r:� .... • Packaging for
`Ltighting Applications
`
`Design, Manufacturing and Testing
`
`NICHIA EXHIBIT 2004
`Vizio, Inc. v. Nichia Corporation
`Case IPR2018-00386
`
`IPR Page 1
`
`

`

`LED PACKAGING
`FOR LIGHTING
`APPLICATIONS
`
`IPR Page 2
`
`

`

`LED PACKAGING
`FOR LIGHTING
`APPLICATIONS
`DESIGN, MANUFACTURING
`AND TESTING
`
`Sheng Liu
`School of Mechanical Science and Engineering
`and Wuhan National Laboratory for Optoelectronics
`Huazhong University of Science and Technology
`Wuhan, Hubei, China
`
`Xiaobing Luo
`School of Energy and Power Engineering
`and Wuhan National Laboratory for Optoelectronics
`Huazhong University of Science and Technology
`Wuhan, Hubei, China
`
`IPR Page 3
`
`

`

`This edition first published 2011
`Ó 2011 Chemical Industry Press. All rights reserved.
`
`Published by John Wiley & Sons (Asia) Pte Ltd, 1 Fusionopolis Walk, #07-01 Solaris South Tower, Singapore 138628,
`under exclusive license by Chemical Industry Press in all media and all languages throughout the world excluding
`Mainland China and excluding Simplified and Traditional Chinese languages.
`
`For details of our global editorial offices, for customer services and for information about how to apply for permission to
`reuse the copyright material in th is book pl ease see our website at www.wiley.com.
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`and product names used in this book are trade names, service marks, trademarks or registered trademarks of their
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`
`Library of Congress Cataloging-in-Publication Data
`
`Liu, S. (Sheng), 1963-
`LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu, Xiaobing Luo.
`p. cm.
`Includes bibliographical references and index.
`ISBN 978-0-470-82783-3 (hardback)
`1. Light emitting diodes–Design and construction. 2. Light emitting diodes–Computer simulation. 3. Electronic
`packaging. 4. Electric lighting–Equipment and supplies. I. Luo, Xiaobing, 1974- II. Title.
`TK7871.89.L53L58 2011
`621.3815’22–dc23
`
`2011015480
`
`Print ISBN: 978-0-470-82783-3
`ePDF ISBN: 978-0-470-82784-0
`oBook ISBN: 978-0-470-82785-7
`ePub ISBN: 978-0-470-82840-3
`Mobi ISBN: 978-1-118-08295-9
`
`Set in 10/12 pt Times by Thomsom Digital, Noida, India
`
`IPR Page 4
`
`

`

`Contents
`
`Foreword by Magnus George Craford
`
`Foreword by C. P. Wong
`
`Foreword by B. J. Lee
`
`Preface
`
`Acknowledgments
`
`About the Authors
`
`1
`
`Introduction
`1.1
`Historical Evolution of Lighting Technology
`1.2
`Development of LEDs
`1.3
`Basic Physics of LEDs
`1.3.1 Materials
`1.3.2
`Electrical and Optical Properties
`1.3.3 Mechanical and Thermal Properties
`Industrial Chain of LED
`1.4.1
`LED Upstream Industry
`1.4.2
`LED Midstream Industry
`1.4.3
`LED Downstream Industry
`Summary
`1.5
`References
`
`1.4
`
`2.2
`
`2 Fundamentals and Development Trends of High Power LED Packaging
`2.1
`Brief Introduction to Electronic Packaging
`2.1.1 About Electronic Packaging and Its Evolution
`2.1.2 Wafer Level Packaging, More than Moore, and SiP
`LED Chips
`2.2.1
`Current Spreading Efficiency
`2.2.2
`Internal Quantum Efficiency
`2.2.3 High Light Extraction Efficiency
`Types and Functions of LED Packaging
`2.3.1
`Low Power LED Packaging
`2.3.2 High Power LED Packaging
`
`2.3
`
`ix
`
`xi
`
`xiii
`
`xv
`
`xix
`
`xxi
`
`1
`1
`2
`6
`6
`10
`18
`19
`21
`22
`22
`28
`29
`
`33
`33
`33
`36
`37
`37
`41
`43
`48
`49
`50
`
`IPR Page 5
`
`

