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`US 20050269587Al
`
`(19) United States
`(12) Patent Application Publication
`Loh et al.
`
`(10) Pub. No.: US 2005/0269587 Al
`Dec. 8, 2005
`( 43) Pub. Date:
`
`(54) POWER LIGHT EMITTING DIE PACKAGE
`WITH REFLECTING LENS AND THE
`METHOD OF MAKING THE SAME
`
`(76)
`
`Inventors: Ban P. Loh, Durham, NC (US); Gerald
`H. Negley, Carrborro, NC (US)
`
`Correspondence Address:
`D. James Chung
`Suite 245
`6601 Koll Center Parkway
`Pleasanton, CA 94566 (US)
`
`(21) Appl. No.:
`
`10/861,929
`
`(22) Filed:
`
`Jun.4,2004
`
`Publication Classification
`
`(51)
`
`Int. Cl.7 ........................... HOlL 33/00; H0lL 21/00
`
`(52) U.S. Cl. ............................ 257/99; 257/433; 257/676;
`438/27; 438/123
`
`(57)
`
`ABSTRACT
`
`A light emitting die package and a method of manufacturing
`the die package are disclosed. The die package includes a
`leadframe, at least one light emitting device (LED), a
`molded body, and a lens. The leadframe includes a plurality
`of leads and has a top side and a bottom side. A portion of
`the leadframe defines a mounting pad. The LED device is
`mounted on the mounting pad. The molded body is inte(cid:173)
`grated with portions of the leadframe and defines an opening
`on the top side of the leadframe, the opening surrounding the
`mounting pad. The molded body further includes latches on
`the bottom side of the leadframe. The lens is coupled to the
`molded body. A composite lens is used as both reflector and
`imaging tool to collect and direct light emitted by LED(s) for
`desired spectral and luminous performance.
`
`~10
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`Patent Application Publication Dec. 8, 2005 Sheet 1 of 5
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`US 2005/0269587 Al
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`ylO
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`44
`FIG. IA
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`·I
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`22a
`
`FIG. IB
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`16
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`28
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`r24 FIG. IC
`__..........,_ __ ~~ t
`22a
`26
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`44
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`31 30 45 20
`
`I·
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`14
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`T
`l
`i 12 l
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`Patent Application Publication Dec. 8, 2005 Sheet 2 of 5
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`US 2005/0269587 Al
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`70
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`45
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`FIG. 2A
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`Patent Application Publication Dec. 8, 2005 Sheet 3 of 5
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`US 2005/0269587 Al
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`75
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`77l 73
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`31
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`ci.___ ___ __,~30
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`FIG. 2B
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`Patent Application Publication Dec. 8, 2005 Sheet 4 of 5
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`US 2005/0269587 Al
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`..,--so
`
`FIG. 3A
`
`FIG. 3C
`
`FIG. 3B
`
`FIG. 3D
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`Patent Application Publication Dec. 8, 2005 Sheet 5 of 5
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`US 2005/0269587 Al
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`73
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`FIG. 4
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`US 2005/0269587 Al
`
`Dec. 8, 2005
`
`1
`
`POWER LIGHT EMITTING DIE PACKAGE WITH
`REFLECTING LENS AND THE METHOD OF
`MAKING THE SAME
`
`BACKGROUND
`
`[0001] The present invention relates to the field of pack(cid:173)
`aging semiconductor devices, and more particularly to pack(cid:173)
`aging light emitting diodes.
`[0002] Light emitting devices (LEDS) such as light emit(cid:173)
`ting diodes are often packaged within leadframe packages.
`A leadframe package typically includes an LED connected
`to thin metal leads where the LED and most of the leads are
`completely encapsulated within a plastic body. A part of the
`plastic body defines a lens. A portion of the leads connected
`to the LED extends outside the plastic body. The metal leads
`of the leadframe package serve as the conduit to supply the
`LED with electrical power and, at the same time, may act to
`draw heat away from the LED. Heat is generated by the LED
`when power is applied to the LED to produce light. The
`portion of the leads that extend out from the package body
`connects to circuits external to the leadframe package.
