Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`BEF?1991
`
`SUPERSEDING
`MIL-HDBK-217E,
`2 J8nwry
`1990
`
`NotIce 1
`
`MILITARY HANDBOOK.
`
`RELIABILITY
`ELECTRONIC
`
`PREDICTION OF
`EQUIPMENT
`
`AMSC N/A
`
`DISTRIBUTION STATEMENT A: Approved for public release; distribution unlimited.
`
`SEC et al. v. MRI
`SEC Exhibit 1016.001
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`DEPARTMENT OF DEFENSE
`WASHINGTON DC 20301
`
`RELIABILllY PREDICTION OF ELECTRONIC EQUIPMENT
`
`1. This standardization handbook was developed by the Department of Deferw
`with the assistance of the military dep~ments,
`federal agencies, and industry.
`
`2. Every effort has been made to reflect the latest information on reliability
`prediction procedures.
`It is the intent to review this handbook periodically to
`ensure its completeness and currency.
`
`3. Beneficial comments (recommendations, additions, deletions) and any pertinent
`data which may be of use in improving this dooument should be addressed to:
`Commander, Rome Laboratory, AFSC, AlTN:
`ERSS, Griffiss Ak Force Base,
`New York 13441-5700,
`by using the self-addressed Standardization Document
`Improvement Proposal
`(DD Form 1426) appearing at the end of this document
`or by letter.
`
`....—
`
`SEC et al. v. MRI
`SEC Exhibit 1016.002
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`I
`
`.
`
`MIL-I+DBK-217F
`
`SECTION
`1.1
`1.2
`1.3
`
`1: SCOPE
`Purpose ...... .......................0...... ............ ● ....................... ● ......... ...... ................. ........
`.........................
`Application .. ............ .... ...*.. ........................ ● ,, *........ ..........*. .....*......
`........ .................................................... ........ .....
`@rnputefized
`RdiabWty Predktbn
`
`SECTION
`
`2:
`
`REFERENCE
`
`DOCUMENTS
`
`● ...................................... ................................
`
`1“1
`1-1
`1-1
`
`2“1
`
`CONTENTS
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`...0
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`SECTION
`3.1
`3.2
`3.3
`3.4
`
`INTRODUCTION
`3:
`Reliability Engineering ........... .
`The Role of Reliability Predktbn ...**.*.*..... ................................................................
`Limitations of Reliability Predictions ● ..... *..*.*... .
`Part Stress Analysis Prediction .................................... ● .....................0....................0
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`. ● .
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`3-1
`3-1
`3-2
`3-2
`
`SEHION
`
`4:
`
`RELIABILIN
`
`ANALYSIS
`
`EVALUATION .....................*..*... .......................
`
`4-1
`
`SECTION
`5.1
`5.2
`5.3
`5.4
`5.5
`5.6
`5.7
`5.8
`5.9
`5.10
`5.11
`5.12
`5.13
`
`INTRODUCTION .......**...**.....................0..... ● .................
`5: MICROCIRCUJTS,
`C3ate/Lo@cArrays and Microprocessors ........................................*... .....*..... .............
`Memorfes .................................................................... ...........................................
`VHSICNHSIC
`Like ............................. ............................ .........................................
`GaAs MMIC and D@ai Devioes ......................................................................... .......
`Hybrids ..................................................................... .............. ...............................
`SAW Devices ................................................ ● .............. ......... ...... ...........................
`Magnetic Bubble Memories ............................................................................ .........
`XT Table for All .................................................... ....................................................
`C2 Table for AIl ................ ............................. .... ......................................................
`......................... .............................................. .............
`%EsXL and fiQ Tabk= for ~i
`TJ Determination,
`(All Except Hybrids) ...................................*... ............*..................
`...................................................................... ● .........
`TJ Determination,
`(For Hybriis)
`Examples .................... .................................................................... .... ...................
`
`Dbdes,
`
`SECTION
`6.0
`6.1
`6.2
`6.3
`6.4
`6.5
`6.6
`6.7
`6.8
`6.9
`6.10
`6.11
`6.12
`6.13
`6.14
`6.15
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`SEMICONDUCTORS
`DISCRETE
`6:
`Discrete Semiconductors,
`Introduction ....................................................................
`Diodes, Low F~ency
`....................................................... .
`High Frequency (Microwave, RF) .............. ...................................................
`Transistors, LOW Frequency, Bifx)lar ........................................ ...... ..........................
`Transistor,
`Low Frequency, Si FET ......................................................................*..
`Transistors, Unijmction ..........00............................................ ............................. ......
`Transistors, Low Noise, High Frequency, Bipolar .............................. ........................
`Transistors, High Power, High Frequency, Bipolar .....................* ..........* ....................
`Transistors, High Frequency, GaAs FET ......................0.... .................... ......... ...........
`Transistors, Hgh Frequency, Si FET ....... ....* ... ............................... ..........................
`end SCRS .... .... ........ ............................. ............... ● ................. .................