`

`Contents
`
`2.4
`2.5
`
`Key Factors and System Design of High Power LED Packaging
`Development Trends and Roadmap
`2.5.1
`Technology Needs
`2.5.2
`Packaging Types
`Summary
`2.6
`References
`
`3.2
`
`3.3
`3.4
`
`3.5
`
`3 Optical Design of High Power LED Packaging Module
`3.1
`Properties of LED Light
`3.1.1
`Light Frequency and Wavelength
`3.1.2
`Spectral Distribution
`3.1.3
`Flux of Light
`3.1.4
`Lumen Efficiency
`3.1.5
`Luminous Intensity, Illuminance and Luminance
`3.1.6
`Color Temperature, Correlated Color Temperature and
`Color Rendering Index
`3.1.7 White Light LED
`Key Components and Packaging Processes for Optical Design
`3.2.1
`Chip Types and Bonding Process
`3.2.2
`Phosphor Materials and Phosphor Coating Processes
`3.2.3
`Lens and Molding Process
`Light Extraction
`Optical Modeling and Simulation
`3.4.1
`Chip Modeling
`3.4.2
`Phosphor Modeling
`Phosphor for White LED Packaging
`3.5.1
`Phosphor Location for White LED Packaging
`3.5.2
`Phosphor Thickness and Concentration for
`White LED Packaging
`Phosphor for Spatial Color Distribution
`3.5.3
`Collaborative Design
`3.6.1
`Co-design of Surface Micro-Structures of LED
`Chips and Packages
`3.6.2 Application Specific LED Packages
`Summary
`3.7
`References
`
`3.6
`
`4 Thermal Management of High Power LED Packaging Module
`4.1
`Basic Concepts of Heat Transfer
`4.1.1
`Conduction Heat Transfer
`4.1.2
`Convection Heat Transfer
`4.1.3
`Thermal Radiation
`4.1.4
`Thermal Resistance
`Thermal Resistance Analysis of Typical LED Packaging
`Various LED Packages for Decreasing Thermal Resistance
`4.3.1 Development of LED Packaging
`
`4.2
`4.3
`
`vi
`
`51
`57
`57
`59
`62
`62
`
`67
`67
`67
`69
`69
`71
`71
`
`76
`80
`83
`83
`85
`90
`93
`98
`98
`102
`108
`108
`
`118
`123
`129
`
`129
`134
`144
`144
`
`149
`149
`150
`150
`151
`153
`154
`156
`156
`
`IPR Page 6
`
`

`

`vii
`
`Contents
`
`Thermal Resistance Decrease for LED Packaging
`4.3.2
`SiP/COB LED Chip Packaging Process
`4.3.3
`Summary
`4.4
`References
`
`5.2
`
`5 Reliability Engineering of High Power LED Packaging
`5.1
`Concept of Design for Reliability (DfR) and Reliability Engineering
`5.1.1
`Fundamentals of Reliability
`5.1.2
`Life Distribution
`5.1.3 Accelerated Models
`5.1.4 Applied Mechanics
`High Power LED Packaging Reliability Test
`5.2.1
`Traditional Testing Standards, Methods, and Evaluation
`5.2.2 Methods for Failure Mechanism Analysis
`5.2.3
`Failure Mechanisms Analysis
`Rapid Reliability Evaluation
`5.3.1 Material Property Database
`5.3.2 Numerical Modeling and Simulation
`Summary
`5.4
`References
`
`5.3
`
`6.2
`
`6 Design of LED Packaging Applications
`6.1
`Optical Design
`6.1.1
`Introduction of Light Control
`6.1.2
`Reflectors
`6.1.3
`Lenses
`6.1.4 Diffuser
`6.1.5
`Color Design and Control in LED Applications
`Thermal Management
`6.2.1 Analysis of System Thermal Resistance
`6.2.2
`Types of Heat Dissipation to Environment
`6.2.3 Design and Optimization of Fin Heat Sink
`6.2.4 Design Examples of Thermal Management of Typical
`LED Lighting Systems
`Drive Circuit and Intelligent Control Design
`6.3.1
`Typical LED Wireless Intelligent Control System
`6.3.2 Working Principles of Wireless Intelligent
`Control System
`Summary
`6.4
`References
`
`6.3
`
`7 LED Measurement and Standards
`7.1
`Review of Measurement for LED Light Source
`7.2
`Luminous Flux and Radiant Flux
`7.3 Measurement for Luminous Intensity
`7.4
`LED Chromaticity Coordinates
`
`158
`162
`164
`164
`
`167
`167
`168
`169
`172
`175
`179
`179
`182
`184
`187
`190
`194
`211
`211
`
`215
`215
`215
`220
`232
`272
`277
`287
`287
`293
`298
`
`303
`311
`311
`
`312
`313
`313
`
`317
`317
`318
`319
`320
`
`IPR Page 7
`
`

