IEEE Std 802.11g™-2003
`(Amendment to IEEE Std 802.11™, 1999 Edition (Reaff 2003)
`as amended by
`IEEE Stds 802.11a™-1999, 802.11b™-1999,
`802.11b™-1999/Cor 1-2001, and 802.11d™-2001)
`
`802.11gTM
`
`IEEE Standard for
`Information technology—
`
`Telecommunications and information
`exchange between systems—
`
`Local and metropolitan area networks—
`
`Specific requirements
`
`Part 11: Wireless LAN Medium Access Control
`(MAC) and Physical Layer (PHY) specifications
`
`Amendment 4: Further Higher Data Rate Extension
`in the 2.4 GHz Band
`
`IEEE Computer Society
`
`Sponsored by the
`LAN/MAN Standards Committee
`
`This amendment is an approved IEEE
`Standard. It will be incorporated into the
`base standard in a future edition.
`
`IEEE Standards
`IEEE Standards
`
`Published by
`The Institute of Electrical and Electronics Engineers, Inc.
`3 Park Avenue, New York, NY 10016-5997, USA
`
`27 June 2003
`
`Print: SH95134
`PDF: SS95134
`
`Authorized licensed use limited to:
`
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`
`DELL
`EXHIBIT 1019 - PAGE 1
`
`

`

`IEEE Std 802.11g(cid:153)-2003
`[Amendment to IEEE Std 802.11TM, 1999 Edition (Reaff 2003)
`as amended by
`IEEE Stds 802.11aTM-1999, 802.11bTM-1999,
`802.11bTM-1999/Cor 1-2001, and 802.11dTM-2001]
`
`IEEE Standard for
`Information technology(cid:151)
`Telecommunications and information exchange
`between systems(cid:151)
`Local and metropolitan area networks(cid:151)
`Specific requirements
`Part 11: Wireless LAN Medium Access
`Control (MAC) and Physical Layer (PHY)
`specifications
`Amendment 4: Further Higher Data Rate
`Extension in the 2.4 GHz Band
`
`Sponsor
`LAN/MAN Standards Committee
`of the
`IEEE Computer Society
`
`Approved 12 June 2003
`IEEE-SA Standards Board
`
`Abstract: Changes and additions to IEEE Std 802.11, 1999 Edition, as amended by IEEE Stds
`802.11a-1999, 802.11b-1999, 802.11b-1999/Cor 1-2001, and 802.11d-2001, are provided to sup-
`port the further higher data rate extension for operation in the 2.4 GHz band.
`Keywords: LAN, local area network, radio frequency, wireless
`
`The Institute of Electrical and Electronics Engineers, Inc.
`3 Park Avenue, New York, NY 10016-5997, USA
`
`Copyright ' 2003 by the Institute of Electrical and Electronics Engineers, Inc.
`All rights reserved. Published 25 June 2003. Printed in the United States of America.
`
`IEEE and 802 are registered trademarks in the U.S. Patent & Trademark Office, owned by the Institute of Electrical and
`Electronics Engineers, Incorporated.
`
`Print:
`PDF:
`
`ISBN 0-7381-3700-6 SH95134
`ISBN 0-7381-3701-4 SS95134
`
`No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior
`written permission of the publisher.
`
`Authorized licensed use limited to:
`
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`
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`EXHIBIT 1019 - PAGE 2
`
`

