US005998275A
`5,998,275
`[11] Patent Number:
`United States Patent 15
`
`Richiuso
`[45] Date of Patent:
`Dec. 7, 1999
`
`[54] METHOD FOR PROGRAMMABLE
`INTEGRATED PASSIVE DEVICES
`
`[75]
`
`Inventor: Dominick L. Richiuso, Saratoga, Calif.
`:
`[73] Assignee: California Micro Devices, Inc.,
`Milpitas, Calif.
`
`[21] Appl. No.: 08/953,350
`[22]
`Filed:
`Oct. 17, 1997
`[SL]
`Tint. Cdone eeeeceseneeecenneeesnneersnneeene HO1L 21/8256
`[52] U.S. Ch.ee eeeseseeeeneeneenes 438/381; 438/239
`[58] Field of Search 0.0.0 438/238, 239,
`438/381, 382; 257/390-391, 532-535
`.
`References Cited
`U.S. PATENT DOCUMENTS
`
`[56]
`
`4,219,836
`4,682,402
`5,120,572
`5,310,695
`5,530,418
`5,635,421
`5,872,040
`5,872,697
`
`8/1980 McElroy .
`7/1987 Yamaguchi.
`6/1992 Kumar.
`5/1994 Suzuki .
`6/1996 Hsu etal. .
`6/1997 Ting .
`2/1999 Wojnarowskietal. .
`2/1999 Christensen et al. oe 361/313
`
`PASSIVATION
`
`OTHER PUBLICATIONS
`Notification of Transmittal of the International Search
`Report, International Scarching Authority, Jul. 8, 1998.
`International Search Report, International Searching Author-
`ity, Jul. 8, 1998.
`
`Primary Examiner—Jey Tsai
`Attorney, Agent, or Firm—Beyer & Weaver LLP
`[57]
`ABSTRACT
`A method for endowing an integrated passive device array
`structure with a programmable value during manufacturing.
`The method includes forming a substantially conductive first
`layer and forming a plurality of passive device array ele-
`ments of the integrated passive device array structure above
`the substantially conductive first layer. The method further
`includes forming an insulating layer above the plurality of
`passive device array elements. There is further included
`selectively forming vais the insulating layer. The vias facili-
`tate electrical connections between selected ones of the
`plurality of passive device array elements with a substan-
`tially conductive second layer subsequently deposited above
`the insulating layer.
`
`14 Claims, 6 Drawing Sheets
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` on
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`METAL PASSIVATION
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`1
`METHOD FOR PROGRAMMABLE
`INTEGRATED PASSIVE DEVICES
`
`BACKGROUND OF THE INVENTION
`
`Thepresent invention relates generally to the manufacture
`of integrated circuits (IC’s). More particularly, the present
`invention relates to programmable capacitors, and methods
`therefor, that render the value of the capacitor selectable
`during manufacturing.
`Integrated circuits integrate many discrete functions and
`componentsinto one “integrated”circuit. One of the reasons
`integrated circuits presently predominate over discrete com-
`poncnt solutions is because of the costs involved in
`manufacturing, assembling, and testing discrete based cir-
`cuits. For example, present day microprocessors incorporate
`more than one million transistors into a square package less
`than 5 cm on each side. The same numberof transistors,
`discretely and separately placed on a printed circuit board,
`would require several orders of magnitude more space.
`Other advantages of integrated circuit technology, which are
`well knownto those skilled in the art, include reliability and
`cost.
`
`‘The miniaturization that present day integrated circuit
`technology, and the benefits that such technology bestows,
`are applicable to passive component integration as well.
`Whenpassive devices, e.g., capacitors, resistors, inductors,
`and the like, are integrated, they are referred to herein as
`passive componcntintegrated circuits.
`In the design of passive thin film integrated circuits, for
`example, capacitors of different values are needed. By way
`of example, in the design of a family offilters or terminators,
`resistors and capacitors are combined in different configu-
`rations and values to provide different functionality and
`performance. In prior art, this is typically accomplished by
`a custom design and integrated circuit layout configuration
`for each type of circuit and for each value. This processis
`time consuming, more prone to errors and less economical.
