I 1111111111111111 1111111111 1111111111 11111 1111111111 11111 111111111111111111
`
`US010115870B2
`
`c12) United States Patent
`Ichikawa et al.
`
`(IO) Patent No.: US 10,115,870 B2
`(45) Date of Patent:
`*Oct. 30, 2018
`
`(54) LIGHT EMITTING DEVICE, RESIN
`PACKAGE, RESIN-MOLDED BODY, AND
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`RESIN-MOLDED BODY
`
`(71) Applicant: NICHIA CORPORATION, Anan-shi,
`Tokushima (JP)
`
`(52) U.S. Cl.
`CPC ........ H0JL 33/486 (2013.01); B29C 4510055
`(2013.01); B29C 45/14655 (2013.01);
`(Continued)
`(58) Field of Classification Search
`CPC ....... B29C 45/14655; HOlL 2924/3025; H01L
`2924/1815; HOlL 2924/00014;
`(Continued)
`
`(72)
`
`Inventors: Hirofumi Ichikawa, Komatsushima
`(JP); Masaki Hayashi, Anan (JP);
`Shimpei Sasaoka, Tokushima (JP);
`Tomohide Miki, Tokushima (JP)
`
`(73)
`
`Assignee: NICHIA CORPORATION, Anan-Shi
`(JP)
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`5,302,849 A
`5,428,248 A
`
`4/ 1994 Cavasin
`6/1995 Cha
`(Continued)
`
`( *) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by O days.
`
`This patent is subject to a terminal dis(cid:173)
`claimer.
`
`EP
`EP
`
`FOREIGN PATENT DOCUMENTS
`
`8/1999
`0 936 683 Al
`2 100 908 Al
`9/2009
`(Continued)
`
`OTHER PUBLICATIONS
`
`(21) Appl. No.: 15/360,316
`
`(22) Filed:
`
`Nov. 23, 2016
`
`(65)
`
`Prior Publication Data
`
`US 2017/0141273 Al May 18, 2017
`
`Related U.S. Application Data
`
`(63) Continuation of application No. 14/928,550, filed on
`Oct. 30, 2015, now Pat. No. 9,537,071, which is a
`(Continued)
`
`(30)
`
`Foreign Application Priority Data
`
`Sep. 3, 2008
`
`(JP) ................................. 2008-225408
`
`(51)
`
`Int. Cl.
`H0JL 33/48
`H0JL 33/50
`
`(2010.01)
`(2010.01)
`(Continued)
`
`EP Connnunication for application No. 09877246.9 dated Nov. 25,
`2013 with attached Supplementary European Search Report for EP
`09 81 1246 dated Oct. 31, 2013.
`(Continued)
`
`Primary Examiner - Caridad Everhart
`(74) Attorney, Agent, or Firm - Foley & Lardner
`
`ABSTRACT
`(57)
`A method of manufacturing a light emitting device having a
`resin package which provides an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, and in which a resin part and a lead
`are formed in a substantially same plane in an outer side
`surface, includes a step of sandwiching a lead frame pro(cid:173)
`vided with a notch part, by means or an upper mold and a
`lower mold, a step of transfer-molding a thermosetting resin
`containing a light reflecting material in a mold sandwiched
`by the upper mold and the lower mold to form a resin-
`(Continued)
`
`520c
`
`-- 525} 520
`- 522
`
`520a
`
`VIZIO Ex. 1029 Page 00001
`
`

