`
`CONFIGURATIONS FOR
`SOLID STATE MEMORIES
`
`
`
`
`
`JEDEC Standard No.21-C
`
`
`
`Release 7
`
`
`
`| ELECTRONIC INDUSTRIES ASSOCIATION
`
`ENGINEERING DEPARTMENT
`
`
`
`GINE Pag
`o>Boxe
`7
`cS
`
`XILINX EXHIBIT 1013
`Page 1
`
`XILINX EXHIBIT 1013
`Page 1
`
`

`

`NOTICE
`
`EIA/JEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and
`approved through the JEDEC Council level and subsequently reviewed and approved by the ELA General
`Counsel.
`
`EIA/JEDEC Standards and Publications are designed to serve the public interest through eliminating
`misunderstandings between manufacturers and purchases, facilitating interchangeability and improvement
`of products, and assisting the purchaser is selecting and obtaining with minimum delay the proper product
`for his particular need. Existence of such standards shall mot in any respect nreclude any member or
`nonmember of JEDEC from manufacturing or selling products not conforming to such standards, nor shall
`the existence of such standards preclude their voluntary use by those other than ELA members, whether the
`standard is to be used either domestically or internationally.
`
`EIA/JEDEC Standards and Publications are adopted without regard to whether their adoption mayinvolve
`patentsor articles, materials, or processes. By such action, ELA/JEDEC does not assume anyliability to any
`patent owner, nor does it assume any obligation whatever to parties adopting the ELA/JEDEC Standards or
`Publications.
`
`The information included in ELAJEDEC Standards and Publications represents a sound approachto product
`specification and application, principally from the solid state device manufacturer viewpoint. Within the
`JEDECorganization there are procedures whereby an ELA/JEDEC Standard or Publication may be further
`processed and ultimately becomes an ELA Standard.
`
`Inquiries. comments, and suggestions relative to the content of this ELA/JEDEC Standard should be addressed
`to the JEDEC Executive Secretary at EIA Headquarters, 2500 Wilson Boulevard, Arlington, VA 22201.
`
`
`
`
`
`
`
`
`Published by
`
`CELECTRONIC INDUSTRIES ASSOCIATION 1997
`Engineering Department
`2500 Wilson Boulevard
`Arlington. VA 22201
`
`“Copvright" does not apply to JEDEC member companies as theyare free
`to dupiicate this document in accordance with the latest revision of the
`JEDEC Publication 2! "Manual of Organization and Procedure”.
`
`PRICE: Please refer to the current
`Catalog of EIA, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS
`or call Global Engineering Documents, USA and Canada (1-800-854-7179)
`International (303-397-7956)
`
`Printed in U.S.A.
`All rights reserved
`
`
`
`XILINX EXHIBIT 1013
`Page 2
`
`XILINX EXHIBIT 1013
`Page 2
`
`

`

`
`
`
`
`24. Remove P 3.7.7-15/16 Add replacement PP 3.7.7-15/16=Errors corrected
`
`21-C Release 7 Insertion Instructions
`Page — 1
`
`JESD 21-C, Release 7 Insertion Instructions
`instructions for adding Release 7 to JEDEC Standard 21-C.
`Inclosed with this instruction sheet are new and replacement pages for JEDEC Standard 21~C. Those pages which contain
`new material! are labeled “Release 7”at the bottom of the page.
`in some cases, there will be old material on the back of the
`sheet containing a Release 7 page. This old materialwill be labeled Release 1, Release 2, Release 3, Release 4, Release 5. or
`Release6 as there are no changesfrom the original release. All new textis marked by a "Revision Bar’ in the outside margin in
`addition to the "Release 7” label in the inside footerof the page.
`In this release, I have introduced a new feature in the Release #. In the past when an older sheet was replaced with a new one,either to
`makea correction, or to revisethe original sheet, the new release numbersimply replaced the old number, thus loosing theinformation ofthe
`original release number. In this release, the old number will be retained followed by the letter "ce" for correction, or “r’for revised,this
`followed by the new release number (e.f 4c7 or 6r7}
`Thefollowing isa series ofsheetby sheet instructionsto be usedto printthepages forthis release. The instruction numbers correspond
`directly the instructions intended for the holders of the Standard. Theseare also included with the new originals for R-6. These instructions
`should be included as the first pages in Release 6. In the printing instructions, the Release # s are refered to as R#.
`in the following 75 instructions,the material is arranged in 3 columns. Thefirst columntells which sheet to removefrom the
`21-C binder. The second columntells which sheetto add to the binder. The third columngives an explanation of the reasonfor
`the change or addition.
`
`REMOVE
`1. Remove Cover Page
`2,
`RemoveTitle Page;
`3. Remove TOC, &sheets;
`4, Remove PP 2-3/4
`
`ADD
`Add replacement Cover Page
`Add replacernentTitle Page:
`Add replacement TOC, 9 sheets;
`Add replacement PP 2-3/4
`
`REASON
`Contains new Release level and date.
`Contains revision Log for Standard.
`Revised Table of Contents
`New definitions added
`
`5. Remove PP 2-5/6
`6. Remove PP 2-7/8
`7. Remove PP 2-9/10
`8. Remove P 3.5.1-3
`9.
`
`40. Remove P 3.5.2-3
`11. Remove P 3.5.2-9
`12.
`
`Add replacement PP 2-5/6
`Add replacement PP 2-7/8
`Add replacement PP 2-9/10
`Add replacement PP 3.5.1-3/4
`Add new PP 3.5.1-33/34
`
`New material added.
`New material added.
`New standards added
`New standard added
`
`Add replacement P 3.5.23
`Add replacement PP 3.5.2-9/10
`Add new P 3.5.2~11
`
`New standards added
`New devices addedto existing standard.
`New standard
`
`13. Remove P 3.5.3-1
`14. Remove P 3.5.3-3/4
`45. Remove P 3.5.3-5/6
`16. Remove P 3.5.3-7/8
`
`Add replacernent P 3.5.3-1/2
`Add replacement PP 3.5.3-3/4
`Add replacement PP 3.5.3-5/6
`Add replacement P 3.5.3-7/8
`
`17.
`
`18.
`
`19.
`
`20.
`
`Add new P 3.5.3-9/10
`
`Add new P 3.5.3-11/42
`
`Add new P 3.5.3+13/14
`
`Add new P 3.8.3-15
`
`Section re-orgainzed
`New standards added.
`New standard added
`New standards added
`
`New standards added
`
`New standards added
`
`New standards added
`
`New standards added
`
`21. Remove P 3.7.5-1/2
`
`Add replacement PP 3.7.5-1/2
`
`New standards added.
`
`22. Remove P 3.7.5-3/4
`
`Add replacernent PP 3.7.5-3/4
`
`New standards added.
`
`23. Remove P 3.7,.5-25/26
`
`Add replacement PP 3.7.5-25/26
`
`Errors corrected
`
`25. Remove P 3.7.8-3
`
`Add replacementP 3.7.8-3
`
`Existing standard modified.
`
`XILINX EXHIBIT 1013
`Page 3
`
`XILINX EXHIBIT 1013
`Page 3
`
`

