0
`
`�
`
`0
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`0
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`
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`
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`
`u
`
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`
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`
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`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 8 of 13
`
`US 9,537,071 B2
`
`Fig. 8
`
`121b
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 9 of 13
`
`US 9,537,071 B2
`
`Fig. 9
`
`Fig. 10
`
`220c
`
`225}
`
`222 220
`
`220b
`
`220a
`
`221
`
`221a
`
`221c
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 10 of 13
`
`US 9,537,071 B2
`
`Fig. 11
`
`320c
`�;��}320
`\_
`c:::::
`320a
`
`320b
`
`Fig. 12
`
`420c
`
`425} 420
`422
`420b
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 11 of 13
`
`US 9,537,071 B2
`
`Fig. 13
`
`Fig. 14 (Prior Art)
`
`520c
`
`520a
`
`(a)
`
`(b)
`
`(c)
`
`(d)
`
`(e)
`
`Fig. 1 5 (Prior Art)
`
`��
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 12 of 13
`
`US 9,537,071 B2
`
`Fig. 1 6 (Prior Art)
`
`Fig. 1 7 (Prior Art)
`
`Fig. 1 8 (Prior Art)
`II
`
`(a)
`
`I
`
`(b)
`
`(c) �
`
`

`

`U.S. Patent
`
`Jan.3,2017
`
`Sheet 13 of 13
`
`US 9,537,071 B2
`
`Fig. 1 9 (Prior Art)
`
`(a)
`
`(b)
`
`(c)
`
`(d) -
`
`

`

`
`
`US 9,537,071 B2
`
`1
`LIGHT EMITTING DEVICE, RESIN
`
`PACKAGE, RESIN-MOLDED BODY, AND
`
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`
`RESIN-MOLDED BODY
`
`CROSS-REFERENCE TO RELATED
`
`APPLICATIONS
`
`
`
`TECHNICAL FIELD
`
`BACKGROUND ART
`
`2
`ment 3). FIG. 17 is a perspective view and sectional view
`
`
`
`
`
`
`illustrating a conventional light emitting device. FIG. 18 is
`
`
`
`a schematic sectional view illustrating a method for manu­
`
`
`
`
`facturing the conventional light emitting device. It is dis-
`
`
`
`5 closed that, with this light emitting device, metal wires are
`formed from a metal foil by a common method such as
`
`
`
`
`punching or etching and are further arranged in a mold of a
`
`
`
`
`predetermined shape, and a thermosetting resin is filled in a
`mold resin inlet to transfer-mold.
`However, this manufacturing method has difficulty in
`
`
`
`This application is a continuation of U.S. patent applica-
`
`
`
`10
`
`
`
`
`manufacturing multiple light emitting devices in a short
`
`tion Ser. No. 13/969,182, filed Aug. 16, 2013, which in tum
`
`
`time. Further, there is a problem that a great amount of a
`
`
`
`is a continuation of U.S. patent application Ser. No. 12/737,
`
`resin of a runner part is discarded per one light emitting
`940, filed on May 13, 2011, which issued as U.S. Pat. No.
`
`device.
`
`8,530,250 on Sep. 10, 2013.
`15 As a different light emitting device and manufacturing
`
`
`
`
`
`
`method therefor, an optical semiconductor element mount­
`
`
`
`ing package substrate which has a light reflecting thermo­
`
`
`The present invention relates
`
`
`
`setting to a light emitting device resin composition layer on the wiring substrate, and
`
`
`
`
`used for light equipment, a display, a backlight
`
`
`
`manufacturing of a mobile method therefor are disclosed (e.g., refer to
`
`
`
`
`
`
`
`telephone, a movie lighting auxiliary light source, and other 20 Patent Document 4). FIG. 19 is a schematic view illustrating
`
`
`
`
`
`
`
`
`
`
`
`general consumer light sources, and to a method for manu­steps of manufacturing a conventional light emitting device.
`
`
`facturing a light emitting device.