`[0003] Some of the heat generated by the LED is dissi(cid:173)
`pated by the plastic package body; however, most of the heat
`is drawn away from the LED via the metal components of
`the package. The metal leads are typically very thin and have
`small cross sections. For this reason, capacity of the metal
`leads to remove heat from the LED is limited. This limits the
`amount of power that can be sent to the LED. This, in turn,
`limits the amount of light that can be generated by the LED.
`[0004] To increase the capacity of an LED package to
`dissipate heat, in one LED package design, a heat sink slug
`is introduced into the package. The heat sink slug draws heat
`from the LED chip, thus increasing the heat dissipating
`capacity of the LED package. However, this design intro(cid:173)
`duces free space in the optical cavity of the package that
`needs to be filled with a refractive-index-matching clear
`encapsulant within the package to extract light from the
`LED chip. Unfortunately, the volumetric expansion and
`contraction of the encapsulant typically exceeds that of the
`space that contains it. Hence, as the temperature rises, the
`encapsulant expands and overflows or is oozed out from the
`cavity through vent holes. Further, when it cools, the encap(cid:173)
`sulant contracts, creating a partial vacuum inside the cavity,
`and thus causing air or moisture to be sucked in. Sometimes,
`voids are formed inside the encapsulant or it delaminates
`from various components that it comes into contact with.
`This adversely affects the light output and reliability of the
`package. Furthermore, this design commonly includes a pair
`of flimsy leads which are typically soldered by a hot-iron.
`This ironing process is incompatible with the commonly
`used SMT (Surface Mount Technology) electronic board
`assembly processes.
`[0005]
`In another LED package design, leads of the lead(cid:173)
`frame are made of different thicknesses in various shapes
`and configurations and extend beyond the immediate edge of
`the LED package body. The package body is molded with
`transparent thermoset plastic which usually serves as the
`encapsulation material for the package. These leads are
`typically thicker than the leads of the LEDS of the previous
`design. The thicker lead is utilized as a heat-spreader and the
`LED chip is mounted on it. This arrangement allows heat
`generated by the LED chip to dissipate through the thicker
`
`leads which are connected thermally to an external heat sink.
`Unfortunately, this design is inherently unreliable due to
`large difference in coefficient of thermal expansion (CTE)
`between the plastic body, the encapsulant and the leadframe
`materials. Thus, when subjected to temperature cycles of,
`say, -40 C to 120 C, most or all components of the LED
`package experience high thermal stresses, especially at
`contact points. This frequently results in cracking of the
`LED chips, delamination of plastic body from the leads,
`breaking of bond wires, or a combination of these problems.
`In addition, the extended leads increase the size of the LED
`package size and footprint. The increased size prevents
`mounting of the packages in a dense cluster on a PCB
`(printed circuit board) to generate bright light for certain
`applications, for example, for automobile lighting or for
`general illumination.
`[0006] Another disadvantage of the current high power
`leadframe package designs is that the thick lead material
`cannot be stamped into a fine circuit for flip-chip or mount(cid:173)
`ing of several LED chips that can be addressed indepen(cid:173)
`dently for color control.
`[0007] Consequently,
`remains a need for an
`there
`improved LED package that overcomes or alleviates one or
`more of the shortcomings of the prior art packages.
`
`SUMMARY
`
`[0008] The need is met by the present invention. In a first
`embodiment of the present invention, a light emitting die
`package includes a leadframe, at least one light emitting
`device (LED), a molded body, and a lens. The leadframe
`includes a plurality of leads and has a top side and a bottom
`side. A portion of the leadframe defines a mounting pad. The
`LED device is mounted on the mounting pad. The molded
`body is integrated with portions of the leadframe and defines
`an opening on the top side of the leadframe, the opening
`surrounding the mounting pad. The molded body further
`includes latches on the bottom side of the leadframe. The
`lens is coupled to the molded body.
