`

`INDEX
`PART NUMBER
`FUNCTIONAL
`CROSS REFERENCE
`
`GENERAL INFORMATION
`INTRODUCTION
`CUSTOM CAPABILITIES
`QUALITY ASSURANCE & QUALITY CONTROL
`
`PAGE I 3
`131
`DATA COMMUNICATION PRODUCTS ..... 25.1641
`BAUD RATE GENERATOR ..... 165.1941
`
`_
`
`4-7
`8-10
`
`11_
`14-17
`18-24
`
`TABLE
`OF
`CONTENTS
`
`CRT DISPLAY ..... 195.2921
`
`MICROPROCESSOR PERIPHERAL ..... 293.3541
`
`PRINTER ..... 355.3681
`
`KEYBOARD ENCODER ..... 369.3821
`
`MiCROCOMPUTER ..... 383.390 I
`
`ORDERING INFORMATION ..... 391.3951
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`CISCO 1042
`Cisco v. ChriMar
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`I
`
`PART NUMBER
`CCC 3500
`CG 4103
`COM 1553A
`COM 1671
`COM 1863
`COM 2017
`COM 2017H
`COM 2449
`COM 2502
`COM 2502H
`COM 2601
`COM 2651
`COM 2661
`COM 5016
`COM 5016T
`COM 5025
`COM 5026
`COM 5026T
`COM 5036
`COM 5036T
`COM 5046
`COM 5046T
`COM 8004
`COM 8017
`COM 8046
`COM 8116
`COM 8116T
`COM 8126
`COM 8126T
`COM 8136
`COM 8136T
`COM 8146
`COM 8146T
`COM 8251A
`
`PART NUMBER INDEX
`
`PAGE
`339
`357
`27
`43
`59
`67
`67
`75
`67
`67
`91
`99
`111
`167
`167
`123
`169
`169
`171
`171
`173
`173
`135
`141
`179
`181
`181
`183
`183
`185
`185
`187
`187
`149
`
`3
`
`PART NUMBER
`COM 8502
`CRT 5027
`CRT 5037
`CRT 5047
`CRT 5057
`CRT 7004
`CRT 8002
`CRT 8002H
`CRT 8021
`CRT 9006
`CRT 9007
`CRT 9021
`CRT 9212
`CRT 96364
`FOC 1761
`FOC 1763
`FOC 1765
`FOC 1767
`FOC 1791
`FOC 1792
`FOC 1793
`FOC 1794
`FOC 1795
`FOC 1797
`FOC 3400
`FOC 9216/8
`KR 2376
`KR 3600
`MPU 3870
`ROM 4732
`ROM 36000
`SR 5015
`SR 5017
`SR 5018
`
`PAGE
`141
`197
`197
`205
`197
`255
`235
`247
`273
`261
`207
`281
`267
`227
`295
`295
`295
`295
`311
`311
`311
`311
`311
`311
`339
`327
`371
`375
`383
`347
`351
`361
`365
`365
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`FUNCTIONAL INDEX
`
`~ Data Communication Products
`
`Part
`Name
`Number
`COM 1553A MIL-STD-
`1553A UART
`ASTRO
`
`COM 1671
`
`COM 1863
`
`UART
`
`COM 2017
`
`UART
`
`COM 20l7H UART
`
`COM 2449
`
`COM 2502
`
`UART
`
`COM 2502H UART
`
`COM 2601
`
`USRT
`
`Max
`Baud Rate
`
`Power
`Supplies
`
`Package
`
`Page
`
`1 MB
`
`+5
`
`40 DIP
`
`27-42
`
`1 MB
`
`+5,-5,+12
`
`40 DIP
`
`43-58
`
`6205 KB
`
`+5
`
`40 DIP
`
`59-66
`
`25KB
`
`+5,-12
`
`40 DIP
`
`67-74
`
`40KB
`
`+5,-12
`
`40 DIP
`
`67-74
`
`1 MB
`
`+5
`
`40 DIP
`
`75-90
`
`25KB
`
`+5,-12
`
`40 DIP
`
`67-74
`
`40KB
`
`+5,-12
`
`40 DIP
`
`67-74
`
`+5,-12
`
`Description
`MIL-STD-1553 (Manchester) Interface
`Controller
`Asynchronous/Synchronous
`Transmitter/Receiver, Full Duplex, 5-8
`data bit, IX or 32X clock
`Universal Asynchronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`I, 1 1/2, 2 stop bit, enhanced distortion
`margin
`Universal Asynchronous Receiver
`Transmitter, Full Duplex, 5-8 data bit,
`I, 1 1/2, 2 stop bit
`Universal Asynchronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`I, 11/2,2 stop bit
`RB449-USART RS 449 Compatible Universal
`Synchronous/~chronous
`Receiver/Transmitter
`Universal ~chronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`1,2 stop bit
`Universal ~chronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`1,2 stop bit
`Universal Synchronous Receiver/
`Transmitter, STR, BSC, Bi-sync
`compatible
`Universal Synchronous/Asynchronous
`Receiver/Transmitter, Full Duplex, 5-8
`data bits; I, 11/2,2 stop bit, IX, 16X,
`64X clock
`Universal Synchronous/Asynchronous
`Receiver/Transmitter, Full Duplex, 5-8
`data bits; I, 1112,2 stop bit, IX, 16X,
