| JEDEC
`STANDARD
`
`CONFIGURATIONS FOR
`SOLID STATE MEMORIES
`
`
`
`
`
`JEDEC Standard No. 21—C
`Release 7
`
`7 ENGINEERING DEPARTMENT
`
`
`
`ELECTRONIC INDUSTRIES ASSOCIATION
`
`as
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`IPR2018-00047
`ASUS Computer EX 1006 Page 1
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`IPR2018-00047
`ASUS Computer EX1006 Page 1
`
`

`

`NOTICE
`ELA/JEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and
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`Counsel.
`
`\ 2
`
`EIA/JEDEC Standards and Publications are designed to serve the public interest through eliminating
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`
`The information included in ELA/JEDEC Standards and Publications represents a sound approachto product
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`
`Inquiries. comments, and suggestions relative to the content of this ELA/JJIEDEC Standard should be addressed
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`
`
`
`Published by
`
`©ELECTRONIC INDUSTRIES ASSOCIATION 1997
`Engineering Department
`2500 Wilson Boulevard
`Arlington, VA 22201
`
`“Copyright” does not apply to JEDEC member companies as theyare free
`to duplicate this document in accordance with the latest revision of the
`JEDEC Publication 21 “Manual of Organization and Procedure".
`
`PRICE: Please refer to the current
`Catalog of EIA, JEDEC, and TIA STANDARDS and ENGINEERING PUBLICATIONS .
`orcall Global Engineering Documents, USA and Canada (1-800-854-71 79)
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`
`Printed in U.S.A.
`All rights reserved
`
`i
`
`IPR2018-00047
`ASUS Computer EX 1006 Page 2
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`IPR2018-00047
`ASUS Computer EX1006 Page 2
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`

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`21—C Release 7 Insertion Instructions
`Page — 1
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`JESD 21—C, Release 7 insertion Instructions
`Instructions for adding Release 7 to JEDEC Standard 21—C.
`inclosed with this instruction sheet are new and replacement pages for JEDEC Standard 21-C. Those pages which contain
`new material are labeled “Release 7” at the bottom of the page.
`In some cases,there will be old material on the backof the
`sheet containing a Release 7 page. This old material will be labeled Release 1, Release 2, Release 3, Release 4, Release5.or
`Release 6 as there are no changesfrom theoriginal release. All new textis marked by a "Revision Bar’in the outside marginin
`addition to the "Release 7”label in the inside footer of the page.
`In this release, I have introduced a new feature in the Release #. In the past when an older sheet was replaced with a new one,eitherto
`makea correction,orto revise the original sheet, the new release number simply replaced the old number, thusloosingthe information ofthe
`original release number. In this release, the old numberwill be retained followedbythe letter ’c’” for correction, or "r”for revised,this
`followed by the new release number(e.f 4c7 or 6r7)
`The following isa series ofsheet by sheetinstructionsto be used to print thepagesforthis release. The instruction numbers correspond
`directly the instructions intendedforthe holders ofthe Standard. Theseare also includedwith the new originals for R-6. These instructions
`should be included as the first pages in Release 6. In the printing instructions, the Release # s are refered to as R#.
`In the following 75 instructions, the material is arranged in 3 columns. Thefirst columntells which sheet to remove from the
`21-C binder. The second columntells which sheetto add to the binder. Thethird column gives an explanation ofthe reason for
`the changeoraddition.
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`REASON
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`Contains new Release level and date.
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`IPR2018-00047
`ASUS Computer EX 1006 Page 3
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`ASUS Computer EX1006 Page 3
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`21-C Release 7 Insertion Instructions
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`Section 4 on Modules has been completely re-organized. Removeand discardall of the old
`pages from Section 4 and replace them with the new ones supplied. No sub-dividers are sup-
`plied, but it will enhancethe usability of the section by adding your own dividers. Theindividual
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`IPR2018-00047
`ASUS Computer EX 1006 Page 4
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`IPR2018-00047
`ASUS Computer EX1006 Page 4
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`

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`CONFIGURATIONS FOR SOLID STATE MEMORIES
`
`
`
`Formulated under the cognizance of Committees JC-42.1, PLD devices, JC-42.3, volatile memories, JC-42.4,
`non-volatile memories, and JC-42.5, memory modules and cards, and approved by the JEDEC Council.
`
`Standard 21—C Revision Log.
