MULTICHIP MODULE
`TECHNOLOGIES AND ALTERNATIVES:
`
`THE BASICS
`
`Elm Exhibit 2162
`Samsung, Micron, SK hynix v. Elm
`IPR2016-00387
`
`

`
`Cover Photo
` of Unisys photographer, Paul Robinson. The top MCM is
`Courtesy
`a hermetic processor module utilizing the
` latest
`with fine pitch, high lead count,
` flip
` TAB connections. The bottom
`three packages are MCM-C modules
` with
` conventional
`connections. These modules are described in Chapter 14.
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 2
`
`

`
`MULTICHIP MODULE
`TECHNOLOGIES AND ALTERNATIVES:
`
`THE BASICS
`
`Edited by:
`Daryl Ann Doane
`Paul D. Franzon
`
`tZHEl SPRINGER SCIENCE+BUSINESS MEDIA, LLC
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 3
`
`

`
`Copyright C 1993 by Springer Science+Business Media New York
`Originally published by Van Nostrand Reinhold in 1993
`Softcover reprint ofthe hardcover lst edition 1993
`Library of Congress Catalog Card Number 92-2779
`ISBN 978-0-442-01236-6
`
`All rights reserved. No part of this work covered by the oopyright hereon may be
`reproduced or used in any form by any means-grapbic, electronic, or mechanical,
`including photooopying, recording, taping, or information storage and retrieval
`systems-witbout written permission of the publisher.
`
`I(Î)P Van Nostrand Reinhhold is a division of International Thomson
`Publishing. ITP Iogo is a trademark under license.
`
`16 15 14 13 12 11 10 9 8 7 6 5 4 3 2
`
`Library of Congress Cataloging-in-Publication Data
`
`Multichip module technologies and alternatives : the basics 1 [edited] by Daryl Ann
`Doane and Paul D. Franzon.
`p. cm.
`lncludes Index.
`ISBN 978-1-4615-3100-5 (eBook)
`ISBN 978-0-442-01236-6
`DOI 10.1007/978-1-4615-3100-5
`1. Microelectronic packaging. 2. lntegrated circuits- Very large scale
`integration - Design and construction. I. Doane, Daryl Ann. U. Franzon, Paul D.
`TK7874.M864 1993
`62139'5- dc20
`
`92-2779
`CIP
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 4
`
`

`
`DEDICATION
`
`This book is dedicated with sincere gratitude
`to the 42 authors who contributed their knowledge,
`suggestions and many hours of writing
`to form the chapters we requested.
`Without their diligence, timeliness of response and
`patience with our requests
`for additional or alternative infonnation,
`there would be no book.
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 5
`
`

`
`ABOUT THE EDITORS
`
`Daryl Ann Doane, President, DAD Technologies, Inc., is a specialist in the
`manufacturing of IC devices and packages, and in the marketing of materials,
`equipment and processes for such manufacturing. She has published more than
`40 reports, papers and reviews documenting new process development and yield
`optimization. DAD Technologies, Inc. is a technOlogy-based consulting
`organization serving both producers and users. Clients have included both
`government and commercial organizations connected with Ie fabrication and
`packaging.
`Dr. Doane previously served as Director, Microelectronics R&D for Hunt
`Chemical (now Olin Hunt Specialty Products). Prior to that she was a Member
`of the Technical Staffs of AT&T Bell Laboratories, RCA and Hewlett-Packard
`Laboratories.
`Dr. Doane is a member of the American Physical Society (APS), Materials
`Research Society (MRS), International Society for Hybrid Microelectronics
`(ISHM), International Electronics Packaging Society (IEPS), and is a Senior
`Member of the IEEE. She received the 1980 Distinguished New Engineer
`Award from the Society of Women Engineers. She also served as President of
`the New Jersey Section of that Society.
`
`msgalica@mintz.com
`
`vii
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`Elm Exhibit 2162, Page 6
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`