`

`IEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Stan-
`dards Association (IEEE-SA) Standards Board. The IEEE develops its standards through a consensus development process, approved
`by the American National Standards Institute, which brings together volunteers representing varied viewpoints and interests to achieve
`the final product. Volunteers are not necessarily members of the Institute and serve without compensation. While the IEEE administers
`the process and establishes rules to promote fairness in the consensus development process, the IEEE does not independently evaluate,
`test, or verify the accuracy of any of the information contained in its standards.
`
`Use of an IEEE Standard is wholly voluntary. The IEEE disclaims liability for any personal injury, property or other damage, of any
`nature whatsoever, whether special, indirect, consequential, or compensatory, directly or indirectly resulting from the publication, use
`of, or reliance upon this, or any other IEEE Standard document.
`
`The IEEE does not warrant or represent the accuracy or content of the material contained herein, and expressly disclaims any express or
`implied warranty, including any implied warranty of merchantability or fitness for a specific purpose, or that the use of the material
`contained herein is free from patent infringement. IEEE Standards documents are supplied (cid:147)AS IS.(cid:148)
`
`The existence of an IEEE Standard does not imply that there are no other ways to produce, test, measure, purchase, market, or provide
`other goods and services related to the scope of the IEEE Standard. Furthermore, the viewpoint expressed at the time a standard is
`approved and issued is subject to change brought about through developments in the state of the art and comments received from users
`of the standard. Every IEEE Standard is subjected to review at least every five years for revision or reaffirmation. When a document is
`more than five years old and has not been reaffirmed, it is reasonable to conclude that its contents, although still of some value, do not
`wholly reflect the present state of the art. Users are cautioned to check to determine that they have the latest edition of any IEEE Stan-
`dard.
`
`In publishing and making this document available, the IEEE is not suggesting or rendering professional or other services for, or on
`behalf of, any person or entity. Nor is the IEEE undertaking to perform any duty owed by any other person or entity to another. Any per-
`son utilizing this, and any other IEEE Standards document, should rely upon the advice of a competent professional in determining the
`exercise of reasonable care in any given circumstances.
`
`Interpretations: Occasionally questions may arise regarding the meaning of portions of standards as they relate to specific applications.
`When the need for interpretations is brought to the attention of IEEE, the Institute will initiate action to prepare appropriate responses.
`Since IEEE Standards represent a consensus of concerned interests, it is important to ensure that any interpretation has also received the
`concurrence of a balance of interests. For this reason, IEEE and the members of its societies and Standards Coordinating Committees
`are not able to provide an instant response to interpretation requests except in those cases where the matter has previously received for-
`mal consideration.
`
`Comments for revision of IEEE Standards are welcome from any interested party, regardless of membership affiliation with IEEE. Sug-
`gestions for changes in documents should be in the form of a proposed change of text, together with appropriate supporting comments.
`Comments on standards and requests for interpretations should be addressed to:
`
`Secretary, IEEE-SA Standards Board
`445 Hoes Lane
`P.O. Box 1331
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`USA
`
`Note: Attention is called to the possibility that implementation of this standard may require use of subject matter covered
`by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent
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`Department.
`
`Authorization to photocopy portions of any individual standard for internal or personal use is granted by the Institute of Electrical and
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`EXHIBIT 1019 - PAGE 3
`
`