`
`Release 1, August 1990
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`Release 2, September 1991
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`Release 3, November 1992
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`Release 4, November 1993
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`Release 5, February 1995
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`Release 6, January 1996
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`Release 7, January 1997
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`Release 7
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`-a~
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`IPR2018-00047
`ASUS Computer EX 1006 Page 5
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`IPR2018-00047
`ASUS Computer EX1006 Page 5
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`

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`Section
`
`Contents
`
`JEDEC Standard No. 21-C
`
`Release #
`
`Page #
`
`ue, TBACKGROUND........ cece cence center erence eee nen e eer e een ene Release1 ....... Page 1-1
`
`- 2 TERMS AND DEFINITIONS........-.....0-- cece cece e ee eee nee eeneeeeees Release1 ....... Page 2-1
`2.1 Conventional Device Pin Names ..........-.0---scceeeee eee neneenes Release 6 ....... Page 2-2
`2.2 Multiport DRAM Pin Names ..........00.e eee e cece eee e cece e ene nenee Release3 ....... Page 2-5
`2.3 Power Pin NameéS ...... 02. e eect eee tee eee een e cece rn ere eenes Release5 ....... Page 2-6
`2.4 Device Type Names .........0c nce e eee c ene e ence en ee ene eeneneonneees Release 6 ....... Page 2-7
`2.5 Miscellaneous Device Related Terms .........-..02cccecccewecneenes Release 1 ....... Page 2-9
`2.6 Special Operational Cycles for MPDRAM .............0000eeeee ences Release 1 ..... Page 2-10
`2.7 Package—Related TermS ....... 00.0. cceee ence cece eee een e eee ne renee Release 5 ..... Page 2-12
`2.8 Memory Card Pin NameS ......2..0.s cece eee e eee eee ne eneseneeweee Release3 ..... Page 2 — 13
`2.9 SRAM and SSRAM special Pin Names ..........2-0ecewecceeeeeeees Release6 ....... Page 2-14
`
`3 MEMORY DEVICE STANDARDS...... 0. cece ee rec cence n eee ee een eeeee Release 1 ....... Page 3-1
`3.1 General Standards .......... ccc cece cece eet e meter en ee eeeeeeeeee Release 1 ..... Page 3 .1-1
`3.1.1 Bytewide 1.0... cece eect e nee enn e eee e eee anarenaes Release 1 ..... Page 3 .1 ~1
`3.1.1.1 ~ 32K TO 256K BY 8 A/A MX FAMILY IN DIP .............-..-.-. Release1 ..... Page 3.1 -1
`FIGURE 3.1-1, 32K TO 256K AVA MULTIPLEXED MEMORY INDIP ............... Release1 ....... Page 3 .1-2
`3.2 Read Only Memory (ROM) .............cccn cece nec cnenceteresunees Release ...... Page 3.2—1
`3.2.0 ROM General Standards ...........c ccc ener e eens ereneas Release 5 ...... Page 3.2—2
`3.2.0.1 — Mask ROM Fasi Address Mode Definition ..................... Release5 ...... Page 3.2~2
`3.2.1 ROM, Byte Wide ..... 0... cc eee e cece cette renee eee n ene enentes Release 1 .... Page 3.2.1-1
`3.2.1.1 —- 2K TO 8K BY 8 ROM FAMILYIN DIP, TYPEA ...............4. Release1 .... Page 3.2.1—1
`3.2.1.2 -—-4K BY 8 ROMIN DIP, TypeB ............. eee cee eee eee eee Release 1 .... Page 3.2.1-1
`3.2.1.38— 8K TO 128K BY 8 ROM FAMILYIN DIP, ..................00008 Release 1 .... Page 3.2.1—1
`3.2.1.4 — 2K TO 32K BY 8 ROM FAMILY IN RCC ..................00005 Release .... Page 3.2.1—-1
`3.2.1.5 — 32K TO 512K BY 8 ROMFAMILYIN SOJ, .....--.....22..0000 Release .... Page 3.2.1—1
`3.2.1.6 - 128K TO 1M BY 8 ROM IN DIP, ......... 0. cece eee eee e eee Releasei .... Page 3.2.1-1
