`
`Reference 29
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 1
`
`
`
`Mehory Systems
`
`I
`
`.Vi-:
`
`1
`
`k w
`
`,
`
`M
`tfi
`
`;
`
`';3
`
`i
`*
`
`»
`
`m
`
`llQl
`
`»
`
`i
`
`■:
`
`:
`
`|E:
`P
`
`i- :
`
`p: J
`
`I
`
`"
`
`:
`m
`i
`
`|
`
`i
`
`I ■
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 2
`
`
`
`In Praise of Memory Systems: Cache, DRAM, Disk
`
`Memory Systems: Cache, DRAM, Disk is the fi rst book that takes on the whole hierarchy in a way that is
`consistent, covers the complete memory hierarchy, and treats each aspect in signifi cant detail. This book will
`serve as a defi nitive reference manual for the expert designer, yet it is so complete that it can be read by a relative
`novice to the computer design space. While memory technologies improve in terms of density and performance,
`and new memory device technologies provide additional properties as design options, the principles and meth-
`odology presented in this amazingly complete treatise will remain useful for decades. I only wish that a book
`like this had been available when I started out more than three decades ago. It truly is a landmark publication.
`Kudos to the authors.
`
`—Al Davis, University of Utah
`
`Memory Systems: Cache, DRAM, Disk fi lls a huge void in the literature about modern computer architecture.
`The book starts by providing a high level overview and building a solid knowledge basis and then provides the
`details for a deep understanding of essentially all aspects of modern computer memory systems including archi-
`tectural considerations that are put in perspective with cost, performance and power considerations. In addi-
`tion, the historical background and politics leading to one or the other implementation are revealed. Overall,
`Jacob, Ng, and Wang have created one of the truly great technology books that turns reading about bits and bytes
`into an exciting journey towards understanding technology.
`
`—Michael Schuette, Ph.D., VP of Technology Development at OCZ Technology
`
`This book is a critical resource for anyone wanting to know how DRAM, cache, and hard drives really work.
`It describes the implementation issues, timing constraints, and trade-offs involved in past, present, and future
`designs. The text is exceedingly well-written, beginning with high-level analysis and proceeding to incredible
`detail only for those who need it. It includes many graphs that give the reader both explanation and intuition.
`This will be an invaluable resource for graduate students wanting to study these areas, implementers, designers,
`and professors.
`
`—Diana Franklin, California Polytechnic University, San Luis Obispo
`
`Memory Systems: Cache, DRAM, Disk fi lls an important gap in exploring modern disk technology with accu-
`racy, lucidity, and authority. The details provided would only be known to a researcher who has also contributed
`in the development phase. I recommend this comprehensive book to engineers, graduate students, and research-
`ers in the storage area, since details provided in computer architecture textbooks are woefully inadequate.
`
`—Alexander Thomasian, IEEE Fellow, New Jersey Institute of Technology and Thomasian and Associates
`
`Memory Systems: Cache, DRAM, Disk offers a valuable state of the art information in memory systems that
`can only be gained through years of working in advanced industry and research. It is about time that we have
`such a good reference in an important fi eld for researchers, educators and engineers.
`
`—Nagi Mekhiel, Department of Electrical and Computer Engineering, Ryerson University, Toronto
`
`This is the only book covering the important DRAM and disk technologies in detail. Clear, comprehensive, and
`authoritative, I have been waiting for such a book for long time.
`
`—Yiming Hu, University of Cincinnati
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 3
`
`
`
`Memory is often perceived as the performance bottleneck in computing architectures. Memory Systems:
`Cache, DRAM, Disk, sheds light on the mystical area of memory system design with a no-nonsense approach to
`what matters and how it affects performance. From historical discussions to modern case study examples this
`book is certain to become as ubiquitous and used as the other Morgan Kaufmann classic textbooks in computer
`engineering including Hennessy and Patterson’s Computer Architecture: A Quantitative Approach.
`
`—R. Jacob Baker, Micron Technology, Inc. and Boise State University.
