DECLARATION OF DEBABANI CHOUDHURY, PH.D.
`
`CONCERNING PAPERS PUBLISHED AT IMS 2010
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`INTEL 1308
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`INTEL 1308
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`

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`I, Debabani Choudhury, declare as follows:
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`1.
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`I am currently employed by Intel Corporation as a Principal Engineer. I have
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`worked at Intel for more than 12 years.
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`2.
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`Iam a Fellow of the Institute of Electrical and Electronics Engineers (IEEE).
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`IEEE is the largest professional organization in the world for electrical engineers.
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`I was elected
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`as an IEEE Fellow for my contributions to millimeter-wave enabling technologies.
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`3.
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`I have served on the Steering Committees and Technical Program Committees for
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`several IEEE conferences, including IEEE International Microwave Symposium (IMS), IEEE
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`Antenna and Propagation Symposium (AP-S), and IEEE Radio and Wireless Symposium
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`(RWS).
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`I am also a member and Past Chair of the IEEE Microwave Theory and Techniques
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`(MTT) MTT-ZO Wireless Communications Committee. In addition, I have served as an editor
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`for multiple journals, including Proceedings ofIEEE, IEEE Transactions on Microwave Theory
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`and Techniques (T-MTT), and multiple special issues of the IEEE Microwave Magazine. My
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`own papers have also been published in IEEE journals.
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`4.
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`I am submitting this declaration in my capacity as an Intel employee, not in any
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`official capacity on behalf of IEEE.
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`5.
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`I earned my Bachelor of Technology degree in Electronics and Communication
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`Engineering from the Institute of Radio Physics and Electronics at the University of Calcutta in
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`Kolkata, India in 1984.
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`I earned my Doctor of Philosophy degree in Electrical Engineering from
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`the Indian Institute of Technology Bombay (IITB) in Mumbai, India in 1991.
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`6.
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`7.
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`A copy of my current curriculum vitae is attached hereto as Attachment A.
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`This declaration concerns a paper entitled “Envelope Tracking Power Amplifier
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`Robust to Battery Depletion,” authored by Dr. Jinsung Choi of the Pohang University of Science
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`- 1 -
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`

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`and Technology in Pohang, South Korea (the “Choi 2010 paper”), a true and accurate copy of
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`which is submitted as Attachment B to this declaration.
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`8.
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`In 2010, I attended and had an official role at the IEEE International Microwave
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`Symposium (“IMS”). The IMS 2010 conference was held in Anaheim, California between May
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`23 and May 28, 2010. For the conference, I was, among other things, the chair for Publications,
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`and the co-chair of the subcommittee for Millimeter—Wave and THz Components and
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`Technologies within the IMS Technical Program Review Committee (TPRC).
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`9.
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`IMS is the leading international conference on microwave/radio frequency (RF)
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`theory and practice. The conference consists of a full week of events, including technical paper
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`presentations, workshops, and tutorials, as well as playing host to a large commercial exhibition.
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`The details of the IMS 2010 conference are listed in an IMS 2010 Program Book available at
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`https://mtt-
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`archivesorg/Chapter E Publications and Publicity/IMS2010 Reports/program book 2010.pdf
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`(“Program Book”), a true and accurate copy of which is submitted as Attachment C to this
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`declaration.
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`10.
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`The IMS conference involves the presentation of papers on, among other things,
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`RF circuit and power supply design, and it always draws many electrical engineers with multiple
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`years’ experience in those areas. IMS 2010 was no exception:
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`it was attended by many leading
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`engineers in those fields, including industry leaders and academics from the largest and most
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`prestigious electronics and semiconductor companies and universities in the world. At the time
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`of the conference, for example, I worked at Intel, had a doctorate in electrical engineering, and
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`had decades of experience in RF design.
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`