`3.2.1.7 — 64K TO 512K BY 9 ROMIN DIP, .............--. eee e ee ee ee eee Release1 .... Page 3.2.1-1
`3.2.1.8 —2 TO 64 X 16K BY 8 PAGE SELECT ROM IN DIP, .............. Release 1 .... Page 3.2.1—1
`3.2.1.9— 512K and 1M BY 8 ROMIN OFP, ..........-.-2.--e eee eee eee Release2 .... Page 3.2.1-1
`FIGURE 3.2.1-1, 2K TO 8K BY 8 ROM IN DIP, TYPESA&B ..................., Release1 ....... Page 3.2.1-2
`FIGURE 3.2.1-2, 8K TO 128K BY 8ROMIN DIP .......... 0... 0 eee eee eee Release ....... Page 3.2.1-3
`FIGURE 3.2.1-3, 2K TO 32K BY 8ROMIN CC... 2... ee ccc cece teen eee Releasei ....... Page 3.2.1-4
`FIGURE3.2.1-4, 32K TO 512K BY 8 ROMINSOJ 00... cece cece eee eee Release 1 ....... Page 3.2.1-5
`FIGURE3.2.1-5, 128K TO IM BY 8ROMINDIP .......... 0. cece eee eee eee Release i ....... Page 3.2.1-6
`FIGURE 3.2.1-6, 64K TO 512K BY9 ROMINDIP ........... cece cece eee eee Release 1 ....... Page 3.2.1-7
`FIGURE3.2.1-7, 2 TO 64 X 16K BY 8 PAGE SELECT .......... 0.0.0 eee eeeaee Release 1 ....... Page 3.2.1-8
`FIGURE 3.2.1-8, 512K AND 1M BY 8 ROMINQFP ........ 0... cece eee e eee Release2 ....... Page 3.2.1-9
`3.2.2 ROM, Word Wide .......20.-cccceceseccese renee nneeeereneatenens Release 1 .... Page 3.2.2-1
`3.2.2.1 — 32K TO 256K BY 16 ROMIN DIP ................2.0. eee eee Release 1 .... Page 3.2.2-3
`3.2.2.2 — 32K TO 256K BY 16 ROM IN SCC ..... cee eee eee eee Release1 .... Page 3.2.2~3
`3.2.2.3 — 16K TO 256K BY 16 ADDRESS/DATA MX ROMINDIP......... Release 1 .... Page 3.2.2-3
`3.2.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX ROM IN RCC ........ Release1 .... Page3.2.2~3
`3.2.2.5 — 256K and 512K BY 16 ROM IN GFP .............. 020 sce eee eee Release2 .... Page 3.2.2-3
`3.2.2.6 — 512K TO 128M BY 16 ROMIN DIP AND SOP ................. Release6 .... Page 3.2.2-3
`3.2.2.7 -512K and 1M BY 16 ROM IN SCC ..................0 00 e eee Release3 .... Page 3.2.2-3
`FIGURE 3.2.2—1, 32K TO 256K BY 16 ROMINDIP ............ 0. cece eee eee Release 1 ....... Page 3.2.2-5
`FIGURE 3.2.2~2, 32K TO 256K BY 1GROMINCC ...... eee eee eee eee eee Release1 ....... Page 3.2.2-6
`Release 7
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`IPR2018-00047
`ASUS Computer EX 1006 Page 6
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`IPR2018-00047
`ASUS Computer EX1006 Page 6
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`

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`JEDEC Standard No. 21-C
`
`Page #
`Release #
`Section
`FIGURE 3.2.2~3, 16K TO 256K BY 16 AQMX ROMINDIP................000005 Release1 ....... Page 3.2.2-7
`FIGURE3.2.24, 16K TO 256K BY 16 AQMX ROMINCC ...... 0. cece eee Release1 ....... Page 3.2.2-8
`FIGURE3.2.2~5, 256K AND 512K BY 16 ROMINQFP .......... 00. ccc cece eee Release2 ....... Page 3.2.2-9
`FIGURE3.2.2-6, 4M TO 128M BY 16 ROMINDIPAND SOP ................0008 Release2 ...... Page 3.2.2~10
`FIGURE3.2.2~7, 512K & IMBY 16 ROMINSCC 0... eee eee eee Release3 ...... Page 3.2.2-11
`FIGURE3.2.2-8, 512K TO 2M BY 16 ROMINDIPAND SOG .................... Release6 ...... Page 3.2.2~12
`3.3 Programmable Read Only Memory (PROM) .......-......ceesneceees Release 1 ...... Page 3.3-—1
`3.3.1 PROM, Nibble Wide ............ cece cee e en ecen meen eeeesnencees Release1 .... Page 3.3.1~1
`3.3.1.1 —.25K & SK BY 4 TTL PROMIN DIP ........... 0... cece een Release1 .... Page 3.3.1-3
`3.3.1.2 —.25K BY 4ECL PROMINDIP ........... 0. cece eee cece ees Release1 .... Page 3.3.1-3
`3.3.1.3- 1K & 2K BY 4 TTL PROMIN DIP .... 2... ccc ee eee Releasei .... Page 3.3.1-3