`
`Memory Systems: Cache, DRAM, Disk is a remarkable book that fi lls a very large void. The book is remarkable
`in both its scope and depth. It ranges from high performance cache memories to disk systems. It spans circuit
`design to system architecture in a clear, cohesive manner. It is the memory architecture that defi nes modern
`computer systems, after all. Yet, memory systems are often considered as an appendage and are covered in a
`piecemeal fashion. This book recognizes that memory systems are the heart and soul of modern computer
`systems and takes a ‘holistic’ approach to describing and analyzing memory systems.
`
`The classic book on memory systems was written by Dick Matick of IBM over thirty years ago. So not only does
`this book fi ll a void, it is a long-standing void. It carries on the tradition of Dick Matick’s book extremely well,
`and it will doubtless be the defi nitive reference for students and designers of memory systems for many years to
`come. Furthermore, it would be easy to build a top-notch memory systems course around this book. The authors
`clearly and succinctly describe the important issues in an easy-to-read manner. And the fi gures and graphs are
`really great—one of the best parts of the book.
`
`When I work at home, I make coffee in a little stove-top espresso maker I got in Spain. It makes good coffee very
`effi ciently, but if you put it on the stove and forget it’s there, bad things happen—smoke, melted gasket—‘burned
`coffee meltdown.’ This only happens when I’m totally engrossed in a paper or article. Today, for the fi rst time, it
` happened twice in a row—while I was reading the fi nal version of this book.
`
`—Jim Smith, University of Wisconsin—Madison
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 4
`
`
`
`Memory Systems
`Cache, DRAM, Disk
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 5
`
`
`
`Memory Systems
`Cache, DRAM, Disk
`
`Bruce Jacob
`University of Maryland at College Park
`
`Spencer W. Ng
`Hitachi Global Storage Technologies
`
`David T. Wang
`MetaRAM
`
`With Contributions By
`Samuel Rodriguez
`Advanced Micro Devices
`
`AMSTERDAM (cid:129) BOSTON (cid:129) HEIDELBERG LONDON
`NEW YORK (cid:129) OXFORD (cid:129) PARIS (cid:129) SAN DIEGO
`SAN FRANCISCO (cid:129) SINGAPORE (cid:129) SYDNEY (cid:129) TOKYO
`Morgan Kaufmann is an imprint of Elsevier
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 6
`
`
`
`Publisher
`Acquisitions Editor
`Publishing Services Manager
`Senior Production Editor
`Developmental Editor
`Assistant Editor
`Cover Design
`Text Design
`Composition
`Interior printer
`Cover printer
`
`Denise E.M. Penrose
`Chuck Glaser
`George Morrison
`Paul Gottehrer
`Nate McFadden
`Kimberlee Honjo
`Joanne Blank
`Dennis Schaefer
`diacriTech
`Maple-Vail Book Manufacturing Group
`Phoenix Color
`
`Morgan Kaufmann Publishers is an imprint of Elsevier.
`30 Corporate Drive, Suite 400, Burlington, MA 01803, USA
`This book is printed on acid-free paper.
`© 2008 by Elsevier Inc. All rights reserved.
`Designations used by companies to distinguish their products are often claimed as trademarks or registered trademarks. In all
`instances in which Morgan Kaufmann Publishers is aware of a claim, the product names appear in initial capital or all capital
`letters. Readers, however, should contact the appropriate companies for more complete information regarding trademarks and
`registration.
`No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means—electronic,
`mechanical, photocopying, scanning, or otherwise—without prior written permission of the publisher.
`Permissions may be sought directly from Elsevier’s Science & Technology Rights Department in Oxford, UK: phone:
`(+44) 1865 843830, fax: (+44) 1865 853333, E-mail: permissions@elsevier.com. You may also complete your request online
`via the Elsevier homepage (http://elsevier.com), by selecting “Support & Contact” then “Copyright and Permission” and then
`“Obtaining Permissions.”