`
`
`
`
`
`This optical semiconductor element mounting package sub­
`
`
`
`
`strate is manufactured as an optical semiconductor element
`
`
`
`
`mounting package substrate of a matrix pattern which has a
`
`
`
`
`25 plurality of concave parts, by attaching a printed-wiring
`
`
`
`A light emitting device using light emitting elements is
`
`board having a flat plate shape to a mold, filling a light
`
`
`
`small, provides good power efficiency, and emits light of
`
`
`
`reflecting thermosetting resin composition in the mold, and
`
`
`
`
`
`bright color. Further, the light emitting elements are semi­
`
`
`
`
`heating and pressuring molding the light reflecting thermo­
`
`
`
`conductor elements, and therefore there is no concern for
`
`
`
`setting resin by means of a transfer-molding machine. Fur-
`
`
`
`
`blowout. The light emitting elements have characteristics of
`
`
`30 ther, it is also disclosed that a lead frame is used instead of
`
`
`
`good initial driving performance and are robust against
`
`a printed-wiring board.
`
`
`
`vibration and repetition of on and off of lighting. The light
`
`
`However, these wiring board and lead frame have a flat
`
`
`
`emitting elements have these good characteristics, and there­
`
`
`plate shape and have a small adhering area because a
`
`
`
`fore light emitting devices using light emitting elements
`
`
`thermosetting resin composition is arranged on this flat
`
`
`
`such as light emitting diodes (LEDs) and laser diodes (LDs)
`
`
`
`
`35 shape, and therefore there is a problem that, for example, a
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`are utilized as various light sources.
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`lead frame and thermosetting resin composition are likely to
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`FIG. 14 is a perspective view illustrating a method for
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`be detached upon singulation.
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`manufacturing a conventional light emitting device. FIG. 15
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`is a perspective view illustrating an intermediate of the
`Open No. 2007-35794
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`conventional light emitting device. FIG. 16 is a perspective
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`40
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`view illustrating the conventional light emitting device.
`Open No. 11-087780
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`Conventionally, as a method for manufacturing a light
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`emitting device, a method is disclosed for insert-molding a
`Open No. 2006-140207
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`lead frame with a non-translucent, light reflecting white
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`resin, and molding a resin-molded body which has concave
`45 Open No. 2007-235085
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`cups at predetermined intervals through the lead frame ( e.g.,
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`of a white resin is not clearly described, as is insertion­
`view illustrating a light emitting FIG. 1 is a perspective molding performed and as is clear from the figu res, a general
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`thermoplastic resin is used. As a general thermoplastic resin, device according to a first embodiment.
`50
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`for example, a thermoplastic resin such as liquid crystal FIG. 2 is a sectional view illustrating the light emitting
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`polymer, PPS (polyphenylene sulfide), and nylon is often device according to the first embodiment.
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`used as a light blocking resin-molded body (e.g., refer to
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`FIG. 3 is a plan view illustrating a lead frame used in the
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`Patent Document 2).
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`first embodiment.
`However, the thermoplastic resin has little adhesion with 55 FIG. 4 is a schematic sectional view illustrating a method
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`a lead frame, and the resin part and lead frame are likely to for manufacturing a light emitting device according to the
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`be detached. Further, the thermosetting resin has lower resin first embodiment.
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`fluidity of the resin and therefore is not adequate to mold a
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`resin-molded body of a complicated shape, and has little according to the first embodiment.
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`light resistance. In recent years in particular, the output of a 60
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`FIG. 6 is a perspective view illustrating a light emitting
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`light emitting element is remarkably improved and, as the device according to a second embodiment.
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`output of a light emitting element is increased, light dete­
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`FIG. 7 is a plan view illustrating a lead frame used in the
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`rioration of a package made of a thermoplastic resin second embodiment.
`FIG. 8 is a plan view illustrating a resin-molded body
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`becomes more distinct.
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`In order to solve the above problems, a light emitting according to the second embodiment.
`65
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`device using a thermosetting resin for a material of a FIG. 9 is a perspective
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`view illustrating a light emitting
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`resin-molded body is disclosed (e.g., refer to Patent Docu-device according to a third embodiment.
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`Patent Document 1: Japanese Patent Application Laid­
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`Patent Document 2: Japanese Patent Application Laid­
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`Patent Document 3: Japanese Patent Application Laid­
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`Patent Document 4: Japanese Patent Application Laid-
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`refer to Patent Document 1 ). Although quality of a material BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 5 is a plan view illustrating a resin-molded body
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`

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`US 9,537,071 B2
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`DETAILED DESCRIPTION
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`4
`3
`FIG. 10 is a plan view illustrating a lead frame used in the is not necessary to apply plating processing per singulated
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`light emitting device and it is possible to simplify a manu­
`third embodiment.