`

`
`
`
`
`
`
`XILINX EXHIBIT 1013
`Page 4
`
`XILINX EXHIBIT 1013
`Page 4
`
`

`

`21-C Release 7 Insertion Instructions
`Page ~-2
`
`26.
`
`Remove PP 3.7.8-9/10
`
`Add replacement PP 3.7.8-9/10
`
`New device added.
`
`27.
`
`28.
`
`Remove P 3.9.1-15/16
`
`Add replacement PP 3.9.1-15/16
`
`New standards added.
`
`Add new P 3.7.8~11
`
`New standards added
`
`23.
`
`Remove P 3.9.2-3/4
`
`Add replacement PP 3.9.2~3/4
`
`New standards added.
`
`Remove PP 3.9.2-15/16
`
`Add replacement PP 3.9.2-15/16
`
`Modified drawing of existing standard.
`
`Remove PP 3.9.2--17/18
`
`Add replacement PP 3.9.2-17/18
`
`Add new PP 3.9.2-19
`
`Modified drawing of existing standard
`New standard.
`
`Remove P 3.9.3-11/12
`
`Add replacement P 3.9.3-1142
`
`Remove P 3.9.4—3/4
`
`Add replacement PP 3.9.4—3/4
`
`Standard modified.
`New standards added.
`
`Remove P 3.9,4-13/14
`
`Add replacement PP 3.9.4—13/14
`
`New standards added.
`
`30.
`
`31.
`
`32.
`
`33.
`
`34.
`
`35.
`
`a6.
`
`37.
`
`Remove P 3.9.5-3
`
`Add replacement P 3.9.5~3
`
`New standards added.
`
`38.
`
`Remove P 3.9.5-15/16
`
`Add replacement PP 3.9.5~15/16
`
`New standard added.
`
`39.
`
`40,
`
`41.
`
`42.
`
`Remove P 3.10.3—1/2
`
`Add replacement PP 3.10.3-1/2
`
`New standards added.
`
`Remove P 3.10.3-5/6
`
`Add replacement PP 3.10.2-5/6
`
`Correct error.
`
`Add new PP 3.10.39
`
`New standards added.
`
`Remove PP 3.10.4-3/4
`
`Add replacement PP 3.10.4—3/4
`
`New standards added
`
`New standards added
`
`
`
`43.
`
`44,
`
`45.
`
`46.
`
`Remove PP 3.10.4-17/18
`
`Add replacement PP 3.10.4-17/18
`
`Remove PP 3.10.4~-19/20
`
`Add replacement PP 3.10.4-19/20
`
`New standards added
`
`Add new PP 3.10.4—21
`
`New standards added
`
`Remove P 3.11.2-1
`
`Add replacement P 3.11.2-1
`
`New standard added.
`
`47.
`
`Remove P 3.11.2-3/4
`
`Add replacement PP 3.11.2-3/4
`
`Existing standard modified.
`
`48.
`
`Add new PP 3.11.2-5
`
`New standards added
`
`4g.
`
`Remove P 3.41.3-1
`
`Add replacement P 3.11.3—1
`
`New standard added.
`
`50.
`
`Remove P 3.11.3-3/4
`
`Add replacement PP 3.11.3-3/4
`
`Existing standard modified, new standard added.
`
`51.
`
`Add new PP 3.11.3-5
`
`New standards added
`
`52.
`
`Remove P 3.11.4—1
`
`Add replacement P 3.11.4-1/2
`
`53.
`
`Remove P 3.11.4—3/4
`
`Add replacement PP 3.11.4—3/4
`
`54.
`
`Remove P 3.11.4-5/6
`
`Add replacement PP 3.11.4+5/6
`
`Standards revised.
`
`Standards revised.
`
`Standards revised.
`
`55,
`
`56.
`
`57.
`
`58.
`
`Remove P 3.11.4-7/8
`
`Add replacement PP 3.11.4~—7/8
`
`Standards revised, correct error.
`
`Add new PP 3.11.4-9
`
`New standards added,
`
`Remove PP 3.11.5-7/8
`
`Add replacement PP 3.11.5-7/8
`
`Correct error.
`
`Remove PP 3.11.5-9/10 Add replacement PP 3.11.5-9/10
`
`Terminology corrections.
`
`Section 4 on Modules has been completely re-organized. Remove and discard all of the old
`pages from Section 4 and replace them with the new ones supplied. No sub-dividers are sup-
`plied, but it will enhancethe usability of the section by adding your own dividers. The individual
`sheets are not listed here as they are supplied in correct order for insertion.
`
`XILINX EXHIBIT 1013
`Page 5
`
`XILINX EXHIBIT 1013
`Page 5
`
`

`

`
`
`
`
`
`
`XILINX EXHIBIT 1013
`Page 6
`
`XILINX EXHIBIT 1013
`Page 6
`
`

`

`CONFIGURATIONS FOR
`SOLID STATE MEMORIES
`
`
`
`
`
`
`
`=: ENGINEERING DEPARTMENT
`
`JEDEC Standard No. 21—C
`Release 7
`
`
`
`| ELECTRONIC INDUSTRIES ASSOCIATION
`
`XILINX EXHIBIT 1013
`Page 7
`
`XILINX EXHIBIT 1013
`Page 7
`
`

`

`ii,
`x
`
`
`
`
`
`XILINX EXHIBIT 1013
`Page 8
`
`XILINX EXHIBIT 1013
`Page 8
`
`

