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`Hardee
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`(10) Patent N0.:
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`(45) Date of Patent:
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`US 6,249,469 B1
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`Jun. 19, 2001
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`US006249469B1
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`(54) SENSE AMPLIFIER WITH LOCAL SENSE
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`DRIVERS AND LOCAL READ AMPLIFIERS
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`(75)
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`Inventor: Kim Hardee, Colorado Springs, CO
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`(US)
`(73) Assignees: United Memories, Inc., Colorado
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`Springs, CO (US); Nippon Steel
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`Semiconductor Corporation (JP)
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`(*) Netieer
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`Subject to any elisglaiineéa the teringf
`patent is exten e
`or a _]1lSIC un er
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`USO 154(b) by 1149 days.
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`(21) Appl. No.: 08/674,282
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`Filed:
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`(22)
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`Jul. 1, 1996
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`329 910 A1
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`2 662 844
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`2 260 839
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`4—228171
`T252493
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`8/1989 (EP) .
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`12/1991 (FR) .............................. .. G11C/7/06
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`4/1993 (GB) .
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`8/1992 (JP).
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`9/1992 (JP) '
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`OTHER PUBLICATIONS
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`English abstract re JP 2—18785 to Hitachi Ltd.
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`English abstract re JP 4—228171 to Hitachi Ltd.
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`English abstract re JP 4—252493 to NEC Corp.
`English abstract re JP 5—303495 to Yamatake Honeywell
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`Co. Ltd.
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`'ted b
`examiner
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`y
`C1
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`Primary Examiner—A. Zarabian
`(74) Attorney, Agent, or Firm—Cook, Alex, McFarron,
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`MaI1Z0> Cummings & Mehlera Ltd
`ABSTRACT
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`A sense amplifier for a very high density integrated circuit
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`meniegy ueinlg §M%Stteeh§010gy 1; e1eSe§ibed~ Each Slegse
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`It er III: 11 CS
`IS
`an t.SeC:)1§l P 01:21
`SCIILSC
`1 fr
`rive ransis ors, one connec ing
`c anne
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`VCC; the other connecting the N channel transistors to VSS.
`A read amplifier circuit
`is provided within each sense
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`amplifier and is operated by read control signals. Internal
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`“°d‘°15°f‘h‘°' latch Of the 59956 amphfier are °.°“P1‘°*d by P955
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`transistors that are responsive to column write control sig-
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`nals. Local data write driver transistors are also provided to
`selectively couple the pass transistors to VCC-Vt or VSS in
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`response to further data write control signals. A relatively
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`wider power line is coupled to the drive transistors to
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`provide VCC thereto, and a narrower line is used to control
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`those first sense amplifier drive transistors. Corresponding
`Widefiaind Iéa.“°Wth“e.S tare “SCSI. ffi” the iecctflld llgcalhsensei
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`“"9 “H515 ‘"5 W 19 C0“? 9
`C anne
`amp .1 er
`9
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`transistors to ground. Each. sense ‘amplifier may be shared
`between first and Second pairs Of bit lines through the use Of
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`isolation transistors and a corresponding isolation signal.
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`Related U_S_ Application Data
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`(63) Continuation of application No. 07/976,312, filed on Nov.
`12, 1992, now abandoned.
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`Int. Cl.7 ..................................................... .. G11C 7/00
`(51)
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`365/205; 365/208; 365/189.05
`(52)
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`(58) Field of Search ..................................... 365/205, 207,
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`(56)
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`References Cited
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`U~S~ PATENT DOCUMENTS
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`7/1987 Miyamoto et al.
`.................. 365/210
`4,680,735
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`8/1988 Bader et al.
`.....N
`365/189
`4,764,900
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`3/1990 Chin et a1.
`365/205 X
`4,943,993 as
`1/1991 Komatsu et a1.
`365/208
`4,984,206
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`1/1992 Lammerts et al.
`5,083,295 *
`365/205
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`365/149
`6/1993 0hSaWa ---- --
`5,220,527 *
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`: 3/ it a1~
`36;/625030);
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`532479479 *
`41993 Yoaufi 9"’ ct 9‘
`‘"‘g'65/18/9 05
`5:265:047 * 11/1993 Leun: e"{;iI.............................. 365/154
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`5,267,197
`11/1993 McClure ....................... .. 365/189.01
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`5,270,971 4 12/1993 Muraoka et al.