`

`US 10,115,870 B2
`Page 2
`
`molded body in the lead frame and a step of cutting the
`resin-molded body and the lead frame along the notch part.
`
`27 Claims, 13 Drawing Sheets
`
`Related U.S. Application Data
`
`continuation of application No. 13/969,182, filed on
`Aug. 16, 2013, now Pat. No. 9,287,476, which is a
`continuation of application No. 12/737,940, filed as
`application No. PCT/JP2009/004170 on Aug. 27,
`2009, now Pat. No. 8,530,250.
`
`(51)
`
`(2010.01)
`(2010.01)
`(2006.01)
`(2006.01)
`(2006.01)
`(2010.01)
`(2010.01)
`
`Int. Cl.
`H0JL 33/60
`H0JL 33162
`B29C 45100
`B29C 45114
`H0JL 23100
`H0JL 33/64
`H0JL 33/56
`(52) U.S. Cl.
`CPC ............ H0JL 24197 (2013.01); H0JL 33/504
`(2013.01); H0JL 33/56 (2013.01); H0JL 33/60
`(2013.01); H0JL 33162 (2013.01); H0JL
`33/641 (2013.01); B29C 2793/009 (2013.01);
`H0JL 2224/48091 (2013.01); H0lL
`2224/48247 (2013.01); H0JL 2224/48257
`(2013.01); H0JL 2924/12035 (2013.01); H0lL
`2924/12041 (2013.01); H0JL 2924/12042
`(2013.01); H0JL 2924/181 (2013.01); H0lL
`2924/3025 (2013.01); H0JL 2933/0033
`(2013.01); H0JL 2933/0066 (2013.01)
`( 58) Field of Classification Search
`CPC ........... H0lL 24/97; H0lL 2224/48091; H0lL
`33/486; H0lL 2224/48247; H0lL
`2924/181; H01L 2933/0033
`See application file for complete search history.
`
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`

`

`US 10,115,870 B2
`Page 3
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`
`VIZIO Ex. 1029 Page 00003
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`

`

`US 10,115,870 B2
`Page 4
`
`(56)
`
`References Cited
`
`OTHER PUBLICATIONS
`
`Nichia Corp. v. Vizio, Inc., No. 2:16-cv-01453-JRG, D.I.211, Joint
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`
`* cited by examiner
`
`VIZIO Ex. 1029 Page 00004
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`

`

`U.S. Patent
`
`Oct. 30, 2018
`
`Sheet 1 of 13
`
`US 10,115,870 B2
`
`Fig. 1
`
`100
`~
`
`/
`
`-r1
`22
`
`22
`
`10
`
`~ 20a
`
`VIZIO Ex. 1029 Page 00005
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`

`

`U.S. Patent
`
`Oct. 30, 2018
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`Sheet 2 of 13
`
`US 10,115,870 B2
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`Fig. 2
`
`27
`
`27a
`
`50
`
`276
`
`10
`
`20a
`
`100 I
`
`26
`
`25
`
`22
`
`20b
`
`20
`
`VIZIO Ex. 1029 Page 00006
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`

`

`U.S. Patent
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`Oct. 30, 2018
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`Sheet 3 of 13
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`US 10,115,870 B2
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`Fig. 3
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`-- 21
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`VIZIO Ex. 1029 Page 00007
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`

`

`U.S. Patent
`
`Oct. 30, 2018
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`Sheet 4 of 13
`
`US 10,115,870 B2
`
`Fig. 4
`
`21a
`
`21
`
`61} 60
`
`62
`
`61}
`
`62
`
`60
`
`VIZIO Ex. 1029 Page 00008
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`

`

`U.S. Patent
`
`Oct. 30, 2018
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`Sheet 5 of 13
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`US 10,115,870 B2
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`Fig. 5
`
`21
`
`·-21a
`/ 27
`
`VIZIO Ex. 1029 Page 00009
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`

`U.S. Patent
`
`Oct. 30, 2018
`
`Sheet 6 of 13
`
`US 10,115,870 B2
`
`Fig. 6
`
`120c
`
`125} 120
`122
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`VIZIO Ex. 1029 Page 00010
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`

`U.S. Patent
`
`Oct. 30, 2018
`
`Sheet 7 of 13
`
`US 10,115,870 B2
`
`Fig. 7
`
`121b
`
`0 o[oro
`~ J ~~
`l1
`0
`~
`~
`~
`~
`~
`~
`~
`~
`
`0
`
`0
`
`0
`
`0
`
`------ 121
`
`~
`r-- ________ 12 1 a
`~
`
`---
`
`0
`
`0
`
`0
`
`0
`
`0
`
`0
`
`0
`
`VIZIO Ex. 1029 Page 00011
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`