`~
`Optoelectronics, Detectors,
`Isolators, Emitters .................. .................................. .....
`Optoeiectmnios, Alphanumeric Displays ..................................................................
`OploekWonios,
`Laser Diode .......................* .........................................*......
`..........
`TJ Determination ............................... .....................................................................
`Example .................................................................................................................
`
`5-1
`5-3
`5-4
`5-7
`5-8
`5-9
`5-10
`5-11
`5-13
`5-14
`5-15
`5-17
`5-18
`5-20
`
`6-1
`6-2
`6-4
`6-6
`6-8
`6-9
`6-10
`6-12
`6-14
`6-16
`6-17
`6-19
`6-20
`6-21
`6-23
`6-25
`
`...
`HI
`
`SEC et al. v. MRI
`SEC Exhibit 1016.003
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`CONTENTS
`
`—
`
`SECTION
`7.1
`7.2
`7.3
`
`TUBES
`7:
`All Types Except TM/T and Magnetron ......................................................................
`Traveli~ Wave ............ ............................. ...... ........................................................
`Magnetron ................................ ......................*.....
`..............................................0..
`
`SECTION
`8.0
`8.1
`8.2
`8.3
`8.4
`
`SECTION
`9.0
`9.1
`9.2
`9.3
`9.4
`9.5
`9.6
`9.7
`9.8
`9.9
`9.10
`9.11
`9.12
`9.13
`9.14
`9.15
`9.16
`9.17
`
`SECTION
`10.1
`10.2
`10.3
`10.4
`10.5
`10.6
`10.7
`10.8
`10.9
`10.10
`10.11
`10.12
`10.13
`10.14
`10.15
`10.16
`10.17
`10.18
`10.19
`10.20
`
`iv
`
`7-1
`7-3
`7-4
`
`8-1
`8-2
`8-3
`8-4
`8-5
`
`9-1
`9-2
`9-3
`9-5
`9-6
`9-7
`9-8
`9-1o
`9-12
`9“13
`9-15
`9-17
`9-19
`9-21
`9-23
`9-25
`9-27
`9-29
`
`LASERS
`0:
`Introduction ... .............................................................. ...........................................
`Helium and Argon ..........................................................**.... .... .... .......................* ...
`Dmxide, Sealed .................................. ......................... ...............................
`Catin
`Carbon Dioxide, Fbwing ............................... .................... ......................................
`SoIii State, ND:YAG and Ruby Rod ............ ...................................................... .......
`
`RESISTORS
`9:
`Introduction ............................................................................................................
`Fixed, Composition (RCR, RC) .................................................................................
`I%@, Fitm (RLR, RL, RN (R.C, or N). RN) .............................. ...................................
`Fixed, Fltrn, Power (fWI) ................ ................... ................................. .......................
`Network, Fixed, Film (RZ) .........................................................................................
`Fixed, Wirewound (RBR, RB) ...................................................................................
`Fixed, Wkewound, Power (RWR, RW) ......................................................................
`Fixed, Wirewound, Power, Chassis Mounted (RER, RE) ............................................
`Thermistor (RTH)
`.................................... ................................................................
`Variable, Wirewound (RTR, RT) ................................................................................
`Variable, Wkewound, Precision (RR) ......... ...............................................................
`Variable, W/rewound, Semiprecision (RA, RK) ..........................................................
`Variable, Wkewound, Power (RP) ............................................................................
`(RJ, RJR) ...........................................................................
`Variable, Nonwirewund
`Variable, Composttlon (RV) ...................*.. ................................................................
`Variabte, NOnwmwu
`nd, Fitmw’KI Prectsion (RQ, RVC) ....... .....................................
`Cakulation of Stress Rat& for Potent&meters ..........................................................
`Example ....................... ................................................. .........................................
`
`10:
`CAPACITORS
`1o-1
`Fixed, Paper, By-Pass (CP, CA) ........................ ..... ............................................... ...
`10-3
`Fixed, Feed-Through (CZR, CZ) ..............................................................................
`10-5
`Fixed, Paper and Plastic Fitrn (CPV, CQR and CQ) .....................................................
`10-7
`Fixed, Metallized Pqw, Paper-Plastic and Plastic (CH, CAR) .....................................
`10-9
`F&ed, Plastic and Metallized Plastic ..........................................................................
`Fixed, Super-Metallized Plastic (CRH)
`............... ....................................................... 10-11
`F&ed, MICA (CM, CMR) .................................................................................. ......... 10-12
`Fixed, MICA, Button (CB) ...........* . ........................................................................... 10-14
`10-16
`Fued, GJass (CY, CYR) ............................................................... ............ .................
`Fixed, Ceramic, General Purpose (CK, CKR) ............................................................. 10-18
`.