`

`Introduction
`
`This introduction is not part of IEEE Std 802.11g-2003 (Amendment to IEEE Std 802.11, 1999 Edition,
`as amended by IEEE Stds 802.11a-1999, 802.11b-1999, 802.11b-1999/Cor 1-2001, and 802.11d-2001),
`IEEE Standard for Information Technology(cid:151)Telecommunications and Information Exchange between
`Systems(cid:151)Local and Metropolitan Area Networks(cid:151)Specific Requirements(cid:151)Part 11: Wireless LAN Me-
`dium Access Control (MAC) and Physical Layer (PHY) specifications(cid:151)Amendment 4: Further Higher
`Data Rate Extension in the 2.4 GHz Band.
`
`This amendment is part of a family of standards for local and metropolitan area networks. The relationship
`between the standard and other members of the family is shown below. (The numbers in the figure refer to
`IEEE standard designations.1)
`
`.
`
`802.2 LOGICAL LINK
`
`802.1 BRIDGING
`
`DATA
`LINK
`LAYER
`
`802.3
`MEDIUM
`ACCESS
`
`802.5
`MEDIUM
`ACCESS
`
`802.11
`MEDIUM
`ACCESS
`
`802.15
`MEDIUM
`ACCESS
`
`802.16
`MEDIUM
`ACCESS
`
`802.3
`PHYSICAL
`
`802.5
`PHYSICAL
`
`802.11
`PHYSICAL
`
`802.15
`PHYSICAL
`
`802.16
`PHYSICAL
`
`PHYSICAL
`LAYER
`
`802.1 MANAGEMENT
`
`802 OVERVIEW & ARCHITECTURE*
`
`SECURITY
`
`802.10
`
`* Formerly IEEE Std 802.1A.
`
`This family of standards deals with the Physical and Data Link layers as defined by the International
`Organization for Standardization (ISO) Open Systems Interconnection (OSI) Basic Reference Model (ISO/
`IEC 7498-1: 1994). The access standards define five types of medium access technologies and associated
`physical media, each appropriate for particular applications or system objectives. Some access standards
`have been withdrawn and other types are under investigation.
`
`The standards defining the technologies noted above are as follows:
`
`(cid:149) IEEE Std 802:2
`
`(cid:149) IEEE Std 802.1B(cid:153)
`and 802.1k(cid:153)
`[ISO/IEC 15802-2]
`
`(cid:149) IEEE Std 802.1D(cid:153)
`
`Overview and Architecture. This standard provides an overview to the family of
`IEEE 802 Standards.
`LAN/MAN Management. Defines an OSI management-compatible architecture
`and services and protocol elements for use in a LAN/MAN environment for
`performing remote management.
`
`Media Access Control (MAC) Bridges. Specifies an architecture and protocol
`for the interconnection of IEEE 802 LANs below the MAC service boundary.
`
`1The IEEE standard designations referred to in the above figure and list are trademarks owned by the Institute of Electrical and
`Electronics Engineers, Incorporated.
`2The IEEE 802 Overview and Architecture Specification, originally known as IEEE Std 802.1A, has been renumbered as IEEE Std 802.
`This has been done to accommodate recognition of the base standard in a family of standards. References to IEEE Std 802.1A should be
`considered as references to IEEE Std 802.
`
`Copyright ' 2003 IEEE. All rights reserved.
`
`iii
`
`Authorized licensed use limited to:
`
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`EXHIBIT 1019 - PAGE 4
`
`

`

`(cid:149) IEEE Std 802.1E(cid:153)
`[ISO/IEC 15802-4]
`
`System Load Protocol. Specifies a set of services and protocol for those aspects
`those aspects of management concerned with the loading of systems on IEEE
`802 LANs.
`
`(cid:149) IEEE Std 802.1F(cid:153)
`
`Common Definitions and Procedures for IEEE 802 Management Information.
`
`(cid:149) IEEE Std 802.1G(cid:153)
`[ISO/IEC 15802-5]:
`
`Remote Media Access Control (MAC) Bridging. Specifies extensions for the
`interconnection, using non-LAN systems communication technologies, of
`geographically separated IEEE 802 LANs below the level of the logical link
`control protocol.
`
`(cid:149) IEEE Std 802.1H(cid:153)
`[ISO/IEC TR 11802-5]
`
`Recommended Practice for Media Access Control (MAC) Bridging of Ethernet
`V2.0 in IEEE 802 Local Area Networks.
`
`(cid:149) IEEE Std 802.1Q(cid:153)
`
`Virtual Bridged Local Area Networks. Defines an architecture for Virtual
`Bridged LANs, the services provided in Virtual Bridged LANs, and the proto-
`cols and algorithms involved in the provision of those services.
`
`(cid:149) IEEE Std 802.2
`[ISO/IEC 8802-2]
`
`Logical Link Control.
`
`(cid:149) IEEE Std 802.3
`
`CSMA/CD Access Method and Physical Layer Specifications.
`
`(cid:149) IEEE Std 802.5
`[ISO/IEC 8802-5]
`
`(cid:149) IEEE Std 802.10
`
`Token Ring Access Method and Physical Layer Specifications.
`
`Standard for Interoperable LAN Security (SILS). Currently approved: Secure
`Data Exchange (SDE).
`
`(cid:149) IEEE Std 802.11
`[ISO/IEC 8802-11]
`
`Wireless LAN Medium Access Control (MAC) Sublayer and Physical Layer
`Specifications.
`
`(cid:149) IEEE Std 802.15
`
`Wireless Medium Access Control (MAC) and Physical Layer (PHY)
`Specifications for: Wireless Personal Area Networks.
`
`(cid:149) IEEE Std 802.16
`
`Air Interface for Fixed Broadband Wireless Access Systems.
`
`The reader of this standard is urged to become familiar with the complete family of standards.
`
`iv
`
`Copyright ' 2003 IEEE. All rights reserved.
`
`Authorized licensed use limited to:
`
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`
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`EXHIBIT 1019 - PAGE 5
`
`