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`11.
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`The IMS 2010 conference was both well-advertised and well-attended. For
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`example, the online webpage publicizing the IMS 2010 conference stated that IMS 2010 is “the
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`premier annual international meeting for technologists involved in all aspects of microwave
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`theory and practice.” See 2010 International Microwave Symposium, About the Symposium
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`(Feb. 23, 2010 archived version), available at https://web.archive.org/web/20100223070645/
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`http://www.imsZO10.0rg:80/about.html (accessed January 31, 2018), a true and accurate copy of
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`which is submitted as Attachment D to this declaration.
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`12.
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`Based on my experience working on the IMS 2010 conference, and my own
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`personal attendance at that conference, I know that more than 1,800 people attended IMS 2010.
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`13.
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`As reflected in the symposium’s technical program, IMS 2010 included a specific
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`session on “Power Amplifier Circuits.” See Attachment C (Program Book), at 40. Papers
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`presented during this session represented the state ofthe art in power amplifier circuits at that
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`time, and wOuld have been of interest to academic and industry leaders in the field of power
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`amplifiers seeking to learn about new developments in the field.
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`g 14.
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`The Choi 2010 paper was announced in the Program Book for the IMS 2010
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`conference. Attachment C (Program Book), at 40. On information and belief, Dr. Jinsung Choi
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`presented the Choi 2010 paper at the IMS 2010 conference as Paper ID WEPF—5, during the
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`Power Amplifier Circuits, Interactive Forum session WEPF held on Wednesday, May 26, 2010.
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`15.
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`The IMS 2010 conference in general, and the Power Amplifier Circuits session in
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`particular, were open to the public. Anyone willing to pay the registration fee was permitted to
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`attend, with IEEE members paying a discounted rate. No confidentiality restrictions of any kind
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`were imposed on attendees at IMS 2010, and attendees were free to (and indeed encouraged to)
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`

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`disseminate and'discuss papers and other technical material presented during the conference
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`openly.
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`16.
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`PDF versions of the papers presented at the conference were available at
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`computer terminals stationed throughout the conference space. A person who wanted a hard
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`copy of a particular paper could use the printers at those computer terminals to print a copy. The
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`IMS Program Book (Attachment C) refers to these computer terminals on page 5 (“Print on
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`Demand”).
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`17.
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`Over 2,000 identical USB drives were created before the 2010 conference began,
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`each containing a copy in PDF format of every paper presented at the conference—including the
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`Choi 2010 paper attached hereto as Attachment B.
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`18.
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`My official role at the IMS 2010 conference included not only the roles identified
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`above but also the preparation of the Symposium Proceedings USB drives containing the
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`conference papers. As shown in the Program Book for the IMS 2010 conference, I was the
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`chairman of the “Proceedings USB” subcommittee:
`
`Proceedings USB
`Bebabafii Chondhury, Chairman
`Weiheng Chang
`
`Attachment C (Program Book), at 59.
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`19.
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`All the IMS 2010 papers were available to the IMS Technical Paper Review
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`Committee (TPRC) members no later than December 2009. The IMS 2010 published papers
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`were selected by TPRC members on Sunday, January 10, 2010 at a TPRC meeting in New
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`Orleans, Louisiana.
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`

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`20.
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`To permit sufficient time to prepare the USB drives in advance of the conference,
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`we required final manuscripts of accepted papers to be submitted on or before March 4, 2010.
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`I
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`recall the publications committee receiving these papers, and, over the ensuing weeks, committee
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`members participated in organizing the papers (including Choi 2010) for publication to
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`symposium participants on the USB drives, with the help of an external USB vendor.
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`21.
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`Copies of the USB drive containing these papers (including Choi 2010) were then
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`created at my direction, and these Copies were distributed to conference attendees when they
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`checked in at our conference location the Anaheim Convention Center in Anaheim, California.
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`22.
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`Participants typically want a USB drive containing the papers and therefore
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`register to receive one. Based on my personal attendance at and involvement with the
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`conference, I know that a significant share of the USB drives (more than 1,500) were distributed
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`to participants at the conference.
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`23.
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`Because each of the USB drives contained the Choi 2010 paper, more than 1,500 '
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`people, all of whom attended the IMS 2010 conference, received the Choi 2010 paper no later
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`than May 28, 2010.
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`24.
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`There were no confidentiality restrictions placed on any of the papers contained
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`on the USB drives, and the purpose of distributing the USB drives to attendees was to promote
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`the further dissemination of these papers to the interested public.
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`25.
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`I have been in possession of the USB drive that I received at the start of the IMS
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`2010 conference on or about May 23, 2010. My USB drive is identical to the USB drives given
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`to IMS 2010 conference registrants.
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`26.
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`The copy of Choi 2010 that is attached hereto as Attachment B is a true and
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`accurate copy of this paper contained on the USB drive that I received at the IMS 2010
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`