`
`viii ABOUT TIIE EDITORS
`
`Dr. Doane presently serves as Director of Technical Marketing for the IEEE(cid:173)
`CHMT (Components, Hybrids & Manufacturing Technology) Society. She also
`is an elected member of the Board of Governors of the National CHMT Society.
`She served previously as Chairman of the San Diego Chapter of the CHMT
`Society.
`Dr. Doane received the BA with Distinction in Chemistry and Physics, an
`MA in Chemistry, and an MS and PhD in Metallurgy and Materials Science
`from M.LT. and the University of Pennsylvania, respectively.
`
`Paul D. Franzon is currently an Assistant Professor in the Department of
`Electrical and Computer Engineering at North Carolina State University. He has
`over eight years experience in electronic systems design and design methodology
`research and development. During that time, in addition to his current position,
`he has worked at AT&T Bell Laboratories in Holmdel NJ, at the Australian
`Defense Science and Technology Organization, as a founding member of a
`successful Australian technology start-up company, and as a consultant to
`industry, including positions on Technical Advisory Boards.
`Dr. Franzon' s current research interests include design sciences/methodology
`for high speed packaging and interconnections systems and also for high speed
`and low power chip design. In the past, he has worked on problems and projects
`in wafer scale integration, IC yield modeling, VLSI chip design and
`communications systems design. He has published over 45 articles and reports.
`His teaching interests focus on microelectronic systems building including
`package and interconnection design, circuit design, processor design and the
`gaining of hands-on systems experience for students.
`Dr. Franzon is a member of the IEEE, ACM and ISHM. He serves as the
`Chairman of the Education Committee for the National IEEE-CHMT Society.
`Dr. Franzon received a BS in Physics and Mathematics, a BE with First
`Class Honors in Electrical Engineering and a PhD in Electrical Engineering all
`from the University of Adelaide, Adelaide, Australia.
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 7
`
`

`
`TABLE OF CONTENTS
`
`Foreword
`Preface
`Acknowledgments
`
`Part A: The Framework
`
`1
`
`Introduction
`1.1 Background and Defmitions
`1.1.1 Purpose and Perspective of the Book
`1.1.2 Architecture - Building a
`Multichip Module Structure
`1.1.3 First Level Connection and Common
`Circuit Base Alternatives
`1.1.4 MCM Packaging Alternatives
`1.2 Finding Your Way
`1.3 The Importance of Materials
`1.4 The Importance of Manufacturing Processes
`1.5 The Importance of Industry Infrastructure
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`xxxi
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`Elm Exhibit 2162, Page 8
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`

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`X CONTENTS
`
`1.6 Decision-Making as a Process
`1.6.1 Determining the Application:
`Possible MCM Markets
`1.6.2 Determining the MCM Technology:
`Business Decisions
`1.6.3 Designing the Product:
`Multidisciplinary Engineering
`1. 7 Overall Prospects for MCMs
`1.8 Summary
`General References
`References
`
`2 M eM Package Selection:
`A Materials and Manufacturing Perspective
`2.1 Introduction
`2.2 Package Body and Substrate Base Choices
`2.2.1 Ceramics
`2.2.2 Organic Laminates
`2.2.3 Metals
`2.3 Signal Interconnect and MCM Substrate Choices
`2.3.1 MCM-C (Coftred Ceramics)
`2.3.2 MCM-L (Organic Laminates)
`2.3.3 MCM-D (Deposited Dielectric)
`2.3.4 MCM-D/C (Deposited Dielectric
`on Coftred Ceramic)
`2.3.5 MCM-Si (Inorganic Thin Film)
`2.3.6 Thick Film Hybrid MCM
`2.4 Chip Mounting Choices
`2.4.1 Die Attach/Wire Bond
`2.4.2 TAB
`2.4.3 Flip TAB
`2.4.4 Flip Chip
`2.5 Module Level Connection Choices
`2.5.1 Peripheral 110
`2.5.2 Pin Grid Array
`2.5.3 Pad Array Carrier (PAC)
`2.6 Global Materials and Manufacturing Considerations
`2.6.1 Cost
`2.6.2 Electrical Performance
`2.6.3 Thermal Path
`2.6.4 Rework
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`