`64X clock
`Multi-Protocol SDLC, HDLC, ADCCP, Bi-sync, DDCMP
`USYNRT
`compatible, automatic bit stuffing/
`stripping, frame detection/generation,
`CRC generation/checking, sync detection
`Companion device to COM 5025
`for 32 bit CRC
`
`USART/PCI
`
`USART/EPCI
`
`COM 2651
`
`COM 2661
`
`COM 5025
`
`COM 8004
`
`COM 8017
`
`250KB
`
`40 DIP
`
`91-98
`
`1 MB
`
`+5
`
`28 DIP
`
`99-110
`
`1 MB
`
`+5
`
`28 DIP
`
`111-122
`
`105MB
`
`+5, +12
`
`40 DIP
`
`123-134
`
`200MB
`
`40KB
`
`+5
`
`+5
`
`20 DIP
`
`135-140
`
`40 DIP
`
`141-148
`
`6205KB
`
`+5
`
`40 DIP
`
`59-66
`
`64 KB (sync)
`906 KB (async)
`
`40KB
`
`+5
`
`+5
`
`28 DIP
`
`149-164
`
`40 DIP
`
`141-148
`
`Universal Asynchronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`1,11/2,2 stop bit
`Universal Asynchronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`I, 1l/2, 2 stop bit, enhanced distortion
`margin
`Universal Synchronous/Asynchronous
`Receiver/Transmitter, Full Duplex, 5-8
`data bit, I, 11/2,2 stop bit
`Universal Asynchronous Receiver/
`Transmitter, Full Duplex, 5-8 data bit,
`1,2 stop bit
`
`4
`
`32 Bit CRC
`Generator/
`Checker
`UART
`
`COM 8018
`
`UART
`
`COM 8251A USART
`
`COM 8502
`
`UART
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`~ Baud Rate Generator
`
`All Baud Rate Generators are programmable
`dividers capable of providing 16 output frequen(cid:173)
`cies" for UARTs or USARTs from either an on-Chip
`crystal oscillator or an external frequency input.
`"T" versions utilize an external frequency input
`only. Dual Baud Rate Generators provide two out-
`
`put frequencies simultaneously for full duplex
`communications.
`Baud Rate Generators providing all standard baud
`rates from various popular crystal frequencies are
`available. In addition the baud rate generator mBJ"
`be custom mask programmed for other divisors.
`
`I
`
`"except as noted
`
`Part Number
`COM 5016
`
`Description
`Dual Baud Rate Generator
`
`COM 5016T(3)
`COM 5026
`
`Dual Baud Rate Generator
`Single Baud Rate Generator
`
`COM 5026T(3)
`COM 5036
`
`Single Baud Rate Generator
`Dual Baud Rate Generator
`
`COM 5036T (3)
`
`Dual Baud Rate Generator
`
`COM 5046
`
`Single Baud Rate Generator
`
`COM 5046T (3)
`
`Single Baud Rate Generator
`
`COM 8046
`
`Single Baud Rate Generator
`
`COM 8046T (3)
`
`Single Baud Rate Generator
`
`COM 8116
`
`Dual Baud Rate Generator
`
`COM 8116T (3)
`
`Dual Baud Rate Generator
`
`COM 8126
`
`Single Baud Rate Generator
`
`COM 8126T (3)
`
`Single Baud Rate Generator
`
`COM 8136
`
`Dual Baud Rate Generator
`
`COM 8136T (3)
`
`Dual Baud Rate Generator
`
`COM 8146
`
`Single Baud Rate Generator
`
`COM 8146T (3)
`
`Single Baud Rate Generator
`
`Features
`On-chip oscillator or external
`frequency input
`External frequency input
`On-chip oscillator or external
`frequency input
`External frequency input
`COM 5016 with additional
`output of input frequency --;- 4
`COM: 5016T with additional
`output of input frequency --;- 4
`COM 5026 with additional
`output of input frequency --;- 4
`COM 5026T with additional
`output of input frequency --;- 4
`32 baud rates; IX, 16X, 32X
`clock outputs; single +5 volt
`supply
`COM 8046 with external
`frequency input only
`Single +5 volt version of
`COM 5016
`Single +5 volt version of
`COM 5016T
`Single +5 volt version of
`COM 5026
`Single +5 volt version of
`COM 5026T
`Single +5 volt version of
`COM 5036
`Single +5 volt version of
`COM 5036T
`Single +5 volt version of
`COM 5046