`In the description that follows, an integrated capacitor is
`selected for discussion. It should be borne in mind, however,
`that the inventive concepts herein also apply to other types
`of passive devices, e.g., resistors, inductors, and the like. In
`the prior art, when an application requires an integrated
`capacitor having a value that is previously unavailable, a
`new custom design is necessitated to create an integrated
`circuit having a capacitor with the desired value. This
`custom design approach requires a substantial amount of
`time, effort, and expense since a custom design with specific
`capacitance values and characteristics must be laid out and
`verified, the required masks must be created, and manufac-
`turing steps must be tailored to fabricate the required inte-
`grated circuit. As can be appreciated from the foregoing, the
`custom design approach is disadvantageous in view of the
`great variety of device values required by modern electronic
`equipment.
`In view of the foregoing, what is desired are passive
`component
`integrated circuit structures and methods
`therefor, which can implement a wide range of valucs in a
`given single design. This alleviates all the above mentioned
`limitations of prior art custom design approaches, thereby
`providing quicker design turnaround time, fewer design
`errors and a lower manufacturing cost.
`
`SUMMARYOF THE INVENTION
`
`The present invention relates, in one embodiment, to a
`method for endowing an integrated passive device array
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`structure with a programmable value during manufacturing.
`The method includes forming, a substantially conductivefirst
`layer and forming a plurality of passive device array ele-
`ments of the integrated passive device array structure above
`the substantially conductive first layer. ‘the method further
`includes forming an insulating layer above the plurality of
`passive device array elements. There is further included
`selectively forming vias in the insulating layer. The vias
`facilitate electrical connections between selected onesof the
`
`plurality of passive device array clements with a substan-
`tially conductive second layer subsequently deposited above
`the insulating layer.
`In another embodiment, the invention relates to a method
`for forming an integrated passive device array structure
`having a programmable value. The method includes forming
`a substantially conductive first layer, and electrically cou-
`pling the substantially conductive first layer with a plurality
`of passive device array elements of the integrated passive
`device array structure. The plurality of passive device array
`elements is disposed above the substantially conductivefirst
`layer. There is also included electrically coupling selected
`ones of the plurality of passive device array elements with
`a substantially conductive second layer to form the inte-
`grated passive device array structure. The selected ones of
`the plurality of passive device array clements represent a
`subset of the plurality of passive device array elements.
`In yet another embodiment, the invention relates to an
`integrated programmable passive device array structure,
`whichincludesa first node, and a plurality of passive device
`array elements electrically coupled to the first node. The
`integrated programmable passive device array structure fur-
`ther includes a second nodeelectrically coupled, in a selec-
`tive manner, to selected ones of the plurality of passive
`device array elements. The selected ones of the plurality of
`passive device array elements represent a subset of the
`plurality of passive device array elements, wherein a value
`of the programmable passive device array structure is sub-
`stantially determined by an aggregate of values of the
`selected ones of the plurality of passive device array ele-
`ments.
`
`In another embodiment, the invention relates to a capaci-
`tor array structure having multiple capacitor array elements.
`During production, the individual capacitor array elements
`are selected for inclusion into or exclusion out of the final
`capacitor structure. An included capacitor array element
`contributes its capacitance value to the capacitance value of
`the final capacitor structure. In contrast,
`the capacitance
`value of an excluded capacitor array element makes no
`contribution to the capacitance value of the final capacitor
`structure.
`
`In another embodiment, the capacitor array elements are
`binary related. in accordance with this embodiment, a given
`array element has twice the capacitance value of its smaller
`counterpart. For example, the cell surface area of a succes-
`sive capacitor array element
`increases by a factor of 2
`relative to its immediately smaller counterpart. Because
`capacitance is proportional to the surface area of the plates
`forming the capacitor, by providing n distinct cells in the
`array structure, 2n different capacitance values may be
`available for each such array structure.
`In accordance with yet another embodimentof the present
`invention, a given capacitor array element is selected for
`inclusion by providing it with a contact, thereby permitting
`an electrical path to exist between its plates and the nodes of
`the final capacitor structure through the provided contact.