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`CONTENTS xi
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`130
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`2.7 Module Design Examples
`2.7.1 Mainframe Computer Module
`2.7.2 Workstation Module
`2.7.3 Low Cost Module
`2.7.4 Data Communications Module
`2.8 Future Trends in MCM Materials Manufacturing
`2.8.1 Substrates
`2.8.2 Optical Multichip Modules (MCM-O)
`2.8.3 Test
`2.8.4 Thermal Control
`2.8.5 Environmental Concerns
`References
`
`3 M CM Package Selection: A Systems Need Perspective
`3.1 Introduction
`3.2 System Design Process
`3.3 The Packaging Hierarchy
`3.4 Packaging Performance Factors
`3.4.1 Size and Weight
`3.4.2 Interconnection Capacity Within Each Level
`3.4.3 Connection Capacity Between Packaging Levels
`3.4.4 Delay and Electrical Noise
`3.4.5 Power Consumption
`3.4.6 Heat Dissipation
`3.4.7 Performance Tradeoffs
`3.5 Packaging Cost Factors
`3.5.1 Production Cost
`3.5.2 Post Production Costs
`3.5.3 Design and Prototyping Costs
`3.5.4 Time-to-Market
`3.5.5 Cost Tradeoffs
`3.6 Packaging Decisions and the System Design Process
`3.7 Determining System Requirements and Goals
`3.8 Determining and Evaluating Packaging Alternatives
`3.9 Impact of Semiconductor Technology
`3.10 Example of the System Design Process
`3.11 Summary
`References
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`

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`xii CONTENTS
`
`4 MCM Package Selection: Cost Issues
`4.1 Introduction
`4.1.1 The Importance of Cost
`4.2 Techniques for Cost Analysis
`4.2.1 Traditional Cost Analysis
`4.2.2 Activity-Based Cost Analysis
`4.2.3 Technical Cost Modeling
`4.3 Technical Cost Modeling
`4.3.1 Principles of Technical Cost Modeling
`4.3.2 Applications of Technical Cost Modeling
`4.4 Results of Technical Cost Modeling
`4.4.1 Printed Wiring Boards
`4.4.2 Thick Film Substrates
`4.4.3 Coftred Multilayer Substrates
`4.4.4 Thin Film MCMs
`4.4.5 Cost of MCM Assembly
`4.5 Applications to Substrate Selection
`4.6 Design Activity-Based Cost Modeling
`4.7 Summary
`References
`
`Part B: The Basics
`
`5 Laminate-Based Technologies for Multichip Modules
`5.1 Introduction
`5.1.1 MCM-L Amid the Spectrum of
`MCM Substrate Technologies
`5.1.2 MCM-L Attributes
`5.2 Standard MCM-L Construction Process
`5.2.1 Dielectric Material
`5.2.2 Copper Foil (Conductor) Processing
`5.2.3 Inner Layer Photolithographic Processing
`5.2.4 Blind and Buried Via Formation
`5.2.5 Lamination
`5.2.6 Drilling
`5.2.7 Plating of Drilled Holes
`5.2.8 Processing of Surface Layers
`5.3 Material Considerations
`5.3.1 Dielectric Layers
`5.3.2 Polymers for Dielectric Layers
`5.3.3 Reinforcements for Dielectric Layers
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`5.3.4 Copper Conductors
`5.4 Flexible ("Flex") Circuits
`5.4.1 Flex Circuit and Connector Integration
`5.5 Advanced MCM-L Material and Process Technology
`5.5.1 Integral Termination Resistor Technology
`5.5.2 Additive Conductor Processing
`5.5.3 Advanced Reinforcement, Rigidifying Materials
`5.6 IC Connection and Repair: Laminate Implications
`5.6.1 Wire Bonding to MCM-L Substrates
`5.6.2 TAB Bonding on MCM-L Substrates
`5.6.3 Flip Chip Bonding on MCM-L Substrates
`5.7 Versions of Assembled MCM-L Systems
`5.7.1 Substrate 110 Configurations
`5.8 MCM-L Extendibility and Cost Issues
`References
`
`6 Thick Film and Ceramic Technologies
`for Hybrid Multichip Modules
`6.1 Introduction
`6.1.1 Definitions of MCM-C Technologies
`6.1.2 General Comparison of MCM-C Technologies
`6.2 Material Considerations
`6.2.1 Thick Film Technology
`6.2.2 High Temperature Coftred Ceramic Technology
`6.2.3 Low Temperature Coftred Ceramic Technology
`6.3 Processing
`6.3.1 Thick Films
`6.3.2 High Temperature Coftred Ceramics
`6.3.3 Low Temperature Coftred Ceramics
`6.4 Design Rules
`6.5 Applications
`6.6 Future Trends
`6.7 Engineering Choices
`References
`
`7 Thin Film Multilayer Interconnection
`Technologies for MuItichip Modules
`7.1 Introduction
`7.2 Characteristics, Benefits of 1FML Interconnections
`7.2.1 Packaging Structures Using
`1FML Interconnections
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`CONTENTS xiii
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`