`Single +5 volt version of
`COM 5046T
`
`Power
`Supplies
`+5,+12
`
`+5,+12
`+5,+12
`
`+5,+12
`+5,+12
`
`Package
`18 DIP
`
`Page
`167-168
`
`18 DIP
`14 DIP
`
`14 DIP
`18 DIP
`
`167-168
`169-170
`
`169-170
`171-172
`
`+5,+12
`
`18 DIP
`
`171-172
`
`+5,+12
`
`14 DIP
`
`173-174
`
`+5,+12
`
`14 DIP
`
`173-174
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`+5
`
`16 DIP
`
`179-180
`
`16 DIP
`
`179-180
`
`18 DIP
`
`181-182
`
`18 DIP
`
`181-182
`
`14 DIP
`
`183-184
`
`14 DIP
`
`183-184
`
`18 DIP_
`
`185-186
`
`18 DIP
`
`185-186
`
`14 DIP
`
`187-188
`
`14 DIP
`
`187-188
`
`,~ Keyboard Encoder
`
`Part Number
`KR-2376 XX(3)
`KR-3600 XX (3)
`
`No. of Keys Modes
`88
`3
`90
`4
`
`(3)M~ be custom mask programmed
`
`Features
`2 Key Rollover
`2 Key or
`N Key Rollover
`
`Standard Fonts
`Description
`SUffix
`-ST
`ASCII
`-ST
`ASCII
`-STD
`ASCII
`-PRO
`Binary Sequential
`
`Power
`SUpplies Package
`+5,-12
`40 DIP
`+5, -12
`40 DIP
`
`Page
`371-374
`375-382
`
`5
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`

`

`

`

`Description
`
`SMC
`Part #
`
`AMI
`
`Fairchild
`
`UART (1112 8B)**
`
`COM 2017
`
`81883
`
`UART (1, 28B)**
`
`COM 2502
`
`-
`
`UART (n-Channel)**
`
`COM 8017
`
`86850*
`
`UART (n-Channel)**
`
`COM 8502
`
`-
`
`UART (n-Channel)*
`
`COM 1863
`
`U8RT
`
`A8TRO
`
`PCI
`
`EPCI
`
`USART
`
`COM 2601
`
`COM 1671
`
`COM 2651
`
`COM 2661
`
`COM 8251A
`
`81602
`
`82350*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`SMCCROSS
`
`Harris
`
`Intel
`
`Intersil
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`IM6402
`
`General
`Instrument
`
`AY 5-1013A
`
`AY 5-1013
`
`AY 3-1015
`
`HM6402
`
`AY 3-1015
`
`HM6403*
`
`8251*
`
`IM6403*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`8251A
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`Multi-Protocol,
`USYNRT
`
`Dual Baud Rate Gen.
`
`COM 5025
`
`COM 5016/36
`COM 8116/36
`
`8ingle Baud Rate Gen. COM 5026/46
`COM 8126/46
`
`88 Key KB Encoder
`
`KR 2376
`
`90 Key KB Encoder
`
`KR3600
`
`CRT Controller
`
`CRT 5037
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`Character Generator
`
`CRT 7004
`
`88564*
`
`Character Generator
`
`CRT8002
`
`-
`
`Character Generator
`
`CG4100
`
`88499
`
`8hift Register
`
`ROM
`
`ROM
`
`8R5015
`
`82182/3/5
`
`ROM 4732
`
`868332
`
`ROM 36000
`
`84264*
`
`F3846*
`F6856*
`
`-
`
`F4702*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`HD4702*
`HD6405*
`
`AY 5-2376
`
`AY 5-3600
`
`-
`
`-
`
`-
`
`RO 5-22408*
`
`-
`
`RO 3-9332
`
`RO 3-9364
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`8275*
`
`-
`
`-
`
`-
`
`-
`
`2332*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`* Functional Equivalent
`**Most UART's are interchangeable; consult the factory for detailed information on interchangeability.
`
`8
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`REFERENCE GUIDE
`
`:ommodore
`(MOS
`"echnology)
`
`Mostek
`
`Motorola
`
`National
`
`NEe
`
`Signetics
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`MC6850*
`
`-
`
`MM5303*
`
`f../PD369*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`2536
`
`-
`
`-
`
`-
`
`Solid
`State
`Scientific
`
`-
`
`-
`
`SCR1854
`
`-
`
`-
`
`Synertec
`
`Western
`Texas
`Instruments Digital
`
`-
`
`-
`
`-
`
`-
`
`-
`
`TMS6011
`
`TR1602
`
`-
`
`-
`
`-
`
`-
`
`TR1402
`
`-
`
`TR1983*
`
`TR1863
`
`I
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`INS1671
`
`INS2651
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`2651
`
`2661
`
`INS8251
`
`f../PD8251A.