`

`Participants
`
`When the IEEE 802.11 Working Group approved this standard, it had the following membership:
`
`Stuart J. Kerry, Chair
`Al Petrick and Harry Worstell, Vice-Chairs
`Tim Godfrey, Secretary
`Brian Mathews, Publicity Standing Committee
`Teik-Kheong Tan, Wireless Next-Generation Standing Committee
`
`John Fakatselis, Chair Task Group e
`Duncan Kitchin, Vice-Chair Task Group e
`David Bagby, Chair Task Group f
`Mika Kasslin, Chair Task Group h
`David Halasz, Chair Task Group i
`
`When the IEEE 802.11 Working Group approved this standard, the Task Group G had the following
`membership:
`
`Matthew B. Shoemake, Chair
`John Terry, Vice-Chair
`Carl F. Andren, Technical Editor
`Kevin Smart, Secretary
`Bong-Rak Choi
`Sunghyun Choi
`Ken Clements
`John T. Coffey
`Terry Cole
`Paul Congdon
`Craig Conkling
`Todor Cooklev
`Thomas P. Costas
`Wm. Caldwell Crosswy
`Peter Dahl
`Barry Davis
`Rolf De Vegt
`Javier del Prado
`Michael Derby
`Georg Dickmann
`Wim Diepstraten
`Roger Durand
`Eryk Dutkiewicz
`Mary DuVal
`Donald E. Eastlake III
`Dennis Eaton
`Peter Ecclesine
`Jon Edney
`Christoph Euscher
`John Fakatselis
`Lars Falk
`Augustin J. Farrugia
`Weishi Feng
`Norm Finn
`Matthew James Fischer
`Kenji Fujisawa
`Marcus Gahler
`James Gardner
`Atul Garg
`Al Garrett
`Vafa Ghazi
`Tim Godfrey
`Wataru Gohda
`
`Peter Goidas
`Alex Gorokhov
`Rik Graulus
`Evan Green
`Larry Green
`Patrick Green
`Kerry Greer
`Daqing Gu
`Srikanth Gummadi
`Fred Haisch
`David Halasz
`Steve D. Halford
`Mark Hamilton
`Christopher J. Hansen
`Yasuo Harada
`Amer A. Hassan
`Kevin Hayes
`Victor Hayes
`Chris Heegard
`Robert Heile
`Garth Hillman
`Christopher Hinsz
`Jun Hirano
`Mikael Hjelm
`Jin-Meng Ho
`Maarten Hoeben
`Michael Hoghooghi
`Allen Hollister
`Srinath Hosur
`Russell Housley
`Frank P Howley, Jr.
`Dave Hudak
`John Hughes
`David Hunter
`David Hytha
`Hiroshi IdeDaichi Imamura
`Yasuhiko Inoue
`Katsumi Ishii
`Eric Jacobsen
`
`Tomoko Adachi
`Areg Alimian
`Richard Allen
`Keith Amann
`Merwyn Andrade
`Butch Anton
`Mitch Aramaki
`Takashi Aramaki
`Larry Arnett
`Geert A. Awater
`Floyd Backes
`David Bagby
`Jay Bain
`Dennis J. Baker
`Bala Balachander
`Raja Banerjea
`Boyd Bangerter
`Simon Barber
`Gil Bar-Noy
`John Barr
`Kevin M. Barry
`Anuj Batra
`Tomer Bentzion
`Mathilde Benveniste
`Simon Black
`Jan Boer
`Jim Brennan
`Ronald Brockmann
`Alistair G. Buttar
`Nancy Cam-Winget
`Bill Carney
`Pat Carson
`Clint Chaplin
`Hung-Kun Chen
`Yi-Ming Chen
`Greg Chesson
`Alan Chickinsky
`Aik Chindapol
`Leigh M. Chinitz
`
`Copyright ' 2003 IEEE. All rights reserved.
`
`v
`
`Authorized licensed use limited to:
`
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`DELL
`EXHIBIT 1019 - PAGE 6
`
`