`3.3.1.4-1K & 2K BY 4 TTL PROMIN SOP ........ 0.2 ccc cece eee Release1 .... Page 3.3.1-3
`3.3.1.5 ~ 4K TO 8K BY 4 TTL PROM IN DIP .............. 0... cece eee Release2 .... Page 3.3.1-3
`3.3.1.6 — .25K TO 2K BY 4 TTL PROM FAMILY IN RCC ................. Releasei .... Page 3.3.1-3
`3.3.1.7 — 4K BY 4 TTL PROM, 4K BY 4 TTL RPROMIN SCC ............ Releasei .... Page 3.3.1-3
`3.3.1.8 ~ 1K TO 8K TTL BY 4 PROM FAMILY IN RCC.................2.. Releasei .... Page 3.3.1-3
`3.3.1.9— 1K TO 8K TTL BY 4 PROM FAMILY IN SCC ................00. Release1 .... Page 3.3.1-3
`3.3.1.10 — 1K TO 4K BY 4 DPROM FAMILIES INDIP& SCC ............ Release 1 .... Page 3.3.1-4
`3.3.1.11 — 1K TO 16K BY 4 ECL PROM FAMILY IN DIP ................. Releasei .... Page 3.3.1-4
`FIGURE 3.3.1-1, 25K TO 2K BY 4TTLPROMINDIP ........... 2.00 c eee eee Release1 ....... Page 3.3.1-5
`FIGURE 3.3.1-2, 256 BY 4 ECLPROMINDIP .............. cc cece cence aes Release1 ....... Page 3.3.1-6
`FIGURE3.3.1-3, 1K & 2K BY 4TTL PROMINSOG ...0. 0... cece ees Releasei ....... Page 3.3.1-7
`FIGURE3.3.1-4, 4K AND 8K BY 4 TILPROMINDIP ........ 0... 0. ccc cence eee Release2 ....... Page 3.3.1-8
`FIGURE3.3.1-5, .25K TO 4K BY 4 TTL PROM FAMILY INCC... 2... 0... eee eae Release 1 ....... Page 3.3.1-9
`FIGURE 3.3.1~6, 1K TO 8K BY 4 TTL PROM IN RCC .... 2. ee eee eee eee Release1 ...... Page 3.3.1-10
`FIGURE 3.3.1~7, 1K TO 8K BY 4 TTL PROMINSCC ......... 0. cece ce eee eee Release1 ...... Page 3.3.1-11
`FIGURE3.3.1-8, 1KTO 4K BY4 TILDPROMINDIP ................cecceeaas Release i ...... Page 3.3.1-12
`FIGURE 3.3.1-9, 1K TO 4K BY 4 DPROMINCC 1... o.oo ccc eee Release 1 ...... Page 3.3.1-13
`FIGURE 3.3.1-10, 1K TO 16K BY 4ECL PROMINDIP............. 202 e eee eeaee Release 1 ...... Page 3.3.1-14
`3.3.2 PROM, Bytewide .........ccec sce e eee reece eee eee e een neeeenneee Release 1 .... Page 3.3.2—-1
`3.3.2.1 — 32 BY 8 TTL PROMIN DIP & SCC ... eee eee ee Release1 .... Page 3.3.2-3
`3.3.2.2 ~ 32 BY 8 ECL PROM IN DIP & SCC 2. cece nee Release 1 .... Page 3.3.2-3
`3.3.2.3 —.25K & 5K BY 8 TIL PROM IN DIP & SCC ..... eee eee, Release1 .... Page 3.3.2-3
`3.3.2.4 — .25K TO 8K BY 8 TTL PROM FAMILYIN DIP .................. Release1 .... Page 3.3.2-3
`3.3.2.5 — .5K TO 4K BY 8 TTL LPROM FAMILYIN DIP .................. Release .... Page 3.3.2-3
`3.3.2.6 — .5K TO 4K BY 8 TTL RPROM FAMILYIN DIP .................. Releasei .... Page 3.3.2-3
`3.3.2.7 — .5K TO 8K BY 8 TTL PROM FAMILIES INRCC & SCC ......... Release1 .... Page 3.3.2-3
`3.3.2.8 — .5K TO 2K BY 8 TTL RPROM FAMILY IN SCC ................. Release1 .... Page 3.3.24
`3.3.2.9 — 16K TO 64K BY 8 TTL PROM FAMILY IN DIP ................. Release1 .... Page 3.3.24
`3.3.2.10~ 512 BY 8 ECL RPROMIN DIP& SCC ...................... Release2 .... Page 3.3.2-4
`FIGURE3.3.2—1, 32 BY 8 TTL& ECL PROMIN DIP .... 2... ec ee eee eee Release1 ....... Page 3.3.2-5
`FIGURE3.3.2~2, 32, 256, & 512 BY 8 TTL PROM IN CC, 32 BY 8ECL PROMINCC ... Release1 ....... Page 3.3,.2-6
`FIGURE3.3,2~3, 256 & 512 BY 8TTL PROMINDIP ............. 0.00. ee eens Release1 ....... Page 3.3.2~7
`FIGURE3.3.2—-4, .25K TO 8K BY 8TILPROMINDIP .................20ceeeee Releasei ....... Page 3.3.2-8
`FIGURE 3.3.2-5, 5K TO 4K BY 8TTLLPROMINDIP ...................000 eee Release1 ....... Page 3.3.2-9
`FIGURE3.3.2-6, .5K TO 4K BY 8 TTL RPROMINDIP .................000eeeus Releasei ...... Page 3.3.2-10
`FIGURE3.3.2~7, .5K TO 8K BY8TTLPROMINSCC ............ cee eee ee eee Release 1 ...... Page 3.3.2-11
`FIGURE3.3.2-8, 5K TO 8K BY 8TILPROMINRCC ........... 2 cece eee eae Release i ...... Page 3.3.2-12