`
`Library of Congress Cataloging-in-Publication Data
`Application submitted
`
`ISBN: 978-0-12-379751-3
`For information on all Morgan Kaufmann publications,
`visit our Web site at www.mkp.com or www.books.elsevier.com
`Printed in the United States of America
`08 09 10 11 12 5 4 3 2 1
`
`Working together to grow
`libraries in developing countries
`www.elsevier.com | www.bookaid.org | www.sabre.org
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 7
`
`
`
`
`
`
`
`Dedication
`
` Jacob To my parents, Bruce and Ann Jacob, my wife,
`Dorinda, and my children, Garrett, Carolyn,
`and Nate
`
` Ng Dedicated to the memory of my parents
` Ching-Sum and Yuk-Ching Ng
`
`Wang Dedicated to my parents Tu-Sheng Wang and
`Hsin-Hsin Wang
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 8
`
`
`
`You can tell whether a person plays or not by the way he carries the
`instrument, whether it means something to him or not.
`
`Then the way they talk and act. If they act too hip, you know they can’t
`play [jack].
`
`—Miles Davis
`
`[...] in connection with musical continuity, Cowell remarked at the
`New School before a concert of works by Christian Wolff, Earle Brown,
`Morton Feldman, and myself, that here were four composers who were
`getting rid of glue. That is: Where people had felt the necessity to stick
`sounds together to make a continuity, we four felt the opposite neces-
`sity to get rid of the glue so that sounds would be themselves.
`
`Christian Wolff was the fi rst to do this. He wrote some pieces vertically
`on the page but recommended their being played horizontally left to
`right, as is conventional. Later he discovered other geometrical means
`for freeing his music of intentional continuity. Morton Feldman di-
`vided pitches into three areas, high, middle, and low, and established
`a time unit. Writing on graph paper, he simply inscribed numbers of
`tones to be played at any time within specifi ed periods of time.
`
`There are people who say, “If music’s that easy to write, I could do it.” Of
`course they could, but they don’t. I fi nd Feldman’s own statement more
`affi rmative. We were driving back from some place in New England
`where a concert had been given. He is a large man and falls asleep
`easily. Out of a sound sleep, he awoke to say, “Now that things are so
`simple, there’s so much to do.” And then he went back to sleep.
`
`—John Cage, Silence
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 9
`
`
`
`Preface
`
`Overview
`
`"It’s the Memory, Stupid!" .............................................. xxxi
`On Memory Systems and Their Design .................................
`1
`2
`Ov.1 Memory Systems ..........................................................................................
`Ov.l.1 Locality of Reference Breeds the Memory Hierarchy ......................................... 2
`Ov.l.2 Important Figures of Merit .................................................................................
`7
`10
`Ov.l.3 The Goal of a Memory Hierarchy .....................................................................
`Ov.2 Four Anecdotes on Modular Design ..........................................................
`14
`Or.2.1 Anecdote I’. Systemic Behaviors Exist ...............................................................
`15
`0v.2.2 Anecdote II: The DLL in DDR SDRAM .............................................................
`17
`0v.2.3 Anecdote lII: A Catch-22 in the Search for Bandwidth ................................... 18
`0v.2.4 Anecdote IV: Proposals to Exploit Variability in Cell Leakage ........................ 19
`19
`0v.2.5 Perspective .........................................................................................................
`Or.3 Cross-Cutting Issues ..................................................................................
`20
`Or.3.1 Cost/Performance Analysis ...............................................................................
`20
`26
`0v.3.2 Power and Energy .............................................................................................
`32
`0v.3.3 Reliability ..........................................................................................................
`34
`0v.3.4 Virtual Memory .................................................................................................
`Ov.4 An Example Holistic Analysis ....................................................................
`41
`Or.4.1 Fully-Buffered DIMM vs. the Dislc Cache .........................................................
`41
`0v.4.2 Fully Buffered DIMM: Basics ............................................................................
`43
`46
`0v.4.3 Disk Caches: Basics ...........................................................................................
`0v.4.4 Experimental Results ........................................................................................
`47
`52
`0v.4.5 Conclusions .......................................................................................................
`Ov.5 What to Expect ............................................................................................