`On the other hand, another given capacitor array elementis
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`excluded from the final capacitor structure when no contact
`is provided for it, thereby inhibiting the formation of an
`electrical path between its plates and the nodesof the final
`capacitor structure.
`Io this manner,
`individual capacitor
`array elements of a capacitor array structure may be pro-
`grammably selected for inclusion or exclusion by appropri-
`ately designing the contact mask.
`These and other advantages of the present invention will
`become apparent upon reading the following detailed
`descriptions and studying the various figures of the draw-
`ings.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`in
`FIGS. 1(a) and 1(b) are a schematics illustrating,
`accordance with one aspect of the present invention, capaci-
`tor array structures having capacitors coupled in parallel for
`implementing the programmable capacitors of the present
`invention.
`
`TIG. 1(c) is a symbolic circuit diagram illustrating the
`contribution made by selected and non-selected capacitor
`array membersto the capacitance value ofthe final capacitor
`structure.
`
`FIG. 2 shows, in accordance with one embodiment of the
`present invention, a top plane view of a capacitor array
`layout.
`FIGS. 3a—3) illustrate, in accordance with one embodi-
`mentof the present invention, the relevant steps involved in
`the fabrication and programming of a capacitor array struc-
`ture.
`
`DESCRIPTION OF THE PREFERRED
`EMBODIMENT
`
`In accordance with one aspect of the present invention,
`the value of the inventive programmable capacitor may be
`rendered selectable during manufacturing by fabricating the
`capacitor as a programmable capacitor array structure. The
`value of the capacitor that results may be programmably
`determined during manufacturing by the selective inclusion
`of individual capacitor array members. Capacitor array
`members which are incorporated into the final program-
`mable capacitor array structure contribute to the capacitance
`value of the resulting capacitor. On the other hand, capacitor
`array members which are not incorporated into the final
`programmable array structure do not contribute to the
`capacitance value of that resulting capacitor. The above
`concept may be better understood with reference to the
`Figures below.
`FIGS. 1(a@) through 1(c) illustrate the concept that under-
`lies the programmable capacitor array in accordance with
`one aspect of the present invention. FIG. 1a illustrates a
`programmable capacitor C, which comprises a plurality of
`programmably related capacitor array members, C,, C3, C,
`...C,. The programmably related capacitor array members
`C,,...C,, are arranged such that each, if selected, may be
`coupled in parallel with others in the programmable capaci-
`tor array. As is readily recognizable by those skilled in the
`art,
`the effective capacitance value of the programmable
`capacitor array of FIG. la equals the cummulative capaci-
`tance value of the capacitor array membersthat are coupled
`to nodes 100 and 102 in paralleL In other words, the value
`of programmable capacitor C between nodes 100 and 102 is
`nm
`determined by which of capacitor array members Cy. .. C
`are incorporated into the final capacitor structure.
`In one embodiment,
`the capacitor array members C,
`through C,, are related to one another in a binary manner.In
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`other words, the values of the capacitor array members are
`successively increased by a factor of 2. In FIG. 16, for
`example, there are shown a programmable capacitor array
`comprising six capacitor array members C, ... Cg. Whenthe
`capacitor array members C, .. . C, are binary related,
`capacitor array member C, has twice the capacitance value
`of capacitor array member C,; capacitor array member C,
`has twice the capacitance value of capacitor array member
`C,; and so on. It should be recognized that the capacitance
`value of a capacitor array memberC,,, equals 2°"timesthe
`capacitance value of the smallest capacitor array memberC,
`(m being an arbitrary integer between 1 and n, the total
`number of capacitor array members in the programmable
`capacitor array).
`It should be noted that although binary related capacitor
`array members are discussed herein to facilitate ease of
`understanding, the capacitance values of the capacitor array
`members may berelated to one another via any predeter-
`mined relationship. For example,
`the capacitance values
`among the capacitor array members may be related in
`accordance to a linear, geometric, logarithmic, or exponen-
`tial relationship. Of course,
`they may also relate to one
`another in any other arbitrary, predefined manner.