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`conference on or about May 23, 2010. Attachment B is thus identical to the copy of the Choi
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`2010 paper on each of the identical USB drives distributed to registrants at the IMS 2010
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`conference.
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`27.
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`Other than my ordinary employment relationship with Intel Corporation, I am not
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`receiving any compensation for my declaration or testimony in this matter.
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`28.
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`I declare that all statements made herein Of my own knowledge are true; that all
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`statements made on information and belief are believed to be true; and further that these
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`statements were made with the knowledge that willful false statements and the like are
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`punishable by fine or imprisonment, or both.
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`t
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`Signed: MM (1123!“ l4, (4 0/2?”
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`Dated: Tum 10],le
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`

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`ATTACHMENT A
`ATTACHMENT A
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`

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`
`
`DEBABANI CHOUDHURY, PhD.
`Principal Engineer, Intel Labs
`e-mail: debabani.choudhury@intel.com
`
`SUMMARY OF PROFESSIONAL EXPERIENCE:
`Broad range of technical/technical-management experience in RF/microwave, mm-
`wave/THz technologies, 5G hardware, wireless platform implementation, vehicular
`embedded RF/mmW research.
`
`Proficient in the field of subsystem/circuit/device design, development, integration, and
`testing. Technologies include but not limited to 5G, RF-circuit/system design/integration,
`mm-wave imaging, smart-antennas, active and passive components, antenna/array
`integrated sub-systems, RF-modules/packaging, flexible-electronics, 3D-integration,
`interconnects, RFICs/MMICs, RF-MEMs, III-V devices, III-V fabrication, MMICs, meta-
`materials, FSS/EBGs, wireless-power, sensors/networks, quasi-optics, vehicular.
`
`EMPLOYMENT HISTORY:
`INTEL CORPORATION (2006- to date)
`Principal Engineer - Intel Labs
`(cid:120)(cid:3)Leading 5G and vehicular antenna integrated system research and defining long-term
`strategy at Intel Labs.
`(cid:120)(cid:3)Led a diverse team of technologists to demonstrate Intel’s first 73GHz E2E link demo
`with direct conversion approach.
`(cid:120)(cid:3)Defined 60GHz modular antenna array (MAA) front-end modules project and led a
`team of technologists from various Intel BUs to demonstrate MAA front-end modules for
`60GHz wireless, backhaul and hybrid beamforming applications.
`(cid:120)(cid:3)Demonstrated smartphone integrated antenna POCs for LTE-A type applications.
`Collaborated with BUs for FFRD demonstration.
`(cid:120) Coordinated completion of an antenna/Front-End Module project with external vendors
`using organic-based low-cost embedded passives in a small-form-factor. Achieved
`smallest form factor with desirable performance of front-ends (FEMs) and integrated
`antennas.
`(cid:120)(cid:3)Initiated 60GHz hardware research at Intel for future platform-specific applications and
`generated IPs on integrated package/RFIC/antennas based on various usage models.
`Collaborated with product team members to generate initial WPAN ideas for Intel
`products.
`(cid:120)(cid:3)Taken strategy, management and leadership courses from Intel University and
`Stanford Graduate School of Business (GSB).
`(cid:120)(cid:3)Created multiple Intel research projects with different universities.
`(cid:120)(cid:3)Invited to DARPA Workshops on mm-wave silicon-based architectures
`(cid:120)(cid:3)Supervising SRC/Intel funded university research efforts on RFICs, mm-wave phased
`arrays, MIMO-based mm-wave imaging and THz electronics.
`
`Attachment A - 1
`
`