`54
`
`ix
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 10
`
`
`
`X Contents
`
`Part I
`Chapter I
`
`Chapter
`
`Cache ...............................................55
`An Overview of Cache Principles ......................................... 57
`1.1 Caches, ’Caches,’ and "Caches" ....................................................................59
`1.2 Locality Principles ........................................................................................62
`1.2.1
`Temporal Locality .................................................................................................. 63
`1.2.2 Spatial Locality ...................................................................................................... 63
`1.2.3 Algorithmic Locality .............................................................................................. 64
`1.2.4 Geographical Locality? Demographical Locality? ............................................... 65
`1.3 What to Cache, Where to Put It, and How to Maintain It .............................66
`1.3.1 Logical Organization Basics: Blocks, Tags, Sets .................................................... 67
`1.3.2 ConWnt Management: To Cache or Not to Cache ................................................68
`1.3.3 Consistency Management’. Its Responsibilities ..................................................... 69
`1.3.4
`Inclusion and Exclusion ........................................................................................ 70
`Insights and Optimizations ..........................................................................7a
`1.4.1 Perspective .............................................................................................................. 73
`1.4.2 Important Issues, Future Directions ..................................................................... 77
`
`1.4
`
`Logical Organization .........................................................
`79
`2.1 Logical Organization: A Taxonomy ..............................................................
`79
`2.2 Transparently Addressed Caches .................................................................82
`2.2.1 Implicit Management: Transparent Caches ......................................................... 86
`2.2.2 Explicit Management: Software-Managed Caches .............................................. 86
`2.a Non-TransparentlyAddressed Caches .........................................................90
`2.3.1 Explicit Management: Scratch-Pad Memories ..................................................... 91
`2.3.2 Implicit Management: Self-Managed Scratch-Pads ............................................ 92
`2.4 Virtual Addressing and Protection ...............................................................92
`2.4.1 Virtual Caches ........................................................................................................ 93
`2.4.2 ASIDs and Protection Bits ...................................................................................... 96
`2.4.3 Inherent Problems ................................................................................................. 96
`2.5 Distributed and Partitioned Caches ............................................................97
`2.5.1
`UMA and NUMA ...................................................................................................
`98
`2.5.2
`COMA .....................................................................................................................
`99
`2.5.3
`NUCA and NuRAPID .............................................................................................
`99
`2.5.4
`Web Caches ...........................................................................................................
`100
`2.5.5
`102
`Buffer Caches ........................................................................................................
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 11
`
`
`
`Chapter 3
`
`Contents xi
`
`2.6 Case Studies ................................................................................................ 103
`2.6.1 A Horizontal-Exclusive Organization: Victim Caches, Assist Caches ................ 103
`2.6.2 A Software Implementation: BSD’s Buffer Cache ............................................... 104
`2.6.3 Another Dynamic Cache Block: Trace Caches .................................................... 106
`
`Management of Cache Contents ..........................................
`117
`120
`3.1 Case Studies: On-Line Heuristics ...............................................................
`120
`3.1.1 On-Line Partitioning Heuristics .........................................................................
`129
`3.1.2 On-Line Prefetching Heuristics ...........................................................................
`141
`3.1.3 On-Line Locality Optimizations .........................................................................
`151
`3.2 Case Studies: Off-Line Heuristics ...............................................................
`151
`3.2.1 Off-Line Partitioning Heuristics .........................................................................
`155
`3.2.2 Off-Line Prefetching Heuristics ...........................................................................
`161
`3.2.3 Off-Line Locality Optimizations .........................................................................
`169
`a.a Case Studies: Combined Approaches .........................................................
`170
`3.3.1 Combined Approaches to Partitioning ...............................................................
`174
`3.3.2 Combined Approaches to Prefetching ................................................................
`180
`3.3.3 Combined Approaches to Optimizing Locality ..................................................
`202
`3.4 Discussions .................................................................................................
`202
`3.4.1 Proposed Scheme vs. Baseline .............................................................................
`203
`3.4.2 Prefetching vs. Locality Optimizations ...............................................................
`3.4.3 Application-Directed Management vs. Transparent Management .................. 203
`3.4.4 Real Time vs. Average Case ..................................................................................
`204
`3.4.5 Naming vs. Cache Conflicts .................................................................................
`205
`3.4.6 Dynamic vs. Static Management ........................................................................
`208
`3.5 Building a Content-Management Solution ...............................................
`212
`3.5.1
`Degree of Dynamism ...........................................................................................
`212
`3.5.2
`Degree of Prediction .............................................................................................