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`xiv CONI'ENTS
`
`7.2.2 Signal Line Characteristics
`7.2.3 htterconnect Design Rules
`7.204 Comparison With Alternative
`Interconnection Technologies
`7.3 Materials for Thin Film Interconnection Systems
`7.3.1 Substrate Materials
`7.3.2 Conductor Materials
`7.3.3 Dielectric Materials
`7 A Thin Film Multilayer Processing
`704.1 Conductor Deposition and Patterning Processes
`704.2 Dielectric Deposition and Patterning Processes
`704.3 Basic Process Approaches: Additive and Subtractive
`70404 Unique Process Requirements
`7.5 Design Strategies for Thin Film Interconnections
`7.5.1. General Design Strategies
`7.5.2 Implementations of Thin Film Interconnections
`7.6 Applications, Growth of Thin Film htterconnections
`7.6.1 htterconnection Technology Selection
`7.6.2 Evolution of TFML Applications
`7.6.3 Future Applications
`References
`
`8 Selection Criteria For Multichip Module Dielectrics
`8.1 Introduction
`8.2 Behavior and Function of Dielectrics
`8.3 Multilevel Thin Film Structures
`8.3.1 Major Technical Challenges
`8.3.2 MCM Fabrication Processes
`8.3.3 Dielectric Processing
`804 Polymer Properties
`804.1 Some Polymer Specific Terms
`804.2 Dielectric Constant
`804.3 Thermal Stability
`80404 The Glass Transition Temperature
`804.5 Coefficient of Thermal Expansion
`804.6 Mechanical Properties
`804.7 Failure Mechanisms
`804.8 Chemical Resistance
`804.9 Adhesion
`804.10 Water Uptake
`804.11 Planarization
`804.12 Influence of Curing Conditions
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`8.5 Polymer Materials
`8.5.1 Polyimides
`8.5.2 Polyphenylquinoxaline
`8.5.3 Fluorocarbons
`8.504 Benzocyclobutenes
`8.6 Summary
`References
`
`9 Chip-to-Substrate (First Level) Connection
`Technology Options
`9.1 Introduction
`9.1.1 Chip Connection Technologies
`9.1.2 Electrical Design
`9.1.3 Mechanical Design
`9.1.4 Technology Comparisons
`9.2 Die Bonding and Physical Attachment
`9.2.1 Die Attach Material Choices
`9.2.2 Die Attach Processes And Process Control
`9.2.3 Die Attach Equipment
`9.204 Issues for MCMs
`9.3 Wire Bonding
`9.3.1 Wire Bonding Methods and Procedures
`9.3.2 Wire Bonding Processes and Configurations:
`Geometry, Density and Package Design
`Considerations
`9.3.3 Wire Bonding Equipment
`9.304 Electrical Performance
`9.3.5 Reliability as Applied to MCMs
`9.3.6 Yield and Repairability as Applied to MCMs
`9.3.7 Wire Bond Process Development
`9.3.8 Wire Bond Process Costs
`9.3.9 Comparison to Other Connection Techniques
`9.3.10 Summary
`9 A Tape Automated Bonding
`904.1 Introduction
`904.2 Basic Process Flow for TAB Packaging
`904.3 TAB Tape Considerations
`90404 Inner Lead Bonding
`904.5 Outer Lead Bonding
`904.6 Single Chip and MCM Implementations of TAB
`904.7 Thermal and Electrical Performance
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`xvi CONTENTS
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`9.4.8 Reliability
`9.4.9 Reworkability
`9.4.10 Manufacturing Issues and Costs
`9.4.11 Comparison with Other Connection Technologies
`9.4.12 Summary
`9.5 Flip Chip Connection Technology
`9.5.1 Introduction
`9.5.2 The Basics
`9.5.3 Connection Medium (I): Solder Bumps
`9.5.4 Connection Medium (m: Conductive Polymers
`9.5.5 The Whole Picture
`9.6 Flip Chip Solder Bump (FCSB) Technology:
`An Example
`9.6.1 Introduction
`9.6.2 Fabrication, Process Flow, Tools and Hardware
`9.6.3 Manufacturability
`9.6.4 Rework
`9.6.5 Reliability
`9.6.6 Performance
`9.6.7 Summary
`9.7 Summary
`9.7.1 Cost
`9.7.2 Performance
`9.7.3 Tradeoffs: Making a Choice
`References
`
`10 MCM-to-Printed Wiring Board (Second Level) Connection
`Technology Options
`10.1 Introduction
`10.1.1 Second Level Connection Alternatives
`10.2 Basic Issues Mfecting Connection Choice
`10.2.1 Mechanical and Materials Issues with
`Permanent Soldered Connections
`10.2.2 Separable Connector Interface Physics
`10.2.3 Electrical Performance Issues
`10.3 Basic Approaches to MCM Level Two Connections
`10.3.1 Direct Attachment Through Soldering
`10.3.2 Chip-on-Board Connections
`10.3.3 Separable Connections (Sockets)
`10.3.4 Sockets for Leadless MCM Substrates
`10.3.5 Sockets for Leaded MCM Substrates
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`CONTENTS xvii
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`10.4 Standards Activities
`10.4.1 Supporting Groups for Standards
`10.5 Summary
`10.5.1 Recommendations
`10.5.2 Future Trends
`References
`
`11 Electrical Design of Digital Multichip Modules
`11.1 Introduction
`11.2 Delay and Noise in Digital Design
`11.3 Propagation Delay and Reflection Noise
`11.3.1 Reflections
`11.3.2 Line Losses
`11.3.3 First Incidence Switching
`11.3.4 Net Topology
`11.3.5 Effect of Loading
`11.4 Crosstalk Noise
`11.5 Simultaneous Switching Noise
`11.6 Other Sources of Noise
`11.7 The Electrical Design Process
`11.7.1 Technology Selection and System Planning
`11.7.2 Modeling, Simulation, and MCM Layout
`11.8 Summary
`References
`
`12 Thermal Design Considerations for
`Multichip Module Applications
`12.1 Introduction
`12.2 Thermal Management
`12.2.1 Objectives in Thermal Management
`12.2.2 Thermal Paths
`12.3 Thermal Phenomena in Electronic Enclosures
`12.3.1 Heat Transfer Mechanisms
`12.3.2 Heat Transfer in Electronic Components (Modules)
`12.3.3 The Concept of Thermal Resistance
`12.3.4 Heat Transfer On a Board
`12.3.5 Thermal Coupling in Electronic Enclosures
`12.4 Thermal Management of MCMs
`12.4.1 Alternate Thermal Control Methods for MCMs
`12.4.2 Cooling Methods - Cost Impact of
`Thermal Management Techniques
`12.4.3 Parameters Impacting MCM Thermal Performance
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`xviii CONTENTS
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`12.5 Tools for Thermal Design
`12.5.1 Overview of Design Analysis Tools
`12.5.2 Analysis Tools
`12.5.3 Solution Procedure
`12.5.4 Analytical Modeling - Integral Method
`12.5.5 Computer Based Tools - Numerical Method
`12.5.6 Experimentation - Why, When and How
`12.6 Summary
`References
`
`13 Electrical Testing of Multichip Modules
`13.1 Introduction
`13.2 Substrate Test
`13.2.1 Introduction
`13.2.2 Fixed Probe Array Testing
`13.2.3 Single Probe Testing
`13.2.4 Two Probe Testing
`13.2.5 Electron Beam Probing
`13.2.6 Developing a Substrate Test Strategy
`13.2.7 Summary
`13.3 IC Test
`13.3.1 Requirements for MCM Modules
`13.3.2 Introduction to IC Test
`13.3.3 Test Generation
`13.3.4 Boundary Scan and Built-In Self Test
`13.3.5 Parametric Testing
`13.3.6 Wafer Probing
`13.3.7 Die Carriers and Packages
`13.3.8 Final Test
`13.3.9 Bum-In
`13.3.10 Summary
`13.4 Assembled Module Test
`13.4.1 Introduction
`13.4.2 Testing Strategies
`13.4.3 Design for Testability
`13.4.4 Test Generation
`13.4.5 Test Equipment
`13.4.6 Bring-Up
`13.4.7 Production Test
`13.4.8 Summary
`13.5 Conclusion
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`Elm Exhibit 2162, Page 17
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`

