`
`
`
`
`FEATURES
`Ultralow power: as low as 23 μA in measurement mode and
`0.1 μA in standby mode at VS = 2.5 V (typical)
`Power consumption scales automatically with bandwidth
`User-selectable resolution
`Fixed 10-bit resolution
`Full resolution, where resolution increases with g range,
`up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB
`scale factor in all g ranges)
`Patent pending, embedded memory management system
`with FIFO technology minimizes host processor load
`Single tap/double tap detection
`Activity/inactivity monitoring
`Free-fall detection
`Supply voltage range: 2.0 V to 3.6 V
`I/O voltage range: 1.7 V to VS
`SPI (3- and 4-wire) and I2C digital interfaces
`Flexible interrupt modes mappable to either interrupt pin
`Measurement ranges selectable via serial command
`Bandwidth selectable via serial command
`Wide temperature range (−40°C to +85°C)
`10,000 g shock survival
`Pb free/RoHS compliant
`Small and thin: 3 mm × 5 mm × 1 mm LGA package
`APPLICATIONS
`Handsets
`Medical instrumentation
`Gaming and pointing devices
`Industrial instrumentation
`Personal navigation devices
`Hard disk drive (HDD) protection
`
`3-Axis, ±2 g/±4 g/±8 g/±16 g
`Digital Accelerometer
`ADXL345
`
`GENERAL DESCRIPTION
`The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer
`with high resolution (13-bit) measurement at up to ±16 g. Digital
`output data is formatted as 16-bit twos complement and is acces-
`sible through either a SPI (3- or 4-wire) or I2C digital interface.
`The ADXL345 is well suited for mobile device applications. It
`measures the static acceleration of gravity in tilt-sensing appli-
`cations, as well as dynamic acceleration resulting from motion
`or shock. Its high resolution (3.9 mg/LSB) enables measurement
`of inclination changes less than 1.0°.
`Several special sensing functions are provided. Activity and
`inactivity sensing detect the presence or lack of motion by
`comparing the acceleration on any axis with user-set thresholds.
`Tap sensing detects single and double taps in any direction. Free-
`fall sensing detects if the device is falling. These functions can
`be mapped individually to either of two interrupt output pins.
`An integrated, patent pending memory management system with a
`32-level first in, first out (FIFO) buffer can be used to store data to
`minimize host processor activity and lower overall system power
`consumption.
`Low power modes enable intelligent motion-based power
`management with threshold sensing and active acceleration
`measurement at extremely low power dissipation.
`The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm,
`14-lead, plastic package.
`
`
`FUNCTIONAL BLOCK DIAGRAM
`VS
`VDD I/O
`
`ADXL345
`
`POWER
`MANAGEMENT
`
`SENSE
`ELECTRONICS
`
`ADC
`
`DIGITAL
`FILTER
`
`3-AXIS
`SENSOR
`
`CONTROL
`AND
`INTERRUPT
`LOGIC
`
`INT1
`
`INT2
`
`SDA/SDI/SDIO
`SDO/ALT
`ADDRESS
`SCL/SCLK
`
`
`
`07925-001
`
`32 LEVEL
`FIFO
`
`SERIAL I/O
`
`GND
`
`CS
`
`Figure 1.
`
`Rev. C
`Information furnished by Analog Devices is believed to be accurate and reliable. However, no
`responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
`rights of third parties that may result from its use. Specifications subject to change without notice. No
`license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
`Trademarks and registered trademarks are the property of their respective owners. See the last
`page for disclaimers.
`
`
`
`
`
`
`
`One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
`www.analog.com
`Tel: 781.329.4700
`Fax: 781.461.3113 ©2009–2011 Analog Devices, Inc. All rights reserved.
`
`Petitioner Samsung Ex-1056, 0001
`
`