`and Chip (CCR and CC, CDR) ................ 10-20
`Fixed, Cerarnk, Tenpemtum ~
`Fixed, Electrolytic, Tantalum, Solid (CSR) ........................ .................................... ..... 10-21
`Fixed, Electrolytic, Tantalum, Non-Solid (CL, CLR) .................................................... 10-22
`Ektrotytic, Aluminum (CUR and CU) ............................................................. 10-24
`Fbd,
`Fixed, Electrolytic (Dfy), Aluminum (CE) .................................................................... 10-26
`Variable, Ceramic (CV) ............................................................................................. 10-27
`Variable, Pkton Type (PC) ....................................................................................... 10-28
`Varitie. ArTfimmr
`(C~ ........................................................................................ 10-29
`Variable and Rxd. Gasor V.um(CG)
`................................................................... 10-30
`Example ................................. ........... ............... ............................................. ......... 10-32
`
`SEC et al. v. MRI
`SEC Exhibit 1016.004
`IPR 2023-00199
`
`

`

`——
`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`CONTENTS
`
`SECTION
`11.1
`11.2
`11.3
`
`SECTION
`12.1
`12.2
`12.3
`12.4
`
`DEVICES
`INDUCTIVE
`11:
`Transformers ........................................ ..................................................................
`cob .... .....*.. .............................................................................*...... .....................
`Determination of Hot Spot Temperature ............................................................0...0..
`
`ROTATING DEVICES
`12:
`Motors . ................. .....* ● ......................................... ................................................
`Synchros and Resolvers .......................... ...............................................................
`EIapsed Time Meters .....................*.. .......................... ............................................
`Example ......................................................... ........................................................
`
`11-1
`11-3
`11-5
`
`12-1
`12-3
`124
`12-5
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`...*.....
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`..0......
`
`II
`
`RELAYS
`13:
`......................................0..●.........................● ...................................0.....
`Mechanbl
`Solid State and Time Delay .
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`.
`
`SECTION
`13.1
`13.2
`
`( I
`
`SWITCHES
`SECTION 14:
`Toggle or Pushbutton ............................. ................................................................
`14.1
`Basic sensitive .......................................................................................................
`34.2
`Rotary .. ................... ............... ...............................................................................
`14.3
`.................................................................................................... .... ..
`14.4
`Thumbwheel
`Circuit Breakers .......................................... ................ ............................................
`14.5
`
`SECTION
`15.1
`15.2
`15.3
`
`SECTION
`16.1
`
`CONNECTORS
`15:
`(Except Printed Cir@t Board) .............. .......................................................
`General
`Printed Circuit Board . ... ....................................................................................... ....
`Integrated CituJlt Sockets .......................................................................................
`
`ASSEMBLIES
`lNTERCONNECTtON
`16:
`lntemomectkm Assenb+ies with Ptated Through t-totes ................. ................... ........
`
`SECTION
`17.1
`
`17:
`CONNECTIONS
`Connections ..........................................................................................................
`
`SECTION
`18.1
`
`METERS
`18:
`Meters, Panel ..................................................... ................................. ...................
`
`SECTION
`19.1
`
`QUARTZ CRYSTALS
`19:
`Quartz Crystals.......................................................................................................
`
`SECTION
`20.1
`
`20:
`hmp
`
`LAMPS
`.. ........... .................................................. ....................................................
`
`SECTION
`21.1
`
`FILTERS
`ELECTRONIC
`21:
`Fitters, NorwTunabte................................................................................
`Eiectmrtb
`
`SECTION
`22.1
`
`FUSES
`22:
`Fuses .. . ....0.... ● ........... ........................................................... ................................
`
`SECTION
`23.1
`
`PARTS
`MISCELLANEOUS
`23:
`Miscellaneous Patis ............................................................................. ...................
`
`APPENDIX
`
`APPENDIX
`
`APPENDIX
`
`A:
`
`B:
`
`C:
`
`PARTS
`
`COUNT
`
`RELIABILITY
`
`PREDICTION
`
`......................... .................
`
`VHSIC/VtiSIC-LIKE
`
`AND VLSI CMOS
`
`(DETAILED
`
`MODEL)
`
`... ....... ....
`
`BIBLIOGRAPHY
`
`.........................................................................................
`
`.
`
`13-1
`13-3
`
`14-1
`14-2
`14-3
`14-4
`14-5
`
`15-1
`15-4
`15-6
`
`16-1
`
`17-1
`
`18-1
`
`19-1
`
`20-1
`
`21-1
`
`22-1
`
`23-1
`
`A-1
`
`B-1
`
`c-1
`
`v
`
`SEC et al. v. MRI
`SEC Exhibit 1016.005
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`LIST OF TABLES
`
`—
`
`Parts with Multi-Level Quality Spedfications ........................................................
`Environmental Symbol and Desdptiin ..............................................................
`...... ................................................................... ....
`Reliability Analysis Cbckfist
`................................... .......
`Default Case Temperatures for All Environments (~)
`Approximate Thermal Resistance for SernbncWtor
`Devices
`in Various Package Sizes ......... .................. ................ .....................................