`

`Contents
`
`7.5
`
`Dominant Wavelength Determination Algorithm
`7.5.1
`Curve Fitting Method
`LED Color Purity
`7.6
`Color Temperature and Correlated Color Temperature of Light Source
`7.7
`Automatic Sorting for LEDs
`7.8
`7.9 Measurement for LED Road Lights
`7.9.1
`Electrical Characteristics
`7.9.2
`Color Characteristics
`7.9.3
`Light Distribution Characteristics
`7.9.4 Dynamic Characteristics
`7.9.5
`Test of Reliability
`7.10 Summary
`References
`
`Appendix: Measurement Method for Integral LED Road Lights
`Approved by China Solid State Lighting Alliance
`
`Index
`
`viii
`
`321
`321
`322
`323
`324
`325
`325
`326
`326
`326
`329
`329
`329
`
`331
`
`349
`
`IPR Page 8
`
`

`

`Foreword
`
`By Magnus George Craford
`
`LEDs have been commercially available for nearly 50 years but for most of that time they were
`low power and relatively inefficient devices that were primarily used for indicator applications.
`Initially LEDs were red only, but these were soon followed by green and yellow devices and
`finally about 15 years ago by blue and, with phosphors, white devices. During these years the
`efficiency increased by a factor of 10 every 10 years. Ten years ago high power (one watt) white
`LEDs were introduced with efficiencies high enough that there began to be serious discussion
`about using LEDs for solid state lighting (SSL) applications. Over the last decade performance
`has continued to increase from about 20 lumens/watt to over 100 lumens/watt today. The power
`handling capacity of packages has increased, with packages which can handle over 10 watts now
`available. There is no longer any question about whether LEDs will be important for SSL. I
`believe the only question is when LEDs will dominate all lighting applications. China has been
`one of the leaders in pushing for the rapid adoption of LEDs in order to save energy and to provide
`improved illumination for its vast population. Over the next decade we are sure to see an
`explosion of new applications, and new package types to enable those applications. A critical
`issue is to develop packages and systems that enable efficient and reliable solutions to lighting
`problems. If systems are unreliable it will slow down the adoption of LEDs to the detriment of
`everyone. There are many books about LEDs but most of them focus on the chip and epitaxial
`materials technology. Books of this type focusing on packaging and applications are badly
`needed to help engineers and scientists use LEDs in the most effective manner possible, and to
`ensure the rapid adoption of efficient LED technology around the world.
`The authors Professors Sheng Liu and Xiaobing Luo have done a thorough job of discussing
`the optical design, thermal management, and reliability of high power LEDs and systems.
`System reliability is only as good as the weakest link and it is critical for system designers to
`understand all aspects of the system. The authors have also adopted experience gained in
`silicon technology to the field of high power LEDs. I am happy to see this book completed and
`feel that it will be an important addition to our field.
`
`Dr. Magnus George Craford
`Recipient of the 2002 USA National Medal of Technology
`Member of Academy of Engineering of the USA
`IEEE Life Fellow
`Former Chief Technology Officer
`Solid State Lighting Fellow
`Philips Lumileds Lighting
`Palo Alto, California, USA
`
`IPR Page 9
`
`

