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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
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`TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
`Petitioner,
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`v.
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`GODO KAISHA IP BRIDGE 1,
`Patent Owner.
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`Case IPR2016-012461
`Patent 7,126,174 B2
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`PETITIONER’S OBJECTIONS TO PATENT OWNER’S EVIDENCE
`SUBMITTED DURING THE PRELIMINARY PROCEEDING
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`1 Case IPR2016-01247 has been consolidated with this proceeding.
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`IPR2016-01246, IPR2016-01247
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`Patent 7,126,174 B2
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`In accordance with 37 C .F.R. § 42.64(b)(l), Petitioner Taiwan
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`Semiconductor Manufacturing Company, Ltd. hereby submits a list of objections to
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`Patent Owner IP Bridge’s Exhibits 2001 through 2011 submitted during the
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`preliminary proceeding, identified in the chart below:
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`E h'b't
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`2001
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`Declaration of Dr- E. Fred Schubert, Ph.D. in support of Patent Owner’s
`Preliminary Response filed in IPR20l6-01246 on October 5, 2016
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`Schematic illustration of the Chemical Mechanical Polishing process
`from Steigerwald, Murarka, and Gutmann, Chemical Mechanical
`Planarization ofMicroelectronic Materials (1997).
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`Schematic illustration of the Chemical Mechanical Polishing process
`from the Motorola Company. SCSolutions.com. Accessed September
`30, 2016. http://wvvw.scs0lutions.com/chernical-
`mechanicalplanarization-cmp-controllers-0
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`Photograph of a Chemical Mechanical Polishing Tool from the Applied
`Materials Company- BusinessWire.com- Accessed October 5, 2016.
`http://www.businesswire.com/news/home/2004071 1005007/en/Applied
`—Materials—ReVolutionizes—Planarization—Technology—Breakthrough—
`Reflexion
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`2005
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`Troxel, Boning, McIlrath “Semiconductor Process Representation.”
`Wiley Encyclopedia ofElectrical and Electronics, pp. 139 -147 (1999).
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`2006
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`U.S. Patent No. 6,052 319 to Jacobs
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`2007
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`U.S. Patent No. 6,952,656 to Cordova et al.
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`2008
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`Hunt, “Low Budget Undergraduate Microelectronics Laboratory.”
`University Government Industry Microelectronics Symposium, pp.
`81-87 (2006).
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`2009
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`U.S. Patent No. 7,074,709 to Young
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`IPR20l6-01246, IPR2016-01247
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`Patent 7,126,174 B2
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`E l|'b't
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`Preliminary Response filed in IPR2016-01247 on October 7, 2016 - DeclarationofDr- E. Fred Schubert, Ph.D. in support ofPatentOwner’s
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`Burckel, “3D—ICs created using oblique processing.” Advances in
`Patterning Materials and Processes JOCXYII, pp. 1-12 (2016).
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`I.
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`Objection to Paragraphs 33-159 of Patent Owner’s Exhibit 2001 and
`Paragraphs 33-149 of Patent Owner’s Exhibit 2011—Unreliable
`“Expert” Testimony
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`Petitioner objects to Exhibits 2001 and 2011 because they contain unreliable
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`testimony under Fed. R. Evid. 702 and Daubert v. Merrell Dow Pharm., Inc. , 509
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`U.S- 579 (1993). Dr. Schubert’s declaration includes numerous purported “expert”
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`opinions on matters for which Dr. Schubert has failed to establish himself as an
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`expert. Based on paragraphs 13—21 of Ex. 2001 and Ex. 20] 1,2 Dr. Schubert has
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`not established himself as someone possessing sufficient knowledge, skill,
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`experience, training, and/or education regarding LDD (lightly doped drain)
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`MOSFETS. Although he may have experience with III-V compound
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`2 Dr. Schubert claims to have included his curriculum vitae as “Exhibit A”
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`to Ex. 2001 and Ex. 2011, but no “Exhibit A” appears to have been filed or served
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`on Petitioner.