`

`ADXL345
`
`
`
`TABLE OF CONTENTS
`Features .............................................................................................. 1
`Applications....................................................................................... 1
`General Description ......................................................................... 1
`Functional Block Diagram .............................................................. 1
`Revision History ............................................................................... 3
`Specifications..................................................................................... 4
`Absolute Maximum Ratings............................................................ 6
`Thermal Resistance ...................................................................... 6
`Package Information .................................................................... 6
`ESD Caution.................................................................................. 6
`Pin Configuration and Function Descriptions............................. 7
`Typical Performance Characteristics ............................................. 8
`Theory of Operation ...................................................................... 13
`Power Sequencing ...................................................................... 13
`Power Savings ............................................................................. 14
`Serial Communications ................................................................. 15
`SPI................................................................................................. 15
`I2C................................................................................................. 18
`Interrupts..................................................................................... 20
`FIFO ............................................................................................. 21
`
`
`
`
`
`Self-Test ....................................................................................... 22
`Register Map ................................................................................... 23
`Register Definitions ................................................................... 24
`Applications Information .............................................................. 28
`Power Supply Decoupling ......................................................... 28
`Mechanical Considerations for Mounting.............................. 28
`Tap Detection.............................................................................. 28
`Threshold .................................................................................... 29
`Link Mode ................................................................................... 29
`Sleep Mode vs. Low Power Mode............................................. 30
`Offset Calibration....................................................................... 30
`Using Self-Test ............................................................................ 31
`Data Formatting of Upper Data Rates..................................... 32
`Noise Performance..................................................................... 33
`Operation at Voltages Other Than 2.5 V ................................ 33
`Offset Performance at Lowest Data Rates............................... 34
`Axes of Acceleration Sensitivity ............................................... 35
`Layout and Design Recommendations ................................... 36
`Outline Dimensions....................................................................... 37
`Ordering Guide .......................................................................... 37
`
`Rev. C | Page 2 of 40
`
`Petitioner Samsung Ex-1056, 0002
`
`

`

`
`
`ADXL345
`
`
`
`
`
`
`REVISION HISTORY
`5/11—Rev. B to Rev. C
`Added Preventing Bus Traffic Errors Section ............................15
`Changes to Figure 37, Figure 38, Figure 39 .................................16
`Changes to Table 12 ........................................................................19
`Changes to Using Self-Test Section...............................................31
`Changes to Axes of Acceleration Sensitivity Section..................35
`11/10—Rev. A to Rev. B
`Change to 0 g Offset vs. Temperature for Z-Axis Parameter,
`Table 1.................................................................................................4
`Changes to Figure 10 to Figure 15 ..................................................9
`Changes to Ordering Guide...........................................................37
`4/10—Rev. 0 to Rev. A
`Changes to Features Section and General
`Description Section...........................................................................1
`Changes to Specifications Section...................................................3
`Changes to Table 2 and Table 3 .......................................................5
`Added Package Information Section, Figure 2, and Table 4;
`Renumbered Sequentially ................................................................5
`Changes to Pin 12 Description, Table 5 .........................................6
`Added Typical Performance Characteristics Section ...................7
`Changes to Theory of Operation Section and Power Sequencing
`Section ..............................................................................................12
`Changes to Powers Savings Section, Table 7, Table 8, Auto Sleep
`Mode Section, and Standby Mode Section ..................................13
`Changes to SPI Section...................................................................14
`Changes to Figure 36 to Figure 38 ................................................15
`Changes to Table 9 and Table 10 ...................................................16
`Changes to I2C Section and Table 11............................................17
`Changes to Table 12 ........................................................................18
`Changes to Interrupts Section, Activity Section, Inactivity
`Section, and FREE_FALL Section.................................................19
`
`Added Table 13................................................................................19
`Changes to FIFO Section ...............................................................20
`Changes to Self-Test Section and Table 15 to Table 18 ..............21
`Added Figures 42 and Table 14 .....................................................21
`Changes to Table 19 ........................................................................22
`Changes to Register 0x1D—THRESH_TAP (Read/Write)
`Section, Register 0x1E, Register 0x1F, Register 0x20—OFSX,
`OFSY, OSXZ (Read/Write) Section, Register 0x21—DUR
`(Read/Write) Section, Register 0x22—Latent (Read/Write)
`Section, and Register 0x23—Window (Read/Write) Section ...23
`Changes to ACT_X Enable Bits and INACT_X Enable Bit
`Section, Register 0x28—THRESH_FF (Read/Write) Section,
`Register 0x29—TIME_FF (Read/Write) Section, Asleep Bit
`Section, and AUTO_SLEEP Bit Section.......................................24
`Changes to Sleep Bit Section .........................................................25
`Changes to Power Supply Decoupling Section, Mechanical
`Considerations for Mounting Section, and Tap Detection
`Section ..............................................................................................27
`Changes to Threshold Section.......................................................28
`Changes to Sleep Mode vs. Low Power Mode Section...............29
`Added Offset Calibration Section.................................................29
`Changes to Using Self-Test Section ..............................................30
`Added Data Formatting of Upper Data Rates Section, Figure 48,
`and Figure 49 ...................................................................................31
`Added Noise Performance Section, Figure 50 to Figure 52, and
`Operation at Voltages Other Than 2.5 V Section .......................32
`Added Offset Performance at Lowest Data Rates Section and
`Figure 53 to Figure 55.....................................................................33
`6/09—Revision 0: Initial Version
`
`
`
`
`
`Rev. C | Page 3 of 40
`
`Petitioner Samsung Ex-1056, 0003
`
`