`

`(cid:120)(cid:3)Served on the distinguished panel of US National Science Foundation (NSF)
`Engineering Advisory Committee to evaluate funding to US universities.
`
`
`HRL LABORATORIES, (former HUGHES RESEARCH LABORATORIES), CA
`(1996- 2006)
`Senior Staff Scientist
`(cid:120)(cid:3)Led several programs on sub-system integration, circuit and III-V semiconductor
`device development to successful completion. (cid:3)
`(cid:120)(cid:3)Worked on several different semiconductor device technologies such as, InP HEMT,
`InP HBT, SiGe, RF MEMs, InP Gunn diode, varactor, etc. Developed antennas, active
`devices, MMICs and integration techniques for imaging and automotive applications.
`(cid:120)(cid:3)Developed new RFIC/MMIC architectures for mm- and higher frequencies. Introduced
`new ideas to multi-gigabit IC design approach and packaging.
`(cid:120)(cid:3)Invited to multiple DARPA workshops, influenced DARPA BAA solicitation/topics and
`was involved in writing DARPA proposals on mm-wave/THz imaging approaches
`(cid:120)(cid:3)InP HBT/HEMT-based IC projects included high frequency device modeling,
`interconnects and IC packaging, 1-300+ GHz ICs, 40+ Gb/s ICs, etc. Demonstrated a
`packaged HBT-IC design with a world record BW of 1-70+ GHz.
`(cid:120)(cid:3)Demonstrated largest bandwidth active amplifiers using HBT-IC process
`technology.
`(cid:120)(cid:3)Was responsible for several programs related to design and demonstration of RF
`Micro-Electro-Mechanical (MEM) switches, phase shifters, filters, resonators, beam
`switched-antennas/arrays and other components. Implemented novel ideas and
`monolithic integration of MEMs switches on InP and GaAs MMICs.
`(cid:120)(cid:3)Research/development included flexible electronics, wafer-scale packaging of MMICs
`and MEMs, 3D-package with heterogeneous device integration.
`(cid:120)(cid:3)Investigated Rotman lens and 3D-imaging designs with flexible electronics
`(cid:120)(cid:3)Developed low-cost Gunn devices for mm-wave oscillator application including a novel
`Gunn Device processing technique for 77GHz and 140GHz automotive applications.
`(cid:120)(cid:3)Experienced on antenna array, Frequency Selective Surfaces (FSS), meta-materials,
`resonator/filters, requiring extensive 3D EM design efforts.
`(cid:120)(cid:3)Designed beam-steerer and spatial power combiners based on planar and waveguide
`technologies.
`(cid:120)(cid:3)Developed automotive-embedded antennas and MMICs for 77GHz auto-radar.
`(cid:120)(cid:3)Developed antenna-embedded rectifier circuits/arrays for wireless power.
`(cid:120)(cid:3)Received new inventor award at HRL for generating IPs to impact the future product
`oriented research.
`
`
`Millivision and Millitech Corporation, MA (1994 - 1996)
`Senior Technical Staff
`(cid:120)(cid:3)Led an effort for the design and development quasi-optical and wave-processing
`(WP)-MMICs for imaging applications. Projects included mm-wave beam-forming and
`beam-steering imagers and sub mm wave (-upto 800GHz) circuits/components.
`
`Attachment A - 2
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`

`

`(cid:120)(cid:3)Guided a technical team to develop design, fabrication and testing methodologies for
`dual-polarized electronic beam steering and demonstrated world’s first dual-polarized
`quasi-optical monolithic beam steering array for mm-wave imaging. Projects included
`semiconductor processing and testing of circuits and systems.
`(cid:120)(cid:3)Experience in developing folded lens and optics based compact mm-wave handheld
`passive imager.
`(cid:120)(cid:3)Was instrumental in the co-design and development of antenna and RF front ends of
`focal plane array heterodyne receivers for passive mm-wave imaging systems at
`94GHz. Investigated focal plane array based 140GHz design also.
`
`
`NASA/JET PROPULSION LABORATORY, Caltech, CA (1991- 1994)
`Researcher
`(cid:120)(cid:3)As a JPL researcher, worked on the submm-wave/THz heterodyne receiver
`development effort for earth remote sensing and astrophysics applications.
`(cid:120)(cid:3)Was responsible for the development of sub-millimeter-wave, solid-state local
`oscillator sources for space applications. Was involved in all aspects of the
`submillimeter-wave frequency multiplier program; -starting from design of multiplier
`circuits to the design, fabrication, characterization of novel varactor devices as well as
`assembly/testing of the solid state multipliers.
`(cid:120)(cid:3)Collaborated on multiple quasi-optical circuit designs and demonstration
`(cid:120)(cid:3)Led an effort on the development of innovative planar varactor diode frequency
`multipliers and THz waveguide circuitry. Created numerous new concepts on device
`and circuits for THz and received multiple NASA recognition/awards.
`
`
`INDIAN INSTITUTE OF TECHNOLOGY, India (1987 - 1991)
`Project Engineer, Advanced Center for Research in Electronics (ACRE)
`∞ Was responsible for designing and fabricating monolithic and hybrid microwave
`integrated circuits. Developed novel method of selective electrolessplating for MIC
`applications and a CAD package for designing MIC components.
`∞ Was In-Charge of the CAD/CAM lab. at defense research center ACRE.
`
`ELECTRICAL ENGINEERING DEPARMENT, IIT, BOMBAY, INDIA
`Research Scholar (1987-1990), (received Ph.D degree in 1991)
`∞ Developed a Finite Element package for analyzing transmission lines
`∞ Worked on Monolithic Microwave Integrated Circuit (MMIC) /passive structures.
`
`EDUCATION:
`Ph.D (1991) Electrical Engineering, Indian Institute of Technology (IIT), Mumbai India.
`The thesis is entitled “Experimental and finite element studies on monolithic microwave
`integrated circuit transmission lines”.
`M.Tech (1986) Electronics and Comm. Engineering, Institute of Radio Physics &
`Electronics, Calcutta University, Kolkata, India.
`B.Tech (1984) Electronics and Comm. Engineering, Institute of Radio Physics &
`Electronics, Calcutta University, Kolkata, India.
`
`Attachment A - 3
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`