`

`Foreword
`
`By C. P. Wong
`
`Design is a multi-disciplinary activity that relies on the expertise of the engineering profession
`and is supported by the methodology and innovations developed within the fields of science.
`The integration of science, engineering, and end applications has produced remarkable
`changes in the end users. This system integration can be demonstrated by the evolution of
`understanding of solid state physics and compound semiconductors, the development of
`epitaxial layers, the design of LED devices, and the applications to packaged modules and
`light fixtures.
`The most popular methodology of design is named Design for X (DFX, here X refers to
`manufacturing, assembly, testing, reliability, maintenance, environment, and even cost), which
`has been widely adopted by those multinational and many small high tech start-up companies.
`The design methodology is being adjusted to meet the requirements of a full life cycle, so called
`“concept/cradle-to-grave” product responsibilities, coined by Dr. Walter L. Winterbottom of
`Ford Science Lab.
`An LED packaging module and the related application systems, like any other electronic
`systems, involve a lot of manufacturing processes from epitaxial growth to chip manufacturing
`to packaging and to final fixture assembly, and extensive reliability testing for extended life
`goals of many critical products such as those used for road lighting, automotive lighting, and so
`on. Defects in terms of dislocations, voids, cracks, delaminations, and microstructure changes
`can be induced in any step and may interact and grow in subsequent steps, imposing extreme
`demands on the fundamental understanding of stressing and physics of failures. Currently, the
`testing programs have been extensive to assure reliability during the product development.
`An iterative, build-test-fix-later process has long been used in new product development;
`significant concerns are being raised as cost effective and fast time-to-market needs may not be
`achievable with such an approach. In terms of high reliability, system hardware design,
`manufacturing and testing are costly and time consuming, severely limiting the number of
`design choices within the short time frame, and not providing enough time to explore the
`optimal design. With the current situation of three to six months for each generation of LED
`devices, it is challenging to achieve truly optimal and innovative products with so many
`constraints in design. Design procedure must be modified and DFX must be used so as to
`achieve integrated consideration of manufacturing processes, testing, and operation.
`Professors Sheng Liu and Xiaobing Luo have been promoting the new design method in the
`past many years to help assist in material selection, manufacturing yield enhancement, and
`
`IPR Page 10
`
`

`

`Foreword
`
`xii
`
`appropriate rapid reliability assessment when the packaging module and system are subjected
`to uncertainties of material selection, process windows, and various service loadings. All these
`issues must be addressed prior to hardware buildup and test. The authors have demonstrated
`excellent examples for optical, thermal, and reliability aspects. Application of specific LED
`packaging (ASLP) is indeed an example of a careful design and consideration of packaging
`integration. Its three-in-one, four-in-one and five-in-one modules conceived by the authors’
`group are very likely to be widely used by this fast growing industry. They will be popular
`choices in terms of performance and cost for those traditional light fixture companies, as they
`represent the true nature of integration in microelectronics, MEMS, and optoelectronics/LED,
`to name a few fields. Detailed modeling of manufacturing processes such as wire bonding for
`LED has been shown to be important and the co-design of the LED chip and packaging indeed
`show the importance of concurrent consideration of traditionally divided product chains and
`provides a new direction for further improvement of optical performance.
`This book focuses on LED packaging for lighting applications and illustrates the importance
`of packaging and the power of integration in the packaging modules and lighting application
`systems by the authors’ pioneering efforts. Packaging has been ignored from the whole system
`development in the past and the authors explore four functions of packaging in this book:
`powering, signal distribution in terms of both optical and electrical signals and quality, thermal
`management, and mechanical protections. The authors describe their contributions in detail
`and provide guidance to those in the field and present a design approach that must ultimately
`replace the build-test-fix-later process if the efficiencies and potential cost benefits of high
`power LED based systems are to be fully realized.
`
`C.P. Wong
`IEEE Fellow
`Member of Academy of Engineering of the USA
`Former Bell Labs Fellow
`Regents’ Professor, Georgia Institute of Technology, Atlanta, GA 30332
`
`IPR Page 11
`
`