`
`CONTENTS xix
`
`Part C: Case Studies
`
`14 The Development of Unisys Multichip Modules
`14.1 Introduction
`14.2 The Driving Forces Behind Multichip Packaging
`14.3 Advances in Silicon Delay Multichip Modules
`14.4 Single Chip Packages have Limitations
`14.5 Basic Packaging Goals
`14.6 Multichip Module Development Process
`14.6.1 Designing Through Technology Change
`14.6.2 Develop a Multichip Packaging Strategy First
`14.6.3 Technical Decision Making in an MCM Program
`14.6.4 Making Multichip Module Tradeoffs
`in a Disciplined Way
`14.6.5 Temperature Hierarchy Management
`14.6.6 Problems Encountered and Solutions Developed
`14.6.7 Good News for the MCM Developer
`14.6.8 Verify the Reliability of the Multichip Module
`14.6.9 Summary of Development Phase Challenges
`14.7 Unisys Multichip Module Implementations
`14.7.1 SCAMP
`14.7.2 A16/A19
`14.7.3 2200/900 Double Sided Multichip Module
`14.7.4 Limits of Cofired MCMs
`14.7.5 Thin Film MCMs
`14.8 Multichip Module Industry Issues
`References
`
`661
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`665
`665
`666
`667
`668
`668
`669
`669
`670
`670
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`671
`676
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`680
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`685
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`693
`
`15 High Performance Aerospace Multichip Module
`695
`Technology Development at Hughes
`695
`15.1 MCMs Meet the Needs of Systems Evolution
`696
`15.1.1 Examples of Trends in Weapons
`15.1.2 Measuring the Trends
`701
`706
`15.2 New Packaging Roles
`706
`15.2.1 A High Density Multichip Interconnection Program
`706
`15.2.2 A Company Wide Electronics Packaging Program
`707
`15.3 Developing Two Key MCM Technologies
`708
`15.3.1 An Evolutionary Approach
`709
`15.3.2 Technology Comparisons
`711
`15.3.3 HDMI Technology
`15.3.4 Low Temperature Cofrred Ceramic (LTCC) Technology 718
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`Elm Exhibit 2162, Page 18
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`