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`SY2661
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`UC1671
`
`-
`
`-
`
`-
`
`SD1933*
`
`-
`
`-
`
`-
`
`-
`
`MCS1009*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`MC14411 *
`
`MM5307*
`
`f../PD379*
`
`2652
`
`SND5025
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`MM5740*
`
`f../PD364*
`
`-
`
`MK3807
`
`MC6845*
`
`DP8350*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`TMS5001
`
`SND5027
`SND5037
`
`6545*
`
`TMS9927
`
`BR1941 L
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`MCM66700*
`MC6570*
`
`DM8678*
`
`-
`
`-
`
`MCS1004*
`MCS2027*
`
`MK2002
`
`MC1132*
`
`M5240*
`
`-
`
`MK1007*
`
`-
`
`5054*
`
`2332
`
`2364*
`
`-
`
`MCM8332
`
`-
`
`JIPD2332
`
`2632
`
`MK36000 MCM68A364* MM52864*
`
`JIPD2364*
`
`2664*
`
`2609*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`2532*
`
`-
`
`-
`
`-
`
`-
`
`SY2332
`
`-
`
`-
`
`TMS4103
`
`TMS3113*
`TMS3114*
`TMS4732
`
`SY2364*
`
`TMS4764*
`
`-
`
`-
`
`-
`
`-
`
`-
`
`SND8002
`
`-
`
`-
`
`-
`
`-
`
`For Floppy Disk Controllers-See Next Page
`
`9
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`FLOPPY DISK CONTROLLERS
`
`Description
`
`SMC
`Part #
`
`Fairchild Fujitsu
`
`Mostek
`
`Synertec
`
`Western
`Digital
`
`Floppy Disk Controller
`
`FDC 1791-02
`
`Floppy Disk Controller
`
`FDC 1792-02
`
`Floppy Disk Controller
`
`FDC 1793-02
`
`Floppy Disk Controller
`
`FDC 1794-02
`
`Floppy Disk Controller
`
`FDC 1795-02
`
`Floppy Disk Controller
`
`FDC 1797-02
`
`Floppy Disk Controller
`
`FDC 1761-02
`
`Floppy Disk Controller
`
`FDC 1763-02
`
`Floppy Disk Controller
`
`FDC 1765-02
`
`Floppy Disk Controller
`
`FDC 1767-02
`
`Floppy Disk Data Separator
`
`FDC 9216
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`Microcomputer
`
`MPU 3870
`
`F3870-2
`
`*Functional Equivalent
`
`MB8876
`
`-
`
`M8877
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`MK3870/20
`
`SY1791-02
`
`FD 1791-02
`
`-
`
`FD 1792-02
`
`SY1793-02
`
`FD 1793-02
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`-
`
`FD 1794-02
`
`FD 1795-02
`
`FD 1797-02
`
`FD 1761-02
`
`FD 1763-02
`
`FD 1765-02
`
`FD 1767-02
`
`FD 1691*
`
`-
`
`10
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`I
`
`-
`
`Innovation in microelectronic technology is the key to
`growth at Standard Microsystems.
`Since its inception, Standard Microsystems has been a leader in creating new tech-
`nology for metal oxide semiconductor large scale integrated (MOS/LSI) circuits.
`For example, while the first MOS/LSI processes were p-channel, it was recognized
`very early that an n-channel process would greatly improve switching speeds and
`circuit density. However, the fundamental problem of parasitic currents needed to
`be solved. The research and development staff at Standard Microsystems recognized
`this problem and directed its energy toward the development of its now-famous
`COPLAMOS® technology. COPLAMOS® defines a self-aligned, field-doped, locally
`oxidized structure which produces high-speed, high-density n-channel IC's.
`In addition, on-chip generation of substrate bias, also pioneered by Standard
`Microsystems, when added to the COPLAMOS® technology, results in the ability to
`design dense, high-speed, low-power n-channel MOS integrated circuits through the
`use of one external power supply voltage.
`Again recognizing a need and utilizing its staff of qualified process experts, Stan(cid:173)
`dard Microsystems developed the CLASP® process. The need was for fast turna(cid:173)
`round, easily programmable semi-custom LSI technology. The development was
`CLASP®, a process that utilizes ion implantation to define either an active or passive
`device which allows for the presence of a logical 1 or 0 in the matrix of a memory or
`logic array. This step is accomplished after all wafer manufacturing steps are
`performed including metalization and final passiviation layer formation. Thus, the
`wafer can be tested and stored until customer needs dictate the application, a huge
`saving in turnaround time and inventory costs.