`

`Foreword
`
`By B. J. Lee
`
`Since the invention of the light-emitting diode (LED) by Holonyak and Bevacqua in 1962, the
`LED has experienced great breakthroughs particularly with the invention of nitride blue LED in
`the early 1990s by Nakamura from Nichia Corporation of Japan. Ever since then, the average
`LED usage in each household has grown more than tenfold.
`There was no LED industry until mid-1960s. Nevertheless, the worldwide LED device
`production values have reached $7 billion in year 2008. It is estimated that the compound
`annual growth rate will be more than 20% for LED applications in the next 10 years. This LED
`revolution has been affecting the lives of many people around the world. In 2005, global
`lighting consumed 8.9% of total electric power in a whole year and contributed 0.63% of the
`GDP, according to Dr. Jeff Tsao from Sandia National Laboratories of the USA. In 2050, the
`contribution to GDP can reach as high as 1.65%.
`The LED chip cannot operate by itself without connection to outside driver circuits. Light, as
`an optical power coming out of the LED chip, must be extracted efficiently. In order to maintain
`a good efficacy through a whole temperature range, the generated heat from LED chips must be
`dissipated as efficiently and as quickly as possible. Finally, mechanical protection must be
`adopted to prevent the chip from being damaged or being gradually degraded in subsequent
`testing or operations in harsh environments. While chip manufacturers are making efforts to
`improve the optical, electrical, and thermal performances of LED chips by various approaches,
`including better light extraction, improved crystal quality, uniform current spreading, and
`using substrate with good thermal conductivity, the corresponding packaging technologies
`must be developed to make use of these chip improvements. Collaborative designs between
`chip manufacturers and packaging vendors are thus required to take advantage of each others’
`progress, which has been mostly ignored among LED communities.
`In addition, optical design has been playing an important role in improving the LED efficacy.
`How light can be re-directed efficiently out of the active layers becomes crucial. It involves
`light extraction, phosphor coating, and secondary optics. More and more emerging applica-
`tions require certain light emission patterns, which is posing the demand for a matched
`secondary optical lens along with the original first level optics. Due to the point source
`characteristics of the LED chip, the glare issue has prompted the LED community to develop
`highly efficient secondary lenses to reduce the glare effect. In the meanwhile, the cost pressure
`is always there when compared to the traditional lighting sources, so the functional integration
`(either monolithically or in a hybrid way) seems to be essential.
`
`IPR Page 12
`
`

`

`Foreword
`
`xiv
`
`Reliability has been the focus of LED industries. LED has been regarded as a more reliable
`light source compared with traditional light sources. To make LED worthy of the fame,
`systematic reliability monitoring will be needed before the products are shipped out. Usually,
`reliability tests are very costly and time-consuming. Therefore, rapid reliability evaluation will
`be an alternative. It will be difficult to develop a more efficient reliability evaluation method if
`there still exists poor failure analysis methods, lack of the appropriate test methodology and
`standards, and shortage of an effective approach to evaluate the safety of the lighting fixtures.
`Based on all these issues, there was an urgent need, both for industry and for academy, for a
`comprehensive book covering the current state-of-the-art technologies in the design of LED
`packaging for solid state lighting applications. This book has been written in such a way that
`readers can quickly learn about the fundamental theories and problem-solving techniques, as
`well as understand the design trade-offs, and finally make accurate system-level decisions.
`Dr. Sheng Liu and Dr. Xiaobing Luo have done a significant amount of work and brought
`together all the useful information from the latest technical publications related to LED
`packaging. They have together written this technical book entitled LED Packaging for Lighting
`Applications, an informative book for both industrial and academic users. It is appropriate to be
`used either as an introductory book for those who are just entering this field or as an up-to-date
`reference for those who have been engaged in LED packaging and lighting module/system
`development for some time.
`This book covers the subject of LED packaging and related lighting applications on several
`key topics – high power packaging development trends, optical design of high power LED
`packaging modules with the focus on the integration of secondary optics into the device
`packaging, thermal management, reliability engineering including the analysis of failure
`mechanisms and method of quick evaluation, advanced design of LED packaging applications,
`and, in the final chapter, an introduction to standards and measurement methods including LED
`street lights. I am also delighted to find that both authors have made significant efforts to discuss
`the connection between chip level design (such as surface roughening and color uniformity)
`and packaging efficiency. I would like to join the authors in hoping that this book will attract the
`attentions of engineers and applied scientists working in this field, as well as faculty and
`students, to become aware of the design challenges that must be overcome in order to provide
`the best products to the market. Let us work together to achieve a greener Earth by lighting the
`Earth by LED.
`
`B. J. Lee
`Chairman, Epistar Corporation
`
`IPR Page 13
`
`