`

`Marc Jalfon
`Peter Johansson
`David Johnston
`V. K. Jones
`Bobby Jose
`Daryl Kaiser
`Srinivas Kandala
`Jeyhan Karaoguz
`Kevin Karcz
`Mika Kasslin
`Patrick Kelly
`Stuart J. Kerry
`Andrew K. Khieu
`Jamshid Khun-Jush
`Ryoji Kido
`Dukhyun Kim
`Edward Kim
`Je Woo Kim
`Joonsuk Kim
`Ziv Kimhi
`Duncan Kitchin
`G(cid:252)nter Kleindl
`Cees Klik
`David Kline
`John M. Kowalski
`Bruce P. Kraemer
`Thomas Kuehnel
`Denis Kuwahara
`Joe KwakPaul A. Lambert
`David S. Landeta
`Jim Lansford
`Colin Lanzl
`Kim Laraqui
`Jon LaRosa
`David J. Leach, Jr.
`Dongjun Lee
`Richard van Leeuwen
`Martin Lefkowitz
`Uriel Lemberger
`Onno Letanche
`Mike Lewis
`Sheung Li
`Jie Liang
`Isaac Lim Wei Lih
`Huashih A. Lin
`Shawn Liu
`Titus Lo
`Peter Loc
`Ralph Lombardo, Jr.
`Luke Ludeman
`Yeong-Chang Maa
`Akira Maeki
`Douglas Makishima
`Mahalingam Mani
`Roger Marks
`Brian Mathews
`Jo-Ellen F Mathews
`Mark Mathews
`Thomas Maufer
`Conrad Maxwell
`Justin McCann
`Kelly McClellan
`Gary McCoy
`Bill McFarland
`Gary McGarr
`Bill McIntosh
`Jorge Medina
`Mehul Mehta
`Pratik Mehta
`
`
`Robert C. Meier
`Graham Melville
`Klaus Meyer
`Robert Miller
`Partho Mishra
`Yasuhiko Mizoguchi
`Leo Monteban
`Michael Montemurro
`Tim Moore
`Mike Moreton
`Roy Morris
`Robert Moskowitz
`Oliver Muelhens
`Peter Murphy
`Peter Murray
`Andrew Myles
`Ravi Narasimhan
`Kevin Negus
`David B. Nelson
`Dan Nemits
`Chiu Ngo
`Qiang Ni
`Gunnar Nitsche
`Erwin R. Noble
`Hiroshi Nomura
`Tzvetan D. Novkov
`Ivan Oakes
`Bob O(cid:146)Hara
`Yoshihiro Ohtani
`Kazuhiro Okanoue
`Lior Ophir
`Richard H. Paine
`Mike Paljug
`Vijay M. Patel
`Lizy Paul
`Sebastien Perrot
`Al Petrick
`James Portaro
`Al Potter
`Mike Press
`Ron Provencio
`Henry Ptasinski
`Raad Raad
`Ali Raissinia
`Murali Ramadoss
`Noman Rangwala
`Ivan Reede
`Stanley A. Reible
`Danny Rettig
`Edward Reuss
`Bill Rhyne
`Jim Richards
`David Richkas
`Maximilian Riegel
`Carlos A. Rios
`Benno Ritter
`Kent G. Rollins
`Stefan Rommer
`Jon Rosdahl
`Pejman Roshan
`Reinhard Ruckriem
`Ali Sadri
`Kenichi Sakusabe
`Antonio Salloum Salazar
`John H. Santhoff
`Anil K. Sanwalka
`Sid Schrum
`Erik Schylander
`Michael Seals
`Joe Sensendorf
`
`Yangmin Shen
`Matthew Sherman
`William Shvodian
`David Skellern
`Donald I. Sloan
`Andrew Smith
`Dave Smith
`Yoram Solomon
`Wei-Jei Song
`Amjad Soomro
`Gary Spiess
`Dorothy V. Stanley
`Adrian Stephens
`Carl R. Stevenson
`Paul F Struhsaker
`Michael Su
`Masahiro Takagi
`Minoru Takemoto
`Pek-Yew Tan
`Teik-Kheong Tan
`Takuma Tanimoto
`Roger Teague
`Carl Temme
`Yossi Texerman
`Jerry A. Thrasher
`James D. Tomcik
`Walt Trzaskus
`Allen Tsai
`Chih C. Tsien
`Tom Tsoulogiannis
`Toru Ueda
`Naoki Urano
`Niels Van Erven
`Wim J. van Houtum
`Richard van Nee
`Patrick Vandenameele
`Dmitri Varsanofiev
`Jagannatha L. Venkatesha
`Madan Venugopal
`Nanci Vogtli
`Dennis Volpano
`Toan X. Vu
`Tim Wakeley
`Jesse R. Walker
`Brad Wallace
`Thierry Walrant
`Christopher Ware
`Fujio Watanabe
`Mark Webster
`Menzo Wentink
`Robert Whelan
`Michael Wilhoyte
`Richard G.C. Williams
`Steven D. Williams
`Timothy G. Wong
`Harry Worstell
`Charles R. Wright
`Micheal Wright
`Liwen Wu
`Yang Xiao
`Shugong Xu
`Jung Yee
`Kit Yong
`Albert Young
`Heejung Yu
`Patrick Yu
`Glen Zorn
`Arnoud Zwemmer
`Jim Zyren
`
`vi
`
`Copyright ' 2003 IEEE. All rights reserved.
`
`Authorized licensed use limited to:
`
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`EXHIBIT 1019 - PAGE 7
`
`