`[0009]
`In a second embodiment of the present invention,
`a method of manufacturing a light emitting die package is
`disclosed. A leadframe strip is fabricated. The leadframe
`strip includes a plurality of leads, each lead having a top side
`and a bottom side. Portions of a first lead define a mounting
`pad. A body is molded and integrated with portions of the
`leadframe strip. The molded body defines an opening on the
`top side of the leadframe and the opening surrounds the
`mounting pad. The molded body further includes latches on
`the bottom side of the leadframe. Then, at least one light
`emitting device is mounted on the mounting pad.
`[0010] Other aspects and advantages of the present inven(cid:173)
`tion will become apparent from the following detailed
`description, taken in conjunction with the accompanying
`drawings, illustrating by way of example the principles of
`the invention.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0011] FIG. lA is a perspective view of a light emitting
`die package according to one embodiment of the present
`invention;
`[0012] FIG. 1B is a top view of the light emitting die
`package of FIG. 1 but without lens illustrated in FIG. lA;
`
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`Dec. 8, 2005
`
`2
`
`[0013] FIG. lC is a cutaway side view of the light
`emitting die package of FIG. 1;
`
`[0014] FIG. 2A is an exploded perspective view of the
`light emitting die package of FIG. 1;
`
`[0015] FIG. 2B is a exploded cutaway side view of the
`light emitting die package of FIG. 1;
`
`[0016] FIGS. 3A through 3D are perspective illustrations
`of a light emitting die package at various stages of its
`manufacturing process; and
`
`[0017] FIG. 4 is a perspective view of a lens according to
`one embodiment of the present invention.
`
`DETAILED DESCRIPTION
`
`[0018] The present invention will now be described with
`reference to the FIGS. lA through 4, which illustrate
`various embodiments of the present invention. In the Fig(cid:173)
`ures, some sizes of structures or portions are exaggerated
`relative to sizes of other structures or portions for illustrative
`purposes and, thus, are provided to illustrate the general
`structures of the present invention. Furthermore, various
`aspects of the present invention are described with reference
`to a structure or a portion being formed on other structures,
`portions, or both. As will be appreciated by those of skill in
`the art, references to a structure being formed "on" or
`"above" another structure or portion contemplates that addi(cid:173)
`tional structure, portion, or both may intervene. References
`to a structure or a portion being formed "on" another
`structure or portion without an intervening structure or
`portion are described herein as being formed "directly on"
`the structure or portion.
`
`[0019] Furthermore, relative
`terms such as "on" or
`"above" are used herein to describe one structure's or
`portion's relationship to another structure or portion as
`illustrated in the Figures. It will be understood that relative
`terms such as "on" or "above" are intended to encompass
`different orientations of the device in addition to the orien(cid:173)
`tation depicted in the Figures. For example, if the device in
`the Figures is turned over, structure or portion described as
`"above" other structures or portions would now be oriented
`"below" the other structures or portions. Likewise, if the
`device in the Figures is rotated along an axis, structure or
`portion described as "above" other structures or portions
`would now be oriented "next to" or "left of" the other
`structures or portions. Like numbers refer to like elements
`throughout.
`
`[0020] As shown in the figures for the purposes of illus(cid:173)
`tration, embodiments of the present invention are exempli(cid:173)
`fied by a light emitting die package including a leadframe
`and molded body integrated with portions of the leadframe.
`At least one light emitting device (LED) such as a light
`emitting diode is mounted on the leadframe. The molded
`body has an opening that surrounds the LED and has latches
`for latching a heatsink. The LED is covered by an encap(cid:173)
`sulant that substantially fills the opening.
`
`[0021] The molded body is made of high temperature
`plastic providing structural support to relatively thin lead(cid:173)
`frame. The LED is mounted on a main lead of the leadframe
`and is connected by bond wires to other leads for additional
`electrical connections.