`These innovations in both process and circuit technology have received wide(cid:173)
`spread industry recognition; In fact, many of the world's most prominent semicon(cid:173)
`ductor companies have been granted patent and patent/technology licenses covering
`various aspects of these technologies. The companies include Texas Instruments,
`IBM, General Motors, ITT, Western Electric, Mostek, Hitachi and Fujitsu.
`Over the past few years, scientists and engineers at Standard Microsystems have
`been developing a technology to significantly reduce the sheet resistivity of
`polycrystalline silicon and thereby dramatically decrease internal time constants in
`MOS devices. Their work has culminated in the successful completion of a program
`to replace polycrystalline silicon in n-channel MOS devices with an alternate mate(cid:173)
`rial, titanium disilicide. This has enabled Standard Microsystems to become the first
`semiconductor manufacturer to market and sell MOSNLSI circuits which employ a
`metal silicide to replace the conventional doped polycrystalline silicon layer.
`
`11
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`Our engineering staff follows the principle that "necessity
`is the mother of invention. "
`This philosophy led Standard Microsystems Corporation to COPLAMOS®, CLASP®,
`and Titanium Oisilicide gate technology, as well as other innovative developments. It
`also brings companies to us to solve tough problems that other suppliers can't.
`But it's a philosophy that involves more than just developing the next generation of
`MOS/LSI devices.
`Such exploration, for example, helped Standard Microsystems recognize the need
`for communication controllers to handle the latest data communication protocols.
`As a result, Standard Microsystems was the first to introduce a one-chip LSI controller
`for HDLC protocols-the COM 5025.
`The COM 5025 is so versatile it can actually provide the receiver/transmitter func(cid:173)
`tions for all the standard bit and byte oriented synchronous protocols, including
`SOLC, HDLC, ADCep, bi-sync and ODCMP.
`In another area, CRT display systems have traditionally required a great deal of
`support circuitry for the complex timing, refresh and control functions.
`This need led the engineers at Standard Microsystems to develop the CRT 5027
`Video Timer and Controller eVTAC®) that provides all these functions on a single
`chip. This left the display, graphics and attributes control spread over another 20 or
`30 SSI, MSI and LSI devices. Standard Microsystems combined all these functions in
`the CRT 8002 Video Display Attributes Controller eVDAC n' ). The COPLAMOS® pro
`ccess was used to achieve a 20 MHz video shift register, and CLASP® was used for
`fast turnaround of character font changes through its last stage programmability.
`So from 60 to 80 integrated circuits, Standard Microsystems reduced display and
`timing to 2 devices, drastically reducing the cost and size of today's CRT terminals.
`Another major achievement was the development of the "next generation" Video
`Processor And Controller (VPAC™), the CRT 9007. This chip replaces up to 80 SSI
`and MSI TTL devices as well as providing a hardware solution to many of the
`software problems of CRT Video Controller design.
`Achievements like these help keep Standard Microsystems custom and standard
`products in the forefront of technology with increased speeds and densities, and a
`lower cost per function.
`
`12
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`I
`
`Improvements in processing and manufacturing keep
`pace with advances in semiconductors.
`With the phenomenal growth of the electronics industry, innovation is, of course,
`highly desirable. But if the products are to perform as designed, they also have
`to be reliable.
`That's why at Standard Microsystems we take every means to insure the utmost
`quality and dependability. Consequently, "state-of-the-art" applies not only to our
`products, but to the way we manufacture them.
`In wafer fabrication, the latest equipment and techniques are-employed. In addi(cid:173)
`tion to conventional processing equipment, we use ion implantation technology
`extensively. We also use plasma reactors for much of our etching and stripping oper(cid:173)
`ations to maintain tight tolerances on process parameters.
`To make plastic packaging immune to moisture, we use a process that deposits a
`protective (passivating) layer of silicon nitride on the device surface.
`Standard Microsystems processes include high and low voltage p-channel metal
`gate, n-channel silicon gate (COPLAMOS®), high-speed n-channel silicon gate with
`depletion mode devices, CLASP® and titanium disilicide gate. In general, these
`processes have been engineered so that they are also compatible with most
`industry standard processes.
`One obvious advantage our total capability gives customers, is that they can bring
`us their project at any stage in the development process. For instance, they may
`already have gone through system definition. Or they may have gone all the way to
`prototype masks, and only want production runs.
`It makes no difference to Standard Microsystems. We can enter the process at
`any level.
`Our full service capability lets us make full use of the technologies we develop. We
`can produce any quantity of semiconductors customers may require. And we can
`offer them one of the fastest turnaround times in the industry.
