`U.S. Patent No. 7,126,174
`
`Filed on behalf of Godo Kaisha IP Bridge 1
`By: Neil F. Greenblum (ngreenblum@gbpatent.com)
`
`Greenblum & Bernstein, P.L.C.
`
`1950 Roland Clarke Place
`
`Reston, VA 20191
`
`Tel: 703-716-1191
`
`Fax: 703-716-1180
`
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`____________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________
`
`TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED,
`Petitioner,
`
`v.
`
`GODO KAISHA IP BRIDGE 1,
`Patent Owner.
`____________
`
`Case IPR2016-012461
`U.S. Patent No. 7,126,174
`____________
`
`PATENT OWNER’S CURRENT EXHIBIT LIST
`(As of March 24, 2017)
`
`
`
`Mail Stop PATENT BOARD, PTAB
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-1450
`
`
`
`1 Case IPR2016-01247 has been consolidated with this proceeding.
`
`
`
`
`
`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
`PATENT OWNER’S CURRENT EXHIBIT LIST
`(As of March 24, 2017)
`
`Exhibit
`No.
`
`Description
`
`2001
`
`2002
`
`2003
`
`2004
`
`Substitute Declaration of Dr. E. Fred Schubert,
`Ph.D. in support of Patent Owner’s Preliminary
`Response filed in IPR2016-01246 on October 5,
`2016.
`
`Schematic illustration of the Chemical Mechanical
`Polishing process from Steigerwald, Murarka, and
`Gutmann, Chemical Mechanical Planarization of
`Microelectronic Materials (1997).
`
`Schematic illustration of the Chemical Mechanical
`Polishing process from the Motorola Company.
`SCSolutions.com. Accessed September 30, 2016.
`http://www.scsolutions.com/chemical-mechanical-
`planarization-cmp-controllers-0.
`
`Photograph of a Chemical Mechanical Polishing
`Tool from the Applied Materials Company.
`BusinessWire.com. Accessed October 5, 2016.
`http://www.businesswire.com/news/home/20040711
`005007/en/Applied-Materials-Revolutionizes-
`Planarization-Technology-Breakthrough-Reflexion.
`
`2005
`
`Troxel, Boning, McIlrath “Semiconductor Process
`Representation.” Wiley Encyclopedia of Electrical
`and Electronics, pp.139 –147 (1999).
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`2006
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`U.S. Patent No. 6,052,319 to Jacobs.
`
`2007
`
`U.S. Patent No. 6,952,656 to Cordova et al.
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`Newly
`Submitted
`
`Served
`only
`
`
`
`
`
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`
`
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`
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`
`
`1
`
`
`
`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
`Description
`
`Newly
`Submitted
`
`Hunt, “Low Budget Undergraduate
`Microelectronics Laboratory.” University
`Government Industry Microelectronics Symposium,
`pp.81-87 (2006).
`
`
`
`Exhibit
`No.
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`2008
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`2009
`
`U.S. Patent No. 7,074,709 to Young.
`
`Burckel, “3D-ICs created using oblique processing.”
`Advanced in Patterning Materials and Processes
`XXXIII, pp. 1–12 (2016).
`
`Substitute Declaration of Dr. E. Fred Schubert,
`Ph.D. in support of Patent Owner’s Preliminary
`Response filed in IPR2016-01247 on October 7,
`2016.
`
`Served
`only
`
`Declaration of Dr. E. Fred Schubert, Ph.D. in
`support of Patent Owner’s Response filed in
`IPR2016-01246 on March 24, 2017.
`
`Thompson, L. F. “An Introduction to Lithography.”
`Introduction to Microlithography, ACS Symposium
`Ser., American Chemical Society, pp. 1-13 (1983).
`
`2010
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`2011
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`2012
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`2013
`
`2014
`
`CA1275846 C to Roland et al.
`
`2015
`
`U.S. Patent No. 5,314,843 to Yu et al.
`
`2016
`
`U.S. Patent No. 5,231,306 to Meikle et al.
`
`2017
`
`U.S. Patent No. 4,529,621 to Ballard.
`
`2018
`
`U.S. Patent No. 5,310,624 to Ehrlich.
`
`2019
`
`U.S. Patent No. 5,097,422 to Corbin, II et al.
`
`2020
`
`Declaration of Amanda Dove.
`
`2021
`
`U.S. Patent No. 4,952,524 to Lee et al.
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`2
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`
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`x
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`x
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`x
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`x
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`x
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`x
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`x
`
`x
`
`x
`
`x
`
`
`
`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
`Description
`
`Newly
`Submitted
`
`x
`
`x
`
`x
`
`x
`
`x
`
`x
`
`Exhibit
`No.
`
`2022
`
`2023
`
`2024
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`2025
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`2026
`
`Bryant, A.; Haensch, W.; Geissler, S; Mandelman,
`Jack; Poindexter, D.; and Steger, M. “The Current-
`Carrying Corner Inherent to Trench Isolation.”
`IEEE Electron Device Letters, Vol. 14, No. 8, pp.
`412-414 (1993).