`365/205 X
`5,298,815 *
`3/1994 Brunolli
`......................... .. 365/205 X
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`FOREIGN PATENT DOCUMENTS
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`..
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`175 880
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`4/1986 (EP)
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`.............................. .. G11C/7/00
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`ELREF 246
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`22 Claims, 7 Drawing Sheets
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`223/
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`255 24
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`I 222
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`0/75 V
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`on _.LA7-;,., 5
`4
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`/52
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`J;
`Issf 1-
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`J
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`23ar +5754 —»24o
`/so/?
`2647
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`225
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`224/
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`260
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`244
`I
`252 i
`5/TR
`ELREF E/TB/9
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`Page1 of 16
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`SAMSUNG EXHIBIT 1007
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`Page 1 of 16
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`SAMSUNG EXHIBIT 1007
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`U.S. Patent
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`Jun. 19, 2001
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`Sheet 1 of 7
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`US 6,249,469 B1
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`P5»toEo¢N._m:E~
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`Emutaint\.§Firm.
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`Page2 of 16
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`U.S. Patent
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`Jun. 19, 2001
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`Sheet 2 of 7
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`US 6,249,469 B1
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`2£Z;"’ZEo“”
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`1./v
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`JFWZE7. 3 (PRIOR ART)
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`Page 3 of 16
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`U.S. Patent
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`Jun. 19, 2001
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`Sheet 3 of 7
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`US 6,249,469 B1
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`vcc
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`(1/cc)
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`Jun. 19, 2001
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`Sheet 4 of 7
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`US 6,249,469 B1
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`COLUMN SELECT YW
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`(VCC}
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`BLOCK
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`U.S. Patent
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`Jun. 19, 2001
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`Sheet 5 of 7
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`US 6,249,469 B1
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`BLREF 245‘
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`254
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`DW
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`DW LOCAL
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`/26
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`224
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`250
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`260
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`226
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`31. REF 3/rm?
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`Sheet 6 of 7
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`US 6,249,469 B1
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`Sheet 7 of 7
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`US 6,249,469 B1
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`1
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`SENSE AMPLIFIER WITH LOCAL SENSE
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`DRIVERS AND LOCAL READ AMPLIFIERS
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`This is a continuation of application Ser. No. 07/976,312
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`filed on Nov. 12, 1992, now abondoned.
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`FIELD OF THE INVENTION
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`5
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`The present invention relates to integrated circuit memo-
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`ries and particularly relates to sense amplifiers for use
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`therein.
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`10
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`14 are referred to as “pull-up” transistors whereas transistors
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`18 and 20 are referred to as “pull-down” transistors. When
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`a transistor 24 is turned on, it couples VCC through its
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`source-drain path to line 16, thereby providing the LATCHP
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`signal. Sense amplifier 10 forms a flip-flop so that either
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`transistor 12 or 14 but not both will be turned on and will
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`pull the voltage at its corresponding node toward VCC. At
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`or near the same time, one of the transistors 18 or 20 will
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`pull down the voltage at the other node toward VSS which
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`will be connected to line 22 via a transistor 26 being turned
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`on. In this way, one of the two nodes is pulled high and the
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`other is pulled low, and the sense amplifier latches into a
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`stable state.