`
`[0022] A lens coupled to the molded body above the
`opening to provide optical functions for light generated by
`the LED. As discussed in more detail below, the lens
`occupies much of the opening around the LED thus reducing
`the amount of encapsulant used within the package. This
`alleviates the differential thermo stress problems associated
`with the volumetric expansion and contraction of the encap(cid:173)
`sulant discussed above, leading to lower failure rates and
`relatively higher reliability.
`[0023] A heatsink is coupled to the leadframe, using the
`latches, to further aid in heat dissipation. The latch design
`allows for simpler and less costly manufacture of the die
`package.
`[0024] Apparatus
`[0025] FIG. 1A is a perspective view of a light emitting
`die package 10 according to one embodiment of the present
`invention. FIG. 1B is a top view of the light emitting die
`package 10 illustrated without lens and without light emit(cid:173)
`ting devices both of which are illustrated in FIG. lA. FIG.
`lC is a cutaway side view of the light emitting die package
`10. FIG. 2A is an exploded perspective view of the light
`emitting die package 10. FIG. 2B is an exploded cutaway
`side view of the light emitting die package 10.
`[0026] Referring to FIGS. 1A through 2B, the light
`emitting die package 10 includes a leadframe 20 including
`a plurality of leads, collectively referred to as leads 22. In the
`Figures, to avoid clutter, not all the illustrated leads are
`designated with the reference number 22. The leadframe has
`a top side 24 and a bottom side 26. The leadframe 20 is made
`of metal or other electrically conductive material having a
`predetermined thickness that can vary greatly depending on
`the desired characteristics and application. For example, the
`thickness of the leadframe 20 may be in the order of tens or
`hundreds of microns.
`[0027] A portion of the leadframe 20 such as a first lead
`22a, generally in the center, defines a mounting pad 28 on
`which a light emitting device (LED) assembly 50 is
`mounted. The light emitting device (LED) assembly 50
`includes at least one light emitting device (LED) such as a
`light emitting diode.
`[0028] A molded body 40 is integrated with portions of the
`leadframe 20 in that an upper portion of the molded body 40
`is above the leadframe 20 while a lower portion of the same
`molded body 40 is below the leadframe 20. In the illustrated
`sample embodiment, the molded body 40 covers a signifi(cid:173)
`cant portion of the leadframe 20. The upper portion of the
`molded body 40 defines an opening 42 surrounding the
`mounting pad 28. The lower portion of the molded body 40
`includes latches 44. A heatsink 30 can be attached to the
`leadframe 20 by engaging the latches 44.
`[0029] The heatsink 30, when engaged to the leadframe
`20, draws heat generated by the LED assembly 50 when
`energized and aids in dissipation of the generated heat. To
`avoid electrical shorts, the heatsink 30 is made of dielectric
`material. Alternatively, if the heatsink 30 is made using
`electrically conductive material, then the heatsink 30 can be
`separated from the leadframe by a dielectric layer 31. The
`dielectric layer 31 can be, for example, glass or organic
`polymer filled with highly thermally conductive ceramics.
`[0030] A lens 70 is coupled to the molded body 40 at its
`opening 42 and over the LED assembly 50. The molded
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`3
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`body 40 can be injection molded onto and around the
`leadframe 20 using high temperature plastic. Material for the
`molded body 40 is known in the art. The molded body 40
`can be injection molded onto and around the leadframe 20
`using high temperature plastics. Examples of the material
`for the molded body 40 are LCP (Liquid Crystal Polymers)
`filled with glass or carbon fibers.
`
`[0031] The lens 70 can be rigidly attached to the molded
`body 40 by an adhesive or by mechanical means at its
`opening 42 and over the LED assembly 50. Alternatively,
`the lens can couple to the molded body 40 by the soft
`encapsulant adhesive such that the lens is allowed to float on
`the molded body 40 as the temperature rises or falls.