`
`13
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`Standard Microsystems' Custom Capability.
`
`Custom MOS. A Small
`Revolution with a Large Impact
`Remarkable advances in semiconductor tech(cid:173)
`nology, combined with the availability of
`quality, low-cost electronics, continue to open
`new markets for products incorporating micro(cid:173)
`electronic components.
`Today, metal-oxide semiconductor/large
`scale integrated (MaS/LSI) circuits are integral
`components in computers and computer
`peripherals, automobiles, televisions, electrical
`appliances, electronic toys and games, bank
`terminals, telephones and a host of other signif(cid:173)
`icant applications.
`With further applications for large scale inte(cid:173)
`grated and very large scale integrated (VLSI)
`circuits being discovered every day, one thing is
`certain. They will have a profound effect on
`our lifestyle.
`
`Custom Commitment
`Standard Microsystems is organized into two
`separate Product Lines; Custom Products and
`Standard Products. Custom Products has its
`own management, marketing, and engineering
`team that is fully dedicated to developing and
`producing custom products.
`Custom MaS/LSI is a major portion of our
`business. Fully one-third of all our revenue is a
`direct result of our custom MaS/LSI projects.
`Over the years, Standard Microsystems has
`developed custom circuits for a wide variety
`of applications: Computers and computer
`peripherals, telecommunications and data com(cid:173)
`munications, garage door openers and burglar
`alarms, electronic toys and games, musical
`instruments and more. Both over-the-air and
`cable T.V. systems have made use of our cus(cid:173)
`tom circuits. One company's line of word
`.
`processing equipment makes almost exclusive
`use of our custom LSI.
`As a company committed to serve the custom
`marketplace, Standard Microsystems has
`developed the resources and established proce(cid:173)
`dures for MOS/LSI circuit development that
`enables the company to respond rapidly to
`growing customer needs.
`
`System Design-The Alternatives
`The electronic system designer can select from
`several alternatives in the implementation of the
`system. The optimum selection for any system
`will depend upon the relative significance of the
`following factors-
`• Costs-developmental, production and
`maintenance;
`• Performance-speed, power dissipation;
`• Form factor-system size and weight;
`• Uniqueness-proprietary features;
`• Development time-product introduction;
`• Reliability-mean time between failures
`(MTBF).
`No single alternative is best for all cases(cid:173)
`each represents a combination of advantages
`and disadvantages to be evaluated for the sys(cid:173)
`tem under consideration. The major alternatives
`available are listed below.
`Standard Circuits
`The use of "off the shelf" small scale (SSI) ,
`medium scale (MSI) , or large scale (LSI) inte(cid:173)
`grated circuits is appropriate whenever develop(cid:173)
`ment costs and time must be kept to a
`minimum, and system performance require(cid:173)
`ments can be met by interconnecting numbers
`of such standard components. Standard Micro(cid:173)
`systems is a recognized industry leader in
`standard LSI components for the data communi-
`.cations and computer peripheral markets.
`Microprocessors
`These programmable LSI standard circuits can
`be the elements of choice for certain classes of
`systems where there is a good fit between the
`microprocessor capability and the system
`performance requirements. The system parts
`count is reduced at the expense of a longer
`(software) development time.
`Gate Arrays
`A gate array is a semi-custom circuit containing
`a pattern of elements which can be selectively
`interconnected to form the desired logic. The
`interconnections are typically accomplished by
`a customized metal pattern.
`For low to medium volume production, these
`"hardware programmable" circuits can reduce
`parts count and offer some degree of unique(cid:173)
`ness, at modest development cost and time.
`
`14
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`I
`
`The Custom Option
`FOR HIGH VOLUME PRODUCTION, WHERE
`THE DEVELOPMENT INVESTMENT CAN BE
`MADE, THE CLEAR CHOICE IS THE FULLY(cid:173)
`CRAFTED CUSTOM CIRCUIT. A custom circuit
`implementation will provide-
`Lowest Overall Cost
`The overall cost savings realized with custom
`LSI can be substantial, especially wh'en high(cid:173)
`volume production is encountered.
`Savings are effected in several ways. Because
`custom designed circuits contain only neces(cid:173)
`sary components, the cost of unused circuitry
`on. st~ndo:rd .microprocessors or integrated cir(cid:173)
`CUltS.IS ellmmated. Costs for troubleshooting,
`repair and warranty claims are reduced. In addi(cid:173)
`tion, custom MOS can be more economical over
`SSI and MSI when purchase, inventory and
`assembly costs are considered. Also, when a
`~ystem contains a large amount of SSI and MSI,
`Its custom counterpart can significantly reduce
`power consumption.