`

`
`PATENTS/PUBLICATIONS/PRESENTATIONS:
`(cid:120)(cid:3)25+ patents/patent applications. Several invention disclosures.
`(cid:120)(cid:3)Published numerous articles in refereed journals and conferences.
`(cid:120)(cid:3)Several invited talks in workshops, Conferences and Universities.
`
`
`PROFESSIONAL ACTIVITIES:
`(cid:120)(cid:3)Elected 2011 IEEE Fellow.
`(cid:120)(cid:3)Invited speaker at many IEEE conferences, Workshops/Summits and Universities at
`US and abroad.
`(cid:120)(cid:3)Served as Industry Advisor for multiple university Post-graduate theses.
`(cid:120)(cid:3)Reviewed NSF funded proposals and Impacted DARPA BAAs.
`(cid:120)(cid:3)Served on the distinguished panel of NSF Committee of Visitors (COV).
`(cid:120)(cid:3)Industry liaison of SRC funded university programs.
`(cid:120)(cid:3)Co-Editor for 2013 Proceedings of IEEE issue on Wireless Power Technologies and
`Applications.
`(cid:120)(cid:3)Co-Editor, IEEE Transactions on Microwave Theory and Techniques Special Issue on
`5G Technologies, 2017.
`(cid:120)(cid:3)Editor, Microwave magazine Special Issue on RWW11, RWW12
`(cid:120)(cid:3)Editor, Microwave magazine Special Issue on 5G Technologies, 2017 and Full-Duplex
`in 2018.
`(cid:120)(cid:3)Multiple IEEE MTT-S Technical Co-ordination Committee (TCC) member:
`o MTT-20 on Wireless Communications
`o MTT-26 on Wireless Power and Energy Conversion
`o MTT-6 on Microwave and Millimeter Wave ICs
`o MTT-27 on Wireless Enabled Automotive & Vehicular Applications
`(cid:120)(cid:3)Elected and served three years as Chair of IEEE MTT-S TCC committee MTT-20 on
`Wireless Communications.
`(cid:120)(cid:3)Served as elected Co-Chair for two IEEE MTT-S Committees (MTT-20 and MTT-26)
`for three years.
`(cid:120)(cid:3)Technical Program Committee (TPC) Co-Chair for 2013 IEEE Radio and Wireless
`Symposium.(cid:3)(cid:3)
`(cid:120)(cid:3)Chair, 2017 and 2018 IEEE 5G Summit
`(cid:120)(cid:3)Technical Program Committee (TPC) member for IEEE International
`Microwave Symposium since 2001 .
`(cid:120)(cid:3)Technical program reviewer and TPC member/Session Organizer for IEEE Antennas
`and Propagation Symposium (APS).
`(cid:120)(cid:3)TPC Member for SPIE Int. Symp. on Microelectronics, MEMs & Nanotech. Since
`2006.
`(cid:120)(cid:3)TPC member and subcommittee chair for IEEE Radio & Wireless Symposium
`(cid:120)(cid:3)Served as Co-Chair for IEEE IMS symposium subcommittees.
`(cid:120)(cid:3)Technical session chairs for IEEE-IMS, IEEE-APS, IEEE RWS .
`(cid:120)(cid:3)IEEE MTT-S Steering Comm member in 1999,2001,2005,2007,2008,2010.
`
`Attachment A - 4
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`