`

`Preface
`
`Eight years ago, when the first author was a newcomer in LED packaging, he thought that LED
`packaging must be easier than integrated circuit (IC) packaging, as there were only two input/
`output (IO) terminals for most LED packaging, while for IC packaging, IOs tended to be in the
`hundreds and thousands and there were already many different packaging types such as plastic
`packaging, ball grid array, flip-chip, wafer level packaging, chip-scale packaging, and so on.
`After visiting many leading packaging houses and going through details of packaging in our
`laboratory and at those collaborating companies, he found that the packaging of LED was not
`that easy. According to the classical definition of conventional IC packaging, there are four
`major functions of a packaging: powering, signal distribution, thermal management, and
`mechanical protection. Powering has actually become a bottleneck for the claimed long life of
`the LED. What is also unique about the packaging is that light and color associated with light
`are new. Thermal management is also challenging due to the requirement for a lower junction
`temperature, which is related to both the chip design and packaging design. Mechanical
`protection is also important due to the natural use of those materials with poor adhesion and
`possible poor material handling in the early stage of process development. We began to be very
`interested in high power LED packaging in 2005 and have spent a lot of efforts since then. It has
`been the belief that the knowledge learned in the past 20 years in IC packaging can be applied to
`LED packaging and in particular the concept of system in packaging (SiP), which is still a hot
`research topic in IC packaging and a useful industrial practice as well, can be further developed
`in LED packaging. This book intends to assemble what we have learned in the past few years
`into a useful reference book for both the LED and IC packaging communities, with the hope
`that the results to be presented are going to benefit engineers, researchers, and young students.
`Therefore, this book focuses on solid state lighting by light emitting diode (LED) and it is
`intended for design engineers, processing engineers, application engineers, and graduate
`students. It is also helpful for art designers for buildings, roadways, and cities. This book
`provides quantitative methods for optical, thermal, reliability modeling and simulation so that
`predictive quantitative modeling can be achieved. It proposes Application Specific LED
`Packaging (ASLP) to integrate the secondary optics into the first level device and modules. This
`book also further develops System in Packaging (SiP) for LED modules and applications and
`provides a co-design approach for the rapid design of module and lighting systems so as to
`minimize the time to market for LED products. Fundamental research is also presented to
`satisfy the interests of the active researchers.
`Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962,
`the field has experienced great breakthroughs particularly in the early 1990s by Nakamura from
`
`IPR Page 14
`
`

`

`Preface
`
`xvi
`
`Nichia Corporation of Japan. Nakamura successfully prepared high-brightness blue and green
`LED in GaN-based materials. LEDs have made remarkable progress in the past four decades
`with the rapid development of epitaxy growth, chip design and manufacture, packaging
`structure, processes, and packaging materials. White LEDs have superior characteristics such
`as high efficiency, small size, long life, dependable, low power consumption, high reliability, to
`name a few. The market for white LED is growing rapidly in various applications such as
`backlighting, roadway lighting, vehicle forward lamp, museum illumination, and residential
`illumination. It has been widely accepted that solid state lighting, in terms of white LEDs, will
`be the fourth illumination source to substitute the incandescent lamp, fluorescent lamp, and
`high pressure sodium lamp. In the next five to eight years, with the development of the LED
`chip and packaging technologies, the efficiency of high power white LED will reach as high as
`160 lm/W to 200 lm/W, which will broaden the application markets of LEDs furthermore and
`will also change the lighting concepts of our life.
`There are already five books on this topic available to readers. They are Introduction to Light
`Emitting Diode Technology and Applications by Gilbert Held in 2008, Light-Emitting Diodes
`by E. Fred Schubert in 2006, Introduction to Solid-State Lighting by Arturas Zukauskas,
`Michael S. Shur, and Remis Gaska in 2002, Introduction to Nitride Semiconductor Blue Lasers
`and Light Emitting Diodes by Shuji Nakamura, and Shigefusa F. Chichibu in 2000, and Power
`Supplies for LED Driving by Newnes in 2008. However, all of them allocated a very small
`section to LED packaging and there is no book focusing on high power LED packaging for
`applications. The authors thought that this might be due to the highly proprietary nature of
`high power LEDs. In addition, there are no books dedicated to reliability engineering and
`standards. In recent years, China has been pushing hard for many demonstration projects in
`LED. Many lessons have been learned and there is an urgent need for both reliability and
`standards for both modules and light fixtures. Both authors feel obligated to explore these
`subjects and contribute to this community by sharing their recent findings so as to promote the
`healthy development of high power LED packaging and their applications. Chapter 1 provides
`an introduction of LED. Chapter 2 provides the fundamentals and development trends of high
`power LED packaging, demonstrating that LED development follows a similar trend to IC
`packaging. Optical design of high power LED packaging module is discussed in Chapter 3,
`with the focus on the importance of integration of secondary optics into the device packaging
`level and more integration of other functions to form more advanced modules. Chapter 4 is
`devoted to the basic concepts in thermal management. Chapter 5 is devoted to the reliability
`engineering of high power packaging with the preference of physics of failure based
`modeling and sensors based prognostics health management for LED systems and more
`robust models with more physical variables and integration of processing, testing, and field
`operation. Chapter 6 is devoted to the design of LED packaging applications to sufficient
`details. Chapter 7 provides an introduction to standards and measurement methods for
`some applications.
`We hope this book will be a valuable source of reference to all those who have been facing the
`challenging problems created in the ever-expanding application of high power LEDs. We also
`sincerely hope it will aid in stimulating further research and development on new packaging
`materials, analytical methods, testing and measurement methods, and even newer standards,
`with the objective of achieving a green environment and eco-friendly energy saving industry.
`The organizations that know how to learn about the design and manufacturing capabilities of
`high power LED packaging with high reliability have the potential to make major advances in
`
`IPR Page 15
`
`