`
`3-3
`3-4
`.
`6:2;
`
`6-24
`
`CONTENTS
`
`Table 3-1:
`Table 3-2:
`Table 4-1:
`Table &l:
`Table S2:
`
`LIST OF FIGURES
`
`Figure 5-1:
`Figure 8-1:
`Figure 9-1:
`
`Cross Sectbnal Vk!w of a Hybrid with a Single Multi-Layered Substmte ................
`Examples of Active O@cal Surfaces ........................ ............................... ...........
`MIL-R-39008 Deratinfj cum ..... ................................................................. ......
`
`5-18
`8-1
`9-1
`
`vi
`
`SEC et al. v. MRI
`SEC Exhibit 1016.006
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`provides the following changes based upon recently completed studies
`This revision to MIL-HDBK-217
`(see Ref. 30 and 32 listed in Appendix C):
`
`1. New failure rate prediction models are prov-kled for the following nine major classes of
`microcircuits:
`
`FOREWORD
`
`●
`
`●
`
`●
`
`●
`
`●
`
`●
`
`●
`
`●
`
`●
`
`MonoliihE B~lar
`
`Dqital and Linear Gate/lm@c Array Devioes
`
`Monolithic MOS Digital and Lmar Gate/Logic Amy Devfces
`
`Monolithic B@olar and MOS Digital Microprocessor Devkes (Including Controllers)
`
`Monolithic Blpotar and MOS Memory Devices
`
`Monolithk (W@ Di@tal Devices
`
`Monolithic GaAs MMIC Devices
`
`Hybrid Microcircuits
`
`Magnetic Bubble Memories
`
`Surface Acoustic Wave Devices
`
`This revision provides new prediction models for bipolar and MOS microcircuits with gate counts up to
`
`60,000,
`
`linear microcircuits with up to 3000 transistors, bipolar and MOS digital microprocessor and co-
`
`processor
`
`up to 32 bits, memory devices with up to 1 nlftion bits, GaAs monolithic microwave integrated
`
`ICS with up to 10,000 transistors. The
`circuits (MMICS) with up to 1,000 active elements, and GaAs digital
`factors have been extensively revised to reflect new technology devices with improved reliability,and
`Cl
`
`the activation energies representing the temperature sensitivity of the dice (nT) have been changed for
`
`MOS devices and for memories. The C2 factor remains unchanged fmm the previous Handbook version,
`
`but includes pin grfd arrays and surface mount packages using the same model as hermetic, solder-sealed
`dual in-line packages. New values have been included for the quality factor (~),
`the learning factor (~),
`
`and the environmental
`
`factor (@.
`
`The rrwfel
`
`for hybrid microcircuits has been revised to be simpler to
`
`use, to delete the terrperature dependence of the seal and interconnect
`
`failure rate contributions, and to
`
`provide a method of oakulating ohp jundon temperatures.
`
`2. A new model for Very High Speed Integrated Circuits (V1-fSIC/VHSIC Like) and Very Large
`Scale Integration (VLSI) devices (gate counts above 60,000).
`
`3.
`
`The reformatting of the entire handbook to make H easier to use.
`
`4. A reduction in the number of environmental
`
`fado~
`
`(~E) from 27 to 14.
`
`5. A revised failure rate model for Network Resistors.
`
`and Ktystrons based on data supplied by the Electronic Industries
`6. Revised models for Ms
`Association Microwave Tube DiWon.
`
`vii
`
`--
`
`. ...=--------
`
`- —----
`
`--u.
`
`I --
`
`1 -u
`
`I
`
`SEC et al. v. MRI
`SEC Exhibit 1016.007
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`1.0
`
`SCOPE
`
`is to establish and maintain consistent and uniform
`- The purpose of thfs MruboOk
`Purpoee
`for estimating the hhemnt rek&Slity (i.e., the reUabflityof a mature design) of rnilbry @edron&
`ti.~
`predictionsckhg aoquis&bn progmms
`It provides a common basfs for ~
`-
`systems.
`~~~
`for military ebctrcmc systems and equipment. h atso establishes a common basis for oomparfng and
`evafuatlng reliability predictions of rdated or competitive destgns. The handbook is intended to be used
`as a tool to increase the reliabil”~ of the equ@merx being designed.
`
`- This handtmok oontains two methods of reMWiJity pmdiotbn - “Part Stress
`Appllcatlon
`1.2
`Analysis” In Sectfons 5 through 23 amf 7%rts Count- in Appendix IL These methods vary in degree of
`informatbn needed to apply them.
`lhe Part Stress Anafysii Method recpires a greater amount of detailed
`In&mtfon
`and ts appfkabfe mrfng the later design phase when actual hardware and c&wits are being
`designed. The Parts Count Method raquires less infonnatbn, generally part quantities, qmtity level, and
`the applkatbn
`environmen& This method Is appfioable cMng the early de-
`@ase and du~
`pmpo@
`formulation.