`

`(cid:120)(cid:3)Served as Plenary, Panel, Focused session and Registration Chair for RWW.
`(cid:120)(cid:3)Publications Chair for multiple IEEE IMS Symposiums: IMS2005, IMS2007, IMS2008
`and IMS2010; CDROM Editor for IMS1999 and IMS2001.
`(cid:120)(cid:3)TPC and organizing committee member for several International conferences
`supported by MTT-S and AP-S societies (European Microwave Conference (EuMC),
`Asia Pacific Microwave Conference (APMC, ICMIM, Wireless Power Transfer
`Conference (WPTC) AEMC/IAW, IMWS-IWPT, RFIDTA and so on.
`(cid:120)(cid:3)Multiple IEEE IMS Workshop, focused session and panel organizer.
`(cid:120)(cid:3)2013(cid:3)IEEE Wireless Industry Day (WID) speaker.
`(cid:120)(cid:3)2018(cid:3)IEEE Communications Future Summit speaker.
`(cid:120)(cid:3)Reviewer of several IEEE Transactions/Journals.
`(cid:120)(cid:3)Editorial board member of CUP Wireless Power Journal.
`
`Attachment A - 5
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`ATTACHMENT B
`ATTACHMENT B
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`

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`(cid:16)(cid:43)(cid:57)(cid:34)(cid:40)(cid:45)(cid:46)(cid:34)(cid:62) (cid:26)(cid:49)(cid:29)(cid:32)(cid:39)(cid:37)(cid:43)(cid:36)(cid:62) (cid:21)(cid:45)(cid:58)(cid:34)(cid:49)(cid:62) (cid:11)(cid:41)(cid:46)(cid:40)(cid:37)(cid:35)(cid:34)(cid:49)(cid:62) (cid:23)(cid:45)(cid:30)(cid:55)(cid:51)(cid:53)(cid:62) (cid:53)(cid:45)(cid:62) (cid:14)(cid:29)(cid:53)(cid:53)(cid:34)(cid:49)(cid:59)(cid:62) (cid:15)(cid:34)(cid:46)(cid:40)(cid:34)(cid:53)(cid:37)(cid:45)(cid:43)(cid:62)
`
`(cid:7)(cid:22)(cid:26)(cid:30)(cid:32)(cid:26)(cid:20)(cid:35) (cid:3)(cid:21)(cid:27)(cid:22)(cid:1)(cid:35) (cid:4)(cid:27)(cid:26)(cid:20)(cid:30)(cid:32)(cid:35) (cid:8)(cid:22)(cid:25)(cid:1)(cid:35) (cid:4)(cid:14)(cid:18)(cid:21)(cid:34)(cid:32)(cid:26)(cid:35) (cid:8)(cid:14)(cid:26)(cid:20)(cid:1)(cid:35) (cid:7)(cid:32)(cid:26)(cid:20)(cid:25)(cid:22)(cid:26)(cid:35) (cid:9)(cid:14)(cid:29)(cid:23)(cid:1)(cid:35) (cid:2)(cid:27)(cid:30)(cid:21)(cid:22)(cid:35) (cid:7)(cid:22)(cid:26)(cid:1)(cid:35) (cid:14)(cid:26)(cid:17)(cid:35) (cid:2)(cid:32)(cid:25)(cid:25)(cid:14)(cid:26)(cid:35) (cid:8)(cid:22)(cid:25)(cid:35)
`
`(cid:4)(cid:18)(cid:28)(cid:14)(cid:29)(cid:31)(cid:25)(cid:18)(cid:26)(cid:31)(cid:35) (cid:27)(cid:19)(cid:35) (cid:5)(cid:24)(cid:18)(cid:16)(cid:31)(cid:29)(cid:22)(cid:16)(cid:14)(cid:24)(cid:35) (cid:5)(cid:26)(cid:20)(cid:22)(cid:26)(cid:18)(cid:18)(cid:29)(cid:22)(cid:26)(cid:20)(cid:1)(cid:35) (cid:9)(cid:27)(cid:21)(cid:14)(cid:26)(cid:20)(cid:35) (cid:13)(cid:26)(cid:22)(cid:33)(cid:18)(cid:29)(cid:30)(cid:22)(cid:31)(cid:34)(cid:35) (cid:27)(cid:19)(cid:35) (cid:11)(cid:16)(cid:22)(cid:18)(cid:26)(cid:16)(cid:18)(cid:35) (cid:14)(cid:26)(cid:17)(cid:35) (cid:12)(cid:18)(cid:16)(cid:21)(cid:26)(cid:27)(cid:24)(cid:27)(cid:20)(cid:34)(cid:1)(cid:35)
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