`
`XX CONTENTS
`
`15.4 Comprehensive Design/Manufacturing Services
`15.4.1 Design
`15.4.2 Interconnection Structures
`15.4.3 Pretesting of Packaging System Elements
`15.4.4 Component Attachment and Connections
`15.4.5 Electrical Testing
`15.4.6 Inspection, Quality and Reliability
`15.4.7 Encapsulation
`15.5 Summary
`References
`
`16 Silicon-Based Multichip Modules
`16.1 Introduction
`16.2 Materials
`16.2.1 Silicon Substrates
`16.2.2 Conductors
`16.2.3 Dielectrics
`16.3 MCM Examples
`16.3.1 Prototype Silicon Substrates
`16.3.2 Custom Silicon Substrates
`16.4 Summary
`References
`
`17 The Technology and Manufacture of the
`VAX-9000 Multichip Unit
`17.1 Introduction
`17.2 MCM System Perspective
`17.3 VAX-9000 MCU Development
`17.3.1 V AX -9000 Performance Goals
`17.3.2 Analysis of Alternative Physical Technologies
`17.3.3 V AX-9000 MCU Strategy
`17.3.4 MCU Manufacturability Goals
`17.3.5 Concurrent MCU Engineering and Manufacturing
`17.3.6 MCU Quality Engineering
`17.4 V AX-9000 MCU Technology
`17.4.1 MCU Overview
`17.4.2 MCU Integrated Circuits
`17.4.3 HDSC Interconnect Technology
`17.4.4 MCU Structure
`17.4.5 MCU Electrical Characteristics
`17.4.6 MCU Thermal Management
`
`msgalica@mintz.com
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`721
`722
`727
`727
`729
`731
`732
`732
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`734
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`737
`738
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`772
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`780
`782
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`785
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`Elm Exhibit 2162, Page 19
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`