`In general, the Parts Count Metfwd wffl usually result in a more conservative estknate (i.e.,
`~f*mte)ofsy’stem
`r@taMtythanthe Parts Stress Method.
`
`1.3
`Computerfzad Rellablllty PmcffctlOn - Rome Laborato~
`- ORACLE is a computer program
`to aid in appfying the part stress analysis procedure
`of MIL-HDBK-217.
`Based on
`developed
`environmental use chamcteristks,
`piece part oount, thermal and electrical stresses, subsystem repair rates
`and system configuration,
`the program calculates piece part, assemMy and subassembly failure rates.
`It
`also flags overstressed parts, afbws the user to perform tradeoff analyses and provides system mean-
`time-to-failure and availability. The ORACLE computer program software (available in both VAX and IBM
`PC versbns)
`is available at replacement
`tape/disc cost
`to all DoD organizations,
`and to
`co~atible
`contractors for applbcatbn on spedfk
`DoD contraots as government
`furnished property (GFP).
`A
`statement of terms and conditions may be obtained upon written request
`to: Rome Laborato~/ERSR,
`Grtffiss AFB, NY 13441-5700.
`
`I
`
`1
`
`I
`
`f-l
`
`SEC et al. v. MRI
`SEC Exhibit 1016.008
`IPR 2023-00199
`
`

`

`..-”,
`
`.-
`
`-,
`
`Downloaded from http://www.everyspec.com
`
`,..
`
`. .
`
`MIL-tiDBK-217F
`
`2.0
`
`REFE!?ENCE
`
`DOCUMENTS
`
`dofwhiohdescrb ectevicesthatam
`somespecificatbns which have beencanoslle
`~s~cites
`nottobeused fornewdes@n.
`lWiinfomatti&s
`Wms$arytmcxames omeofthesed evicasarusecfin
`soalfed %ff-th~
`eqdpment which the Depwtment of Defense purchases. The documents cited
`m this section are for @dance and information.
`
`SPECIFICATION
`
`SECTION #
`
`10.7
`
`9.1
`
`9.11
`
`10.11
`
`9.12
`
`10.1
`
`9.6
`
`11.1
`
`10.15
`
`10.16
`
`10.18
`
`9.5
`
`9.14
`
`23.1
`
`20.1
`
`14.5
`
`22.1
`
`22.1
`
`19.1
`
`15.1
`
`15.1
`
`15.1
`
`Ca@&s,
`
`FMed,Mii-Dieisctric, General Specifii
`
`for
`
`~,
`
`F&a
`
`composition (Insufated) General $pecuii
`
`for
`
`Resiekx. Variab&gWirewound (Low Operating Tmpwatum) General
`Spo&@atbn for
`
`~)
`v@fw=-
`“~
`@Pw@%=d~
`Estdfkhed and Nonestabiished Reliability, General Specifiiion
`
`for
`
`Rask!or, Wuewow
`
`Power Type, General Spa&cation for
`
`Dire Cwrent (Hermetically Sealed
`p~r~~~
`fiti
`~.
`in Metal Case@, General Specification for
`
`Resistor, Fued, Wkewound (Power Type), Genarai Specifhbn
`
`for
`
`Tmnsfonner and fndwtor (Audio, Power, High Power, High Power
`Pulse). General Sfxdiibn
`for
`
`(DG fgruminum.W E~@,
`Fiu~ ~fo~~
`~r.
`spadkamn
`Pdar&ed), Gened
`
`Capacitor, Variable, Ceramic Dielectric (Trimmer). General Specification
`for
`
`Ctpcitor,
`
`Variable, Air Dielectric (Trimmer), General Specificaii
`
`for
`
`Resistor, Fwed, Wkewound (Aocura!e), General Spdfkdon
`
`for
`
`Resistor, Variable, Composition, General Specifiin
`
`for
`
`Vior,
`
`Interrupter and Self -RectifyingO General Specification for
`
`-.
`
`hadaant
`
`Miniature, Tungaran Fikment
`
`Ckauit Br@der, MOidOdC&m, BrarmflcfrcuRand~
`
`Fuse, Q@ridge, CJassH (Thii mvem renewable and mrwnebie)
`
`Fuse, Camidge, High InterruptingCqmcity
`
`_
`
`Unk ~
`
`~~end Spcifiw&m for
`
`Connector,Coax&~Radii Frequency, Series Pulse, Gene@
`,
`SpdMlOns
`for
`
`Connector, Coaxial, Radio Frequency, Series NH, Associated Ftiings,
`~neral
`s~
`for
`
`Connector, Coaxial, Radio Frequency, Series LC
`
`MIL-C-5
`
`MIL%l 1
`
`MlL-R-l 9
`
`MIL-G20
`
`MIL-R-22
`
`MIL-C-25
`
`MIL-R-26
`
`MIL-T-27
`
`ML-(X2
`
`MIL-G81
`
`MIL-92
`
`MIL-R-93
`
`MIL-R-94
`
`MIL-V-9S
`
`W-L-111
`
`W=
`
`W-F-1726
`
`w-f-i814
`
`MfL-G3098
`
`MIL-G3807
`
`MIL-G3643
`
`MlL4N8so
`
`I
`
`Luw u I
`
`SEC et al. v. MRI
`SEC Exhibit 1016.009
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`.
