`
`Ex.1027
`CISCO SYSTEMS, INC. / Page 1 of 5
`
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`
`
`INTRODUCTION TO
`MULTICHIP MODULES
`
`NAVEED SHERWANI
`intel CCorporation
`
`QIONG YU
`Cadence Design Syst
`
`SANDEEP BADIDA
`Advanced Micro Devices
`
`VV|
`
`A Wiley-interscience Publication
`JOHN WILEY & SONS,
`INC.
`New York/ Chichester! Brisbane/ Toronta/ Singapore
`
`Ex.1027
`CISCO SYSTEMS,INC./ Page 2 of 5
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`Ex.1027
`CISCO SYSTEMS, INC. / Page 2 of 5
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`Ex.1027
`CISCO SYSTEMS,INC./ Page 3 of 5
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`Ex.1027
`CISCO SYSTEMS, INC. / Page 3 of 5
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`SYSTEM, PACKAGING, AND PERFORMANCE
`
`5
`
`FIG. 1.3, Electronic package hierarchy
`
`In the years to come,it is
`microprocessor, which is capable of over 400 MIPS.
`expected that the MIPS rating will give way to BIPS, that is, billions ofinstruc-
`tions per second
`The performanceofan electronic systemis mainly determined by the number
`
`of instructions executed in cach cycle
`and the clock frequency (see Fig. 1.4), As
`shown in Figure 1.4, the numberofinstructions executed per cycle depends on the
`system design, whereas the clock frequency depends on the IC and electronic
`packaging technologies.
`It should be further notedthat, while the performanceis
`a fundamental parameter, it is affected by the architecture andinstruction set,
`Thus a reduced instruction set computer (RISC) system cannot be compared
`easily with a complex instruction set computer (CISC) system, Accordingly,
`performance compansons are only valid within a given system design,
`The performance ofan electronic system can be improved in three ways: by
`increasing the clock frequency. by increasing the nuntber ofinstructions executed
`in one clock cycle, and by increasing the efliciency of the operations that are
`Ex.1027
`CISCO SYSTEMS,INC./ Page 4 of 5
`TSTEE
`
`
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`Ex.1027
`CISCO SYSTEMS, INC. / Page 4 of 5
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`
`
` Multilayer
`
`substrate
`
`Issive Ci
`Far from beir
`
`
`nee computers p
`today's high per
`
`
`
`wnductar chips that
`they
`s as the se
`
`coset
` semiconductor circurt p
`
`TMmMance 1s
`
`continues Lo be impr ed to be IM NANOSeCor
`relentlessly, the computer
`
`
`pon
`of 1.000 is
`of
`the
`
`
`all the
`eg, Thus the
`
`et the
`unction, such asa ¢
`
`
`
`limits on how far computers can evolve, Mul
`
`these linuts drastically, is expected to be thet
`
`future,
`In addition, since this t
`
`
`CocUpy less spa
`électronics and r
`tions
`diy. Asa result, differ
`Multichip module
`
` section, we discuss the di
`MCMs have been de
`
`
`types of MCMs
`
`1.3.1 Substrate Technologies
`MCMsare ge
`
`
`some MCMs are
`« itc-ol
`
`B technology,
` 1efhy
`ViSI techno
`MCM substrate technologie
`
`the substrate and interconnection technolk
`details of
`
`
`
` If a substrate can be programmed by the
`user, it is r
`progractimable MCM (PMCM). Wewill not discuss PMCMs here;
`they
`treated in detail in Chapter [0
`Ex.1027
`CISCO SYSTEMS,INC. / Page 5 of 5
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`Ex.1027
`CISCO SYSTEMS, INC. / Page 5 of 5
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