`

`U.S. Patent
`
`Oct. 30, 2018
`
`Sheet 8 of 13
`
`US 10,115,870 B2
`
`Fig. 8
`
`121b
`
`/~--
`
`------ 12 1
`
`-- ---121a
`
`124
`
`VIZIO Ex. 1029 Page 00012
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`

`U.S. Patent
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`Oct. 30, 2018
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`Sheet 9 of 13
`
`US 10,115,870 B2
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`Fig. 9
`
`Fig. 10
`
`220c
`
`220a
`
`· 221
`
`221c
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`VIZIO Ex. 1029 Page 00013
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`

`U.S. Patent
`
`Oct. 30, 2018
`
`Sheet 10 of 13
`
`US 10,115,870 B2
`
`Fig. 11
`
`Fig. 12
`
`420c
`
`425} 420
`..-..·--- 422
`
`420b
`
`VIZIO Ex. 1029 Page 00014
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`U.S. Patent
`
`Oct. 30, 2018
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`U.S. Patent
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`Oct. 30, 2018
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`US 10,115,870 B2
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`U.S. Patent
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`Oct. 30, 2018
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`US 10,115,870 B2
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`US 10,115,870 B2
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`1
`LIGHT EMITTING DEVICE, RESIN
`PACKAGE, RESIN-MOLDED BODY, AND
`METHODS FOR MANUFACTURING LIGHT
`EMITTING DEVICE, RESIN PACKAGE AND
`RESIN-MOLDED BODY
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`The present application is a continuation of U.S. patent
`application Ser. No. 14/928,550, filed Oct. 30, 2015, which
`is a continuation of U.S. patent application Ser. No. 13/969,
`182, filed Aug. 16, 2013 (now U.S. Pat. No. 9,287,476,
`issued Mar. 15, 2016), which is a continuation of U.S. patent
`application Ser. No. 12/737,940, filed on May 13, 2011 (now
`U.S. Pat. No. 8,530,250 issued Sep. 10, 2013), which is a
`U.S. national stage entry oflntemational Patent Application
`No. PCT/JP2009/004170, filed Aug. 27, 2009, which claims
`priority to Japanese Patent Application No. 2008-225408,
`filed Sep. 3, 2008, the entireties of which are hereby 20
`incorporated by reference.
`
`TECHNICAL FIELD
`
`The present invention relates to a light emitting device
`used for light equipment, a display, a backlight of a mobile
`telephone, a movie lighting auxiliary light source, and other
`general consumer light sources, and to a method for manu(cid:173)
`facturing a light emitting device.
`
`BACKGROUND ART
`
`A light emitting device using light emitting elements is
`small, provides good power efficiency, and emits light of
`bright color. Further, the light emitting elements are semi(cid:173)
`conductor elements, and therefore there is no concern for
`blowout. The light emitting elements have characteristics of
`good initial driving performance and are robust against
`vibration and repetition of on and off of lighting. The light
`emitting elements have these good characteristics, and there- 40
`fore light emitting devices using light emitting elements
`such as light emitting diodes (LEDs) and laser diodes (LDs)
`are utilized as various light sources.
`FIG. 14 is a perspective view illustrating a method for
`manufacturing a conventional light emitting device. FIG. 15
`is a perspective view illustrating an intermediate of the
`conventional light emitting device. FIG. 16 is a perspective
`view illustrating the conventional light emitting device.
`Conventionally, as a method for manufacturing a light
`emitting device, a method is disclosed for insert-molding a 50
`lead frame with a non-translucent, light reflecting white
`resin, and molding a resin-molded body which has concave
`cups at predetermined intervals through the lead frame ( e.g.,
`refer to Patent Document 1 ). Although quality of a material
`of a white resin is not clearly described, as is insertion- 55
`molding performed and as is clear from the figures, a general
`thermoplastic resin is used. As a general thermoplastic resin,
`for example, a thermoplastic resin such as liquid crystal
`polymer, PPS (polyphenylene sulfide), and nylon is often
`used as a light blocking resin-molded body (e.g., refer to 60
`Patent Document 2).
`However, the thermoplastic resin has little adhesion with
`a lead frame, and the resin part and lead frame are likely to
`be detached. Further, the thermosetting resin has lower resin
`fluidity of the resin and therefore is not adequate to mold a 65
`resin-molded body of a complicated shape, and has little