`
`2.0
`
`REFERENCE
`
`DOCUMENTS
`
`SPECFKATJON
`
`SECTION #
`
`.
`
`Mt4X655
`
`15.1
`
`ML-C-3767
`
`MIL-S-3786
`
`MfL-G3950
`
`MIL-G3965
`
`MIL+5015
`
`MIL-F-5372
`
`MIL-R-5757
`
`MIL-R-6106
`
`MIL-L-6363
`
`15.1
`
`14.3
`
`14.1
`
`10.13
`
`15.1
`
`22.1
`
`13.1
`
`13.1
`
`20.1
`
`_(Jl=SeriasTwin)and
`conneotor, P&q and Ramptda,
`Associated Fitlmgs, General SpuM@mn
`.
`
`~.
`SpacMiion
`
`~
`
`f’q
`for
`
`~
`
`(po”~* B&~
`
`TYP@ -~~
`
`S*.
`~bn
`
`=.
`
`Rotary (Circxit Selector, Low-Current
`for
`
`(Capady)), General
`
`Toggle, Envlmnmantally sealed, General Speckatbn
`
`for
`
`=b~~~
`
`Elti~
`
`(No-lkf
`
`Electrolyte), Tantalum, General
`
`Eledrkal, Circular Threaded, AN Type, General
`~,
`Spedflcation for
`
`I%aa, Currati Limiter Type, Amaft
`
`(For Electronic and Communkation Type Equipment),
`Relay. Electrbl
`General Specifbaticm for
`
`Relay, Electromagnetic (Including Established Reliability(ER) Typs),
`~-~s~
`for
`
`bnp,
`
`Incandemt,
`
`Aviation Service, General Raquiramentfor
`
`MIL-S-8805
`
`14.1, 14.2
`
`SwhcheSand Switch Assemblies, Swxdtivo and Push, (SW Action)
`General Sfx@in
`for
`
`MIL-S-8834
`
`MlL-M-l 0304
`
`MlL-R-l 0509
`
`MIL-C-1095O
`
`14.1
`
`18.1
`
`9.2
`
`10.8
`
`MIL-C-1101S
`
`10.10
`
`M!L-GI 1272
`
`MlL-C-l 1693
`
`MlL-R-l 1804
`
`MIL-G12889
`
`10.9
`
`10.2
`
`9.3
`
`10.1
`
`Switches, Toggle, Positive Brealq General Specification for
`
`Meter, Electkal
`Spedficatbn
`for
`
`Indicating, Panel Type, Ruggedzed, General
`
`Resistor, f%cad IWm (High Stability). General Speoikatbn
`
`for
`
`-Or,
`for
`
`~,
`~bn
`
`Fud, Mii Dielectric, Button Style, General Specifiiion
`
`FU~, Ceramic Dtiric
`for
`
`(General Pupae),
`
`Ganeral
`
`Capadtor, Fixed, Glass Dlelectrb, General Spcfkatbn
`
`for
`
`-
`
`Capadtor, Feed Through. Radio Interference Reduction AC andDC,
`.
`“ hed
`Sdedh
`Metal Casos)Eatabkhed
`and No~
`l!!’!!’
`MaMfiio General Spdicatbn
`for
`
`Resistor, Freed, Film (Power Type), General Specifiin
`
`for
`
`By-Pa&: Radio - Interfermce Reduction, Paper Dielectdc,
`“Cap&or,
`DC, (Hermetbally Sealed in Metallk Casas), Ganeral
`AC d
`Spectficatbn for
`
`MIL-R-12934
`
`9.10
`
`Resistor, Variable, Wirewound, Preasion, General Specification for
`
`2-2
`
`r- .
`
`. .
`
`–n
`
`/
`
`nv
`
`-1
`
`[1-/!1
`
`,
`
`---
`
`--–
`
`.uu l--
`
`,-- --------
`
`—.
`
`n . ——.
`
`ba
`
`-
`
`SEC et al. v. MRI
`SEC Exhibit 1016.010
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`2.0
`
`REFERENCE
`
`DOCUMENTS
`
`sPEcfFlcATloN
`
`SECTKMJ #
`
`ML-C-141S7
`
`10s
`
`-d:
`~,
`current (Hermabd
`@J-~ ~n
`
`a
`
`(pap- PI-tic) or mastic Dweot*
`lySeabdin Matal Cases) amMshed
`for
`
`Direct
`Refkwty,
`
`MIL-G14409
`
`10.17
`
`v-
`~.