`

`ADXL345
`
`
`
`
`
`SPECIFICATIONS
`TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V, acceleration = 0 g, CS = 10 μF tantalum, CI/O = 0.1 μF, output data rate (ODR) = 800 Hz, unless
`otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed.
`Table 1.
`Parameter
`SENSOR INPUT
`Measurement Range
`Nonlinearity
`Inter-Axis Alignment Error
`Cross-Axis Sensitivity2
`OUTPUT RESOLUTION
`All g Ranges
`±2 g Range
`±4 g Range
`±8 g Range
`±16 g Range
`SENSITIVITY
`Sensitivity at XOUT, YOUT, ZOUT
`
`
`
`
`Sensitivity Deviation from Ideal
`Scale Factor at XOUT, YOUT, ZOUT
`
`
`
`
`Sensitivity Change Due to Temperature
`0 g OFFSET
`0 g Output for XOUT, YOUT
`0 g Output for ZOUT
`0 g Output Deviation from Ideal, XOUT, YOUT
`0 g Output Deviation from Ideal, ZOUT
`0 g Offset vs. Temperature for X-, Y-Axes
`0 g Offset vs. Temperature for Z-Axis
`NOISE
`X-, Y-Axes
`
`Min
`
`
`
`
`
`
`
`
`
`
`
`
`230
`230
`115
`57
`29
`
`3.5
`3.5
`7.1
`14.1
`28.6
`
`
`−150
`−250
`
`
`
`
`
`
`
`Typ 1
`
`±2, ±4, ±8, ±16
`±0.5
`±0.1
`±1
`
`10
`10
`11
`12
`13
`
`256
`256
`128
`64
`32
`±1.0
`3.9
`3.9
`7.8
`15.6
`31.2
`±0.01
`
`0
`0
`±35
`±40
`±0.4
`±1.2
`
`0.75
`
`Unit
`Max
`
`
`
`g
`%
`
`Degrees
`
`%
`
`
`
`Bits
`
`Bits
`
`Bits
`
`Bits
`
`Bits
`
`
`
`LSB/g
`282
`LSB/g
`282
`LSB/g
`141
`LSB/g
`71
`LSB/g
`35
`%
`
`mg/LSB
`4.3
`mg/LSB
`4.3
`mg/LSB
`8.7
`mg/LSB
`17.5
`mg/LSB
`34.5
`%/°C
`
`
`
`+150 mg
`+250 mg
`
`mg
`
`mg
`
`mg/°C
`
`mg/°C
`
`
`
`LSB rms
`
`Test Conditions
`Each axis
`User selectable
`Percentage of full scale
`
`
`Each axis
`10-bit resolution
`Full resolution
`Full resolution
`Full resolution
`Full resolution
`Each axis
`All g-ranges, full resolution
`±2 g, 10-bit resolution
`±4 g, 10-bit resolution
`±8 g, 10-bit resolution
`±16 g, 10-bit resolution
`All g-ranges
`All g-ranges, full resolution
`±2 g, 10-bit resolution
`±4 g, 10-bit resolution
`±8 g, 10-bit resolution
`±16 g, 10-bit resolution
`
`Each axis
`
`
`
`
`
`
`
`ODR = 100 Hz for ±2 g, 10-bit resolution or
`all g-ranges, full resolution
`ODR = 100 Hz for ±2 g, 10-bit resolution or
`all g-ranges, full resolution
`User selectable
`
`
`
`
`
`
`
`
`ODR ≥ 100 Hz
`ODR < 10 Hz
`
`ODR = 3200 Hz
`
`Rev. C | Page 4 of 40
`
`Z-Axis
`
`OUTPUT DATA RATE AND BANDWIDTH
`Output Data Rate (ODR)3, 4, 5
`SELF-TEST6
`Output Change in X-Axis
`Output Change in Y-Axis
`Output Change in Z-Axis
`POWER SUPPLY
`Operating Voltage Range (VS)
`Interface Voltage Range (VDD I/O)
`Supply Current
`
`Standby Mode Leakage Current
`Turn-On and Wake-Up Time7
`
`
`
`1.1
`
`
`
`LSB rms
`
`
`0.1
`
`0.20
`−2.10
`0.30
`
`2.0
`1.7
`
`
`
`
`
`
`
`
`
`
`
`
`2.5
`1.8
`140
`30
`0.1
`1.4
`
`
`Hz
`
`
`3200
`
`g
`2.10
`−0.20 g
`g
`3.40
`
`
`3.6
`V
`VS
`V
`
`μA
`
`μA
`
`μA
`
`ms
`
`Petitioner Samsung Ex-1056, 0004
`
`