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`In any large memory, such as a 16 megabit DRAM, there
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`will be thousands of columns and thousands of rows. This is
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`represented in FIG. 1 which shows a second sense amplifier
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`30 connected to corresponding bit line pair BL2 and BL2
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`BAR, and an N-th sense amplifier 32 coupled to bit lines
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`BLN and BLN BAR. It should be appreciated that N may be
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`on the order of 1000 or more. The LATCHP signal is applied
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`to all N of these sense amplifiers via line 16, and the
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`LATCHN signal is applied to them via the line 22. It will be
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`seen in FIG. 1 that a plurality of resistances 34 are illus-
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`trated. These are not discrete resistance devices but rather
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`indicate the parasitic resistance of the lines 16 and 22,
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`which, even though they are formed of conductive materials
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`such as metal or the like, nevertheless over great distances
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`will have some resistance value. Over each resistance, there
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`will be a voltage drop from the voltage applied via transistor
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`24 or 26, as the case may be. Accordingly, the voltage that
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`eventually reaches sense amplifier 32 may be appreciably
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`diminished from VCC or VSS, and that sense amplifier will
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`work inefficiently or slowly. It will also be appreciated that
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`because of this problem, sense amplifier 10 does not activate
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`at the same time as sense amplifier 32 and the resulting skew
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`prolongs access time. Additionally, some prior art designs
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`can be unstable if the selected sense amplifier is connected
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`to the data line (the bit lines) too early.
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`Thus, as power supply (VSS) line 22 is trying to pull
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`down to 0v, transistors start to turn on in the sense ampli-
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`fiers. A current flows to the right on line 22, and there exists
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`a voltage drop due to the resistance of line 22. Practical
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`limitations prevent the solution of greatly widening line 22
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`to reduce its resistance—the chip area is jealously allocated.
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`Hence, in the illustrated architecture, the right-most sense
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`amplifier 10 turns on first, and sense amplifier 32 will turn
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`rate. The far end (most remote from transistor 26) of line 22
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`will drop in voltage slower than the near end. This slows the
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`memory, which is undesirable, but if circuitry drove the near
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`end too fast, then the corresponding near sense amplifiers
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`would become unreliable.
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`Another problem occurs when the near sense amplifiers
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`latch logic “1’s” and the far amplifier latches a logic “0.”
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`There is a pattern sensitivity because when the bit lines are
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`precharged to 1/2 VCC, the memory cell moves only one of
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`the bit lines lower or higher. Sensing a “1” occurs before
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`sensing a “0” because LN needs to drop only 1 Vt below a
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`voltage level corresponding to a “1.” However, to sense a
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`“0” LN must be 1Vt below 1/2 VCC, and this occurs later.
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`Large current flows when “1’s” are read. Because of the
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`large currents, the decline in voltage at the far end of line 22
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`slows to an uncontrolled rate. This effectively can add 7
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`nsec. to the sensing process —a substantial and undesirable
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`increase.
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`One approach that has been proposed for addressing this
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`problem is depicted in FIG. 2. It shows the same sense
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`BACKGROUND OF THE INVENTION
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`Integrated circuit memories include a large number of
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`memory cells which are usually set forth in an array. The
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`memory cells may be volatile or non-volatile. If they are
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`volatile, they may be static RAM cells or dynamic RAM
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`cells. There may be one large array, or a given memory chip
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`may have several sub-arrays which may be arranged in
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`blocks. Typically,
`the memory device comprises a large
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`number of bit lines extending in one direction. The bit lines
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`may be paired or non paired. Where they are paired, they are
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`often referred to as complementary bit lines, or paired bit
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`lines. Complementary bit lines are used for both static RAM
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`25
`and dynamic RAM applications. The bit lines generally
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`extend in a first direction, and a plurality of word lines
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`extend in a second direction which is perpendicular to the
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`first direction. Typically, a memory cell is located at or near
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`the crossing of a bit line with a word line.
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`Often, a memory array is divided into subarrays, and each
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`subarray may further be divided into blocks. Each subarray
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`will often have its own “peripheral circuitry” such as decod-
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`ers.
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`The memory array or subarray is usually said to be
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`organized into rows and columns. Generally, a row indicates
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`the memory cells located along (coupled to) a word line. A
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`column is therefore ordinarily perpendicular to a row and
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`generally indicates a collection of memory cells along
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`(coupled to) a bit line or a bit line pair. Generally, each
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`column is connected to a respective sense amplifier. One job
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`of the sense amplifier is to sense the effect that the memory
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`cell has on the bit line(s) and to amplify that signal for
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`outputting in a read operation. Conversely, the sense ampli-
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`fier may also drive or control
`line(s) when the
`the bit
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`memory is writing data into a memory cell.