`

`4]
`
`CONFIGURATIONS FOR SOLID STATE MEMORIES
`
`Formulated under the cognizance of Committees JC-42.1, PLD devices, JC-42.3,volatile memories, JC-42.4,
`non-volatile memories, and JC-42.5, memory modules and cards, and approved by the JEDEC Council.
`
`Standard 21~C Revision Log.
`
`Release 1, August 1990
`
`Release 2, September 1991
`
`Release 3, November 1992
`
`Release 4, November 1993
`
`Release 5, February 1995
`
`Release 6, January 1996
`
`Release 7, January 1997
`
`Release 7
`
`XILINX EXHIBIT 1013
`Page 9
`
`XILINX EXHIBIT 1013
`Page 9
`
`

`

`
`
`
`
`
`
`
`
`XILINX EXHIBIT 1013
`Page 10
`
`XILINX EXHIBIT 1013
`Page 10
`
`

`

`A
`
`Page #
`Release #
`Section
`1 BACKGROUND 2.0... cee ccc cece cece teen n nen eee eaten aeenarese Releasei ....-.. Page 1-1
`
`Contents
`
`JEDEC Standard No. 21-C
`
`2 TERMS AND DEFINITIONS........- 0020 e cree eee eee reer enc eneeeennees Release 1 ....... Page 2-17
`2.1 Conventional Device Pin Names ......-..-.eseeeeeen cere seweueeens Release 6 ....... Page 2~2
`2.2 Muitiport DRAM Pin Names ........--.01 eee secs eee eee eee n are eeeene Release3 ....... Page 2-5
`2.3 Power Pin NameS 2.0.00... 6c c cece cree teen e cnet tener eeeeentereenee Release 5 ....... Page 2-6
`2.4 Device Type Names ....... 2c cece eee cere ee eee ar nee enna eeaneneunes Release 6 ....... Page 2-7
`2.5 Miscellaneous Device Related Terms .......-------eeeeeeeeeenn rere Release 1 ....... Page 2-9
`2.6 Special Operational Cycles for MPDRAM .......---0seeceeeeeeeneee Release 1°... Page 2-10
`2.7 Package—Related Terms .......0 0. ee eee cence eee e eens eee rene nenneee Release § ..... Page 2-12
`2.8 Memory Card Pin Names ..........0 cece eee eee e eee n eee n ceteris Release 3 ..... Page 2-13
`2.9 SRAM and SSRAM special Pin Names ..-..-....------eereneeeeeeeee Release 6 ....... Page 2-14
`
`3 MEMORY DEVICE STANDARDS........-.02 20 cae ee nec e eee eee e es enteeee Release 1 ......+ Page 3-1
`3.1 General Standards 1.0.2... 0... cc cece cece cere ence cence eeeneneennes Release 1 ...., Page 3.1 -1
`B11 Bytewide .... 0 ccc cece cere e eee eee ee eee ee eeeeesenenaennens Release 1 ..... Page 3.1 -1
`3.1.4.1 - 32K TO 256K BY 8 A/A MX FAMILY IN DIP ..........----. 6006s Release 1 ..... Page 3.1~1
`FIGURE 3.1-1, 32K TO 256K AYA MULTIPLEXED MEMORY INDIP .............5- Release 1 ....... Page 3.1-2
`3.2 Read Only Memory (ROM) ...... 0... cece ener e erect ene eae enn enane Release 1 ...... Page 3.2~1
`3.2.0 ROM General Standards ......0. cee e eee c center e eee eenenennne Release5 ...... Page 3.2-2
`3.2.0.1 — Mask ROM Fast Address Mode Definition eee eee e rt eeeaas Release 5 ...... Page 3.2-2
`3.2.1 ROM, Byte Wide .......... ccc cece eee cee eee cere ea teenie renee Release 1 .... Page 3.2.1-1
`3.2.1.1 — 2K TO 8K BY 8 ROM FAMILY IN DIP, TYPE A ........--2---05) Release t
`.... Page 3.2.1-1
`3.2.1.2 - 4K BY 8 ROMIN DIP, Type B ow... ee ee ete e ees Release 1 .... Page 3.2.1-1
`3.2.1.3 — 8K TO128K BY 8 ROM FAMILY IN DIP... 0... eee eee eee Release i .... Page 3.2.1-1
`3.2.1.4 ~ 2K TO 32K BY 8 ROM FAMILY INRACC 0... eee‘1... Release? .... Page 3.2.11
`3.2.1.5 — 82K TO 512K BY 8 ROM FAMILY IN SOd, ........6-2. 5 eee Release 1 ...: Page 3.2.1~1
`3.2.1.6 — 128K TO iM BY 8 ROM IN DIP, .. 0.66. eee een ees Release t .... Page 3.2.4-1
`3.2.1.7 ~ 64K TO 512K BY 9 ROM IN DIP, .....-.... 0. eee eee aeeeaes Release1 .... Page 3.2.17
`3.2.1.8-—2 TO 64 X 16K BY 8 PAGE SELECT ROMIN DIP, ............-. Release1 .... Page 3.2.1-1
`3.9.1.9-512K and IMBY 8 ROMIN GFP, .......... 0... eee eee Release2 .... Page 3.2.1-1
`FIGURE 3.2.1~-1, 2K TO 8K BY 8ROMIN DIP, TYPESA&B ..... eee eee ees Release t
`.....-.. Page 3.2.1-2
`FIGURE 3.2.1~2, 8K TO 128K BY BROMINDIP 0.0.0... cece er cee eee ee Release i ....... Page 3.2.1-3
`FIGURE 3.2.1-3, 2K TO 32K BY BROMIN CC 20 eer eee Release 1 ....... Page 3.2.1-4
`FIGURE 3.2.1~4, 32K TO 512K BY BROMIN SOU .. 0... eee eee Release 1 ....... Page 3.2.1~5
`FIGURE 3.2.1-5, 128K TO IMBY BROMIN DIP 20.0... 6. cece ee eee eee Release 1 ....... Page 3.2.1-6
`FIGURE 3.2.1-6, 64K TO 512K BY 9 ROMINDIP .. 00.22 eee ee ees Release i ....... Page 3.2.1-7
`FIGURE 3.2.1-7, 2 TO 64 X 16K BY 8 PAGE SELECT ..... 0... 2 eee eee ees Release 1 ......, Page 3.2.1-8
`FIGURE 3.2.1-8, 512K AND MBY 8 ROMINQFP .......... 0.0.2 sere e eee eee Release 2 ....... Page 3.2.1-9
`3.2.2 ROM, Word Wide 2.00.0... 6. e cece eee eee een e nett Release 1 .... Page 3.2.2-1
`3.2.2.1 32K TO 256K BY 16 ROMIN DIP ... 0... eee eee Release 1
`.... Page 3.2.2-3
`3.2.0.9 — 32K TO 256K BY 16 ROM IN SCC .w eee eee Release i
`.... Page 3.2.2-3
`3.2.2.3 -— 16K TO 256K BY 16 ADDRESS/DATA MX ROMIN DIP ......... Release t+ .... Page 3.2.2-3
`3.2.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX ROM IN RCC ........ Release .... Page 3.2.23
`3.2.2.5 —~ 256K and 512K BY 1G ROMINQFP ........... 2.22.22. eee eee Release? .... Page 3.2.2-3
`3.2.2.6~-512K TO 128M BY 16 ROM IN DIP AND SOP ........-----.045 Release6 .... Page 3.2.2-3
`3.2.2.7 -512K and 1M BY 16 ROMIN SCC .... «ieee eee eee Release3 .... Page 3.2.2-3
`FIGURE 3.2.2-1, 32K TO 256K BY 16 ROMINDIP 0... eee eee eee Release 1 ....... Page 3.2.2-5
`FIGURE 9.2.22, 32K TO 256K BY 16 ROMINCO 20 eee ees Release i ....... Page 3,2.2-6
`
`Release 7
`
`XILINX EXHIBIT 1013
`Page 11
`
`XILINX EXHIBIT 1013
`Page 11
`
`