`FIGURE3.3.2-9, .5K TO 2K BY 8RPROMINCC ..... 0.0. cece eee ee cee ee Release1 ...... Page 3.3.2-13
`FIGURE 3.3.2-10, 16K TO 64K BY 8 TILPROMINDIP ..............-.2000000e Release1 ...... Page 3.3.2-14
`FIGURE3.3.2-11, 512 BY 8 10K & 100K ECL RPROM IN DIP AND SCC ............ Release 2 ...... Page 3.3.2-15
`Release 7
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`eos
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`IPR2018-00047
`ASUS Computer EX 1006 Page 7
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`IPR2018-00047
`ASUS Computer EX1006 Page 7
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`

`

`Section
`
`JEDEC Standard No. 21-C
`
`Release #
`
`Page #
`
`3.3.3 PROM, Word Wide .........:ecee cece cec anes en sence cecceuenaes Release 1 .... Page 3.3.3-1
`3.3.3.1 ~32 AND 64 BY 16 PROMIN DIP AND SCC ................... Releasei .... Page 3.3.3-3
`FIGURE3.3.3-1, 32 AND 64 BY 16 TTL PROMINDIP ............... cece eeu Release 1 ....... Page 3.3,.3-5
`FIGURE3.3.3-2, 32 AND 64 BY 16 TTLPROMINCC 2.0... eee e eee ea ee Release 1 ....... Page 3.3.3-6
`3.3.4 PROM Package CoOmversion .........ceceeeeee ecu eee eer cone enous Release i .... Page 3.3.4—1
`3.3.4.1 ~ PROM DIP TO SO CONVERSION, 16, 18, 20, 24 DIP .......... Releasei .... Page 3.3.4—1
`FIGURE3.3.4-1, 1K AND 2K TTL PROM 18 DIP TO. 20 SO CONVERSION .......... Release1 ....... Page 3.3.4-3
`3.4 Erasable Programmable Read Only Memory (EPROM) ...........-... Release i ...... Page 3.4-1
`3.4.1 EPROM, Byte Wide ..... 2... ccc ccc ccc tee cece eee ene tentereee Release i .... Page 3.4.1-1
`3.4.1.1 -— 4K BY 8 EPROM IN DIP, TYPEA .... 02. cece eee eee Release 1 .... Page 3.4.1-3
`3.4.1.2 — 4K AND 8K BY 8 EPROMIN DIP, ........... cece cece eee Release i .... Page 3.4.1-3
`3.4.1.8 — 8K TO 64K BY 8 EPROM FAMILYIN DIP, ................20 00 Release 1 .... Page 3.4.1-3
`3.4.1.4-— 2K TO 512K BY 8 EPROM FAMILY IN RCC ..............-..-- Release 1 .... Page 3.4.1-3
`3.4.1.5 — 32K TO 512K BY 8 EPROM FAMILYIN SOJ, ................6. Releasei .... Page 3.4.1-3
`3.4.1.6 — 128K TO 1M BY 8 EPROM FAMILYIN DIP,.................05- Release i .... Page 3.4.1-3
`3.4.1.7 — 64K TO 512K BY 9 EPROM FAMILYIN DIP, ..................- Release 1 .... Page 3.4.1-3
`3.4.1.8 —-2 TO 64 X 16K BY 8 PAGE SELECT EPROM FAMILYIN DIP,
`... Release1 .... Page 3.4.1-3
`3.4.1.9 — 128K TO 512K BY 8 EPROM FAMILY IN TSOP—1, ............. Release 4 .... Page 3.4.1-3
`FIGURE 3.4.1—1, 4K AND 8K BY 8 EPROMIN DIP, TYPESA&B ................. Release1 ....... Page 3.4.1-5
`FIGURE 3.4.1-2, 8K TO 64K BY SEPROMINDIP ........... 00... ccc cece eee Release1 ....... Page 3.4.1-6
`FIGURE3.4.1-3, 2K TO 512K BY 8EPROMINCC ... oe eee eee eee Release 1 ....... Page 3.4.1-7
`FIGURE3.4.1-4, 32K TO 512K BY 8 EPROMIN SOU 2... cece eee ee Release 1 ....... Page 3.4.1-8
`FIGURE3.4.1-5, 128K TO 1M BY 8 EPROMIN DIP .......... 22... eee eee eee Release1 ....... Page 3.4.1-9
`FIGURE 3.4.1-6, 64K TO 512K BY 9 EPROMINDIP ......0..-- cece cece e ee eee Release 1 ...... Page 3.4.1-10
`FIGURE3.4.1-7, 2 TO 64 X 16K BY 8 PAGE SELECT EPROMINDIP.............. Release1 ...... Page 3.4.1-11
`FIGURE 3.4.1-8, 128K TO 512K BY 8 EPROMIN TSOP-1 ....... 020.0... -02 eee Release 4 ...... Page 3.4.1-12
`3.4.2 EPROM, Word Wide ............. ccc cece eee eee neeennenvenseen Release1 .... Page 3.4.2~1
`3.4.2.1 ~ 32K TO 256K BY 16 EPROMIN DIP ............. 00-2 eee eee Release 1 .... Page 3.4.2-3
`3.4.2.2 — 82K TO 256K BY 16 EPROM IN SCC ........... cc cece eee Release 1 .... Page 3.4.2-3