`

`xvii
`
`Preface
`
`developing their own intellectual properties (IP) in packaging and applications, to achieve
`benefits in performance, cost, quality, and size/weight. It is our hope that the information
`presented in this book may assist in removing some of the barriers, avoid unnecessary false
`starts, and accelerate the applications of these techniques. We believe that the design of high
`power LED packaging for applications is limited only by the ingenuity and imagination of
`engineers, managers, and researchers.
`
`Sheng Liu, PhD, ASME Fellow
`ChangJiang Scholar Professor
`School of Mechanical Science and Engineering
`and Wuhan National Laboratory for Optoelectronics
`Huazhong University of Science and Technology
`Wuhan, Hubei, China
`
`XiaoBing Luo, PhD, Professor
`School of Energy and Power Engineering
`and Wuhan National Laboratory for Optoelectronics
`Huazhong University of Science and Technology
`Wuhan, Hubei, China
`
`IPR Page 16
`
`

`

`Acknowledgments
`
`Development and preparation of LED Packaging for Lighting Application was facilitated by
`a number of dedicated people at John Wiley & Sons, Chemical Industry Press, and Huazhong
`University of Science and Technology. We would like to thank all of them, with a special
`mention for Gang Wu of Chemical Industry Press and James W. Murphy of John Wiley & Sons.
`Without them, our dream of this book could not have come true, as they have solved many
`problems during this book’s preparation. It has been a great pleasure and fruitful experience to
`work with them in transferring our manuscript into a very attractive printed book.
`The material in this book has clearly been derived from many sources including individuals,
`companies, and organizations, and we have attempted to acknowledge the help we have received.
`It would be quite impossible for us to express our appreciation to everyone concerned for their
`collaboration in producing this book, but we would like to extend our gratitude. In particular, we
`would like to thank several professional societies in which we have published some of the material
`in this book previously. They are the American Society of American Engineers (ASME) and the
`Institute of Electrical and Electronic Engineers (IEEE) for their conferences, proceedings, and
`journals, including ASME Transactions on Journal of Electronic Packaging, IEEE Transactions
`on Advanced Packaging, IEEE Transactions on Components and Packaging Technology, and
`IEEE Transactions on Electronics Packaging Manufacturing. Many important conferences such
`as the Electronic Components and Technology Conference (ECTC), and the International
`Conference on Electronic Packaging Technology & High Density Packaging (ICEPT–HDP)
`are also acknowledged for allowing the reproduction of some of their publication materials.
`We would also like to acknowledge those colleagues who have helped review some chapters
`in the manuscript. They are Professor Ricky Lee of Hong Kong University of Science and
`Technology, Professor Dexiu Huang and Professor Liangshan Wang of Huazhong University of
`Science and Technology (HUST), Professor Jiangen Pan of Everfine Optoelectronics of China,
`and Dr. Shu Yuan of HK ASTRI. We would like to thank them for their many suggestions and
`comments which contributed tremendously to this book. Their depth of knowledge and their
`dedication have been demonstrated throughout the process of reviewing this book.
`We would also like to thank Huazhong University of Science and Technology (HUST),
`Wuhan National Laboratory for Optoelectronics, the School of Mechanical Science and
`Engineering, and the School of Energy and Power Engineering for providing us with an
`excellent working e