`

`The following members of the balloting committee voted on this standard. Balloters may have voted for
`approval, disapproval, or abstention.
`Butch Anton
`Eladio Arvelo
`David Bagby
`John Barnett
`John Barr
`Jan Boer
`Mitchell Buchman
`Kimara Chin
`Keith Chow
`Terry Cole
`Michael Coletta
`Todor Cooklev
`Todd Cooper
`Guru Dutt Dhingra
`Thomas Dineen
`Sourav Dutta
`Peter Ecclesine
`Darrell Fletcher
`Keng Fong
`Avraham Freedman
`Michele Gammel
`Andrew Germano
`James Gilb
`Tim Godfrey
`Rajugopal Gubbi
`Qiang Guo
`
`Satoshi Oyama
`Sebastien Perrot
`Ian Perryman
`Subbu Ponnuswamy
`Hugo Pues
`Vikram Punj
`Charles Rice
`Maximilian Riegel
`Jon Rosdahl
`Douglas Sanderson
`Michael Seals
`Stephen Shellhammer
`Matthew Sherman
`Neil Shipp
`Gil Shultz
`Kevin Smart
`Amjad Soomro
`Minoru Takemoto
`Jerry A. Thrasher
`Dmitri Varsanofiev
`Hung-yu Wei
`Edward Woodrow
`Harry Worstell
`Jung Yee
`Oren Yuen
`Arnoud Zwemmer
`
`Victor Hayes
`Gerald Heller
`Srinivas Kandala
`Stuart J. Kerry
`Thomas A. Kim
`Yongsuk Kim
`John M. Kowalski
`Pi-Cheng Law
`Amir Leshem
`Daniel Levesque
`Sheung Li
`Jeb Linton
`Kyle Maus
`Michael McInnis
`George Miao
`Apurva Mody
`Leo Monteban
`Mike Moreton
`Andrew Myles
`Charles Ngethe
`Paul Nikolich
`Erwin R. Noble
`Ellis Nolley
`Timothy O(cid:146)Farrell
`Bob O(cid:146)Hara
`
`When the IEEE-SA Standards Board approved this standard on 12 June 2003, it had the following
`membership:
`
`Don Wright, Chair
`Howard M. Frazier, Vice Chair
`Judith Gorman, Secretary
`
`H. Stephen Berger
`Joe Bruder
`Bob Davis
`Richard DeBlasio
`Julian Forster*
`Toshio Fukuda
`Arnold M. Greenspan
`Raymond Hapeman
`
`*Member Emeritus
`
`Donald M. Heirman
`Laura Hitchcock
`Richard H. Hulett
`Anant Jain
`Lowell G. Johnson
`Joseph L. Koepfinger*
`Tom McGean
`Steve Mills
`
`Daleep C. Mohla
`William J. Moylan
`Paul Nikolich
`Gary Robinson
`Malcolm V. Thaden
`Geoffrey O. Thompson
`Doug Topping
`Howard L. Wolfman
`
`Also included are the following nonvoting IEEE-SA Standards Board liaisons:
`
`Alan Cookson, NIST Representative
`Satish K. Aggarwal, NRC Representative
`
`Michelle Turner
`IEEE Standards Project Editor
`
`Copyright ' 2003 IEEE. All rights reserved.
`
`vii
`
`Authorized licensed use limited to:
`
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`DELL
`EXHIBIT 1019 - PAGE 8
`
`