`3.4.2.3 — 16K TO 256K BY 16 ADDRESS/DATA MX EPROM IN DIP ...... Release i .... Page 3.4.2-3
`3.4.2.4 — 16K TO 256K BY 16 ADDRESS/DATA MX EPROM INRCC ..... Release1 .... Page 3.4.2-3
`3.4.2.5 —- 512K TO 128M BY 16 EPROM or OTP IN DIP AND SOP ....... Release6 .... Page 3.4.2-3
`3.4.2.6—512K and 1M BY 16 EPROMIN SCC .......... 0... e ee eee Release3 .... Page 3.4.2-3
`3.4.2.7 — 64K TO 256K BY 16 EPROM IN TSOP-1 ..............--...-- Release4 .... Page 3.4.2-3
`FIGURE 3.4.2~1, 32K TO 256K BY 16 EPROMINDIP .............. ccc cece eee Release 1 ....... Page 3.4.2-5
`FIGURE 3.4.2~2, 32K TO 256K BY 16 EPROMIN SCC... eee eee eee Release1 ....... Page 3.4.2-6
`FIGURE3.4.2-3, 16K TO 256K BY 16 ADDRESS/DATAMX EPROM INDIP ......... Release 1 ....... Page 3.4.2~7
`FIGURE3.4.2—-4, 16K TO 256K BY 16 ADDRESS/DATA MX EPROM INRCC......... Release 1 ....... Page 3.4.2-8
`FIGURE3.4.2-5, 4M TO 128M BY 16 EPROM OR OTP INDIPAND SOP ........... Release1 ....... Page 3.4.2-9
`FIGURE3.4.2-6, 512K & IMBY 16 EPROMINCC o.oo. eee ee eee eee Release3 ...... Page 3.4.2-10
`FIGURE3.4.2~7, 64K BY 256K BY 16 EPROMIN TSOP-1 ................0.0005 Release 4 ...... Page 3.4.2-11
`FIGURE 3.4.2~8, 512K TO 2M BY 16 EPROM INDIPAND SOG .................. Release6 ...... Page 3.4.2~12
`3.5 Electrically Erasable Programmable Read Only Memory (EEPROM) ... Releasei ...... Page 3.5—1
`3.5.1 EEPROM, Byte Wide ...........cn cece een een ee rte eeereeeeennees Releasei .... Page 3.5.1-1
`3.5.1.1 ~.5K TO 2K BY 8 EEPROM FAMILYIN DIP..............--2. sees Release 1 .... Page 3.5.1-2
`3.5.1.2 — 2K & 4K BY 8 EEPROM IN RCC ... ce eee eee eee Releasei .... Page 3.5.1-2
`3.5.1.8— 1K TO 32K BY 8 EEPROM FAMILYIN DIP ...........----..04- Release1 .... Page 3.5.1-2
`3.5.1.4 — .5K TO 32K BY 8 EEPROM FAMILY IN RCC .................. Release1 .... Page 3.5.1-2
`3.5.1.5 — 32K TO 256K BY 8 EEPROM FAMILY IN SOJ, .........-.-..... Release1 .... Page 3.5.1-2
`3.5.1.6 — 32K TO 512K BY 8 EEPROM FAMILYIN DIP,
`........----...6. Release 1 .... Page 3.5.1-2
`
`Release 7
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`IPR2018-00047
`ASUS Computer EX 1006 Page 8
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`IPR2018-00047
`ASUS Computer EX1006 Page 8
`
`

`

`JEDEC Standard No. 21-C
`
`Page #
`Release #
`Section
`3.5.1.7 — 32K TO 256K BY 8 EEPROM FAMILY IN ROC, ...............-. Release 1 .... Page 3.5.1-2
`3.5.1.8 — 32K TO 256K BY 9 EEPROM FAMILY IN DIP, ................. Release 1 .... Page 3.5.1~2
`3.5.1.9 —- 128K TO 1M BY 8 EEPROM FAMILY IN SCC, ................. Release 1 .... Page 3.5.1~2
`3.5.1.10 —- 32K TO 256K BY 8 EEPROM FAMILY INTSOP1 ............. Release2 .... Page 3.5.1-3
`3.5.1.11 - EXTENDED FEATURE SET FOR 256K BIT EEPROM ......... Release2 .... Page 3.5.1~3
`3.5.1.12 - OPTIONAL COMMAND SET FOR DUAL-SUPPLY EEPROM .. Release3 .... Page 3.5.1-3
`3.5.1.13 — 512K BY 8 DUAL-SUPPLY EEPROM IN RCC ................ Release5 .... Page 3.5.1-3
`3.5.1.14—- 128K to 512K BY 8 SINGLE-SUPPLY EEPROM FAMILY
`IN DIP, ROC, & TSOP1 2... ccc cece eee tees Release5 .... Page 3.5.1-3
`3.5.1.15 — 256K, 512K, &1M BY 8 DUAL~SUPPLY EEPROM IN TSOP1 ... Release6 .... Page 3.5.1-4
`3.5.1.16 — 1M TO 8M BY 8 SINGLE~SUPPLY EEPROM FAMILY INTSOP1 .......... Release5 .... Page 3.5.14
`3.5.1.17 — 8K BY 256B OR 264B SERIAL ACCESS EEPROM INTSOP2 ............ Release6 .... Page 3.5.14
`3.5.1.18 — 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROM IN PSOP2 ........... Release7 .... Page 3.5.1-4
`FIGURE3.5.1-1, 5K TO 2K BY SEEPROMINDIP .............c cece cceeeeees Release1 ....... Page 3.5.1~5