`213
`213
`3.5.3
`Method of Classification .....................................................................................
`Method for Ensuring Availability .......................................................................
`214
`3.5.4
`
`Chapter 4
`
`Management of Cache Consistency ....................................
`217
`4.1 Consistency with Backing Store .................................................................218
`4.1.1 Write-Through .....................................................................................................
`218
`4.1.2 Delayed Write, Driven By the Cache ....................................................................
`219
`4.1.3 Delayed Write, Driven by Backing Store .............................................................
`220
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 12
`
`
`
`xii Contents
`
`Chapter 5
`
`4.3.2
`
`4.3.3
`
`4.3.4
`
`4.2 Consistency with Self. .................................................................................220
`4.2.1 Virtual Cache Management ................................................................................
`220
`4.2.2 ASID Management. .............................................................................................. 225
`4.3 Consistency with Other Clients ..................................................................226
`Motivation, Explanation, Intuition ....................................................................
`226
`4.3.1
`Coherence vs. Consistency ...................................................................................
`231
`Memo ry- Consistency Models ..............................................................................
`233
`Hardware Cache-Coherence Mechanisms ..........................................................
`240
`254
`Software Cache-Coherence Mechanisms ...........................................................
`
`4.3.5
`
`Implementation Issues .......................................................257
`5.1 Overview .....................................................................................................
`257
`5.2 SRAM Implementation ...............................................................................
`258
`5.2.1 Basic 1-Bit Memory Cell ......................................................................................
`259
`5.2.2 Address Decoding .................................................................................................
`262
`5.2.3 Physical Decoder Implementation ......................................................................
`268
`5.2.4 Peripheral Bitline Circuits ...................................................................................
`278
`5.2.5 Sense Amplifiers ...................................................................................................
`281
`5.2.6 Write Amplifier .....................................................................................................
`283
`5.2. 7 SRAM Partitioning ...............................................................................................
`285
`5.2.8 SRAM Control and Timing ..................................................................................
`286
`5.2.9 SRAM Interface ....................................................................................................
`292
`5.3 Advanced SRAM Topics ...............................................................................
`293
`293
`5.3.1 Low-Leakage Operation ......................................................................................
`5.4 Cache Implementation ...............................................................................
`297
`297
`5.4.1
`Simple Caches ......................................................................................................
`5.4.2 Processor Interfacing ...........................................................................................
`298
`5.4.3 Multiporting .........................................................................................................
`298
`
`Chapter
`
`Cache Case Studies ......................................................... 301
`6.1 Logical Organization ..................................................................................301
`301
`6.1.1 Motorola MPC7450 ..............................................................................................
`6.1.2 AMD Opteron .......................................................................................................
`301
`6.1.3
`Intel ltanium-2 ....................................................................................................
`303
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 13
`
`
`
`Contents xiii
`
`6.2 Pipeline Interface .......................................................................................
`6.2.1 Motorola MPC7450 ..............................................................................................
`6.2.2 AMD Opteron .......................................................................................................
`6.2.3 Intel Itanium-2 ....................................................................................................
`6.3 Case Studies of Detailed Itanium-2 Circuits ..............................................
`L1 Cache RAM Cell Array .....................................................................................
`6.3.1
`L2 Array Bitline Structure ....................................................................................
`L3 Subarray Implementation ..............................................................................
`Itanium-2 TLB and CAM Implementation ........................................................
`
`6.3.2
`
`6.3.3
`
`6.3.4
`
`304
`304
`304
`304
`305
`305
`305
`308
`308
`
`Part II DRAM ...........................................313
`Chapter 7 Overview of DRAMs ......................................................315
`7.1 DRAM Basics: Internals, Operation ...........................................................
`316
`7.2 Evolution of the DRAM Architecture .........................................................
`322
`7.2.1
`Structural Modifications Targeting Throughput ...............................................
`322
`7.2.2
`328
`Interface Modifications Targeting Throughput. .................................................
`7.2.3
`Structural Modifications Targeting Latency .......................................................
`330
`7.2.4 Rough Comparison of Recent DRAMs ................................................................
`331
`7.3 Modern-Day DRAM Standards ...................................................................