`
`Ohe, Kikuyo; Odanaka, Shinji; Moriyama, Kaori;
`Hori, Takashi; and Fuse, Genshu. “Narrow-Width
`Effects of Shallow Trench-Isolated CMOS with n+-
`Polysilicon Gate.” IEEE Transactions on Electron
`Devices, Vol. 36, No. 6, pp. 1110-1116 (1989).
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`Shigyo, N.; Wada, T.; Fukuda, S.; Hieda, K.,
`Hamamoto, T.; Watanabe, H.; Sunouchi, K.; and
`Tango, H. “Steep Subthreshold Characteristic and
`Enhanced Transconductance of Fully-Recessed
`Oxide (Trench) Isolated 1/4 µm Width MOSFETs.”
`1987 International Electron Devices Meeting, pp.
`636-639 (1987).
`
`Furukawa, T., and Mandelman, J.A. “Process and
`Device Simulation of Trench Isolation Corner
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`Society, Vol. 135, No. 8, p. 358C, Item 236 (1988).
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`“Structural Analysis Sample Report” downloaded
`from
`https://www.chipworks.com/TOC/Structural_Analy
`sis_Sample_Report.pdf (2008).
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`2027
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`U.S. Patent No. 4,776,922 to Bhattacharyya et al.
`
`3
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`
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`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
`Exhibit
`No.
`
`Description
`
`Newly
`Submitted
`
`Subbanna, S.; Ganin, E.; Crabbé, E.; Comfort, J.;
`Wu, S.; Agnello, P.; Martin, B.; McCord, M.;
`Newman, H. Ng. T.; McFarland, P.; Sun, J.; Snare,
`J.; Acovic, A.; Ray, A.; Gehres, R.; Schulz, R.;
`Greco, S.; Beyer, K.; Liebmann, L.; DellaGuardia,
`R.; Lamberti, A. “200 mm Process Integration for a
`0.15 µm Channel-Length CMOS Technology Using
`Mixed X-Ray / Optical Lithography.” Proceedings
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`Chung, J.; Jeng, M.-C.; Moon, J.E.; Wu, A.T.;
`Chan, T.Y.; Ko, P.K.; Hu, Chenming. “Deep-
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`2032
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`Jaso, M. A.; Guthrie, W. L.; Pearson, D. J.; and
`Small, M. B. “Chemical‐Mechanical Polishing for
`Fabricating Patterned W Metal Features as Chip
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`Society, Vol. 138, No. 11, pp. 3460-3465 (1991).
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`x
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`x
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`x
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`x
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`4
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`
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`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
`Exhibit
`No.
`
`Description
`
`Newly
`Submitted
`
`Landis, H.; Burke, P.; Cote, W.; Hill, W.; Hoffman,
`C.; Kaanta, C.; Koburger, C.; Lange, W.; Leach, M.;
`and Luce, S. “Integration of chemical-mechanical
`polishing into CMOS integrated circuit
`manufacturing.” Thin Solid Films, Vol. 220, No. 1-
`2, pp.1-7 (1992).
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`Library of Congress Catalog Record of
`Steigerwald, Murarka, and Gutmann, Chemical
`Mechanical Planarization of Microelectronic
`Materials (1997).
`
`Library of Congress Catalog Record of Introduction
`to Microlithography, ACS Symposium Ser.,
`American Chemical Society (1983).
`
`Library of Congress Catalog Record of IEEE
`Electron Device Letters, Vol. 14, No. 8 (1993).
`
`Library of Congress Catalog Record of IEEE
`Transactions on Electron Devices, Vol. 36, No. 6
`(1989).
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`Front cover and table of contents of 1987
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`x
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`x
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`2033
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`2034
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`2035
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`2036
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`2037
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`2038
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`2039
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`
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`5
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`
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`Dated: March 24, 2017
`
`Respectfully submitted,
`
`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`
`
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`
`/Neil F. Greenblum/
`Neil F. Greenblum
`Registration No. 28,394
`Greenblum & Bernstein, P.L.C.
`1950 Roland Clarke Place
`Reston, Virginia 20191
`Tel: 703-716-1191
`Fax: 703-716-1180
`Email: ngreenblum@gbpatent.com
`
`Attorney for Patent Owner,
`GODO KAISHA IP Bridge 1
`
`6
`
`
`
`IPR2016-01246; IPR2016-01247
`U.S. Patent No. 7,126,174
`CERTIFICATE OF SERVICE
`
`
`
`The undersigned hereby certifies that a true copy of the foregoing:
`
`PATENT OWNER’S CURRENT EXHIBIT LIST
`(As of March 24, 2017)
`
`was served by electronic mail on this 24th day of March, 2017, upon Counsel for
`
`Petitioner, as follows:
`
`Darren M. Jiron (darren.jiron@finnegan.com);
`J.P. Long (jp.long@finnegan.com);
`E. Robert Yoches (bob.yoches@finnegan.com); and
`TSMC-IPB-PTAB@finnegan.com.
`
`
`
`
`
`/Neil F. Greenblum/
`Neil F. Greenblum
`Registration No. 28,394
`Greenblum & Bernstein, P.L.C.
`1950 Roland Clarke Place
`Reston, Virginia 20191
`Tel: 703-716-1191
`Fax: 703-716-1180
` Email: ngreenblum@gbpatent.com
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