`

`
`
`
`Parameter
`TEMPERATURE
`Operating Temperature Range
`WEIGHT
`Device Weight
`
`Test Conditions
`
`
`
`
`
`Min
`
`−40
`
`
`
`Typ 1
`
`
`
`30
`
`ADXL345
`
`Max
`
`+85
`
`
`
`Unit
`
`°C
`
`mg
`
` 1
`
`
`
`
`
` The typical specifications shown are for at least 68% of the population of parts and are based on the worst case of mean ±1 σ, except for 0 g output and sensitivity,
`which represents the target value. For 0 g offset and sensitivity, the deviation from the ideal describes the worst case of mean ±1 σ.
`2 Cross-axis sensitivity is defined as coupling between any two axes.
`3 Bandwidth is the −3 dB frequency and is half the output data rate, bandwidth = ODR/2.
`4 The output format for the 3200 Hz and 1600 Hz ODRs is different than the output format for the remaining ODRs. This difference is described in the Data Formatting of
`Upper Data Rates section.
`5 Output data rates below 6.25 Hz exhibit additional offset shift with increased temperature, depending on selected output data rate. Refer to the Offset Performance at
`Lowest Data Rates section for details.
`6 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit =
`0. Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate). The part must be in normal power
`operation (LOW_POWER bit = 0 in the BW_RATE register, Address 0x2C) for self-test to operate correctly.
`7 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For
`other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
`
`Rev. C | Page 5 of 40
`
`Petitioner Samsung Ex-1056, 0005
`
`

`

`ABSOLUTE MAXIMUM RATINGS
`Table 2.
`Parameter
`Acceleration
`
` Rating
`
`10,000 g
`10,000 g
`—0.3V to +3.9V
`—0.3V to +3.9V
`
`—0.3 V to Vopvo + 0.3 V or 3.9V,
`whicheveris less
`—0.3 V to +3.9V
`Indefinite
`
`—40°C to +105°C
`—40°C to +105°C
`
`Any Axis, Unpowered
`Any Axis, Powered
`
`Vs
`Vpp vo
`
`Digital Pins
`
`All Other Pins
`
`Output Short-Circuit Duration
`(Any Pin to Ground)
`Temperature Range
`Powered
`
`Storage
`
`Stresses above those listed under Absolute Maximum Ratings
`may cause permanent damageto the device. This is a stress
`rating only; functional operationof the device at these or any
`other conditions above those indicated in the operational
`section ofthis specification is not implied. Exposure to absolute
`maximum rating conditions for extended periods mayaffect
`devicereliability.
`
`THERMALRESISTANCE
`
`RoHS-compliant designation
`#
`Date code
`yww
`vvvv
`Factory lot code
`Table 3. Package Characteristics
`CNTY
`Country oforigin
`fen|@x|Device Weight
`Package Type
`14-Terminal LGA
`150°C/W
`rascw|30mg
`ESD CAUTION
`
`PACKAGE INFORMATION
`
`The information in Figure 2 and Table 4 provide details about
`the package branding for the ADXL345. For a complete listing
`
`Figure 2. Product Information on Package (Top View)
`
`Table 4. Package Branding Information
`Branding Key
`Field Description
`345B
`Part identifier for ADXL345
`
`of product availability, see the Ordering Guide section. 925-102or
`
`
`
`
`ESD (electrostatic discharge) sensitive device.
`Charged devices and circuit boards can discharge
`without detection. Although this product
`features
`patented or proprietary protection circuitry, damage
`may occur on devices subjected to high energy ESD.
`Therefore, proper ESD precautions should be taken to
`avoid performance degradation or loss of functionality.
`
`Rev. C | Page 6 of 40
`
`Petitioner Samsung Ex-1056, 0006
`
`Petitioner Samsung Ex-1056, 0006
`
`