`light resistance. In recent years in particular, the output of a
`
`2
`light emitting element is remarkably improved and, as the
`output of a light emitting element is increased, light dete(cid:173)
`rioration of a package made of a thermoplastic resin
`becomes more distinct.
`In order to solve the above problems, a light emitting
`device using a thermosetting resin for a material of a
`resin-molded body is disclosed (e.g., refer to Patent Docu(cid:173)
`ment 3). FIG. 17 is a perspective view and sectional view
`illustrating a conventional light emitting device. FIG. 18 is
`10 a schematic sectional view illustrating a method for manu(cid:173)
`facturing the conventional light emitting device. It is dis(cid:173)
`closed that, with this light emitting device, metal wires are
`formed from a metal foil by a common method such as
`15 punching or etching and are further arranged in a mold of a
`predetermined shape, and a thermosetting resin is filled in a
`mold resin inlet to transfer-mold.
`However, this manufacturing method has difficulty in
`manufacturing multiple light emitting devices in a short
`time. Further, there is a problem that a great amount of a
`resin of a runner part is discarded per one light emitting
`device.
`As a different light emitting device and manufacturing
`method therefor, an optical semiconductor element mount-
`25 ing package substrate which has a light reflecting thermo(cid:173)
`setting resin composition layer on the wiring substrate, and
`manufacturing method therefor are disclosed (e.g., refer to
`Patent Document 4). FIG. 19 is a schematic view illustrating
`steps of manufacturing a conventional light emitting device.
`30 This optical semiconductor element mounting package sub(cid:173)
`strate is manufactured as an optical semiconductor element
`mounting package substrate of a matrix pattern which has a
`plurality of concave parts, by attaching a printed-wiring
`board having a flat plate shape to a mold, filling a light
`35 reflecting thermosetting resin composition in the mold, and
`heating and pressuring molding the light reflecting thermo(cid:173)
`setting resin by means of a transfer-molding machine. Fur(cid:173)
`ther, it is also disclosed that a lead frame is used instead of
`a printed-wiring board.
`However, these wiring board and lead frame have a flat
`plate shape and have a small adhering area because a
`thermosetting resin composition is arranged on this flat
`shape, and therefore there is a problem that, for example, a
`lead frame and thermosetting resin composition are likely to
`45 be detached upon singulation.
`Patent Document 1: Japanese Patent Application Laid(cid:173)
`Open No. 2007-35794
`Patent Document 2: Japanese Patent Application Laid(cid:173)
`Open No. 11-087780
`Patent Document 3: Japanese Patent Application Laid(cid:173)
`Open No. 2006-140207
`Patent Document 4: Japanese Patent Application Laid(cid:173)
`Open No. 2007-235085
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is a perspective view illustrating a light emitting
`device according to a first embodiment.
`FIG. 2 is a sectional view illustrating the light emitting
`device according to the first embodiment.
`FIG. 3 is a plan view illustrating a lead frame used in the
`first embodiment.
`FIG. 4 is a schematic sectional view illustrating a method
`for manufacturing a light emitting device according to the
`first embodiment.
`FIG. 5 is a plan view illustrating a resin-molded body
`according to the first embodiment.
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`US 10,115,870 B2
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`3
`FIG. 6 is a perspective view illustrating a light emitting
`device according to a second embodiment.
`FIG. 7 is a plan view illustrating a lead frame used in the
`second embodiment.
`FIG. 8 is a plan view illustrating a resin-molded body
`according to the second embodiment.
`FIG. 9 is a perspective view illustrating a light emitting
`device according to a third embodiment.
`FIG. 10 is a plan view illustrating a lead frame used in the
`third embodiment.
`FIG. 11 is a perspective view illustrating a light emitting
`device according to a fourth embodiment.
`FIG. 12 is a perspective view illustrating a light emitting
`device according to a fifth embodiment.
`FIG. 13 is a perspective view illustrating a resin package
`according to a sixth embodiment.
`FIG. 14 is a perspective view illustrating a method for
`manufacturing a conventional light emitting device.
`FIG. 15 is a perspective view illustrating an intermediate
`of a conventional light emitting device.
`FIG. 16 is a perspective view illustrating a conventional
`light emitting device.
`FIG. 17 is a perspective view and a sectional view