`FIGURE3.5.1-2, 2K & 4K BY 8 EEPROM INRCC ...... 0. eee eee eee Release1 ....... Page 3.5.1-6
`FIGURE3.5.1~3, 1K TO 32K BY 8 EEPROM FAMILY INDIP ...............000005 Release 1 ....... Page 3.5.1~7
`FIGURE3.5.1-4, .5K TO 32K BY 8 EEPROM FAMILY INRCC ..............-0000- Release i ....... Page 3.5.1-8
`FIGURE3.5.1~5, 32K TO 256K BY 8 EEPROM FAMILY INSOJ........... 0.000005 Release ....... Page 3.5.1-9
`FIGURE3.5.1-6, 32K TO 512K BY 8 EEPROM FAMILY INDIP ...............000- Release1 ...... Page 3.5.1-10
`FIGURE3.5.1-7, 32K TO 256K BY 8 EEPROM FAMILY INRCC ................04 Release1 ...... Page 3.5.1-11
`FIGURE 3.5.1-8, 32K TO 256K BY 9 EEPROM FAMILY INDIP ................... Release1 ...... Page 3.5.1-12
`FIGURE 3.5.1-9, 128K TO 1M BY 8 EEPROM FAMILY INSCC ........... 20.0000 Releasei ...... Page 3.5.1-13
`FIGURE3.5.1-10, 32K TO 256K BY 8 EEPROM FAMILY INTSOP1 ............... Release2 ...... Page 3.5.1-14
`ADDENDUM 1, 32K X 8 BIT EEPROM EXTENDED FEATURE STANDARD .......... Release2 ...... Page 3.5.1-15
`FIGURE3.5.1-11, DUAL SUPPLY EEPROM COMMANDSET .................0006 Release3 ...... Page3.5.1-238
`FIGURE3.5.1-12, 512K BY 8 DUAL-SUPPLY EEPROM INRCC .............0005 Release5 ...... Page 3.5.1-24
`FIGURE3.5.1-13, 128K to 512K SINGLE-SUPPLY EEPROM FAMILY INDIP ........ Release5 ...... Page 3.5.1-25
`FIGURE3.5.1-14, 128K to 512K SINGLE~SUPPLY EEPROM FAMILY INRCC........ Release5 ...... Page 3.5.1-26
`FIGURE 3.5.1-15, 128K to 512K SINGLE-SUPPLY EEPROM FAMILY INTSOP1...... Release5 ...... Page 3.5.1-27
`FIGURE 3.5.1-16, 1M BY 8 DUAL-SUPPLY EEPROMINTSOP1 ..............65. Release5 ...... Page 3.5.1~28
`FIGURE 3.5.1-17. 1M TO 8M SINGLE-SUPPLY EEPROM FAMILY IN TSOP1 ........ Release5 ...... Page 3.5.1-29
`FIGURE 3.5.1-18, 256K & 512K BY 8 DUAL-SUPPLY EEPROM IN TSOP1 .......... Release6 ...... Page 3.5.1~30
`FIGURE 3.5.1-19 A=>C 8K BY 256B OR 264B SERIAL ACCESS EEPROM IN TSOP2 .. Release 6 .. Page 3.5.1-31=>33
`FIGURE3.5.1-20. 1M, 2M BU 8 SINGLE OR DUAL SUPPLY EEPROM IN PSOP1 ..... Release7 ...... Page 3.5.1-34
`3.5.2 EEPROM, Word Wide ........ 2c cece eee e sence nee ee ene wseeseens Release i .... Page 3.5.2—1
`3.5.2.1~4K TO 32K BY 16 EEPROMINDIP ................. 2. ee cee Release1 .... Page 3.5.2-3
`3.5.2.2 -4K TO 256K BY 16 EEPROM IN SCC ....................000: Releasei .... Page 3.5.2-3
`3.5.2.3 — 256K TO 128M BY 16 EEPROM IN DIP AND SOG ............. Release6 .... Page 3.5.2-3
`3.5.2.4~— 1M TO 4M BY 16 DS EEPROMIN SSOP......... been seeeeee Release6 .... Page 3.5.2-3
`3.5.2.5 ~ 1M TO 4M DENSITY, BY 8 OR 16 FEEPROMINPSOP........ Release7 .... Page 3.5.2-3
`3.5.2.6 — 1M TO 32M DENSITY, BY 8OR16 FEEPROM IN TSOP1...... Release7 .... Page 3.5.2-3
`FIGURE3.5.2-1, 4K TO 32K BY 16 EEPROM FAMILY INDIP ........2... 02.0000. Release ....... Page 3.5.2-5
`FIGURE 3.5.2-2, 4K TO 256K BY 16 EEPROM FAMILY INSCC ...............00. Release ....... Page 3.5.2-6
`FIGURE 3.5.2-3, 4M TO 128M BY 16 EEPROM FAMILY INDIP ANDSOG .......... Release2 ....... Page 3.5.2-7
`FIGURE 3.5.24, 256K TO 2M BY 16 EEPROM FAMILY INDIPANDSOG........... Release6 ....... Page 3.5.2-8
`FIGURE3.5.2-5, 1M TO 4M BY 16 DS EEPROM IN SSOP ............... Release6 ....... Page 3.5.2-9
`FIGURE 3.5.2-6, 1M TO 4M DENSITY BY 8 OR16 FEEPROM IN PSOP... Release7 ...... Page 3.5.2-10
`FIGURE3.5.2-7, 1M TO 32M DEBSITY BY 8 OR16 FEEPROM IN PSOP.. Release7 ...... Page 3.5.2~11
`3.5.3 EEPROM EXTENDED FEATURES.............2- cen eee seer eens Release i .... Page 3.5.3-1
`3.5.3.1 - EXTENDED FEATURE SET FOR 256Kb EEPROM............ Release1 .... Page 3.5.3-3