`

`
`
`
`
`
`
`
`
`
`
`JEDEC Standard No. 21-C
`
`Page #
`Release #
`Section
`FIGURE 3.2.2-3, 16K TO 258K BY 16 AQ MX ROMINDIP .......0.00020..00000, Release i ....... Page 3.2.2-7
`FIGURE 3.2.2-4, 16K TO 256K BY 16 AQ MX ROMINGG 20... Releasei ......, Page 3.2.2-8
`FIGURE 3.2.2-5, 256K AND 512K BY 16 ROMINQFP .............00000.00.02. Release2 ....... Page 3.2.2-9
`FIGURE3,2.2-6, 4M TO 128M BY 16 ROMIN DIPAND SOP .......... 00.00 Release2 ...... Page 3.2.2-10
`FIGURE3.2.27, 512K & IMBY 16 ROMINSCO0. eee Release3 ...... Page 3.2.2~11
`FIGURE 3,2.2-8, 512K TO 2M BY 16 ROMINDIPANDSOG 0... ... 0c cee Release6 ...... Page 3.2.2-42
`3.3 Programmable Read Only Memory (PROM) ......-.... 2c cece eee eens Release1 ...... Page 3.3~1
`3.3.1 PROM, Nibble Wide 2.0... ccc cence eee nee eee teen eee Release? .... Page 3.3.1-1
`3.3.1.1 -.25K & 5K BY 4 TTL PROM IN DIP 2.0.2... eee eee Release 1 .... Page 3.3.1-3
`3.3.12—~-.25K BY4 ECL PROMINDIP ............-.-. eee eee Release i .... Page 3.3.1-3
`3.3.1.9-— 1K & 2K BY 4 TTL PROMIN DIP 00... cece eee eee Release 1 .... Page 3.3.1-3
`3.3.1.4—-1K & 2K BY 4 TTL PROMIN SOP ....... cece eee ees Release 1 .... Page 3.3.1~-3
`3.3.1.5 — 4K TO 8K BY 4 TTL PROMIN DIP 2.00... cece ce eee Release2 .... Page 3.3.1-3
`3.3.1.6 — .25K TO 2K BY 4 TTL PROM FAMILY IN RCC ..... 02. Release 1 .... Page 3.3.1-3
`3.3.1.7 — 4K BY 4 TTL PROM, 4K BY 4 TTL RPROM IN SCC ............ Release 1 .... Page 3.3.1-3
`3.3.1.8 — 1K TO 8K TTL BY 4 PROM FAMILY IN RCC ........0...0....-.. Release1 .... Page 3.3.1-3
`3.3.1.9 - 1K TO 8K TTL BY 4 PROM FAMILY IN SCC .. 2... eee eee Heleasei .... Page 3.3.1-3
`3.3.1.10 - 1K TO 4K BY 4 DPROM FAMILIES INDIP& SCC ............ Release 1 .... Page 3.3.14
`3.3.1.11- 1K TO 16K BY 4 ECL PROM FAMILY INDIP .............005. Release 1
`.... Page 3.3.1-4
`FIGURE 3.3.1-1,.25K TO2K BY 4 TTLPROMINDIP .........-... 0 cece eens Release 1 ....... Page 3.3.1-5
`FIGURE 3.3.1~2, 256 BY 4ECL PROMIN DIP ..... 0.06 cae ena erent as Release i ....... Page 3.3,1-6
`FIGURE 3.3.1-3, 1K & 2K BY 4 TTL PROMIN SOG ... cece cee eee Release 1 ....... Page 3.3.1-7
`FIGURE 3.3.1-4, 4K AND 8K BY 4 TTLPROMINDIP ............. 0. eee ee Release 2 ....... Page 3.3.1-8
`FIGURE 3.3.1-5, 25K TO 4K BY 4 TTL PROM FAMILY INCC 0.0... 00... c ceca Release i ....... Page 3.3.1-9
`FIGURE 3.3.1-6, 1K TO 8K BY 4TTL PROMINACC ....eee, Release i ...... Page 3.3.1-10
`FIGURE 3.3.1-7, 1K TO8K BY 4 TIL PROMINSCC 00... eens Release ...... Page 3.3.1-11
`FIGURE 3.3.1-8, IKTO 4K BY 4 TTL DPROMINDIP ........ 0... c cece eee eae Release i ...... Page 3.3.i~12
`FIGURE 3.3.1-9, 1K TO 4K BY 4DPROMINCG ooo cece ees Release i ....., Page3,3.1-13
`FIGURE 3,3,1-10, 1K TO 16K BY 4 ECL PROMINDIP...............-. Vannes Release i ...... Page 3.3.1-14
`3.3.2 PHOM; Bytewide ...... 20... cece cee ere erecta nea eenenenuas Release i .... Page 3.3.2—1
`3.3.2.1 —32 BY 8 TTL PROM IN DIP & SCC ...........ee Release 1 .... Page 3.3.2-3
`3.3.2.2 — 32 BY 8 ECL PROM IN DIP & SCC ....... 20.00... v sess es, Release 1 ,... Page 3.3.2-3
`3.3.2.3 — 25K & 5K BY 8 TTL PROM IN DIP& SCC .................0088 Release1 .... Page 3.3.2-3
`3.3.2.4 ~ .25K TO 8K BY 8 TTL PROM FAMILY IN DIP ............00..8. Release1 .... Page 3.3.2-3
`3.3.2.5 — 5K TO 4K BY 8 TTL LPROM FAMILYIN DIP .........-....0..., Release] .... Page 3.3.2-3
`3.3.2.6 — .5K TO 4K BY 8 TTL RPROM FAMILY IN DIP ........ 0.0. eee Release 1 .... Page 3.3.2~3
`3.3.2.7 — 5K TO 8K BY 8 TTL PROM FAMILIES IN RCC & SCC o.oo... Release i .... Page 3.3.2-3
`3.3.2.8 ~ 5K TO 2K BY 8 TTL RPROM FAMILY iN SCC .............005. Release 1 .... Page 3.3.2-4
`3.3.2.9 — 16K TO 64K BY 8 TTL PROM FAMILY IN DIP ..............46. Release 1 .... Page 3.3.24
`3.3.2.10—- 512 BY 8 ECL RPROMIN DIP& SCC oo. ieee cece eae Release2 .... Page 3.3.24
`FIGURE 3.3.2-1,32 BY 8 TTL&ECLPROMINDIP ........0 0.0... cece eee Release i ......, Page 3.3.2-5
`FIGURE 3.3.2-2, 32, 256, & 512 BY 8 TTL PROM IN CG, 32 BY8 ECLPROMINCC ... Release1 ....... Page 3.3.2-6
`FIGURE 3.3.2-3, 256 & 512 BY 8 TTLPROMINDIP ...0.................0005. Release 1 ....... Page 3.3.2-7
`FIGURE 3.3.24, 25K TO 8K BY 8TTLPROMINDIP 2.0.00... eee eee Release1 ....... Page 3.3.2-8
`FIGURE 3.3.2-5, 5K TO 4K BY8TTLLPROMINDIP 1.2.0.0... 0... eee eee Release i ....... Page 3.3.2-9
`FIGURE 3.3.2-6, 5K TO 4K BY 8 TTL RPROMINDIP .............0.00..00002,. Releasei ...... Page 3.3.2-10
`FIGURE3.3.2-7, 5K TO 8K BYBTTLPROMINSCO ....... 0... Release1 ...... Page 3.3.2-11
`FIGURE 3.3.2-8, 5K TO 8K BY 8TTLPROMINRCC ooo. Release t 1... Page 3.3.2-12
`FIGURE 3.3.2~9, SK TO 2K BY 8 RPROMINCC .0 00. ee Release i ...... Page 3.3.2-13
`FIGURE 3.3.2-10, 16K TO 64K BY 8 TTL PROMINDIP .......0....0....000000, Release 1 ...... Page 3.3.2-14
`FIGURE 3.3.2-11, 612 BY 8 10K & 100K ECL RPROM IN DIP AND SCC W022... 0... Release? ...... Page 3.3.2-15
`Release 7
`
`
`
`
`Bo,
`See
`
`
`
`a
`
`XILINX EXHIBIT 1013
`Page 12
`
`XILINX EXHIBIT 1013
`Page 12
`
`