`illustrating a conventional light emitting device.
`FIG. 18 is a schematic sectional view illustrating a
`method for manufacturing a conventional light emitting
`device.
`FIG. 19 is a schematic diagram illustrating steps of
`manufacturing a conventional light emitting device.
`
`DETAILED DESCRIPTION
`
`In view of the above problems, an object of the present
`invention is to provide a simple and low-cost method for
`manufacturing, in a short time, multiple light emitting
`devices which has high adhesion between a lead frame and
`a thermosetting resin composition.
`The present invention is earnestly studied and as a result
`is finally completed.
`In this description, terms such as leads, a resin part, and
`resin package are used for a singulated light emitting device,
`and terms such as a lead frame and resin molded body are
`used in the stage prior to singulation.
`The present invention relates to a method of manufactur- 45
`ing a light emitting device having a resin package which
`provides an optical reflectivity equal to or more than 70% at
`a wavelength between 350 nm and 800 nm after thermal
`curing, and in which a resin part and a lead are formed in a
`substantially same plane in an outer side surface. The 50
`method comprises: a step of sandwiching a lead frame
`provided with a notch part, by means of an upper mold and
`a lower mold; a step of transfer-molding a thermosetting
`resin containing a light reflecting material in a mold sand(cid:173)
`wiched by the upper mold and the lower mold to form a 55
`resin-molded body in the lead frame; and a step of cutting
`the resin molded body and the lead frame along the notch
`part. With the configuration, the thermosetting resin is filled
`in the notch parts, and therefore an adhering area between
`the lead frame and the thermosetting resin becomes large, so 60
`that it is possible to improve adhesion between the lead
`frame and the thermosetting resin. Further, a thermosetting
`resin having lower viscosity than a thermoplastic resin is
`used, so that it is possible to fill the thermosetting resin in the
`notch parts without leaving a gap. Further, it is possible to 65
`manufacture multiple light emitting devices at one time and
`greatly improve productive efficiency. Furthermore, it is
`
`5
`
`4
`possible to reduce runners which are discarded, and provide
`light emitting devices at low cost.
`Preferably, plating processing is applied to the lead frame
`before the lead frame is sandwiched by the upper mold and
`the lower mold. In this case, in the manufactured light
`emitting device, plating processing is not applied to a cut
`surface and is applied to parts other than the cut surface. It
`is not necessary to apply plating processing per singulated
`light emitting device and it is possible to simplify a manu-
`lO facturing method.
`Preferably, the notch part in a cut part of the lead frame
`is about half the entire surrounding periphery. By this means,
`it is possible to reduce the weight of the lead frame and
`15 provide light emitting devices at low cost. Further, the part
`of the lead frame to be cut decreases, so that it is possible to
`better prevent the lead frame and the thermosetting resin
`from detaching.
`In addition, the difference is that, while the thermosetting
`20 resin is filled in the notch parts, the thermosetting resin is not
`filled in hole parts which are described later. While the notch
`parts and hole parts penetrate the lead frame, grooves which
`are described later do not penetrate the lead frame.
`Preferably, a hole part is provided in the lead frame before
`25 the lead frame is sandwiched by the upper mold and the
`lower mold. By this means, it is possible to reduce the
`weight of the lead frame more, and provide light emitting
`devices at low cost. It is possible to apply the plating
`processing to the hole parts, and consequently prevent
`30 exposure of the lead frame.
`Preferably, a groove is provided in the lead frame before
`the lead frame is sandwiched by the upper mold and the
`lower mold. By this means, it is possible to reduce the
`weight of the lead frame more, and provide light emitting
`35 devices at low cost. It is possible to apply plating processing
`to the grooves, and consequently prevent exposure of the
`lead frame.
`Preferably, the upper mold and the lower mold sandwich
`a part of the lead frame where a light emitting element is
`40 placed or near a hole part. By this means, it is possible to
`prevent the lead frame from flip-flopping and reduce burrs.
`The present invention relates to a light emitting device