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`CMOS technology is prevalent today. FIG. 1 illustrates a
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`prior art configuration and shows a sense amplifier 10 using
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`CMOS technology. The operation and configuration of such
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`a sense amplifier 10 is well known and will not be explained
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`except briefly herein. Amplifier 10 contains P channel tran-
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`sistors 12 and 14 having source electrodes commonly
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`coupled to a line 16 which carries from time to time a signal
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`LP also called LATCHP. The sense amplifier also comprises
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`a pair of N channel transistors 18, 20 having source elec-
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`trodes commonly coupled to a line 22 which sometimes
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`carries a signal which may be called LN or LATCHN. Apair
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`of internal nodes A, B are connected to gate electrodes. In
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`particular, node A is coupled to the gate electrodes of
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`transistors 12 and 18, while node B is coupled to the gate
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`electrodes of transistors 14 and 20. These transistors form a
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`latch. A first bit line BL1 on the left side of sense amplifier
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`10 is coupled to node B which is also coupled between the
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`drain electrode of P channel transistor 12 and the drain
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`electrode of N channel transistor 18. Likewise, a comple-
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`mentary bit line BL1 BAR is connected to node A which is
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`also coupled between the drain electrodes of P channel
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`transistor 14 and N channel transistor 20. Transistors 12 and
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`45
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`Page 9 of 16
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`Page 9 of 16
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`US 6,249,469 B1
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`10
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`40
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`3
`amplifiers 10, 30, and 32, and has the same signals LATCHP
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`and LATCHN provided by transistors 24 and 26 respec-
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`tively. However, further N channel transistors have been
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`added beneath the sense amplifiers and a modification has
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`been made so that LATCHN is carried by two distinct lines.
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`One of these lines 40 is constructed relatively wide to carry
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`most of the current, and the other line 42 is relatively
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`narrower because it will carry current for just a single
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`selected sense amplifier. Line 40 is coupled to the sources of
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`a plurality of transistors 44, each sense amplifier having a
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`respective transistor 44. Each transistor 44 has its gate
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`electrode coupled to VCC and is therefore generally on.
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`Transistors 44 are relatively small in size so that they do not
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`carry much current to any single sense amplifier.
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`The narrower line or rail 42 is coupled to the several sense
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`amplifiers by source-drain paths of respective transistors 46,
`which are shown also as N channel transistors. Transistors
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`46 are decoded and this is indicated by a low to high
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`transition signal YR 47 shown beside the gate electrode of
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`transistor 46 for sense amplifier 32 at the far left side of FIG.
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`2. The other transistors 46 also are coupled to their YR
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`signals, which are shown illustratively at 0v, i.e. they are not
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`selected columns. Thus, the column which has been selected
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`decodes its YR signal to apply to the gate electrode of the
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`transistor 46 thereby to couple the narrow LATCHN line 42
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`to the sense amplifier. See also Okamura et al., “Decoded-
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`Source Sense Amplifier for High-Density DRAMs”, IEEE J.
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`Solid State Circuits, Vol. 25, No. 1 (Feb 1990), pp 18-23.
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`This solution does reduce the sensing skew since the current
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`flowing through fine 40 is reduced due to the weak transis-
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`tors 44 in the current path. Therefore, the voltage drop down
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`line 40 is reduced. Disadvantages of this approach are that
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`the large transistors 46 must be added and that the capacitive
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`loading on the column select signal YR is increased since it
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`must drive the gates of transistors 46. There is poor control
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`over the current draw and extra loading to the YR line
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`because it is driving an extra transistor per sense amplifier.
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`Chin et al., “An Experimental 16-Mbit DRAM with
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`Reduced Peak-Current Noise,” IEEE J. Solid State Circuits,
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`vol. 24, no. 5 (Oct. 1989) at p. 1191 et seq. and particularly
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`in FIG. 4 adds both p-channel and n-channel transistors
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`between sense amplifiers and power supply lines. However,
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`FIG. 4(a) does not use one connection to the VCC line and
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`one connection to the VSS line per sense amplifier. It does
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`not drive these power lines from one end only, but rather
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`from several connections that are distributed in the array.