`Spac#ioatbn for
`
`(Pii
`
`TyP, T“lar
`
`Trimmer), GWWraI
`
`MIL-F-15160
`
`MK-C-IS305
`
`MfL-F-15733
`
`UL-GW312
`
`ML-F-13327
`
`MIL-R-16546
`
`MIN-19500
`
`MIL-R-19523
`
`ML-R-19M8
`
`22.1
`
`11.2
`
`21.1
`
`10.4
`
`21.1
`
`9.7
`
`6.0
`
`13.1
`
`13.1
`
`Fuse,
`
`Instmnem Poww amf Telephone
`
`Coil, Fixed and Vari*,
`
`Radio Frequency, General Specifiibn
`
`for
`
`FBtler,Rack Imarkmrux, General SpecMin
`
`for
`
`~.
`Dbbdrk,
`~ibn
`
`Metzdl&ed (Paper, Paper Plastic or Plastic Film)
`-,
`Dkocl Cummt
`(Herrneticaliy sealed in Metal Cases), Gemral
`for
`
`Filter, High Pass, k
`Pass, Band Pass, Band Suppression and Dual
`for
`Funcknkg,
`General Specdfiition
`
`Redstor, Freed, WWewound(Power Type, Chassis Mounted), General
`Specificatbn for
`
`SomkOnductor Oevice, Geneml Specification for
`
`Relay, Contmi, Naval Ship&oard
`
`Roley, Tree, Delay,
`
`lherm~
`
`General Specifiition
`
`for
`
`ML-C-19978
`
`10.3
`
`MIL-T-21036
`
`MUA-21097
`
`MIL-FM2097
`
`MIL-R-Z?664
`
`MIL-S-2271O
`
`ML-S-22665
`
`MIL-C-22W2
`
`ML+163
`
`M&GZ3269
`
`MIL-FW3265
`
`11.1
`
`15.2
`
`9.13
`
`9.2
`
`14.4
`
`14.1
`
`1s.1
`
`10.19
`
`10.9
`
`9.1s
`
`Fmecf Plastic (or Paper-Plastic) Dielectric (Hermetically
`~or,
`Sealed m Metal, Cemmc or Glass Cases), EstafXished and
`Noneatabiiahed ReGabilii, General Specifiicatbn for
`
`Transformer, Pulse, Low Power, General Specikatiin
`
`for
`
`Connector, Electrical, Printed WInng Board, General Purpose, General
`Spedfbatbn for
`
`Rasistor, VarMMe, Nonwirewound (AdjustmentTypes), General
`Spedfbatbn for
`
`Resistor, F&d,
`
`Film,
`
`lnsdated, General Specifiiion
`
`for
`
`S*.
`-nerd
`
`Mary
`~*
`
`(Printed Circuit), (Tlwmbwheel.
`
`In-1ine and Pushbutton),
`
`Switches, Pushbutton,
`
`Illuminated, General Specification for
`
`Connector, Cyfinddcal, Heavy Outy, General Specification for
`
`=
`
`~~
`
`ofi,v*.
`
`V=xum MI-*
`
`General Specifiibn
`
`em.
`Speclkatbn
`
`Fi~.
`for
`
`G-
`
`Diekrik
`
`Estiiiihed
`
`Reliabllky, General
`
`Reaiir,
`
`Variable, Nonwirewound, General Specificationfor
`
`2-3
`
`. .
`
`SEC et al. v. MRI
`SEC Exhibit 1016.011
`IPR 2023-00199
`
`

`

`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`2.0
`
`REFERENCE
`
`DOCUMENTS
`
`SPECfFICATlON
`
`sEcTKm #
`
`MIL-F-23419
`
`MIL-T-23648
`
`MfL-G24308
`
`MIL-G25516
`
`MfL&+6482
`
`MN-R-27208
`
`MIL-C-2f1748
`
`MIL-R-28750
`
`MfL-G288tM
`
`MIL-C-2884O
`
`MIL-hR851 O
`
`MIL-H-38S34
`
`MIL-I-38535
`
`22.1
`
`9.8
`
`15.1
`
`15.1
`
`15.1
`
`9.9
`
`15.1
`
`13.2
`
`15.1
`
`15.1
`
`5.0
`
`5.0
`
`5.0
`
`MIL-C-38999
`
`15.1
`
`MfL-C-39001
`
`MIL-R-39002
`
`10.7
`
`9.11
`
`MfL—G39003
`
`10.12
`
`MIL-R~
`
`9.5
`
`MtL+39006
`
`10.13
`
`Fuse, bstrumont Type,Gonad
`
`~km
`
`for
`
`Thormistw,
`Spadfioatbn
`
`(Tharmafly Sensitive Resistor),
`for
`
`Insulated, Generaf
`
`Rectangular, Miniature Polatizad Shell, Rack and
`Connec40r, E-
`Panel. Genoraf Spodcatbn for
`
`Cortnector, ~
`-~~fof
`
`Cormoctor, Efoctr&f
`Environment Rl&ting)
`for
`
`, Miniature, ~
`
`Environment Resistant Type.