`

`Section
`
`JEDEC Standard No, 21-C
`
`Release #
`
`Page #
`
`3.3.3 PROM, Word Wide .......0 0. ccc e ccc cce renee nner ereeenenage Release 1 .... Page 3.3.3—1
`3.3.3.1 -32 AND 64 BY 16 PROMIN DIP AND SCC ..............5..55 Release .... Page 3.3.3-3
`FIGURE 3.3.3-1, 32 AND 64 BY 16 TFL PROMINDIP .................c0e sean Release ....... Page 3.3.3-5
`FIGURE 3.3.3-2, 32 AND 64 BY 16 TTL PROMINGC .... 6... cece ere e eens Release i ....... Page 3.3.3-6
`3.3.4 PROM Package Conversion ........0cceseeeee eee e ee ee et enennas Release? .... Page 3.3.4—1
`3.3.4.1 - PROM DIP TO SO CONVERSION, 16, 18, 20,24 DIP .......... Release i .... Page 3.3.4-1
`FIGURE 3.3.4-1, 1K AND 2K TTL PROM 18 DIP TO 20 SOCONVERSION .......... Release i ....... Page 3.3.4-3
`3.4 Erasable Programmable Read Only Memory (EPROM).........-...++ Release 1 ...... Page 3.4~1
`3.4.1 EPROM, Byte Wide .......... 00. cca cc eter errr e nance eee eeenees Release i=... Page 3.4.1-1
`3.4.1.1 - 4K BY 8 EPROM IN DIP, TYPEA ................ vee e eae eens Release 1
`.... Page 3.4.1-3
`3.4.1.2 ~ 4K AND 8K BY 8 EPROMIN DIP, ............ 2.0. c eee eee ee Releasei .... Page 3.4.1-3
`3.4.1.3 —- 8K TO 64K BY 8 EPROM FAMILY IN DIP, .........-.....-0.05. Release 1 .... Page 3.4.1-3
`3.4.1.4 ~ 2K TO 512K BY 8 EPROM FAMILY IN RCC ............ 00.20 ee Release1 .... Page 3.4.1-3
`3.4.1.5 — 32K TO 512K BY 8 EPROM FAMILY IN SOU, .......... 000s eee Release 1 .... Page 3.4.1-3
`3.4.1.6 — 128K TO 1M BY & EPROM FAMILYIN DIP, ...............0.000. Release i .... Page 3.4.1-3
`3.4.1.7 - 64K TO 512K BY 9 EPROM FAMILY IN DIP, ..........-2.00005- Release 1 .... Page 3.4.1+3
`3.4.1.8 — 2 TO 64 X 16K BY 8 PAGE SELECT EPROM FAMILYIN DIP,
`... Release i .... Page 3.4.1-3
`3.4.1.9 ~ 128K TO 512K BY 8 EPROM FAMILY IN TSOP-1, .........-... Release4 .... Page 3.4.1-3
`FIGURE 3.4.1-1, 4K AND 8K BY 8 EPROMIN DIP, TYPESA&B...... 0.6... eee, Release 1 ....... Page 3.4.1-5
`FIGURE 3.4.1-2, 8K TO 64K BY BEPROMIN DIP .. 00. e ees Release 1 ....... Page 3.4.1-6
`FIGURE 3.4.1-3, 2K TO 512K BY 8EPROMINCO 0... eee eee eee Release 1 ....... Page 3.4.1-7
`FIGURE 3.4.1-4, 32K TO 512K BY BEPROMIN SOU 2... ee eee Release i ....... Page 3.4.1-8
`FIGURE 3.4.1-5, 128K TO IMBY BEPROMINDIP ..............-00055 beeeees Release? ....... Page 3.4.1-9
`FIGURE 3.4.1-6, 64K TO 512K BYSEPROMINDIP 2.0.0.0... eee eee eee Release 7 ...... Page 3.4.1-10
`FIGURE3.4,1-7, 2 TO 64 X 16K BY 8 PAGE SELECT EPROMINDIP.............. Release i ...... Page 3.4.1-11
`FIGURE 3.4.1-8, 128K TO 512K BY 8 EPROM IN TSOP-1 20.0... eee eee Released ...... Page 3.4.1-12
`3.4.2 EPROM, Word Wide .........0.0.02-e0005gene ee eveeew ene eeeeens Release 1 .... Page 3.4.2-1 .
`3.4.2.1 — 32K TO 256K BY 1G EPROMIN DIP ...... 0. eee eee eae eee Release 1 .... Page 3.4.2-3
`3.4.2.2 — 32K TO 256K BY 16 EPROMIN SCC... eee eee eee Release1 .... Page 3.4.2-3
`3.4.2.3 — 16K TO 256K BY 16 ADDRESS/DATA MX EPROM INDIP ...... Release 1 .... Page 3.4.2-3
`3.4.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX EPROMIN RCC ..... Release1 .... Page 3.4.2-3
`3.4.2.5 —- 512K TO 128M BY 16 EPROM or OTP IN DIP AND SOP ....... Release6 .... Page 3.4.2-3
`3.4.2.6 - 512K and iM BY 16 EPROMIN SCC oo... eee eee Release3 .... Page 3.4.2-3
`3.4.2.7 — 64K TO 256K BY 16 EPROM IN TSOP=1 ......... beeen e en nee Released .... Page 3.4.2-3
`FIGURE 3.4.2-1, 32K TO 256K BY 16 EPROMINDIP ........0. 0.00 cece eae Release 1 ....... Page 3.4.2-5
`FIGURE 3,4,.2-2, 32K TO 256K BY 16 EPROMINSCOeee eee eee Release1 ....... Page 3.4.2~-6
`FIGURE3.4.23, 16K TO 256K BY 16 ADDRESS/DATA MX EPROMINDIP ......... Release1 ....... Page 3.4.2~7
`FIGURE 3.4.2-4, 16K TO 256K BY 16 ADDRESS/DATA MX EPROMINROC......... Release 1 ....... Page 3.4.2-8
`FIGURE3.4.2-5, 4M TO 128M BY 16 EPROM OR OTP INDIP AND SOP ........... Release? ....... Page 3.4.2-9
`FIGURE 3.4.2-6, 512K & IMBY 1G EPROMINCO 0... eee eee eee Release3 ...... Page 3.4.2-10
`FIGURE3.4.2-7, 64K BY 256K BY 16 EPROMINTSOP-1 ... 0.0.0.0... 0... eee Release 4 ...... Page 3.4.2-11
`FIGURE3.4.2-8, 512K TO 2M BY 16 EPROM IN DIP AND SOG .................. Release 6 ...... Page 3.4.2-12
`3.5 Electrically Erasable Programmable Readid Only Memory (EEPROM)... Release? ...... Page 3.5~1
`3.5.1 EEPROM, Byte Wide ......... 0. cert cere terete eet ete e eee n eens Release 1 .... Page 3.5.1-1
`3.5.1.1 —.5K TO 2K BY 8 EEPROM FAMILY IN DIP.................000. Release i .... Page 3.5.1-2
`3.5.1.2-2K & 4K BY 8 EEPROMIN RCC .....wee eae Release i .... Page 3.5,1-2
`3.5.1.3 — 1K TO 32K BY 8 EEPROM FAMILY IN DIP ... 20... 2 ee eee Release1 .... Page 3.5.1-2
`3.5.1.4 -— .5K TO 32K BY 8 EEPROM FAMILY INACC .......02.0020 220. Release .... Page 3.5.1-2
`3.5.1.5 — 32K TO 256K BY 8 EEPROM FAMILY IN SOJ,............ ..... Releaset .... Page 3.5.1-2
`3.5.1.6 — 32K TO 512K BY 8 EEPROM FAMILY IN DIP, .............0... Releasei
`.... Page 3.5.1-2
`
`Release 7
`
`~ tii
`
`XILINX EXHIBIT 1013
`Page 13
`
`XILINX EXHIBIT 1013
`Page 13
`
`