`Lowest Parts Count
`There are many applications where a single(cid:173)
`package custom LSI circuit can out-perform a
`microprocessor and its ROM and RAM circuits
`~hile reducing costs. A custom LSI unit can rap(cid:173)
`Idly exec~te repe.titive functions using high
`speed logiC. A microprocessor needs time-con(cid:173)
`suming algorithms to do the same thing.
`Highest Reliability
`Higher reliability is achieved, especially when
`replacing circuits that contain significant
`amounts of SSI and MSI. Fewer parts and solder
`points reduce the failure rate and raise the relia(cid:173)
`bility. This means low MTTR (mean time to
`repair), which translates into lower mainte(cid:173)
`nance costs and higher customer satisfaction.
`Minimum Size, Weight, Power Dissipation
`The size and complexity of printed circuit
`boards are greatly reduced when using a cus(cid:173)
`tom circuit. The custom circuit results in a most
`compact package, specifically designed to
`perform only the necessary tasks utilizing mini(cid:173)
`mum power and space.
`Unique Proprietary Features
`Proprietary design is another major benefit. It
`protects your design from would-be copiers
`be~ause it make.s testing and support difficult.
`ThiS, coupled with the complexity of custom
`semiconductor fabrication, makes duplicating
`your custom circuit far less probable.
`
`The Full Design Custom
`Program
`Typically in a custom program where Standard
`Microsystems performs all of the operations(cid:173)
`from design through to finished product-the
`following sequence applies:
`
`Evaluation
`The customer's system characteristics are care(cid:173)
`fully evaluated from the information provided
`to determine the feasibility of the custom
`approach, considering such factors as system
`partitioning, functional performance opera(cid:173)
`tion~l environment, operating speed,' power
`reqUIrements, process selection, packag-
`ing and testing.
`If the conclusion is positive, Standard Micro(cid:173)
`systems will quickly provide a Quotation to the
`potential customer, which will include-
`• a firm development schedule
`• the non-recurring engineering charge (NRE)
`• a production price schedule
`System Definition
`Once the design is authorized, a thorough spec(cid:173)
`ification review takes place between Standard
`Microsystems' engineers and the customer's
`engineers. In this critical phase, Standard
`Microsystems' years of successful design expe(cid:173)
`rience are applied as an extension of the
`customer's design resource in a close working
`relationship.
`Circuit Design
`Required functions are converted to detailed
`MOS logic. The logic is verified via advanced
`logic simulation routines, utilizing our in-house
`computers (VAX, Eclipse, PDP-I!), and/or
`breadboard emulators. Circuit simulation is
`done using SPICE, MOSAID, and Standard
`Microsystems written software.
`Artwork Generation
`At Standard Microsystems, device layout is a
`blend of custom "hand-crafting" and sophisti(cid:173)
`cated CAD, using our Calma GDS I and GDS II
`color graphics systems, to achieve the optimum
`composite drawing in terms of size and sched(cid:173)
`ule. Check plots are obtained on our Xynetics
`and Versatec plotters, and advanced design rule
`checks (DRC) and electrical rule checks (ERC)
`provide comprehensive artwork verification.
`Mask Fabrication
`Production tooling is obtained from qualified
`mask vendors to Standard Microsystems' exact-
`
`15
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`ing, above-industry standards. Colored overlays
`of each mask layer are typically used as a final
`check point.
`
`Wafer Fabrication
`Standard Microsystems offers a variety of pro(cid:173)
`cesses, including a mature p-channel metal
`gate process, and a range of n-channel silicon
`gate processes. We will determine the appropri(cid:173)
`ate process to satisfy each customer's cost!
`performance requirements.
`All wafer processing is done in our facilities,
`utilizing state-of-the-art equipment. Standard
`
`Microsystems has made substantial investments
`in direct-step-on-wafer equipment, and
`advanced ion-implantation, sputtering, deposi(cid:173)
`tion and plasma etch equipment.
`
`Assembly
`Standard Microsystems can provide a wide vari(cid:173)
`ety of industry-standard packages, including
`ceramic, plastic and CERDIP dual-in-line types,
`flat-packs and chip carriers. The latest in
`automated equipment, such as our automatic
`wire bonders, insure high quality and high
`volume throughput.
`
`MASK
`PROCESS LEVELS
`5
`3000
`
`5000
`
`6000
`
`7000
`
`8000
`
`9000
`
`5
`
`6
`
`7
`
`6
`
`7
`
`SMC PROCESS CHARACTERISTICS
`TYPICAL
`MAX.
`FREQ.
`SUPPLY
`(MHz)
`VOLTAGES
`+5, -12
`1 to 3
`
`FEATURES/COMMENTS
`p-channel metal gate. Enhancement
`mode, most mature process, low
`performance.