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`IPR2016-01246, IPR2016-01247
`Patent 7,126,174 B2
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`semiconductors and light-emitting devices,3 such devices are vastly different from
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`the LDD Si MOSFET devices at issue in these proceedings.
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`Dr. Schubert does not claim to have significant experience designing or
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`making LDD Si MOSFET devices, let alone during the relevant time period.4
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`Nevertheless, Dr. Schubert repeatedly opines about the understanding of a person
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`of ordinary skill in the art during the relevant period with respect to LDD Si
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`MOSFET devices.
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`II. Objection to Patent Owner’s Exhibits 2002, 2003, 2004, 2005, 2008, and
`2010—Failure to Authenticate
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`Patent Owner has not submitted evidence to authenticate Exhibits 2002,
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`2003, 2004, 2005, 2008, and 2010, making them inadmissible under Fed. R. Evid.
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`901.
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`3 See, e.g., Ex. 2001 & 2011 at ¶¶ 14–16; https://www.rpi.edu/dept/cfes/
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`researchers/Fred%20Schubert.html (last visited Jan. 7, 2017).
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`4 Although MOSFETS may be included in some of the subject matter of
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`courses taught by Dr. Schubert, he provides no evidence regarding the type of
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`information taught relative to MOSFETs, the depth of its treatment, or why mere
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`inclusion of MOSFETs in a course establishes him as an expert relative to the
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`design and fabrication of LDD MOSFETs (or even one of ordinary skill in the art).
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`IPR2016-01246, IPR2016-01247
`Patent 7,126,174 B2
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`III. Objection to Patent Owner’s Exhibits 2002, 2003, 2004, 2005, 2006,
`2007, 2008, 2009, and 2010—Improper Incorporation By Reference
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`Neither of Patent Owner’s Preliminary Responses cites Exhibits 2002, 2003,
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`2004, 2005, 2006, 2007, 2008, 2009, or 2010; they only appear in Dr. Schubert’s
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`declarations (Exhibits 2001 and 2011), and therefore are improperly incorporated
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`by reference in violation of 37 C.F.R. § 42.6(a)(3).
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`IV. Objection to Patent Owner’s Exhibits 2002, 2003, 2004, 2005, 2006,
`2007, 2008, 2009, and 2010—Irrelevant and Non-Probative Evidence
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`Patent Owner’s Exhibits 2002, 2003, 2004, 2005, 2006, 2007, 2008, 2009,
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`and 2010 are irrelevant to any material facts at issue in these proceedings, and any
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`probative value Patent Owner may try to assign them is substantially outweighed
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`by their tendency to confuse the issues, mislead the Board, waste time, and
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`needlessly present cumulative evidence. These exhibits are therefore inadmissible
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`under Fed. R. Evid. 401, 402, and 403.
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`Citations to Exhibits 2002, 2003, and 2004 appear only in footnotes to
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`paragraph 61 of Dr. Schubert’s declarations (Exhibits 2001 and 2011). Paragraph
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`61 of both declarations reads, in its entirety, as follows:
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`61. CMP is a process that includes a polishing pad that is soaked with
`a chemical solution. The semiconductor wafer is slightly pressed onto
`the polishing pad. The semiconductor wafer and polishing pad are
`subjected to rotating motions to ensure uniformity of the CMP
`process. CMP
`includes a chemical-etching component and a
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`Patent 7,126,174 B2
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`mechanical-polishing component both of which contribute to the
`planarization (or flattening) of the wafer surface. Two schematics of
`the CMP process5 and a photograph of a CMP tool6 are shown below.
`The schematics and photograph show a Si wafer subjected to CMP.
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`Footnotes 5 and 6 cite Exhibits 2002, 2003, and 2004 as the sources of the
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`photographs above. None of the claims at issue in these proceedings, which are
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`device structure claims, recites CMP or even planarization, making the entire
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`discussion of CMP irrelevant.