`

`CONTENTS
`
`3.
`
`4.
`
`7.
`
`Definitions ........................................................................................................................................... 2
`
`Abbreviations and acronyms ............................................................................................................... 2
`
`Frame formats ...................................................................................................................................... 2
`
`7.2 Format of individual frame types................................................................................................. 2
`7.2.1 Control frames ................................................................................................................. 2
`7.2.1.2 CTS frame format ............................................................................................ 2
`7.2.3 Management frames......................................................................................................... 2
`7.2.3.1 Beacon frame format ....................................................................................... 3
`7.2.3.4 Association Request frame format................................................................... 3
`7.2.3.5 Association Response frame format ................................................................ 4
`7.2.3.6 Reassociation Request frame format ............................................................... 4
`7.2.3.7 Reassociation Response frame format............................................................. 4
`7.2.3.8
`Probe Request frame format ............................................................................ 5
`7.2.3.9
`Probe Response frame format.......................................................................... 5
`7.3 Management frame body components......................................................................................... 6
`7.3.1 Fixed fields ...................................................................................................................... 6
`7.3.1.4 Capability Information field ............................................................................ 6
`7.3.1.9
`Status code field............................................................................................... 8
`Information elements ....................................................................................................... 8
`7.3.2.2
`Supported Rates element ................................................................................. 8
`7.3.2.13 ERP Information element ................................................................................ 9
`7.3.2.14 Extended Supported Rates element ............................................................... 10
`
`7.3.2
`
`9. MAC sublayer functional description................................................................................................ 11
`
`9.2 DCF............................................................................................................................................ 11
`9.2.11 NAV distribution ........................................................................................................... 11
`9.2.12 Determination of PLME aCWmin characteristics ......................................................... 11
`9.6 Multirate support........................................................................................................................ 12
`9.7 Frame exchange sequences........................................................................................................ 13
`9.10 Protection mechanism................................................................................................................ 13
`
`10.
`
`Layer management............................................................................................................................. 14
`
`10.4 PLME SAP interface ................................................................................................................. 14
`10.4.4 PLME-DSSSTESTMODE............................................................................................. 14
`10.4.4.2 PLME-DSSSTESTMODE.request ................................................................ 14
`
`18.
`
`High Rate direct sequence spread spectrum (HR/DSSS) PHY specification.................................... 14
`
`18.2 High Rate PLCP sublayer .......................................................................................................... 14
`18.2.2 PPDU format.................................................................................................................. 14
`18.2.2.2 Short PPDU format (optional) ....................................................................... 14
`
`viii
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`EXHIBIT 1019 - PAGE 9
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`19.
`
`Extended Rate PHY specification...................................................................................................... 15
`
`19.1 Overview.................................................................................................................................... 15
`19.1.1 Introduction.................................................................................................................... 15
`19.1.2 Operational modes ......................................................................................................... 15
`19.1.3 Scope.............................................................................................................................. 16