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`facturing method.
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`FIG. 11 is a perspective view illustrating a light emitting
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`Preferably, the notch part in a cut part of the lead frame
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`device according to a fourth embodiment.
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`5 is about half the entire surrounding periphery. By this means,
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`FIG. 12 is a perspective view illustrating a light emitting
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`it is possible to reduce the weight of the lead frame and
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`device according to a fifth embodiment.
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`provide light emitting devices at low cost. Further, the part
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`FIG. 13 is a perspective view illustrating a resin package
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`of the lead frame to be cut decreases, so that it is possible to
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`according to a sixth embodiment.
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`better prevent the lead frame and the thermosetting resin
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`FIG. 14 is a perspective view illustrating a method for
`10 from detaching.
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`manufacturing a conventional light emitting device.
`In addition, the difference is that, while the thermosetting
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`FIG. 15 is a perspective view illustrating an intermediate
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`resin is filled in the notch parts, the thermosetting resin is not
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`of a conventional light emitting device.
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`filled in hole parts which are described later. While the notch
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`FIG. 16 is a perspective view illustrating a conventional
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`parts and hole parts penetrate the lead frame, grooves which
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`light emitting device.
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`15 are described later do not penetrate the lead frame.
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`FIG. 17 is a perspective view and a sectional view
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`Preferably, a hole part is provided in the lead frame before
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`illustrating a conventional light emitting device.
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`the lead frame is sandwiched by the upper mold and the
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`FIG. 18 is a schematic sectional view illustrating a
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`lower mold. By this means, it is possible to reduce the
`method for manufacturing a conventional light emitting
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`weight of the lead frame more, and provide light emitting
`device.
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`20 devices at low cost. It is possible to apply the plating
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`FIG. 19 is a schematic diagram illustrating steps of
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`processing to the hole parts, and consequently prevent
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`manufacturing a conventional light emitting device. exposure of the lead frame.
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`Preferably, a groove is provided in the lead frame before
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`the lead frame is sandwiched by the upper mold and the
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`25 lower mold. By this means, it is possible to reduce the
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`weight of the lead frame more, and provide light emitting
`In view of the above problems, an object of the present
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`devices at low cost. It is possible to apply plating processing
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`invention is to provide a simple and low-cost method for
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`to the grooves, and consequently prevent exposure of the
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`manufacturing, in a short time, multiple light emitting
`lead frame.
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`devices which has high adhesion between a lead frame and
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`Preferably, the upper mold and the lower mold sandwich
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`a thermosetting resin composition.
`30
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`a part of the lead frame where a light emitting element is
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`The present invention is earnestly studied and as a result
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`placed or near a hole part. By this means, it is possible to
`is finally completed.
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`prevent the lead frame from flip-flopping and reduce burrs.
`In this description, terms such as leads, a resin part, and
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`The present invention relates to a light emitting device
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`resin package are used for a singulated light emitting device,
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`having a resin package having an optical reflectivity equal to
`35
`and terms such as a lead frame and resin molded body are
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`or more than 70% at a wavelength between 350 nm and 800
`used in the stage prior to singulation.
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`nm after thermal curing, wherein a resin part and a lead are
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`The present invention relates to a method of manufactur­
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`formed in a substantially same plane in an outer side surface,
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`ing a light emitting device having a resin package which
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`and wherein at least one surface of a bottom surface and an
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`provides an optical reflectivity equal to or more than 70% at 40
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`upper surface of a lead is plated and the outer side surface
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`a wavelength between 350 nm and 800 nm after thermal
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`of the lead is not plated. By this means, it is possible to
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`curing, and in which a resin part and a lead are formed in a
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`prevent exposure of leads to which plating processing is not
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`substantially same plane in an outer side surface. The
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`applied, and provide multiple light emitting devices at one
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`method comprises: a step of sandwiching a lead frame
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`time. Further, by applying plating processing to only the part
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`provided with a notch part, by means of an upper mold and 45
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`which reflects light from a light emitting element, it is
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`a lower mold; a step of transfer-molding a thermosetting possible to improve the efficiency to extract light from the
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`resin containing a light reflecting material in a mold sand­light emitting device.