`

`
`
`
`
`
`
`
`JEDEC Standard No. 21-C
`
`Section
`
`Release #
`
`Page #
`
`3.5.1.7 - 2K TO 256K BY 8 EEPROM FAMILY IN RCC, ..............-. Release 1 .... Page 3.5.1-2
`3.5.1.8 — 32K TO 256K BY 9 EEPROM FAMILY IN DIP, ................. Release 1 .... Page 3.5.1-2
`3.5.1.9 - 128K TO 1M BY 8 EEPROM FAMILY IN SCC, ..............04. Release i .... Page 3.5.1-2
`3.5.1.10- 32K TO 256K BY 8 EEPROM FAMILY INTSOP1 ............. Release? .... Page 3.5.1-3
`3.5.1.11 - EXTENDED FEATURE SET FOR 256K BIT EEPROM ......... Release2 .... Page 3.5.13
`3.5.1.12 —- OPTIONAL COMMAND SET FOR DUAL-SUPPLY EEPROM .. Release3 .... Page 3.5.1-3
`3.5.1.13 - 512K BY 8 DUAL-SUPPLY EEPROM IN RCC... eee Release5 .... Page 3.5.1-3
`3.5,1.14 — 128K to 512K BY 8 SINGLE—-SUPPLY EEPROM FAMILY
`INDIP ROC, & TSOPT ooo ccc nett nee ees Release5 .... Page3.5.1-3
`3.5.1.15 — 256K, 512K, &1M BY 8 DUAL-SUPPLY EEPROM IN TSOP1 ... Reiease6 °... Page 3.5.14
`3.5.1.16 — {M TO 8M BY 8 SINGLE-SUPPLY EEPROM FAMILY INTSOP1 .......... Release§ .... Page 3.5.1-4
`3.5.1.17 — 8K BY 256B OR 2848 SERIAL ACCESS EEPROMINTSOP2 ............ Release§ .... Page 3.5.1-4
`3.5.1.18 — 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROM IN PSOP2 ........... Release7 .... Page 3.5.1-4
`FIGURE 3.5.1-1, 5K TO 2K BY 8EEPROMINDIP ............. 0 0c eee eee eee Release 1 ......, Page 3.5.1-5
`FIGURE 3.5.1~2, 2K &4K BY SEEPROMINRACC ... 2c eee Releaset ....... Page 3.5.1-6
`FIGURE 3.5.1-3, 1K TO 32K BY 8 EEPROM FAMILY IN DIP ©... eee eee Release 1 ....... Page 3.5.1-7
`FIGURE 3.5.1-4, 5K TO 32K BY 8 EEPROM FAMILY INACC 0... eee eee Release 1 ....... Page 3.5.1-8
`FIGURE3.5.1-5, 32K TO 256K BY 8 EEPROM FAMILY INSOJ 1.2... eee Release 1 ....... Page 3.5,1-9
`FIGURE 3.5.1-6, 32K TO 512K BY 8 EEPROM FAMILY INDIP ................00. Release 1 ...... Page 3.5.1-10
`FIGURE3,5.1-7, 32K TO 266K BY 8 EEPROM FAMILY INRCO o 0... eee eee eae Release 1 ...... Page 3.6.1-11
`FIGURE3.5.1-8, 32K TO 258K BY 9 EEPROM FAMILY INDIP .........0.....00.. Release 1 ...... Page 3.5.1-42
`FIGURE 3.5.1-9, 128K TO 1M BY 8 EEPROM FAMILY INSCC ....0....0...- 0000. Release 1 ...... Page 3.5.1~-13
`FIGURE3.5.1-10, 32K TO 258K BY 8 EEPROM FAMILY INTSOP1
`....-........., Release 2 ...... Page 3.5.1-14
`ADDENDUM 1, 92K X 8 BIT EEPROM EXTENDED FEATURE STANDARD .......... Release 2 ...... Page 3.5.1-15
`FIGURE3.5.1-11, DUAL SUPPLY EEPROM COMMAND SET. 0... ccc eee Release3 ...... Page 3.5.1-23
`FIGURE 3,5,1-12, 512K BY 8 DUAL-SUPPLY EEPROM INROC oo... kee eee Release5 ...... Page 3.5.1-24