`

`
`
`
`
`PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
`
`
`ADXL345
`
`ADXL345
`TOP VIEW
`(Not to Scale)
`SCL/SCLK
`
`13
`
`12
`
`11
`
`10
`
`9 8
`
`14
`
`+x
`
`+z
`
`+y
`
`7
`
`1 2 3 4
`
`5 6
`
`VDD I/O
`
`GND
`
`RESERVED
`
`GND
`
`GND
`
`VS
`
`CS
`Figure 3. Pin Configuration (Top View)
`
`
`
`Table 5. Pin Function Descriptions
`Pin No.
`Mnemonic
`1
`VDD I/O
`2
`GND
`3
`RESERVED
`4
`GND
`5
`GND
`6
`VS
`7
`CS
`8
`INT1
`9
`INT2
`10
`NC
`11
`RESERVED
`12
`SDO/ALT ADDRESS
`13
`SDA/SDI/SDIO
`14
`SCL/SCLK
`
`
`Description
`Digital Interface Supply Voltage.
`This pin must be connected to ground.
`Reserved. This pin must be connected to VS or left open.
`This pin must be connected to ground.
`This pin must be connected to ground.
`Supply Voltage.
`Chip Select.
`Interrupt 1 Output.
`Interrupt 2 Output.
`Not Internally Connected.
`Reserved. This pin must be connected to ground or left open.
`Serial Data Output (SPI 4-Wire)/Alternate I2C Address Select (I2C).
`Serial Data (I2C)/Serial Data Input (SPI 4-Wire)/Serial Data Input and Output (SPI 3-Wire).
`Serial Communications Clock. SCL is the clock for I2C, and SCLK is the clock for SPI.
`
`Rev. C | Page 7 of 40
`
`SDA/SDI/SDIO
`
`SDO/ALT ADDRESS
`
`RESERVED
`
`NC
`
`INT2
`
`INT1
`
`
`
`07925-002
`
`Petitioner Samsung Ex-1056, 0007
`
`

`

`ADXL345
`
`
`
`TYPICAL PERFORMANCE CHARACTERISTICS
`
`
`
`
`
`07925-207
`
`100
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`
`Figure 7. X-Axis Zero g Offset at 25°C, VS = 3.3 V
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`468
`
`PERCENT OF POPULATION (%)
`
`2 0
`
`–150
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`468
`
`PERCENT OF POPULATION (%)
`
`
`
`07925-204
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`Figure 4. X-Axis Zero g Offset at 25°C, VS = 2.5 V
`
`100
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`02468
`
`–150
`
`PERCENT OF POPULATION (%)
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`468
`
`PERCENT OF POPULATION (%)
`
`
`
`07925-208
`
`100
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`
`Figure 8. Y-Axis Zero g Offset at 25°C, VS = 3.3 V
`
`
`
`07925-209
`
`100
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`
`Figure 9. Z-Axis Zero g Offset at 25°C, VS = 3.3 V
`
`2 0
`
`–150
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`468
`
`PERCENT OF POPULATION (%)
`
`2 0
`
`–150
`
`Rev. C | Page 8 of 40
`
`
`
`07925-205
`
`100
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`
`Figure 5. Y-Axis Zero g Offset at 25°C, VS = 2.5 V
`
`
`
`07925-206
`
`150
`
`–100
`
`50
`0
`–50
`ZERO g OFFSET (mg)
`Figure 6. Z-Axis Zero g Offset at 25°C, VS = 2.5 V
`
`100
`
`2 0
`
`–150
`
`20
`
`18
`
`16
`
`14
`
`12
`
`10
`
`468
`
`PERCENT OF POPULATION (%)
`
`2 0
`
`–150
`
`Petitioner Samsung Ex-1056, 0008
`
`

`

`ADXL345
`
`N = 16
`AVDD = DVDD = 2.5V
`
`
`
`07925-213
`
`100
`
`
`
`07925-214
`
`100
`
`–20
`
`0
`
`40
`20
`TEMPERATURE (°C)
`Figure 13. X-Axis Zero g Offset vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V
`
`60
`
`80
`
`N = 16
`AVDD = DVDD = 2.5V
`
`–20
`
`0
`
`40
`20
`TEMPERATURE (°C)
`Figure 14. Y-Axis Zero g Offset vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V
`
`60
`
`80
`
`N = 16
`AVDD = DVDD = 2.5V
`
`150
`
`100
`
`50
`
`0
`
`–50
`
`–100
`
`OUTPUT (mg)
`
`–150
`–40
`
`150
`
`100
`
`50
`
`0
`
`–50
`
`–100
`
`OUTPUT (mg)
`
`–150
`–40
`
`150
`
`100
`
`50
`
`0
`
`–50
`
`–100
`
`OUTPUT (mg)
`
`30
`
`25
`
`20
`
`15
`
`10
`
`PERCENT OF POPULATION (%)
`
`
`
`
`
`05
`
`–2.0
`
`1.5
`1.0
`0.5
`0
`–0.5
`–1.0
`–1.5
`ZERO g OFFSET TEMPERATURE COEFFICIENT (mg/°C)
`Figure 10. X-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
`
`
`
`07925-210
`
`2.0
`
`30
`
`25
`
`20
`
`15
`
`10
`
`PERCENT OF POPULATION (%)
`
`05
`
`–2.0
`
`25
`
`20
`
`15
`
`10
`
`5
`
`PERCENT OF POPULATION (%)
`
`1.5
`1.0
`0.5
`0
`–0.5
`–1.0
`–1.5
`ZERO g OFFSET TEMPERATURE COEFFICIENT (mg/°C)
`Figure 11. Y-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
`
`
`
`07925-211
`
`2.0
`
`
`
`07925-215
`
`40
`20
`TEMPERATURE (°C)
`
`60
`
`80
`
`100
`
`–150
`–40
`
`–20
`
`0
`
`Figure 15. Z-Axis Zero g Offset vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V
`
`
`
`07925-212
`
`1.5
`1.0
`0.5
`0
`–0.5
`–1.0
`–1.5
`ZERO g OFFSET TEMPERATURE COEFFICIENT (mg/°C)
`
`2.0
`
`0
`–2.0
`
`Figure 12. Z-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
`
`Rev. C | Page 9 of 40
`
`Petitioner Samsung Ex-1056, 0009
`
`