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`Signals SAP and SAN bar may correspond to LP and LN
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`respectively. Thus,
`in the architecture disclosed in that
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`article, there are several sense amplifiers connected together,
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`and there will still be some pattern sensitivity. FIG. 4(b),
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`however,
`in view of the caption for the figure and the
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`accompanying text, could mean that each sense amplifier
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`has a respective pair of local P channel and N channel drive
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`transistors. Nevertheless, FIG. 4(b) shows that all of the P
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`channel transistors (for multiple sense amplifiers) are con-
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`nected to a single node SAP. All of the N channel transistors
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`are connected to a single node SAN bar.
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`Chin et al. U.S. Pat. No. 4,948,993 similarly shows such
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`common nodes S and S bar in FIG. 2, but FIG. 3 thereof
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`avoids such common nodes.
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`FIG. 3 illustrates further transistors that have been used in
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`the past or are used in current generations (16 Meg) of very
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`large capacity integrated circuit memories. Thus, sense
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`amplifier 10 is coupled between LATCHP and LATCHN
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`65
`signals which are generally VCC and VSS. The data signals
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`coming from the data lines are illustrated as D and its
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`complement D BAR. However, the source-drain paths-of
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`4
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`further pass transistors 48 and 50 couple the data signal D to
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`the sense amplifier, and an identical arrangement is provided
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`for the complementary data signal. Transistor 48 is respon-
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`sively coupled to a global column select signal Y which is
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`applied to the gate electrode thereof. Most 16 meg DRAMs
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`have such global Y select signals. Additionally, very large
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`scale memories, as mentioned above, include one or more
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`blocks, and transistors 50 are illustrated to show a block
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`enable signal controlling the operation of transistor 50. In
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`the complementary data signals must be high, near
`this,
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`VCC, during reading and the pass transistors must be small
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`compared to the LATCH transistors to avoid instability.
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`FIG. 4 shows some of the problems of circuitry styled
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`along the lines of FIG. 3.
`In FIG. 4,
`three identically
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`constructed sense amplifiers 10 are illustrated, and for ease
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`of reference they will be referred to in this drawing as 10A,
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`10B and 10C. For ease of illustration, the LATCHP line 16
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`and LATCHN line 22 are not shown. The column select
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`signal Y is a global select signal and is therefore shown as
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`having a voltage of VCC. The block enable signals are
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`separately provided so that the pass transistors 50A for sense
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`amplifier 10A have their gate electrodes coupled to a line
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`52A which carries a first block select signal. Similarly, pass
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`transistors 50A for sense amplifier 10B have their gate
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`electrodes coupled to a second block select line 52B which
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`carries a second block select signal, and a block select signal
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`line 52C similarly corresponds to sense amplifier 10C.
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`Sense amplifier 10A is illustratively in an inactive block,
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`for sake of explanation. “Inactive” means herein that LN and
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`LP are at 1/2 VCC and the latch is inactive. Its block has not
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`been enabled so the block enable signal on line 52A is low
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`at zero volts. Thus, pass transistors 50A are off, and regard-
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`less of whether transistors 48A may be on, sense amplifier
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`10A is generally isolated from data. However, to prevent it
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`from latching, LATCHP and LATCHN must both be kept at
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`1/2 VCC, and the data write signal DW and its complement
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`DWB are held at VCC.
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`Sense amplifier 10B is in an active block with LN at 0v
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`and LP at VCC. However, with the block select at 0v, no
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`write will occur even with the global column select Y at
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`VCC.
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`Since amplifier 10C is in an active block and a write
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`operation is to occur through amplifier 10C. The block select
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`signal on line 52C is high, at VCC. The column select signal
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`Y is high. With the data signal DW high at VCC and its
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`complement DWB low at zero volts (or vice-versa if dif-
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`ferent data is being written), the pass transistors 48C, 50C on
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`at least one side of sense amplifier 10C will turn on, and the
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`sense amplifier will latch the data state and drive the bit lines
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`so that the data state will be written into the memory cell or
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`cells along the column (usually at the active word line).
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`An object of the present invention is to improve the sense
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`amplifiers to overcome or reduce the aforementioned prob-
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`lems.