`wiched by the upper mold and the lower mold to form a
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`Preferably, the lead is exposed at four comers of the resin
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`resin-molded body in the lead frame; and a step of cutting package. The exposed parts of the leads are reduced com­
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`the resin molded body and the lead frame along the notch 50 pared to leads which are provided on the one entire side
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`part. With the configuration, the thermosetting resin is filled surface of a resin package, so that it is possible to improve
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`in the notch parts, and therefore an adhering area between adhesion between the resin part and the leads. Further, the
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`the lead frame and the thermosetting resin becomes large, so insulating resin part is provided between a positive lead and
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`that it is possible to improve adhesion between the lead a negative lead, so that it is possible to prevent short
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`frame and the thermosetting resin. Further, a thermosetting circuiting.
`55
`resin having lower viscosity than a thermoplastic resin is Preferably, four corners of the resin package are formed in
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`used, so that it is possible to fill the thermosetting resin in the an arc shape seen from a bottom surface side. It is also
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`notch parts without leaving a gap. Further, it is possible to possible to employ a configuration where plating processing
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`manufacture multiple light emitting devices at one time and is applied to a part which is formed in an arc shape and is
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`greatly improve productive efficiency. Furthermore, it is 60 not applied to the cut surface. By this means, it is possible
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`possible to reduce runners which are discarded, and provide to expand a bonding area with, for example, a solder, and
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`light emitting devices at low cost.
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`improve the boding strength.
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`Preferably, plating processing is applied to the lead frame Preferably, a step is provided in the lead. The differences
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`before the lead frame is sandwiched by the upper mold and in level are preferably provided in the bottom surface of the
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`the lower mold. In this case, in the manufactured light 65 resin package. It is also possible to employ a configuration
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`emitting device, plating processing is not applied to a cut where plating processing is applied to a part in which
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`surface and is applied to parts other than the cut surface. It differences in level are formed and is not applied to the cut
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`

`

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`US 9,537,071 B2
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`6
`5
`surface. By this means, it is possible to expand a bonding The present invention relates to a resin-molded body
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`having an optical reflectivity equal to or more than 70% at
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`area with, for example, a solder, and improve the boding
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`a wavelength between 350 nm and 800 nm after thermal
`strength.
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`curing, wherein a plurality of concave parts are formed and
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`The present invention relates to a method for manufac­
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`a part of a lead frame is exposed in inner bottom surfaces of
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`turing a resin package having an optical reflectivity equal to 5
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`the concave parts, and wherein the lead frame has notch
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`or more than 70% at a wavelength between 350 nm and 800
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`parts and a thermosetting resin which becomes the resin­
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`nm after thermal curing, wherein a resin part and a lead are
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`molded body is filled, the resin-molded body having a
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`formed in a substantially same plane in an outer side surface.
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`sidewall between adjacent concave parts. By this means, it
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`The method comprising: a step of sandwiching a lead frame
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`is possible to provide a resin-molded body of good thermal
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`provided with a notch part, by means of an upper mold and 10
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`resistance and light resistance.
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`a lower mold; a step of transfer-molding a thermosetting
`The light emitting device and manufacturing method
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`resin containing a light reflecting material in a mold sand­
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`therefor according to the present invention can provide a
`wiched by the upper mold and the lower mold to form a
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`light emitting device which provides high adhesion between
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`resin-molded body in the lead frame; and a step of cutting
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`a lead frame and a resin-molded body. Further, it is possible
`15
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`the resin-molded body and the lead frame along the notch
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`to provide multiple light emitting devices in a short time and
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`part. With the configuration, the thermosetting resin is filled
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`greatly improve production efficiency. Furthermore, it is
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`in the notch parts, and therefore an adhering area between
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`possible to reduce runners which are discarded, and provide
`
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`the lead frame and the thermosetting resin becomes large, so
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`light emitting devices at low cost.
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`that it is possible to improve adhesion between the lead 20
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`Hereinafter, the preferred embodiments of a method for
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`frame and the thermosetting resin. Further, a thermosetting
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`manufacturing a light emitting device and a light emitting
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`resin having lower viscosity than a thermoplastic resin is device according to the present invention will be described
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`used, so that it is possible to fill the thermosetting resin in detail with drawings. However, the present invention is
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`in the notch parts without leaving a gap. Further, it is not limited to this embodiment.