`

`
`
`
`
`07925-219
`
`0.02
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
`PERCENT OF POPULATION (%)
`
`05
`
`–0.02
`
`0.01
`0
`–0.01
`SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
`Figure 19. X-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
`
`
`
`07925-220
`
`0.01
`0
`–0.01
`SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
`
`0.02
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
`PERCENT OF POPULATION (%)
`
`05
`
`–0.02
`
`Figure 20. Y-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
`PERCENT OF POPULATION (%)
`
`05
`
`–0.02
`
`0.01
`0
`–0.01
`SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
`Figure 21. Z-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
`
`
`
`07925-221
`
`0.02
`
`ADXL345
`
`
`
`55
`
`50
`
`45
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
` PERCENT OF POPULATION (%)
`
`
`
`07925-216
`
`
`
`07925-217
`
`
`
`07925-218
`
`05
`
`230 234 238 242 246 250 254 258 262 266 270 274 278 282
`SENSITIVITY (LSB/g)
`Figure 16. X-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
`
`55
`
`50
`
`45
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
` PERCENT OF POPULATION (%)
`
`05
`
`230 234 238 242 246 250 254 258 262 266 270 274 278 282
`SENSITIVITY (LSB/g)
`Figure 17. Y-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
`
`55
`
`50
`
`45
`
`40
`
`35
`
`30
`
`25
`
`20
`
`15
`
`10
`
` PERCENT OF POPULATION (%)
`
`05
`
`230 234 238 242 246 250 254 258 262 266 270 274 278 282
`SENSITIVITY (LSB/g)
`Figure 18. Z-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
`
`Rev. C | Page 10 of 40
`
`Petitioner Samsung Ex-1056, 0010
`
`

`

`ADXL345
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`240
`
`235
`
`SENSITIVITY (LSB/g)
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`240
`
`235
`
`SENSITIVITY (LSB/g)
`
`
`
`
`
`230
`–40
`
`–20
`
`0
`
`
`
`07925-225
`
`120
`
`80
`
`100
`
`20
`40
`60
`TEMPERATURE (°C)
`Figure 25. X-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
`
`230
`–40
`
`–20
`
`0
`
`
`
`07925-222
`
`120
`
`80
`
`100
`
`60
`40
`20
`TEMPERATURE (°C)
`Figure 22. X-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`240
`
`SENSITIVITY (LSB/g)
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`SENSITIVITY (LSB/g)
`
`240
`
`235
`
`235
`
`
`
`07925-226
`
`120
`
`
`
`07925-227
`
`120
`
`230
`–40
`
`–20
`
`0
`
`60
`40
`20
`TEMPERATURE (°C)
`Figure 26. Y-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
`
`80
`
`100
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`240
`
`235
`
`SENSITIVITY (LSB/g)
`
`230
`–40
`
`–20
`
`0
`
`60
`40
`20
`TEMPERATURE (°C)
`Figure 27. Z-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution
`
`80
`
`100
`
`
`
`07925-223
`
`120
`
`
`
`07925-224
`
`120
`
`230
`–40
`
`–20
`
`0
`
`20
`40
`60
`TEMPERATURE (°C)
`Figure 23. Y-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
`
`80
`
`100
`
`280
`
`275
`
`270
`
`265
`
`260
`
`255
`
`250
`
`245
`
`240
`
`235
`
`SENSITIVITY (LSB/g)
`
`230
`–40
`
`–20
`
`0
`
`20
`40
`60
`TEMPERATURE (°C)
`Figure 24. Z-Axis Sensitivity vs. Temperature—
`Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution
`
`80
`
`100
`
`Rev. C | Page 11 of 40
`
`Petitioner Samsung Ex-1056, 0011
`
`