`In FIG. 1b, capacitor array members C, and C; are not
`incorporated into the final capacitor structure. As such, the
`capacitancevalue ofthe capacitor structure of FIG. 1b sub-
`stantially equals to the sum of the capacitance values of
`capacitor array members C,, Cy, Cs, and C,(or C,+8C,+
`16C,4+32C,=57C,). Other capacitance values may be
`obtained, as can be appreciated fiom the foregoing, by
`selectively incorporating or removing the individual capaci-
`tor array members from the final capacitor structure.
`Depending on the particular
`fabrication technology
`employed, the layout of the integrated circuit may, in some
`cases,give rise to parasitic capacitance betweenthe layers in
`somestructures. The parasitic capacitance associated with a
`given capacitor array member may contribute to the capaci-
`tance value of the final capacitor structure even if that
`particular capacitor array memberis not incorporated into
`the final capacitor structure. To illustrate this concept, FIG.
`1c symbolically illustrates the contribution of each included
`and excluded capacitor array member to the capacitance
`value of the final capacitor structure of FIG. 15.
`Referring ta FIG. 1c, capacitor array member C1 is
`selected for incorporation. Accordingly,
`its capacitance
`value contributes to the resultant capacitance value of the
`final capacitor structure of FIG. 1b. In the context of FIG. 1c
`the incorporation of capacitor array memberC1 is illustrated
`symbolically by the connection of capacitor C1 to nodes 100
`and 102.
`
`Capacitor array member C, is not selected for incorpo-
`ration. Accordingly, its capacitance value does not contrib-
`ute to the resultant capacitance value of the final capacitor
`structure of [IG. 1b. As shown in FIG. 1c, however, the
`parasitic capacitance value associated with capacitor array
`member C,still contributes to the capacitance value of the
`final capacitorstructure. As a result, a parasitic capacitor C,,,
`(where p denotes parasitic capacitance) is symbolically
`coupled to node 100 in FIG. 1c. Likewise, capacitor array
`member C,
`is not selected. As shown in FIG.
`lc,
`the
`parasitic capacitor C3,,, which is associated with capacitor
`array memberC,,still makes its contribution to the capaci-
`tance value of the resultant capacitor structure.
`Finally, capacitor array members C, and Cs are selected
`for incorporation. As a result,
`their capacitance values
`contribute to the value of the capacitor structure that results,
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`as shown in FIG. 1c. FIG. 1c is also useful for visualizing
`the programmable aspect of the inventive capacitor array
`structure. When a given capacitor array memberis selected
`for incorporationinto the final capacitor structure, its capaci-
`tor may be thought of as being coupled to a capacitor node
`(node 100 in the case of FIG. 1c) by a switch. When a given
`capacitor array memberis not selected for incorporation into
`the final capacitor structure, its capacitor is not coupled to
`the capacitor nodes. Instead, the parasitic capacitor assaci-
`ated with the non-sclected capacitor array member maythen
`be thought of as being coupled to the capacitor nodes.
`FIG. 2 illustrates, in accordance with one embodimentof
`the present invention, the layout of a programmable capaci-
`tor array. For ease of discussion, the capacitor array mem-
`bers of FIG. 2 are binary related although, as noted earlier,
`other relationships may well be employed.
`As is well known, a capacitor is created by placing a
`dielectric medium of a certain thickness between two con-
`
`ductive regions, or plates, with the capacitance being
`directly proportional to the surface area of the plates in
`contact with the diclectric; directly proportional
`to the
`dielectric constant and inversely proportional to the dielec-
`tric thickness. In this manner, for a given dielectric constant
`and thickness, if the surface area is doubled, the capacitance
`is also doubled. In FIG. 2, the surface area of capacitor C,
`is twice that of capacitor C,. Similarly, the capacitance of
`capacitor C, is twice that of capacitor C,, and that of C, is
`twice that of capacitor C3, and so on.