`n-channel si-gate. Enhancement
`mode, most mature n-channel
`process, moderate performance.
`Substrate bias required.
`Same as 5000 process with buried
`contacts.
`n-channel si-gate. Enhancement!
`depletion mode, buried contacts,
`moderate to high performance. No
`substrate bias required.
`Same as 7000 process without buried
`contacts.
`Very high performance n-channel si-
`gate. Enhancement/depletion mode.
`Substrate bias required.
`
`+5, + 12
`-3 (or pump)
`
`3 to 7
`
`+5, +12,
`-3 (or pump)
`+5
`
`3 to 7
`
`6 to 15
`
`+5
`
`+5
`+ 12 (optional)
`-3 (or pump)
`
`6 to 15
`
`9 to 25
`
`Customer Owned Tooling
`An area of continuing interest to Standard
`Microsystems is that of Customer Owned
`Tooling (COT) or Customer Supplied Tooling
`(CST). In contrast to a full custom design pro(cid:173)
`gram where Standard Microsystems is responsi(cid:173)
`ble for the MaS design, a COT/CST program
`is one in which the design function will be
`completed by the customer or an outside
`design house.
`Many customers find it desirable to develop
`an in-house LSI design capability, for their inter(cid:173)
`nal circuit requirements. Standard Microsys(cid:173)
`terns can provide valuable assistance in
`achieving this goal.
`
`The customer then provides Standard Micro(cid:173)
`systems with either a completed composite
`drawing, a data base tape (in suitable format),
`or an actual processing mask set. Whatever the
`entry level, Standard Microsystems is prepared
`to carry the program through to completion.
`If the design is in the formative stages, the
`requirements will be studied and the most
`suitable set of design rules will be provided.
`If the design is already completed, Standard
`Microsystems will examine the design rules
`used and recommend which of our processes
`is most compatible. If small variations to
`our "standard" processing are required, they
`can usually be accommodated at little or
`no expense.
`
`16
`
`CISCO 1042
`Cisco v. ChriMar
`
`

`

`

`

`

`

`I
`
`are used. Lead material is MIL-M-3851 0 para 3.5.6 type
`B (42 Alloy) with a solder lead finish.
`6.0 Screening Options
`6.1 High-Reliability Screening
`The routing is as defined in MIL-STD-883 Method 5004
`for Class B product. Periodic Quality Conformance data
`(para. 10.2) is taken on generically similar parts. A sam(cid:173)
`ple flow chart for ceramic product is given on page 6.
`6.1.1
`Internal Visual
`Both Die and Preseal Visual inspections are to the cri(cid:173)
`teria of Method 2010, Condition B of MIL-STD-883. An
`AQL audit is performed on each lot by Quality Control.
`6.1.2 Stabilization Bake
`All parts are placed in 150°C storage for 24 hours per
`Method 1008, Condition C of MIL-STD-883.
`6.1.3 Temperature Cycling
`All parts are subjected to 10 cycles of - 65°C to + 150°C
`per Method 1010, Condition C of MIL-STD-883.
`6.1.4 Constant Acceleration
`All parts are subjected to a 30,000 g force in the Y1 ori(cid:173)
`entation per Method 2001, Condition E.
`6.1.5 Seal
`Hermeticity testing is performed to conditions A and C
`of MIL-STD-883 Method 1014.
`6.1.6 Pre burn-in Electrical Test
`Ordinarily this is the same as final electrical test.
`6.1.7 Burn-in
`Condition A and Condition D of MIL-STD-883, Method
`1015 are available. The stress is applied for 168 hours at
`125°C or at other temperatures according to the time(cid:173)
`temperature regression.
`6.1.8 Final Electrical Test
`Verifies functional and parametric performance to the
`device specifications.
`6.1.9 Final Visual Inspection
`All parts are inspected to Method 2009 of MIL-STD-883.
`6.2 Standard Screening
`Standard Screening is designed for the industrial-com(cid:173)
`mercial customer and is available in all package types.
`For hermetic packages, temperature cycling, centrifuge
`and hermeticity are specified as well as die, preseal, and
`final visual inspection.
`6.2.1 Standard Die and Preseal Visual Inspections
`(AC-04, AC-08)
`These inspections were developed from Method 2010 of
`MIL-STD-883.The inspection criteria are specific to SMC's
`pMOS and nMOS COPLAMOS® technologies.
`6.2.2 Temperature Cycling (AC-15, AD-13)
`Temperature cycling is performed to" the MIL-STD-883,
`equivalent of Method 1010, Condition C, - 65°C/ + 150°C,
`ten cycles.
`6.2.3 Constant Acceleration (centrifuge) (AC-16, AD-14)
`Constant Acceleration is performed to the MIL-STD-883,
`equivalent of Method 2001, Condi