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`Additionally, Exhibits 2002, 2003, and 2004 all seem to have been published
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`years after the date of invention (December 1995, see Paper 8, at 13 n.5). Exhibit
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`2002 bears a copyright date of 2004.5 Exhibit 2003 is an undated Internet
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`webpage, but it cites U.S. Patent Nos. 7,050,880 and 7,437,206, both of which
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`were filed in 2003, and cites an image bearing a copyright date from 2000. Exhibit
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`2004 is an Internet webpage dated July 12, 2004. Because Exhibits 2002, 2003,
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`and 2004 significantly post-date the invention and provide only “impermissible . . .
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`later knowledge about later art-related facts,” they have no relevance. In re
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`Hogan, 559 F.2d 595, 605 (CCPA 1977).
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`The citations to Exhibits 2005, 2006, 2007, 2008, 2009, and 2010 also
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`appear only once, in Dr. Schubert’s declarations, and are cited to support of the
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`5 Patent Owner attempts to rely on the earlier 1997 copyright date to John
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`Wiley & Sons, Inc., rather than the 2004 copyright date to WILEY-VCH Verlag
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`GmbH & Co. KGaA, the name that appears on the reference. Compare Ex. 2001
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`& 2011 at ¶ 61 n.5, with Ex. 2002 at 4. Even assuming the 1997 date were correct,
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`that date still post-dates the invention.
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`proposition, “The complexity of integrated circuit fabrication is appreciated by the
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`technical community and widely supported by the technical literature.” Ex. 2001
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`& 2011 at ¶ 53. The complexity of IC fabrication and the technical community’s
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`recognition of that premise are not at issue in these proceedings, making these
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`references irrelevant.
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`Additionally, Exhibits 2005, 2006, 2007, 2008, 2009, and 2010 significantly
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`post-date the invention and provide only “impermissible . . . later knowledge about
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`later art-related facts.” In re Hogan, 559 F.2d at 605. They are therefore
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`irrelevant. Exhibit 2005 bears a date of 1999. Exhibit 2006 was filed in December
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`1997. Exhibit 2007 was filed in April 2000. Exhibit 2008 bears a date of June
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`2006. Exhibit 2009 was filed in November 2002. Exhibit 2010 bears a copyright
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`date of 2016.
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`V. Objection to Patent Owner’s Exhibits 2003 and 2004—Hearsay
`Petitioner objects to Exhibits 2003 and 2004 to the extent that Patent Owner
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`relies on their contents for the truth of the matters asserted therein. Exhibits 2003
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`and 2004 constitute hearsay under Fed. R. Evid. 801 and 802, and no exception
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`applies. Exhibits 2003 and 2004 are both third-party websites that bear no
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`discernable relationship to Dr. Schubert, strongly suggesting that he has no
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`personal knowledge of the contents contained therein.
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`IPR2016-01246, IPR2016-01247
`Patent 7,126,174 B2
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`Dated: January 19, 2017
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`Respectfully submitted,
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`By: /Darren M. Jiron/
`Darren M. Jiron
`Reg. No. 45,777
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`Lead Counsel for Petitioner
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`IPR2016-01246, IPR2016-01247
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`CERTIFICATE OF SERVICE
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`Pursuant to 37 C.F.R. § 42.6(e), this is to certify that I served a true and
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`correct copy of the Petitioner’s Objections to Patent Owner’s Evidence
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`Submitted During the Preliminary Proceeding by electronic mail, on this 19th
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`day of January, 2017, on counsel of record for the Patent Owner as follows:
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`Neil F. Greenblum
`ngreenblum@gbpatent.com
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`Michael J. Fink
`mfink@gbpatent.com
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`Arnold Turk
`aturk@gbpatent.com
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`By: /Lauren K. Young/
`Lauren K. Young
`Litigation Legal Assistant
`FINNEGAN, HENDERSON, FARABOW,
`GARRETT & DUNNER, L.L.P.
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`Dated: January 19, 2017