`19.1.4 Extended Rate PHY functions ....................................................................................... 16
`19.2 PHY specific service parameter list........................................................................................... 17
`19.3 Extended Rate PLCP sublayer................................................................................................... 18
`19.3.1 Introduction.................................................................................................................... 18
`19.3.2 PPDU format.................................................................................................................. 18
`19.3.2.1 Long preamble PPDU format ........................................................................ 19
`19.3.2.1.1 ERP PLCP length field calculation............................................... 19
`19.3.2.1.2 ERP-PBCC PLCP length (LENGTH) field calculation ............... 19
`19.3.2.2 Short preamble PPDU format ........................................................................ 20
`19.3.2.3 ERP-OFDM PPDU format ............................................................................ 20
`19.3.2.4 DSSS-OFDM long preamble PPDU format .................................................. 21
`19.3.2.4.1 DSSS-OFDM PLCP length field calculation................................ 21
`19.3.2.5 Short DSSS-OFDM PLCP PPDU format...................................................... 22
`19.3.3 PLCP data modulation and rate change......................................................................... 22
`19.3.3.1 Long and short preamble formats .................................................................. 22
`19.3.3.2 ERP-PBCC 22 Mbit/s and 33 Mbit/s formats................................................ 23
`19.3.3.3 ERP-OFDM format........................................................................................ 25
`19.3.3.4 Long & short DSSS-OFDM PLCP format .................................................... 25
`19.3.3.4.1 Overview of the DSSS-OFDM PLCP PSDU encoding process... 26
`19.3.3.4.2 Long sync training sequence definition ........................................ 26
`19.3.3.4.3 OFDM signal field definition ....................................................... 26
`19.3.3.4.4 Data symbol definition.................................................................. 26
`19.3.3.4.5 DSSS-OFDM signal extension ..................................................... 27
`19.3.4 PLCP transmit procedure............................................................................................... 27
`19.3.5 CCA ............................................................................................................................... 27
`19.3.6 PLCP receive procedure ................................................................................................ 27
`19.4 ERP PMD operating specifications (general)............................................................................ 28
`19.4.1 Regulatory requirements................................................................................................ 28
`19.4.2 Operating channel frequencies....................................................................................... 28
`19.4.3 Transmit and receive in-band and out-of-band spurious emissions .............................. 28
`19.4.4 Slot time......................................................................................................................... 28
`19.4.5 SIFS value...................................................................................................................... 28
`19.4.6 CCA performance .......................................................................................................... 28
`19.4.7 PMD transmit specifications.......................................................................................... 29
`19.4.7.1 Transmit power levels.................................................................................... 29
`19.4.7.2 Transmit center frequency tolerance.............................................................. 29
`19.4.7.3 Symbol clock frequency tolerance................................................................. 29
`19.5 ERP operation specifications ..................................................................................................... 29
`19.5.1 Receiver minimum input level sensitivity ..................................................................... 29
`19.5.2 Adjacent channel rejection............................................................................................. 30
`19.5.3 Receive maximum input level capability....................................................................... 30
`19.5.4 Transmit spectral mask .................................................................................................. 30
`19.6 ERP-PBCC operation specifications ......................................................................................... 30
`19.6.1 Receiver minimum input level sensitivity ..................................................................... 30
`19.6.2 Receiver adjacent channel rejection .............................................................................. 30
`
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`19.7 DSSS-OFDM operation specifications...................................................................................... 31
`19.7.1 Overview............................................