`332
`7.3.1
`Salient Features of JEDEC’s SDRAM Technology ................................................ 332
`7.3.2 Other Technologies, Rambus in Particular. ........................................................
`335
`7.3.3 Comparison of Technologies in Rambus and JEDEC DRAM ............................. 341
`7.3.4 Alternative Technologies ......................................................................................
`343
`7.4 Fully Buffered DIMM: A Compromise of Sorts ..........................................
`348
`7.5 Issues in DRAM Systems, Briefly ................................................................
`350
`350
`Architecture and Scaling .....................................................................................
`Z5.1
`Topology and Timing ...........................................................................................
`350
`Z5.2
`351
`Z5.3
`Pin and Protocol Efficiency .................................................................................
`Power and Heat Dissipation ...............................................................................
`351
`Z5.4
`Future Directions ................................................................................................
`351
`Z5.5
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 14
`
`
`
`xiv Contents
`
`Chapter 8
`
`DRAM Device Organization: Basic Circuits and
`Architecture ................................................................... 353
`8.1 DRAM Device Organization .......................................................................3153
`8.2 DRAM Storage Cells .................................................................................... 31515
`356
`8.2.1 Cell Capacitance, Leakage, and Refresh ...........................................................
`8.2.2 Conflicting Requirements Drive Cell Structure ................................................
`356
`8.2.3
`357
`Trench Capacitor Structure ...............................................................................
`8.2.4
`357
`Stacked Capacitor Structure ..............................................................................
`8.3 RAM Array Structures .................................................................................
`358
`359
`8.3.1 Open Bitline Array Structure .............................................................................
`360
`8.3.2 Folded Bitline Array Structure ...........................................................................
`8.4 Differential Sense Amplifier .......................................................................
`360
`8.4.1 Functionality of Sense Amplifiers in DRAM Devices ........................................
`361
`8.4.2 Circuit Diagram of a Basic Sense Amplifier .....................................................
`362
`8.4.3 Basic Sense Amplifier Operation .......................................................................
`362
`8.4.4 Voltage Waveform of Basic Sense Amplifier Operation .................................... 363
`365
`8.4.5 Writing into DRAM Array ..................................................................................
`8.5 Decoders and Redundancy ........................................................................
`366
`368
`8.5.1 Row Decoder Replacement Example ................................................................
`8.6 DRAM Device Control Logic .......................................................................
`368
`8.6.1 Synchronous vs. Non-Synchronous ..................................................................
`369
`370
`8.6.2 Mode Register-Based Programmability ............................................................
`8.7 DRAM Device Configuration ......................................................................
`370
`8.7.1 Device Configuration Trade-offs .......................................................................
`371
`8.8 Data I/0 .......................................................................................................
`372
`3 72
`8.8.1 Burst Lengths and Burst Ordering ....................................................................
`372
`8.8.2 N-Bit Prefetch .....................................................................................................
`DRAM Device Packaging ............................................................................
`373
`DRAM Process Technology and Process Scaling
`Considerations ...........................................................................................
`8.10.1 Cost Considerations ...........................................................................................
`8.10.2 DRAM- vs. Logic-Optimized Process Technology .............................................
`
`374
`375
`375
`
`8.9
`8.10
`
`Chapter
`
`DRAM System Signaling and Timing ................................. 377
`9.1 Signaling System ........................................................................................377
`
`PATENT OWNER DIRECTSTREAM, LLC
`EX. 2141, p. 15
`
`
`
`Contents xv
`
`9.2 Transmission Lines on PCBs ......................................................................
`9.2.1 Brief Tutorial on the Telegrapher’s Equations ...................................................
`9.2.2 RC and LC Transmission Line Models ...............................................................
`9.2.3 LC Transmission Line Model for PCB Traces .....................................................
`9.2.4
`Signal Velocity on the LC Transmission Line ....................................................
`9.2.5
`Skin Effect of Conductors ...................................................................................
`9.2.6 Dielectric Loss .....................................................................................................
`9.2. 7 Electromagnetic Interference and Crosstalk .....................................................
`9.2.8 Near-End and Far-End Crosstalk .....................................