`In accordance with one aspect of the present invention,
`every capacitor array memberof a programmable capacitor
`array is fabricated, complete with its plates and dielectric
`layer irrespective of whether that capacitor array memberis
`incorporated into the final capacitor structure. To sclect a
`capacitor array member for incorporation, a contact is cre-
`ated with a capacitorplate (typically but not necessarily the
`upperplate) to facilitate the formation of a conduction path
`between a common conductor and that capacitor plate. The
`common conductor represents a node of the final capacitor
`structure, e.g., node 100 of FIGS.
`la, 1b, and Ile.
`Consequently, the provision of a contact permits the selected
`capacitor array member to be coupled to the common
`conductor, and to the remainder of the resultant capacitor
`structure, in a parallel fashion with other selected capacitor
`array members.
`If a capacitor array memberis not selected for incorpo-
`ration into the final capacitor array structure, no contact is
`provided for that capacitor array member. Consequently,
`there is no conduction path between the plate of that
`non-selected capacitor and the common conductor, and the
`capacitor array memberis essentially “decoupled,” electri-
`cally speaking, from the remainder of the resultant capacitor
`structure.
`
`The above concept may be better understood with refer-
`ence to FIGS. 3a—3) below. FIGS. 3a—3) illustrate, in accor-
`dance with one embodiment of the present invention, a
`manufacturing method whereby a programmable capacitor
`array is created and selected ones of the array’s membersare
`programmably incorporated into the final capacitor struc-
`ture. FIG. 3a shows the process starting with an n+type
`substrate 30. FIG. 3b shows a p-typeepitaxial layer 32,
`which is grown on n+type substrate 30 using a conventional
`semiconductor manufacturing technique.
`In FIG. 3c, a deep n*diffusion through a selected portion
`of p-type epitaxial layer 32,
`through to substrate 30, is
`performed using conventional masking and diffusion tech-
`niques. This ntregion 34 serves as the bottom plate of the
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`capacilor array members to be subsequently formed. The
`region to be diffused is selected so that it lies underneath the
`entirety of the capacitor array. In addition,
`the n*region
`serves as a low resistance path to the bottom of the wafer
`where physical contact is eventually made to the bottom
`capacitor plate and to insure that the capacitor structure that
`results does not vary with applied voltage (in the manner
`expected of a standard MOS gate transistor).
`Referring to FIG. 1(c), for example, the bottom plate of
`capacitors C,, through C, are electrically connected. For this
`reason and as will be shown herein, the selective incorpo-
`ration of the capacitor array membersis performed using the
`top plates of the capacilor array members.
`In FIG. 3d, field oxidation is selectively performed to
`separate the individual capacitor array members from one
`another. This field oxidation is performed using conven-
`tional masking and deposition techniques. As shown nextin
`FIG. 3e, a selective gate oxidation is performed. Gate oxide
`regions 38a and 385 are grown on the portions of the
`n*region 34 that are not covered by the field oxide regions
`36. These gate oxide regions 38(a) and 38(b) form the
`dielectric of the capacitor array elements of the program-
`mable capacitor array. In the preferred embodiment, the
`dielectric is silicon dioxide ( SiO). However, the dielectric
`may represent a layer of silicon nitride, a silicon dioxide/
`silicon nitsride sandwich combination, or any other dielec-
`tric material.
`
`Next, a polysilicon layer is deposited and masked, as
`shown in FIG. 3f These polysilicon regions 40a and 40b
`form the top plates of the capacitor array elements associ-
`ated with dielectric regions 38a and 38D.
`Next, an intermediate oxide layer 42 is then applied as
`shownin FIG. 3g. This intermediate oxide layer 42 electri-
`cally separates the individual capacitor array elements from
`a subsequently deposited conductive layer.
`In FIG. 3g,
`the capacitor array is essentially “unpro-
`grammed.”At this stage, the wafer prepared in accordance
`with this invention may be stored until a customer’s speci-
`fication for a product is received. To program the capacitor
`of FIG. 3g to a particular desired value,
`the particular
`combination of capacitor array elements Cl... Cn to be
`incorporated into the final capacitor structure is first ascer-
`tained. For example, the desired capacitance value may be
`compared against a predefined table whichlists the possible
`combinations of incorporated capacitor array elements and
`the capacitance values that result thereby.