`
`[0032] The heatsink 30 is typically made of thermally
`conductive materials such as, for example, copper, alumi(cid:173)
`num, or ceramics.
`
`[0033] Size of the light emitting die package 10 can vary
`widely depending on its desired characteristics and applica(cid:173)
`tion. In the illustrated embodiment, the dimensions of the
`light emitting die package 10 can be in the order of a few
`millimeters (mm) or tens of millimeters. For example, the
`light emitting die package 10 can have the following dimen(cid:173)
`sions: thickness 12 ranging from approximately 3 mm to
`approximately 50 mm; length 14 ranging from approxi(cid:173)
`mately 5 mm to approximately 40 mm; and width 16 ranging
`from approximately 5 mm to approximately 30 mm.
`
`[0034] Method
`
`[0035] A method of manufacturing the light emitting die
`package 10 of FIG. lA can be discussed using FIGS. 3A to
`3D. FIGS. 3A through 3D are perspective illustrations of
`the light emitting die package 10 at various stages of its
`manufacturing process. To manufacture the light emitting
`die package 10 of FIG. lA, a leadframe strip 80 is fabri(cid:173)
`cated. For illustratively purposes, in FIG. 3A, the leadframe
`strip 80 is fabricated for manufacturing of two light emitting
`die packages. In fact, a leadframe strip can be fabricated to
`manufacture multiple light emitting die packages simulta(cid:173)
`neously.
`
`[0036] Referring to FIGS. 3A through 3D, the leadframe
`strip 80 includes a plurality of leads 22 and a crossbar 82
`surrounding and supporting the leads 22. The leadframe strip
`80 and the leads 22 have a top side 24 (that is the same side
`as the top side 24 of leadframe 20 of FIGS. lA to 2B) and
`a bottom side 26 (that is the same side as the bottom side 26
`of leadframe 20 of FIGS. 1A to 2B). As also illustrated in
`FIG. 1B, a portion of a first lead 22a defines the mounting
`pad 28. The leadframe strip 80 is fabricated by stamping a
`sheet of electrically conductive material such as metal. The
`thickness of the material may vary greatly depending on the
`desired application, for example, the thickness may range in
`tens or hundreds of microns. Alternately, the leadframe strip
`80 can be fabricated using a chemical etching or milling
`processes.
`
`[0037] The molded body 40 is molded and integrated with
`portions of the leadframe strip 80 and the heatsink 30. The
`molded body 40 defines the opening 42 surrounding the
`mounting pad 28. Further, the molded body 40 includes the
`latches 44 on the bottom side 26 of the leadframe 20.
`
`[0038] Before molding the body 40 is integrated with the
`leadframe strip 80, the heatsink 30 can be attached to the
`
`leadframe strip 80 with a dielectric adhesive film as dis(cid:173)
`cussed above and as illustrated in FIG. 3B. The molded
`plastic body 40, when molded onto the leadframe strip 80,
`locks the heatsink 30 using the latches 44 as illustrated, for
`example, in FIG. lA.
`[0039] Then, as also illustrated in FIGS. 2A and 2B, the
`LED assembly 50 including at least one light emitting
`device is mounted on the mounting pad 28. Next, the LED
`assembly 50 is encapsulated by an encapsulant such as soft
`silicone or any visco-elastic polymer of low durometer or
`hardness. The lens 70 is then coupled to the molded body 40
`over the opening 42 thereby defining an enclosed optical
`cavity 45 illustrated, for example, in FIGS. lC and 2B.
`[0040] The optical cavity 45 of FIGS. lC and 2B, is
`substantially filled with the encapsulant. Depending on the
`desired results, the cavity 45 can be completely filled or
`partially filled while leaving an expansion space or free
`space behind or under the reflector of the lens, the expansion
`space being free of the encapsulant. Then, the crossbar 82
`portion of the leadframe strip 80 is separated leaving the
`leadframe frame die package 10 with external portions of
`leads 22 sticking out of the molded body 40. Finally, the
`external portions of the leads 22 are bent to a gull-wing
`shape as illustrated, for example, in FIGS. lA and lC.