`
`CONTENTS xxi
`
`17.4.7 MCU Test Technology
`17.5 VAX -9000 MCU Manufacturing
`17.5.1 Overview of Manufacturing Process
`17.5.2 HDSC Signal Core Fabrication Process
`17.5.3 HDSC Power Core Fabrication Process
`17.5.4 HDSC Assembly Process
`17.5.5 MCU Subassembly Process
`17.5.6 MCU Assembly Process
`17.6 Future Evolution of MCM Technology
`17.6.1 Strategy for Migration of MCM Technology
`from Mainframe to Low Power Applications
`
`References
`
`Part D: Closing the Loop
`
`18 Complementing Technologies for MCM Success
`18.1 Introduction
`18.2 Separable Connectors and the Packaging Hierarchy
`18.3 Effect of Semiconductor Type on Package Design
`18.4 System Performance Level (Cycle Time)
`18.5 Level of Chip Integration, Function Size
`and Chip I/O
`18.5.1 Memory MCMs
`18.6 Chip Joining Interface, Burn-in, Testability and Repair
`18.6.1 Known Good Die
`18.6.2 Chip Joining Interface
`18.6.3 Flip TAB
`18.6.4 Flip Chip
`18.7 Power Density and Cooling Methods
`18.8 Timeliness of Introduction
`18.9 Alternatives to MCMs
`18.9.1 Future Growth in Single Chip Packaging
`18.10 Inexpensive, Low Complexity MCMs
`18.11 Summary
`References
`
`Epilogue
`
`About the Authors
`Index
`
`msgalica@mintz.com
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`786
`795
`795
`797
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`801
`803
`807
`808
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`809
`813
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`818
`824
`826
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`828
`828
`830
`830
`831
`831
`831
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`838
`840
`840
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`843
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`845
`859
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`Elm Exhibit 2162, Page 20
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`

`
`FOREWORD
`
`Far from being the passive containers for semiconductor devices of the past, the
`packages in today's high performance computers pose numerous challenges in
`interconnecting, powering, cooling and protecting devices. While semiconductor
`circuit performance measured in picoseconds continues to improve, computer
`performance is expected to be in nanoseconds for the rest of this century - a
`factor of 1000 difference between on-chip and off-chip performance which is
`attributable to losses associated with the package. Thus the package, which
`interconnects all the chips to form a particular function such as a central
`processor, is likely to set the limits on how far computers can evolve.
`Multichip packaging, which can relax these limits and also improve the
`reliability and cost at the systems level, is expected to be the basis of all
`advanced computers in the future. In addition, since this technology allows chips
`to be spaced more closely, in less space and with less weight, it has the added
`advantage of being useful in portable consumer electronics as well as in medical,
`aerospace, automotive and telecommunications products.
`The multichip
`technologies with which these applications can be addressed are many. They
`range from ceramics to polymer-metal thin films to printed wiring boards for
`interconnections; flip chip, TAB or wire bond for chip-to-substrate connections;
`and air or water cooling for the removal of heat.
`
`msgalica@mintz.com
`
`xxiii
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`Elm Exhibit 2162, Page 21
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`

`
`xxiv FOREWORD
`
`While there are several books now on packaging, these books deal with the
`subject of multichip modules as part of packaging in general, or they treat a
`particular multichip module technology or they are at an advanced level. What
`is needed, therefore, is a comprehensive book at the basic level, structured so that
`anyone entering the field can quickly learn about the technologies, understand the
`tradeoffs, review the product examples, and make systems level decisions.
`Such a book has been provided by Daryl Ann Doane and Paul D. Franzon.
`They have worked with an outstanding team of packaging experts from industry
`and universities. Together they have produced Multichip Module Technologies
`and Alternatives: The Basics, an outstanding book for both industry and
`It is equally appropriate as an introduction to the multichip
`university use.
`module technologies for those just entering the field, and as an up-to-date basic
`technical book for those currently practicing in it.
`The books deals with the subject of multichip modules along three parts:
`systems level perspectives including packaging technology options and costs, the
`basics of ceramic, thin film and printed wiring board technologies as well as chip
`and module level connections; thermal and electrical design considerations
`including electrical testing; and finally product examples illustrating how
`multichip modules have been useful.
`The basic and integrated nature of the book clearly reflects the dedication
`and the hard work of the editors and the authors.
`
`Rao R. Tummala
`IBM Fellow
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 22
`
`