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`possible to manufacture multiple resin packages at one time 25 <First Embodiment>
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`and greatly improve productive efficiency. Furthermore, it is (Light Emitting Device)
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`possible to reduce runners which are discarded, and provide A light emitting device according to a first embodiment
`
`resin packages at low cost.
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`will be described. FIG. 1 is a perspective view illustrating a
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`Preferably, plating processing is applied to the lead frame light emitting device according to the first embodiment. FIG.
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`before the lead frame is sandwiched by the upper mold and 30 2 is a sectional view illustrating a light emitting device
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`the lower mold. In this case, in the manufactured resin according to the first embodiment. FIG. 2 is a sectional view
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`package, plating processing is not applied to a cut surface taken along line II-II illustrated in FIG. 1. FIG. 3 is a plan
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`and is applied to parts other than the cut surface. It is not view illustrating a lead frame used in the first embodiment.
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`necessary to apply plating processing per singulated resin A light emitting device 100 according to the first embodi­
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`package and it is possible to simplify a manufacturing ment provides an optical reflectivity equal to or greater than
`35
`method.
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`70% at the wavelength between 350 nm and 800 nm after
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`The present invention relates to a resin package
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`thermal curing, having an and has a resin package 20 in which a resin
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`optical reflectivity
`part 25 and leads 22 are formed in the substantially equal to or more than 70% at a wave­ same
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`plane in outer side surfaces curing, 20b. Plating processing is
`length between 350 nm and 800 nm after thermal
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`wherein a resin part and a lead are formed in a substantially 40 applied to at least one surface of the bottom surface ( an outer
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`same plane in an outer side surface, and wherein at least one bottom surface 20a of the resin package 20) and the upper
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`surface of a bottom surface and an upper surface of a lead surface (an inner bottom surface 27a of a concave part 27)
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`is plated and the outer side surface of the lead is not plated. of the leads 22. By contrast with this, plating processing is
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`By this means, it is possible to prevent exposure of leads to not applied to the side surfaces of the leads 22 (the outer side
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`which plating processing is not applied, and provide mul­45 surfaces 20b of the resin package 20). The resin part 25
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`tiple resin packages at one time. Further, by applying plating occupies a large area in the outer side surfaces 20b of the
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`processing to only the part which reflects light from a light resin package 20, and leads 22 are exposed from comer
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`emitting element, it is possible to improve the efficiency to parts.
`The resin package 20 is formed with the resin part 25
`
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`extract light from the light emitting device.
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`The present invention relates to a method of manufactur­50 which mainly contains a light reflecting material 26, and the
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`ing a resin-molded body having an optical reflectivity equal leads 22. The resin package 20 has the outer bottom surface
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`20a in which the leads 22 are arranged, 350 nm and outer side surfaces
`
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`to or more than 70% at a wavelength between
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`20b in which part of the leads 22 are exposed, a plurality of concave and the outer
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`800 nm after thermal curing, wherein
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`parts are formed,
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`upper surface and in which a part of a lead frame is 20c in which an opening concave part 27 is
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`exposed in inner bottom surfaces of the concave parts. The 55 formed. In the resin package 20, the concave part 27 having
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`method comprises: a step of sandwiching the lead frame by an inner bottom surface 27a and inner side surface 27b is
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`means of an upper mold which has convex parts in positions formed. The leads 22 are exposed in the inner bottom surface
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`where the concave parts adjacent in the resin molded body 27 a of the resin package 20 and the light emitting element
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`are molded and a lower mold, the lead frame being provided 10 is placed on the leads 22. In the concave part 27 of the
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`with notch parts; a step of transfer-molding a thermosetting resin package 20, a scaling member 30 which covers the
`60
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`resin containing a light reflecting material in a mold sand­light emitting element 10 is arranged. The sealing member
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`wiched by the upper mold and the lower mold to fill the 30 contains a fluorescent material 40. The light emitting
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`thermosetting resin in the notch parts, and forming the element 10 is electrically connected with the leads 22
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`resin-molded body in the lead frame. With this