`

`ADXL345
`
`
`
`
`
`60
`
`50
`
`40
`
`30
`
`20
`
`10
`
`0
`
`60
`
`50
`
`40
`
`30
`
`20
`
`10
`
`0
`
`60
`
`50
`
`40
`
`30
`
`20
`
`10
`
`PERCENT OF POPULATION (%)
`
`PERCENT OF POPULATION (%)
`
`PERCENT OF POPULATION (%)
`
`
`
`07925-232
`
`50 100 200 400 800 1600 3200
`1.60 3.12 6.25 12.50 25
`OUTPUT DATA RATE (Hz)
`
`160
`
`140
`
`120
`
`100
`
`80
`
`60
`
`40
`
`20
`
`0
`
`CURRENT CONSUMPTION (µA)
`
`
`
`07925-229
`
`Figure 32. Current Consumption vs. Output Data Rate at 25°C—10 Parts,
`VS = 2.5 V
`
`200
`
`150
`
`100
`
`50
`
`SUPPLY CURRENT (µA)
`
`–0.2
`
`–0.5
`
`–1.4
`–1.1
`–0.8
`SELF-TEST RESPONSE (g)
`Figure 29. Y-Axis Self-Test Response at 25°C, VS = 2.5 V
`
`
`–1.7
`
`–2.0
`
`
`
`07925-233
`
`.6
`3
`
`2.0
`
`2.4
`
`2.8
`SUPPLY VOLTAGE (V)
`Figure 33. Supply Current vs. Supply Voltage, VS at 25°C
`
`3.2
`
`0
`
`
`
`07925-230
`
`3.3
`
`0.9
`
`2.1
`1.5
`SELF-TEST RESPONSE (g)
`
`2.7
`
`0
`
`0.3
`
`Figure 30. Z-Axis Self-Test Response at 25°C, VS = 2.5 V
`
`
`
`Rev. C | Page 12 of 40
`
`25
`
`20
`
`15
`
`10
`
`5
`
`0
`
` PERCENT OF POPULATION (%)
`
`07925-231
`
`180
`
`190
`
`200
`
`100
`
`110
`
`120
`
`170
`160
`150
`140
`130
`CURRENT CONSUMPTION (µA)
`
`Figure 31. Current Consumption at 25°C, 100 Hz Output Data Rate, VS = 2.5 V
`
`
`
`
`07925-228
`
`2.0
`
`0.2
`
`0.5
`
`1.4
`1.1
`0.8
`SELF-TEST RESPONSE (g)
`Figure 28. X-Axis Self-Test Response at 25°C, VS = 2.5 V
`
`
`1.7
`
`Petitioner Samsung Ex-1056, 0012
`
`

`

`
`
`
`
`THEORY OF OPERATION
`The ADXL345 is a complete 3-axis acceleration measurement
`system with a selectable measurement range of ±2 g, ±4 g, ±8 g,
`or ±16 g. It measures both dynamic acceleration resulting from
`motion or shock and static acceleration, such as gravity, that
`allows the device to be used as a tilt sensor.
`The sensor is a polysilicon surface-micromachined structure
`built on top of a silicon wafer. Polysilicon springs suspend the
`structure over the surface of the wafer and provide a resistance
`against forces due to applied acceleration.
`Deflection of the structure is measured using differential capacitors
`that consist of independent fixed plates and plates attached to the
`moving mass. Acceleration deflects the proof mass and unbalances
`the differential capacitor, resulting in a sensor output whose ampli-
`tude is proportional to acceleration. Phase-sensitive demodulation
`is used to determine the magnitude and polarity of the acceleration.
`
`ADXL345
`
`POWER SEQUENCING
`Power can be applied to VS or VDD I/O in any sequence without
`damaging the ADXL345. All possible power-on modes are
`summarized in Table 6. The interface voltage level is set with
`the interface supply voltage, VDD I/O, which must be present to
`ensure that the ADXL345 does not create a conflict on the
`communication bus. For single-supply operation, VDD I/O can be
`the same as the main supply, VS. In a dual-supply application,
`however, VDD I/O can differ from VS to accommodate the desired
`interface voltage, as long as VS is greater than or equal to VDD I/O.
`After VS is applied, the device enters standby mode, where power
`consumption is minimized and the device waits for VDD I/O to be
`applied and for the command to enter measurement mode to be
`received. (This command can be initiated by setting the measure
`bit (Bit D3) in the POWER_CTL register (Address 0x2D).) In
`addition, while the device is in standby mode, any register can be
`written to or read from to configure the part. It is recommended
`to configure the device in standby mode and then to enable
`measurement mode. Clearing the measure bit returns the
`device to the standby mode.
`
`
`
`
`Table 6. Power Sequencing
`DD I/O Description
`Condition
`VS V
`Power Off
`Off Off
`The device is completely off, but there is a potential for a communication bus conflict.
`Bus Disabled
`On Off
`The device is on in standby mode, but communication is unavailable and creates a conflict on
`the communication bus. The duration of this state should be minimized during power-up to
`prevent a conflict.
`No functions are available, but the device does not create a conflict on the communication bus.
`At power-up, the device is in standby mode, awaiting a command to enter measurement
`mode, and all sensor functions are off. After the device is instructed to enter measurement
`mode, all sensor functions are available.
`
`Off On
`Bus Enabled
`Standby or Measurement On On
`
`Rev. C | Page 13 of 40
`
`Petitioner Samsung Ex-1056, 0013
`
`