`
`(Circular. Minirdure, QuH kamnoc&
`ReU@ac&
`and Plugs, General Spocik@ion
`
`Resistor, VariaM, WKewound,
`Speciftiion
`for
`
`(Lead Screw Actiied)
`
`General
`
`Rectangular, Ra& and Panel, solder Type and
`Ebct~
`Con-or,
`Crimp Type Contads, General Spacifiition
`for
`
`Relay, Solid State, Ganeral Specification for
`
`Connector. E&ctric Rectangular, High Density, PoMzed Cantral
`Ja&euww, Genoraf Spedficstion for, Inactive for New Designs
`
`cimUlar Threaded, High Denaity, High Shock
`Conrmdor, ~
`Shipboard, Class D, General Spechation
`for
`
`M&oc5rcuits, Generaf Specificatii
`
`for
`
`Hybrid Microcircuits, General Specification for
`
`Integrated Circuits (Microcircuits) Manufacturing, General
`Speclfiiion
`for
`
`Chcular, Miniature, Hgh Density, Quick
`Qxvwc#or, E~
`Disconnect,
`(Bayonet, Threadad, and Breech Coupiing) Environment
`Resistant Remowble Crimp and Hermetic Solder Cmtacts, General
`Specifiiion
`for
`
`~~,
`qor.
`Specification for
`
`Mh Dkktk
`
`Estabkhed ReliaMfity, Generat
`
`Raa&stor, Variable, Wkewound, Sem&Precision, General Spa&icstion
`for
`
`-’
`
`‘a_~&*ewg
`
`●
`
`Raslatcx, Fixed, ~nd,
`Specification for
`‘
`
`T-lJm*
`
`(Aaamte)
`
`EstaMshed Fteflabllity, General
`
`-I&
`~~.
`-N.
`EstalMshed Relilii,
`
`(NortsoMf Ek%rolyte) Tantalum
`for
`General SpadkMon
`
`MfL-Raoo7
`
`9.6
`
`Resistor, Fixed, W~
`General Speckition
`
`nd (Power Type) EstaMished Reliability.
`.
`for
`-
`“-
`-
`
`SEC et al. v. MRI
`SEC Exhibit 1016.012
`IPR 2023-00199
`
`

`

`.-. .
`
`. .
`
`.
`
`. .
`
`. .
`
`Downloaded from http://www.everyspec.com
`
`MIL-HDBK-217F
`
`2.0
`
`REFERENCE
`
`DOCUMENTS
`
`SPEOFICATR3N
`
`SECTION #
`
`MIL-R~
`
`MLC-3901O
`
`MIL-CX9012
`
`UL-C39014
`
`MK-C49015
`
`MIL-R39016
`
`MtL-R-39017
`
`9.1
`
`9.7
`
`11.2
`
`15.1
`
`10.10
`
`9.9
`
`13.1
`
`9.2
`
`Redstor, Fixed, Campoah“ n, (Insutated) Established Reliability,
`Genefal S@fio@hfor
`
`(Power Type, chassis Mounted)
`~nd
`R@!sMcw,m
`EstaMished R@aMfity, General SpecMcMion for
`
`~
`
`Cd, Fbrti Radio Frequency, Molded. Established Ratiiity,
`Spec#iibn
`for
`
`General
`
`Connector, Coaxial, Racfb Frequency, General Spdfii”~
`
`for
`
`Carandc Dielectric (General purpose) EsMMbhd
`~
`~.
`R8iiabili!y, Gmeral SpeoWation for
`
`WkewOund (Lead screw Actuated) Emabfished
`Rdetor, V*,
`Reliability, General Spdfkatbn
`for
`
`Relay, Electromagnetic, Established ReIiabilii, General Specifiition
`for
`
`Resietor, Freed, Fh (insulated), Estabkhed Reliabitky, General
`Specifiikm for
`
`MIL-G39018
`
`10.14
`
`Capacitor. f%ed, Ebctmlytio (Aluminum Oxide) Established Reliabil.~
`and Nonestablished ReKaMIity, General SpecdfbNion for
`
`MIL-C-39019
`
`MIL-G39022
`
`MIL-R-39023
`
`MIL-R-39035
`
`MiL-G49142
`
`MIL-P-5511O
`
`MIL-R-65W2
`
`MIL-G55235
`
`MIL-G55302
`
`MIL—G65339
`
`MIL-G65514
`
`MIL-C-5S629
`
`MIL-T-S5631
`
`14.5
`
`10.4
`
`9.15
`
`9.13
`
`15.1
`
`152
`
`9.2
`
`15.1
`
`15.2
`
`15.1
`
`10.5
`
`14.5
`
`11.1
`
`Cfrcutt Breakera, Magn@iq Low Power, Sealed, Trip%ee, General
`~bn
`for
`
`Mettiized Paper, Paper-Plastic