`To select a given capacitor array element for incorpora-
`tion into the final capacitor array structure, a contact mask
`is employed to perform a contact etch. If a capacitor array
`element site is provided with a contact hole (through inter-
`mediate oxide layer 42) to facilitate electrical contact with a
`subsequently deposited conductive layer,
`that capacitor
`array element is selected for incorporation. On the other
`hand, if a capacitor array element is not provided with a
`contact hole through the intermediate oxide layer 42 that
`overlies it, no electrical contact may be formed betweenthat
`capacitor array element and the subsequently deposited
`conductive layer. Consequently, the latter capacitor array
`element may be thoughtof as being non-selected, 1.e., makes
`no contribution (except for its parasitic capacitance) to the
`capacitance value of the final capacitor structure.
`As shown in FIG. 3h, a contact hole 44 is created by
`etching through the intermediate oxide 42 to expose poly-
`silicon top plate 405. FIG. 3 showsthe deposition of a metal
`layer 46, which makescontact with polysilicon top plate 40b
`through contact hole 44. This metal layer acts as a continu-
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`ous top plate connected to all selected capacitor array
`elements, advantageously minimizingthe parasitic effects of
`resistance and inductance.
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`forming a substantially conductive first layer;
`forming a plurality of integrated passive device array
`elements of said integrated passive device array struc-
`ture above said substantially conductive first layer;
`forming an insulating layer above said plurality of passive
`device array elements; and;
`selectively forming vias in said insulating layer, said vias
`facilitating electric connection between selected ones
`of said plurality of passive device array elements with
`a substantially conductive second layer subsequently
`deposited above said insulating layer, thereby program-
`ming a value into the integrated passive device array
`structure.
`
`2. The method of claim 1 wherein said plurality of passive
`device array elements represent capacitors.
`3. The method of claim 2 wherein said capacitors have
`dielectric portions formed in an oxide layer, said oxide layer
`being disposed between said substantially conductive first
`layer and said insulating layer.
`4. The method of claim 3 wherein areas of said dielectric
`portions are selected to permit values of said plurality of said
`passive device array elements to relate to one another in a
`binary manner.
`5. The method of claim 1 wherein said selectively formn-
`ing vias including selecting an appropriate mask to etch
`through said insulating layer.
`6. A method for forming an integrated passive device
`array structure having a programmable value, comprising:
`forming a substantially conductive first layer;
`electrically coupling said substantially conductive first
`layer with a plurality of passive device array elements
`of said integrated passive device array structure, said
`plurality of passive device array elements being dis-
`posed above said substantially conductive first layer;
`and
`
`electrically coupling selected ones of said plurality of
`passive device array elements with a substantially
`conductive second layer formed above said passive
`device array element to form said integrated passive
`device array structure, said selected ones of said plu-
`rality of passive device array elements representing a
`subset of said plurality of passive device array
`elements, thereby programming a value into the inte-
`grated passive device array structure.
`7. The method of claim 6 wherein a value of said
`
`integrated passive device array structure is substantially
`determined by an aggregate of values of said selected ones
`of said plurality of passive device array elements.
`8. The method of claim 6 wherein said selected ones of
`said plurality of passive device array elements are contig-
`ured to be electrically coupled in parallel between said
`substantially conductive first layer and said substantially
`conductive second layer.
`9. The method of claim 6 further comprising forming said
`plurality of passive device array elements above said sub-
`stantially conductive first layer, including
`forming individual onesof said plurality of passive device
`array elements, values of said individual ones of said
`plurality of passive device array elements being related
`in a binary manner.
`10. The method of claim 6 further comprising forming
`said plurality of passive device array elements above said
`substantially conductive first layer, including
`forming individual onesof said plurality of passive device
`array elements in an oxide layer, said oxide layer being
`disposed between said substantially conductive first
`layer and said substantially conductive second layer.