`FIGURE3.5.1-13, 128K fo 512K SINGLE-SUPPLY EEPROM FAMILY INDIP ........ Release5 ...... Page 3.5.1-25
`FIGURE 3.5.1-14, 128K fo 512K SINGLE-SUPPLY EEPROM FAMILY INROC........ Release5 ..... , Page 3.5.1-28
`FIGURE 3.5,1-15, 128K to 512K SINGLE-SUPPLY EEPROM FAMILY INTSOP1 ...... Release5 ......, Page 3.5.1-27
`FIGURE 3.5.1-16, 1M BY 8 DUAL-SUPPLY EEPROM INTSOP1 ..............00. Release5 ...... Page 3.5.1-28
`FIGURE3.5.1-17. 1M TO 8M SINGLE~SUPPLY EEPROM FAMILY INTSOP1 ........ Release 5 ...... Page 3.5.1-29
`FIGURE 3.5.1~18, 256K & 512K BY 8 BUAL-SUPPLY EEPROM IN TSOP1 .......... Release 6 ..... , Page 3.5.1-30
`FIGURE 3.5.1-19 A=>C 8K BY 2568 OR 2648 SERIAL ACCESS EEPROM IN TSOP2 .. Release6 .. Page $.5.1-31=+33
`FIGURE 3.5.1-20. 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROMINPSOPT ..... Release7 ...... Page 3.5.1-34
`3.5.2 EEPROM, Word Wide .... ccc creer tec cree etree cere neeteeeeenacees Release 1 .... Page 3.5.2-1
`3.5.2.1 —-4K TO 32K BY 16 EEPROMIN DIP... . ec cee cece erence nes Release 1 .... Page 3.5.2-3
`3.5.2.2 ~ 4K TO 256K BY 16 EEPROMIN SCO oo. cee ees Release] .... Page 3.5.2~-3
`3.5.2.3 — 256K TO 128M BY 16 EEPROM IN DIP AND SOG ............. Release6 .... Page 3.5.2-3
`3.5.2.4 ~ 1M TO 4M BY 16 DS EEPROM IN SSOP ..................00. Release6 .... Page 3.5.2-3
`3.5.2.5 — 1M TO 4M DENSITY, BY 8OR 16 FEEPROMIN PSOP ........ Release7 .... Page 3.5.23
`3.5.2.6 — 1M TO 32M DENSITY, BY 8OR 16 FEEPROM IN TSOP1 ...... Release7 .... Page 3.5.2-3
`FIGURE 3.5.2~1, 4K TO 32K BY 16 EEPROM FAMILY INDIP ........ 2. cee ee Release 1 ....... Page 3.5.2-5
`FIGURE3.5.2-2, 4K TO 256K BY 16 EEPROM FAMILY INSCC 2.2.00... 002... Release i ....... Page 3.5.2-6
`FIGURE3.5.2-3, 4M TO 128M BY 16 EEPROM FAMILY INDIPAND SOG .......... Release2 ....... Page 3.5.2-7
`FIGURE 3.5.2-4, 256K TO 2M BY 16 EEPROM FAMILY INDIP AND SOG ........... Release6 ....... Page 3.5.2-8
`FIGURE 3.5.2-5, 1M TO 4M BY 16 DS EEPROMIN SSOP ............... Release6 ....... Page 3.5.2-9
`FIGURE 3.5.2-6, 1M TO 4M DENSITY BY 8OR16 FEEPROMIN PSOP ... Release7 ...... Page 3.5.2-10
`FIGURE 3.5.2-7, 1M TO 32M DEBSITY BY 8 OR16 FEEPROMINPSOP .. Release? ...... Page 3.6.2-11
`3.5.3 EEPROM EXTENDED FEATURES ......... ccc eee eee eee eee Release 1 .... Page 3.5.3-1
`3.5.3.1 — EXTENDED FEATURE SET FOR 256Kb EEPROM .........-.. Release1 .... Page 3.5.3-3
`3.6.3.2 — DUAL SUPPLY EEPROM COMMAND SET .................. Release? ... Page 3.5.3-13
`Release 7
`
`
`
`
`
`
`
`~iv—
`
`XILINX EXHIBIT 1013
`Page 14
`
`XILINX EXHIBIT 1013
`Page 14
`
`