`having a resin package having an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, wherein a resin part and a lead are
`formed in a substantially same plane in an outer side surface,
`and wherein at least one surface of a bottom surface and an
`upper surface of a lead is plated and the outer side surface
`of the lead is not plated. By this means, it is possible to
`prevent exposure of leads to which plating processing is not
`applied, and provide multiple light emitting devices at one
`time. Further, by applying plating processing to only the part
`which reflects light from a light emitting element, it is
`possible to improve the efficiency to extract light from the
`light emitting device.
`Preferably, the lead is exposed at four comers of the resin
`package. The exposed parts of the leads are reduced com(cid:173)
`pared to leads which are provided on the one entire side
`surface of a resin package, so that it is possible to improve
`adhesion between the resin part and the leads. Further, the
`insulating resin part is provided between a positive lead and
`a negative lead, so that it is possible to prevent short
`circuiting.
`Preferably, four corners of the resin package are formed in
`an arc shape seen from a bottom surface side. It is also
`possible to employ a configuration where plating processing
`is applied to a part which is formed in an arc shape and is
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`US 10,115,870 B2
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`5
`not applied to the cut surface. By this means, it is possible
`to expand a bonding area with, for example, a solder, and
`improve the boding strength.
`Preferably, a step is provided in the lead. The differences
`in level are preferably provided in the bottom surface of the 5
`resin package. It is also possible to employ a configuration
`where plating processing is applied to a part in which
`differences in level are formed and is not applied to the cut
`surface. By this means, it is possible to expand a bonding
`area with, for example, a solder, and improve the boding 10
`strength.
`The present invention relates to a method for manufac(cid:173)
`turing a resin package having an optical reflectivity equal to
`or more than 70% at a wavelength between 350 nm and 800
`nm after thermal curing, wherein a resin part and a lead are 15
`formed in a substantially same plane in an outer side surface.
`The method comprising: a step of sandwiching a lead frame
`provided with a notch part, by means of an upper mold and
`a lower mold; a step of transfer-molding a thermosetting
`resin containing a light reflecting material in a mold sand- 20
`wiched by the upper mold and the lower mold to form a
`resin-molded body in the lead frame; and a step of cutting
`the resin-molded body and the lead frame along the notch
`part. With the configuration, the thermosetting resin is filled
`in the notch parts, and therefore an adhering area between 25
`the lead frame and the thermosetting resin becomes large, so
`that it is possible to improve adhesion between the lead
`frame and the thermosetting resin. Further, a thermosetting
`resin having lower viscosity than a thermoplastic resin is
`used, so that it is possible to fill the thermosetting resin
`in the notch parts without leaving a gap. Further, it is
`possible to manufacture multiple resin packages at one time
`and greatly improve productive efficiency. Furthermore, it is
`possible to reduce rumiers which are discarded, and provide
`resin packages at low cost.
`Preferably, plating processing is applied to the lead frame
`before the lead frame is sandwiched by the upper mold and
`the lower mold. In this case, in the manufactured resin
`package, plating processing is not applied to a cut surface
`and is applied to parts other than the cut surface. It is not 40
`necessary to apply plating processing per singulated resin
`package and it is possible to simplify a manufacturing
`method.
`The present invention relates to a resin package having an
`optical reflectivity equal to or more than 70% at a wave(cid:173)
`length between 350 nm and 800 nm after thermal curing,
`wherein a resin part and a lead are formed in a substantially
`same plane in an outer side surface, and wherein at least one
`surface of a bottom surface and an upper surface of a lead
`is plated and the outer side surface of the lead is not plated.
`By this means, it is possible to prevent exposure of leads to
`which plating processing is not applied, and provide mul(cid:173)
`tiple resin packages at one time. Further, by applying plating
`processing to only the part which reflects light from a light
`emitting element, it is possible to improve the efficiency to
`ext