`3.5.3.2 - DUAL SUPPLY EEPROM COMMANDSET .................. Release7 ... Page 3.5.3~-13
`Release 7
`
`"
`
`IPR2018-00047
`ASUS Computer EX 1006 Page 9
`
`IPR2018-00047
`ASUS Computer EX1006 Page 9
`
`

`

`
`
`Section
`
`JEDEC Standard No. 21-C
`
`Release #
`
`Page #
`
`3.5.3.3 —- SINGLE SUPPLY EEPROM COMMAND CODES. .............. Release7 ... Page 3.5.3-14
`3.5.3.4 — EEPROM TOGGLE BIT FEATURE ................... 0.00 eee Release7 ... Page 3.5.3-15
`3.6 Non volatile Random Access Memory (NVRAM) ............0.c0ceeee Release1 ...... Page 3.6-1
`3.6.1 NVRAM, Nibble Wide ............00cccucceccecneencernenstsusene Release 1 ...... Page 3.6-3
`3.6.1.1 —.25K & 1K BY 4NVRAMIN DIP ..... 2. eee eee Release1 ...... Page 3.6-3
`3.6.2 NVRAM, BYTE WIDE .............---.. een cates eens ene ee ene Release 1 ...... Page 3.6-3
`3.6.2.1 — .5K, 1K BY 8 NVRAMIN DIP ............ cece cece eee eens Release1 ...... Page 3.6-3
`3.6.2.2 — 5K & 1K BY 8 NVRAM IN RCC ........ 2 eee cece ene Release 1 ...... Page 3.6-3
`3.6.2.3 — .5K TO 16K BY 8 NVRAM FAMILYIN DIP ..................... Release 1 ...... Page 3.6-3
`3.6.2.4 — .5K TO 16K BY 8 NVRAM FAMILY IN RCC .................05. Release1 ...... Page 3.6-3
`3.6.2.5 — 32K TO 256K BY 8 NVRAM FAMILY IN SOU, .................- Release1 ...... Page 3.6-3
`3.6.2.6 — 32K TO 256K BY 8 NVRAM FAMILYIN DIP, ..............0...- Release 1 ...... Page 3.6-3
`3.6.2.7 ~ 16K TO 128K BY 9 NVRAM FAMILYIN DIP, ..............25-65 Release1 ...... Page 3.6-3
`FIGURE 3.6-1,.25K RIK BY4NVRAMINDIP 2... 00... cee cece eee eres Release 1 ........ Page 3.6-5
`FIGURE 3.6-2, 5K &1KBY8NVRAMINDIP ........... 0... ce cece eee en ees Release 1 ........ Page 3.6-6
`FIGURE 3.6-3, 5K & IK BY 8NVRAMIN RCC 1.2... eee cece eee eens Release1 ........ Page 3.6-7
`FIGURE 3.64, .5K TO 16K BY 8 NVRAM FAMILY INDIP ..................00 00 Release1 ........ Page 3.6-8
`FIGURE 3.6-5, .5K TO 16K BY 8 NVRAM FAMILY INRCC ..................000. Release1 ........ Page 3.6-9
`FIGURE 3.6-6, 32K TO 256K BY 8 NVRAM FAMILY INSOJ ...............0.000. Release 1 ....... Page 3.6-10
`FIGURE 3.6-7, 32K TO 256K NY 8 NVRAM FAMILY INDIP ................0000- Release1 ....... Page 3.6-11
`FIGURE 3.6-8, 16K TO 128K BY 9 NVRAM FAMILY INDIP................00 0 eee Release1 ....... Page 3.6-12
`3.7 Static Random Access Memory (SRAM) ....-......-0.eseeereeeeeaee Release 1 ...... Page 3.7-1
`3.7.1 — JTAG Extension to Revolutionary Pinout SRAM Devices ........ Release 4 ...... Page 3.7—1
`FIGURE 3.7-1, JTAG ADDITION TO REVOLUTIONARY PINOUT SRAM ............ Release4 ........ Page 3.7-3
`3.7.1 Bit Wide TTL SRAM ........0...c cece ence ence ence nee ennnensees Release 1 .... Page 3.7.1-1
`3.7.1.1 -—.25K & IKBY 1 TILSRAMIN DIP 220... ee eee ee Release1 .... Page 3.7.1-3
`3.7.1.2 —.25K & IK BY 1 TILSRAMIN SCC ..... ee ence cee ees Release .... Page 3.7.1-3
`3.7.1.3 — 4K TO 2M BY 1 TTL SRAM FAMILYIN DIP..................2. Release 1 .... Page 3.7.1-3
`3.7.1.4— 16K BY 1 TTL SRAM IN RCC...... 2... ee ccc eee een eee Release1 .... Page 3.7.1-3
`3.7.1.5 — 64K BY 1 TTL SRAM IN RCC... 0... eee ee Release1 .... Page 3.7.1-3
`3.7.1.6 — 16K TO 2M BY 1 TTLSRAMIN SOU 2... eee cece eee Release5 .... Page 3.7.1-3
`3.7.1.7 ~ 256K TO 16M BY 1 TTL SRAM AND 4M BY 1 SSRAM
`IN DIP, SOU, AND TSOP-—2 2.0... ec cece eee nee Release 4 .... Page 3.7.1-3
`3.7.1.8 —256K BY 1 TTL SRAM IN RCC ..... eee cece eee eee Release1 .... Page 3.7.1-3
`3.7.1.9 —4M AND 16M SRAM, CONFIGURABLE TO X1 OR X4
`IN DIP, SOJ, AND TSOP-2 ... 22... eee ccc