`

`4
`
`JEDEC Standard No. 21~C
`
`Page #
`Release #
`Section
`3.5.3.3 - SINGLE SUPPLY EEPROM COMMAND CODES .............. Release? ... Page 3.5.3—14
`3.5.3.4 - EEPROM TOGGLE BIT FEATURE ............-. 0000 e eee eee Release7 ... Page 3.5.3-15
`3.6 Non volatile Random Access Memory (NVRAM) ...........0s0eeee0e- Release? ...... Page 3.6~1
`3.6.1 NVRAM, Nibble Wide .......... 0... cece eect eee e nee n eee eeeenes Release? ...... Page 3.6-3
`3.6.1.1-.25K & IK BY 4NVRAMIN DIP ..... 0. e ee eee eee Release ft ...... Page 3.6-3
`3.6.2 NVRAM, BYTE WIDE ....... 0. cece eee ete nena eee nt eeereeeeen Release 1 ...... Page 3.6-3
`3.6.2.1 — .6K, 1K BY 8NVRAMIN DIP ....0.00.2. 0002 eee eee eee Release1 ...... Page 3.6-3
`3.6.2.2 — .5K & 1K BY 8 NVRAM IN RCC 20... ec eee ees Release 1 ...... Page 3.6~3
`3.6.2.3 ~ .5K TO 16K BY 8 NVRAM FAMILY IN DIP ............0020 0 eee Release i=:..... Page 3.6-3
`3.6.2.4 — 5K TO 16K BY 8 NVRAM FAMILY IN RCC ... 2... eee eee Release 1 ...... Page 3.6-3
`3.6.2.5 — 32K TO 256K BY 8 NVRAM FAMILY IN SOU, ..0.......--...005- Release i ...... Page 3.6-3
`3.6.2.6 — 32K TO 256K BY 8 NVRAM FAMILYIN DIP, ............-...0.- Release i ...... Page 3.6-3
`3.6.2.7 ~ 16K TO 128K BY 9 NVRAM FAMILY IN DIP, ......0.....-.-.0-. Release i ...... Page 3.6-3
`FIGURE 3.6-1,.25K & 1K BY A4NVRAMINDIP 000.0. eee ne Release i ........ Page 3.6-5
`FIGURE 3.6-2, SK & 1K BY SNVRAMINDIP 0.0.0... 0 cece ee renee Release 1 ........ Page 3.6-6
`FIGURE 3.6-3, 5K & IK BYB8NVRAMINRCC 2200. ee ees Release 1 ........ Page 3.6-7
`FIGURE 3,6--4, 5% TO 16K BY 8 NVRAM FAMILY IN DIP .......0.0... 00.0.2 a eee Released ......., Page 3.6-8
`FIGURE 3.6-5, .5K TO 16K BY 8 NVRAM FAMILY INRCC 1.0... eee eee Release i ........ Page 3.6-9
`FIGURE 3.6-6, 32K TO 256K BY 8 NVRAM FAMILY INSOJ .. 0.200020 ee ee, Releasei ....... Page 3.6~10
`FIGURE3.6-7, 32K TO 256K NY 8NVRAM FAMILY INDIP ..0......0. 0.0 0.0080. Release 1 ....... Page 3.6~11
`FIGURE 3.6-8, 16K TO 128K BY 9 NVRAM FAMILY INDIP. 00.2... ee, Release 1 ....... Page 3.6-12
`3.7 Static Random Access Memory (SRAM) .............ceecee eee ceenee Release 1 ...... Page 3.7-1
`3.7.1 — JTAG Extension to Revolutionary Pinout SRAM Devices ........ Release 4 ...... Page 3.7—1
`FIGURE3.7-1, JTAG ADDITION TO REVOLUTIONARY PINOUT SRAM ............ Released ........ Page 3.7-3
`3.7.1 Bit Wide TTL SRAM 2.0.0... cece ccc cece eee nese nee saeeae Release 1 .... Page 3.7.1-1
`3.7.1.1-.25K & 1K BY 1 TTL SRAMIN DIP oo. eee eee Release] .... Page 3.7.1-3
`3.7.1.2 -.25K & 1K BY 1 TTL SRAMIN SCC ....... 20.0. eee eee Release 1 .... Page 3.7.1-3
`3.7.1.3 -— 4K TO 2M BY 1 TTL SRAM FAMILY IN DIP ............ bieeeeee Release 1 .... Page 3.7.1-3
`3.7.1.4— 16K BY 1 TTL SRAMIN RCC 20... rece enee eee enee Release .... Page 3.7.1-3
`3.7.1.5-64K BY 1 TILSRAMIN ACC... eee ee Release 1 .... Page 3.7.1-3
`3.7.1.6 — 16K TO 2M BY 1 TTL SRAM IN SOJ ......... Ve eeee eee bees Release5 .... Page 3.7.1-3
`3.7.1.7 — 256K TO 16M BY 1 TTL SRAM AND 4M BY 1 SSRAM
`IN DIP, SOJ, AND TSOP-2 2.0... Release4 .... Page 3.7.1-3
`3.7.1.8 — 256K BY 1 TTL SRAM INRACC Lode eee eee Releasei
`.... Page 3.7.4-3
`3.7.1.9 -— 4M AND 16M SRAM, CONFIGURABLE TO X1 OR X4
`iN DIP, SOJ, AND TSOP-2 occ cce sce e cee eeeveevauss Release4 .... Page 3.7.1-3
`FIGURE 3.7.1-1, 0.25K & 1K BY f TTL SRAMIN DIP 60. eee R