`

`
`
`Table 8. Typical Current Consumption vs. Data Rate,
`Low Power Mode (TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)
`Output Data
`Rate (Hz)
`400
`200
`100
`50
`25
`12.5
`
`Rate Code
`1100
`1011
`1010
`1001
`1000
`0111
`
`IDD (μA)
`90
`60
`50
`45
`40
`34
`
`Bandwidth (Hz)
`200
`100
`50
`25
`12.5
`6.25
`
`Auto Sleep Mode
`Additional power can be saved if the ADXL345 automatically
`switches to sleep mode during periods of inactivity. To enable
`this feature, set the THRESH_INACT register (Address 0x25)
`and the TIME_INACT register (Address 0x26) each to a value
`that signifies inactivity (the appropriate value depends on the
`application), and then set the AUTO_SLEEP bit (Bit D4) and the
`link bit (Bit D5) in the POWER_CTL register (Address 0x2D).
`Current consumption at the sub-12.5 Hz data rates that are
`used in this mode is typically 23 μA for a VS of 2.5 V.
`Standby Mode
`For even lower power operation, standby mode can be used. In
`standby mode, current consumption is reduced to 0.1 μA (typical).
`In this mode, no measurements are made. Standby mode is
`entered by clearing the measure bit (Bit D3) in the POWER_CTL
`register (Address 0x2D). Placing the device into standby mode
`preserves the contents of FIFO.
`
`
`ADXL345
`
`
`POWER SAVINGS
`Power Modes
`The ADXL345 automatically modulates its power consumption
`in proportion to its output data rate, as outlined in Table 7. If
`additional power savings is desired, a lower power mode is
`available. In this mode, the internal sampling rate is reduced,
`allowing for power savings in the 12.5 Hz to 400 Hz data rate
`range at the expense of slightly greater noise. To enter low power
`mode, set the LOW_POWER bit (Bit 4) in the BW_RATE register
`(Address 0x2C). The current consumption in low power mode
`is shown in Table 8 for cases where there is an advantage to
`using low power mode. Use of low power mode for a data rate
`not shown in Table 8 does not provide any advantage over the same
`data rate in normal power mode. Therefore, it is recommended
`that only data rates shown in Table 8 are used in low power mode.
`The current consumption values shown in Table 7 and Table 8
`are for a VS of 2.5 V.
`
`Table 7. Typical Current Consumption vs. Data Rate
`(TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)
`Output Data
`Rate (Hz)
`3200
`1600
`800
`400
`200
`100
`50
`25
`12.5
`6 25
`3.13
`1 56
`0.78
`0 39
`0 20
`0.10
`
`
`Rate Code
`1111
`1110
`1101
`1100
`1011
`1010
`1001
`1000
`0111
`0110
`0101
`0100
`0011
`0010
`0001
`0000
`
`IDD (μA)
`140
`90
`140
`140
`140
`140
`90
`60
`50
`45
`40
`34
`23
`23
`23
`23
`
`Bandwidth (Hz)
`1600
`800
`400
`200
`100
`50
`25
`12.5
`6.25
`3.13
`1.56
`0.78
`0.39
`0.20
`0.10
`0.05
`
`Rev. C | Page 14 of 40
`
`Petitioner Samsung Ex-1056, 0014
`
`

`

`ADXL345
`
`To read or write multiple bytes in a single transmission, the
`multiple-byte bit, located after the R/W bit in the first byte transfer
`(MB in
` to
`), must be set. After the register
`Figure 37
`Figure 39
`addressing and the first byte of data, each subsequent set of
`clock pulses (eight clock pulses) causes the ADXL345 to point
`to the next register for a read or write. This shifting continues
`CS is deasserted. To perform reads