`
`As can be seen in FIG. 3h, the capacitor array element
`associated with polysilicon top plate 40(b) is selected for
`incorporation into the final capacitor structure. In contrast,
`no contact hole is made with polysilicon top plate 40a, and
`the capacitor array element associated therewith is left
`decoupled from the final capacitor structure. However, there
`exists a parasitic capacitor consisting of two capacitors in
`series. The first capacitor is formed with the metal acting as
`the top plate, the intermediate oxide acting as the primary
`dielectric, and the polysilicon layer acting as the bottom
`plate. The second capacitor is formed with the polysilicon
`layer acting as the top plate, the gate oxide acting as the
`dielectric, and the n*layer acting as the bottom plate. This
`parasitic capacitor, which is associated with the site of the
`non-selected capacitor array member, still contributes to the
`capacitance value of the final capacitor structure in the
`manner discussed in connection with PIG. 1c. In practice,
`the parasitic capacitance value is much smaller than the
`capacitance value of the normal capacitor array element,
`typically one twentieth to one fortieth of the non-selected
`capacitor array member. [‘ollowing the metal deposition step
`of FIG. 3i a passivation layer 50 is deposited in a conven-
`tional manner to protect the entire structure, as shown in 9
`FIG. 3).
`in the above discussed
`It should be emphasized that
`embodiment,
`the separate capacitor array elements are
`always present. Whether a given capacitor array elementis
`selected for incorporation or left out of the final capacitor
`structure depends on whether a contact hole is provided in
`the intermediate oxide layer above that capacitor array
`element to create an electrical path to its top plate. Thus, the
`value of the capacitor structure that results is determined by
`appropriately programming the presence or absence of
`selected contact holes on the contact mask.
`While this invention has been described in terms of
`several preferred embodiments,
`there are alterations,
`permutations, and equivalents which fall within the scope of
`this invention. By way of example, although the inventive
`concept has been discussed, for ease of illustration, with
`reference to n+type substrates, n type or p type materials
`could be reversed in a given process implementation.
`Further, the present inventive concepts also apply equally
`well to capacitor arrays employing different types of dielec-
`tric materials, doping concentrations, as well as those not
`having an epitaxial layer. Additionally, although the pro-
`grammability feature is facilitated through the use of a
`contact mask in this discussion, it should be borne in mind
`that a programmable passive device may be facilitated
`through the use of the metal mask, the via mask between
`metal 1 and metal 2 layers, poly mask, active mask, and the
`like. As a further example, the inventive concepts discussed
`herein are also applicable to passive devices (such as
`capacitors, resistors,
`inductors, and the like) which are
`integrated with active components (such as transistors,
`diodes,andthe like) on the sameintegrated circuit. It should
`also be noted that there are many other alternative ways of
`implementing the methods and apparatuses of the present
`invention.
`It
`is therefore intended that
`the specification
`herein be interpreted as including all such alterations,
`permutations, and equivalents as fall within the true spirit
`and scope of the present invention.
`Whatis claimedis:
`1. A method for endowing an integrated passive device
`array structure with a programmable value during
`manufacturing, comprising:
`
`10
`
`15
`
`20
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`11
`
`11
`
`

`

`5,998,275
`
`10
`9
`forming a substantially conductive first layer;
`11. The method of claim 10 further comprising:
`formling a plurality of integrated capacitor clements to
`forming an insulating layer above said oxide layer; and
`create an integrated capacitor array structure, each of
`furnishing each of said selected ones of said plurality of
`the integrated capacitor elements being electrically
`passive device array elements with a via through said 5
`connected to the substantially conductivefirst layer;
`insulating layer to permit said substantially conductive
`.
`.
`.
`.
`.
`second layer to electrically couple with said each of
`forming an insulating layer that electrically isolates the
`said selected ones of said plurality of passive device
`plurality of integrated capacitor elements;
`array elements.
`forming a substantially conductive second layer;
`12. ‘The method of claim 1 wherein at least one of said 10
`plurality of passive device elements is selected to be elec- berofthe ilectricall li lected d
`
`
`
`
`
`trically decoupled from said substantially conductive second
`© ectrical y coupling a selected num ero the integrate
`layer.
`capacitor elements to the substantially conducti