`
`PREFACE
`
`Welcome!
`
`Welcome to our book. We feel it is a unique book in the field of packaging and
`we hope you fmd it both useful and enjoyable. We (editors and authors) have
`certainly enjoyed bringing it to you!
`
`Uniqueness of the Book
`
`This is a very unique book! Its uniqueness comes about in two ways: first in the
`approach to the subject, and second, in the approach to the writing of the book.
`First, we feel that this book helps defme a turning point in the discipline of
`packaging. The "bottleneck" to increased systems performance is now more
`often the package than the chip. One effect of this is that suddenly a whole
`"breed" of engineers need to gain an understanding of how package design
`affects their systems performance and cost goals. Another effect is the
`widespread recognition that multichip module packaging technologies are
`possible solutions to this performance limitation. The attendant explosive growth
`in the MCM technology alternatives available is a testimony to this recognition.
`
`msgalica@mintz.com
`
`xxv
`
`Elm Exhibit 2162, Page 23
`
`

`
`xxvi PREFACE
`
`Until recently, packaging was mainly the domain of mechanical and
`materials specialists, and furthermore was rarely taught at universities. This has
`changed. Almost overnight, the pressure of high on-chip speeds and high
`transistor counts meant that packaging became a subject that must be understood
`by just about any engineer involved in designing a system. When these
`engineers tried to establish their understanding they found themselves in a virtual
`"Tower of Babel." First, often the same terms were used for different things or,
`just as bad, different terms were used for the same thing. Second, as this was
`the domain of specialists, significant background was required in each discipline
`in order to understand it. This book turns the discipline of packaging into a
`subject accessible to the generalist rather than just one accessible to the
`specialist. Common terms are defmed and crosslinked to the terms in current
`usage. Each discipline is presented in such a way that is both understandable to
`all and is useful.
`In providing this book, we help tum packaging into a
`discipline in which anyone can participate. We also present a book highly suited
`for teaching within a university.
`The book also is unique in how it was created!
`Packaging is a
`multidisciplinary subject. We realized that no two people can claim mastery of
`all the disciplines needed and involved in the subjects we wished to cover. We
`also realized that rapid writing was important. Thus an edited text was called
`for. But edited texts are often poorly lacking in terms of understandability and
`flow. Usually an editor relies on selecting appropriate experts and then accepting
`what each expert writes with minor alterations.
`This book is very different. It could be called a "closely edited" text. Each
`chapter has had the heavy hand of development of both editors in it. This
`happened in several forms. Often we spent many hours with individual authors
`defining what we thought was appropriate and guiding them in the actual writing.
`In all cases, as well as seeking outside reviewers, we wrote "anonymous"
`In some cases, we directly adjusted the text after it was
`reviews ourselves.
`submitted. Thus we are responsible for the final product as much as each chapter
`author is.
`The result, we feel, is a book that has the authority that comes with a book
`written by a team of experts, but has the understandability, completeness and
`flow of a book written by a single author, At least we hope that the book comes
`as close to that ideal as possible!
`
`Audience
`
`For whom is the book intended? This book is for everyone! The emphasis in
`the book is on understanding the fundamentals and the reporting of real
`
`msgalica@mintz.com
`
`Elm Exhibit 2162, Page 24
`
`

`
`PREFACE xxvii
`
`experiences rather than including a huge amount of data. It is intended for those
`who need a broad exposure to the concepts underlying the design, fabrication,
`packaging, assembly, manufacturing of multichip modules and the costs
`associated with alternative packaging technologies. The book is intended for
`applications, manufacturing and design engineers as well as for technical decision
`makers and managers who are confused about MCM issues but who wish to
`understand the fundamentals and basics. Specifically, it will be useful to
`
`•
`
`engineers in design, processing, fabrication, manufacturing, assembly
`and test who need to choose a packaging technology for specific
`product and application goals;
`
`• managers determining technology alternatives for new systems needs;
`
`marketing; sales technologists who need a working knowledge of the
`alternative MCM technologies.
`
`The book also is a suitable text for advanced undergraduate and graduate
`students in design, electrical, mechanical and systems engineering as well as for
`students in the applied sciences as discussed further on in this Preface.
`
`Philosophy of the Book
`
`What are the key decisions needed when considering using MCM technologies?
`There are four perspectives: materials, manufacturing, systems performance and
`cost requirements. The