`
`I,
`
`Yukiko Toyoda Buntin
`
`of
`
`1950 Roland Clarke Place
`
`Reston, VA 20191
`
`declare that I am well acquainted with both the Japanese and English languages, and that the
`
`attached is an accurate partial translation,
`to the best of my knowledge and ability, of
`Japanese Patent Application Publication No. H9-120964 (translation of first page only),
`
`published May6, 1997.
`
`I further declare that all statements made herein of my own knowledge are true and that all
`
`statements made on information and belief are believed to be true; and further that these
`
`statements were made with the knowledge that willful false statements and the like so made
`
`are punishable by fine or imprisonment, or both, under Section 1001 of Title 18 of the United
`States Code and that such willful false statements may jeopardize the validity of the above-
`
`captioned application or any patent issued thereon.
`
`Signature
`
` 5.5,
`Date
`(,-22 701‘]
`
`Yukiko Toyoda Buntin
`
`{3709902 03154220.DOC}
`
`Page 1 of 3
`
`Exhibit 2067
`
`TSMCv. IP Bridge
`IPR2016-01246
`
`Page 1 of 3
`
`Exhibit 2067
`TSMC v. IP Bridge
`IPR2016-01246
`
`
`
`(19) Japan Patent Office (JP)
`
`(12) Patent Publication (A)
`(11) Patent Application Publication No:
`H9-120964
`(43) Publication Date: May 6, 1997
`
`(51) Int.Cl.°
`Classification Symbol
`JPO Ref. FI
`Technical display area
`H 01L 21/3205
`HO1L 21/88
`21/3065
`21/302
`21/768
`21/88
`21/90
`
`J
`J
`P
`A
`
`Examination Request — None — Numberof Claims 16 OL (19 pagestotal)
`
`
` a
`
`(21) Application No: H7-278546
`(22) Filing Date:
`October 26, 1995
`
`(71) Applicant:
`
`000005821
`Matsushita Electric Industrial Co., Ltd.
`1006, Oaza Kadoma, Kadoma-shi, Osaka
`
`(72) Inventor:
`
`Tetsuya UEDA
`c/o Matsushita Electric Industrial Co., Ltd.
`1006, Oaza Kadoma, Kadoma-shi, Osaka
`
`(72) Inventor:
`
`Satoshi VEDA
`c/o Matsushita Electric Industrial Co., Ltd.
`1006, Oaza Kadoma, Kadoma-shi, Osaka
`
`(74) Agent:
`
`Patent Attorney: Hiroshi MAEDA(and 2 others)
`
`(54)
`
`Title of Invention
`
`FORMATION METHOD FOR WIRING AND SEMICONDUCTOR ELEMENT
`
`{J709902 03154264.DOC}
`
`-1-
`
`Page 2 of 3
`
`Page 2 of 3
`
`
`
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`(57) (34)
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`
`{3709902 03154264.DOC}
`
`-2-
`
`Page 3 of 3
`
`Page 3 of 3
`
`
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