`[0041] Lens
`[0042] The lens 70 is illustrated in FIGS. lA, lC, 2A, 2B,
`3D, and 4. In particular, FIGS. 2A, 3D, and 4 illustrate
`perspective views of the lens 70 and FIGS. lC and 2B
`illustrate cutaway side view of the lens 70. Referring to these
`illustrations of the lens 70 but more particularly to FIGS. 2B
`and 4, in the illustrated embodiment, the lens 70 includes
`two portions-an upper portion 75 and a lower portion 77.
`The upper portion 75 includes an optical surface 76 affecting
`optical performance of the die package 10.
`[0043] The lower portion 77 includes a concave bottom
`surface 72, placed over the LED assembly 50, adapted to
`receive light from the LED assembly 50. Furthermore, the
`lower portion 77 defines concave cavity 78 in its central
`portion to provide space for the LED assembly 50. The
`concave cavity 78, in combination with the leadframe 20,
`forms the enclosed optical cavity 45 as discussed above.
`
`[0044] The concave bottom surface 72 of the lens 70 can
`be coated with optical material intended to influence or
`change the nature of the light emitted by the LED chip(s)
`before it leaves the die package 10. Examples of types of
`optical materials are luminescence converting phosphors,
`dyes, fluorescent polymers or other materials which absorb
`some of the light emitted by the chip(s) and re-emit light of
`different wavelengths. Examples of other optical materials
`are light diffusants (such as Titanium oxides) or void which
`disperse or scatter light. Any individual or combination of
`these materials can be applied on the lens to obtain certain
`spectral and luminous performance.
`
`[0045] Also included in the lower portion 77 is an outer
`reflective surface 74 coated with reflective material. The
`outer reflective surface 74 is adapted to collect and to reflect
`the received light from the LED assembly 50. The outer
`reflective surface 74 is coated with reflective material such
`as, for example, silver, gold, or Aluminum. The reflected
`light leaves the lens 70 through the optical surface 76. The
`reflective material can be applied to the outer reflective
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`surface 74 by chemical deposition, printing and curing of
`metal paste using thick film technology.
`
`[0046] The reflective surface 74 can be placed at an angle
`that is greater than critical angle 71 to provide a total internal
`reflection (TIR) for at least a portion of the light emitting by
`the LED assembly 50. Further, the reflective surface 74 can
`be fabricated to have a predetermined optical finish adopted
`to scatter the light in order to mix the light emitted by
`different color LED chips placed inside the optical cavity.
`For placement of the lens 70 on the rest of the light emitting
`die package 10, the lens 70 may include a ledge 73.
`
`[0047] The lower portion 77 of the lens 70 occupies much
`(perhaps even more than 50%) of the opening 42 that
`surrounds the LED assembly 50. Consequently, spatial vol(cid:173)
`ume of the opening 42 that would have been filled by
`encapsulant in prior art designs is reduced. The reduction
`spatial volume of the opening 42 reduces the amount of the
`encapsulant used to fill the volume. The reduction of the
`encapsulant alleviates the differential thermal stress prob(cid:173)
`lems associated with the volumetric expansion and contrac(cid:173)
`tion of the encapsulant discussed above. Consequently, the
`package 10 of the present invention has lower failure rates
`and relatively higher reliability.
`
`[0048] The lens 70 can be attached to the molded body 40
`in a number of ways. For example, the lens 70 is adhered to
`the encapsulant such that the lens 70 sits on and floats on the
`encapsulant during temperature cycles. Alternatively, the
`lens 70 is fixed at its ledge 73 to the molded body 40. A small
`gap, the expansion space, of few hundreds of microns exists
`between lowest point of the lens 70 and the top side 24 of
`the leadframe 22. This gap allows the encapsulant to breathe
`(expand and contract) through this gap during temperature
`cycles such that little, if any, high thermal stresses is
`experienced by other portions of the die package 10. This
`reduces failure by delamination, cracking, and other causes
`related to thermal related stresses.
`
`[0049] The optical surface 76 is a portion of outer surface
`of the composite optical lens 70. Light (both reflected light
`and non-reflected light) from the LED assembly 50 leave the
`composite optical lens 70 through the optical surface 76. The
`lens 70 is made of optical plastic, glass, or both usually clear
`to allow most of the light from the LED assembly 50 to pass
`through the lens 70.
`
`[0050] From the foregoing, it will be apparent that the
`present invention is novel and offers advantages over the
`current art. Although specific embodiments of the invention
`are described and illustrated above, the invention is not to be
`limited to the specific forms or arrangements of parts so
`described and illustrated. For example, differing configura(cid:173)
`tions, sizes, or materials may be used to practice the present
`invention. The invention is limited by the claims that follow.
`
`What is claimed is:
`1. A light emitting die package comprising:
`
`a leadframe including a plurality of leads, said leadframe
`having a top side and a bottom side, and a portion of
`said leadframe defining a mounting pad;
`
`at least one light emitting device mounted on the mount(cid:173)
`ing pad;
`
`a molded body integrated with portions of said leadframe,
`said molded body defining an opening on the top side
`of said leadframe, the opening surrounding the mount(cid:173)
`ing pad;
`
`said molded body including latches on the bottom side of
`said leadframe; and
`
`a lens coupled to the molded body.
`2. The light emitting die package recited in claim 1
`wherein said molded body comprises molded plastic.
`3. The light emitting die package recited in claim 1 further
`comprising a heatsink coupled, via a dielectric adhesive
`film, to said leadframe, said heatsink latched to said lead(cid:173)
`frame by the latches.
`4. The light emitting die package recited in claim 1
`wherein said lens is a composite optical lens.
`5. A method of manufacturing a light emitting die pack(cid:173)
`age, the method comprising:
`
`fabricating a leadframe strip, the leadframe strip including
`a plurality of leads, each lead and the leadframe strip
`having a top side and a bottom side, portions of a first
`lead defining a mounting pad;
`
`molding a body integrated with portions of the leadframe
`strip, the molded body defining an opening on the top
`side of the leadframe strip, the opening surrounding the
`mounting pad;
`
`the molded body including latches on the bottom side of
`the leadframe strip; and
`
`mounting at least one light emitting device on the mount(cid:173)
`ing pad.
`6. The method recited in claim 5 wherein the leadframe
`strip comprises thin metal.
`7. The method recited in claim 5 wherein the leadframe
`strip is stamped from a metal sheet.
`8. The method recited in claim 5 wherein the molded body
`comprises high temperature plastic.
`9. The method recited in claim 5 further comprising
`coupling a heatsink to the leadframe die by engaging the
`heatsink with the latches.
`10. The method recited in claim 5 further comprising
`encapsulating the light emitting device with an encapsulant.
`11. The method recited in claim 5 further comprising
`coupling a lens over the opening thereby defining an optical
`cavity.
`12. The method recited in claim 11 wherein the lens is a
`composite optical lens including a reflector surface and a
`concave bottom surface placed over the mounting pad.
`13. The method recited in claim 11 wherein the lens has
`a bottom surface coated with optical material adapted to
`operate on the light.
`14. The method recited in claim 11 further comprising
`substantially filling the optical cavity with encapsulant while
`leaving an expansion space free of the encapsulant thereby
`allowing the encapsulant to expand and contract.
`15. The method recited in claim 5 further comprising
`removing crossbar portion of the leadframe leaving the light
`emitting die package with external portions of the leads;
`
`and bending the external portions of the leads.
`
`* * * * *
`
`VIZIO Ex. 1022 Page 00010
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