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`SUMMARY OF THE INVENTION
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`The present invention provides a CMOS sense amplifier
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`with local write driver transistors to eliminate the pattern
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`sensitivities and delays of the prior art. Also, each sense
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`amplifier has its own respective drive transistors. Third, each
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`sense amplifier includes a column read amplifier which
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`eliminates the instability problem because the latch nodes
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`are never connected to the data lines. Further, the local write
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`drivers solve the problems associated with global columns
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`selects. Prefer embodiments of the present invention will use
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`column read YR and column write YW signals.
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`Page 10 of 16
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`US 6,249,469 B1
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`6
`includes internal nodes 102 and 104 in a latch formed by
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`transistors 112, 114, 118 and 120. Node 102 is coupled to the
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`gate electrodes of P channel transistor 112 and N channel
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`transistor 118, whereas node 104 is coupled to the gate
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`electrodes of P channel transistor 114 and N channel tran-
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`sistor 120. The configuration of the flip-flop itself within the
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`sense amplifier is the same as that of sense amplifier 10.
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`A column write select signal YW is coupled to the gate
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`electrodes of pass transistors 122, 124. Preferably, the col-
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`umn write signal YW and a column read signal YR
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`described below are decoded for each four columns, so that
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`each four columns has a unique YW and YR. However, this
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`is unnecessary to embody the principles of the invention. In
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`one configuration, each subarray may be fairly large—4
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`Meg illustratively—and may have a respective column
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`decoder that will generate column select signals for that
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`whole subarray. It is desired to be able to write to just one
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`block within the subarray. That will be an “active block”
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`wherein the sense amplifiers are active. An “inactive block”
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`is one where the sense amplifiers are in precharge.
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`the
`Returning to the description of FIG. 5, however,
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`source-drain path of pass transistor 122 is coupled to node
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`104, and the source-drain path of transistor 124 is coupled
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`to node 102.
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`Transistor 122 is also coupled to a node 126 between the
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`source electrode of a local data write driver transistor 128
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`and the drain of another local data write driver transistor
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`130. Transistors 128 and 130 are N channel devices having
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`their source-drain paths coupled in series. The drain of
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`transistor 128 is coupled to VCC and the source of transistor
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`130 is coupled to ground. A data write signal DW is coupled
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`to the gate electrode of transistor 128 and its complement
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`DWB is coupled to the gate electrode of transistor 130. A
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`similar configuration exists on the right side of sense ampli-
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`fier 100 where transistors 132 and 134 are coupled between
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`VCC and ground and have a node 136 therebetween which
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`is coupled to transistor 124. Note, however, that the data
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`write signal DW is coupled to control transistor 134 whereas
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`its complement DWB is coupled to the gate electrode of
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`transistor 132. That is to say, the data write signal DW turns
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`on a pull-up transistor 128 on the left side of the sense
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`amplifier 100, but turns on a pull down transistor 134 on the
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`right side of sense amplifier 100. Its complementary signal
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`DWB likewise has reciprocal effects on the left and right
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`sides.
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`The source electrodes of P channel transistors 112 and 114
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`within amplifier 100 are coupled to a further P channel
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`transistor 140, the source electrode of which is coupled to
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`VCC (or LATCHP). The gate electrode of this P channel
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`device 140 is coupled to receive a signal LPB which is the
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`logical complement of LATCHP. FET 140 is referred to as
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`a local sense amplifier drive transistor. Similarly, the source
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`electrodes of the N channel transistors 118 and 120 within
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`amplifier 100 are coupled to ground through the source-
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`drain path of a further local sense amplifier drive transistor
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`142. The gate electrode of transistor 142 is coupled to
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`receive signal LNB which is the logical complement of
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`LATCHN.
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`The lower portion of FIG. 5 includes a local column read
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`amplifier which includes four N channel transistors 150,
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`152, 154, and 156. The source-drain paths of transistors 150
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`and 152 are coupled in series. The drain electrode of
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`transistor 150 receives a signal DRB which is a logical
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`complement of a data read signal DR. The source electrode
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`of transistor 152 is coupled to ground. Node 104 is coupled
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`via a conductive line 158 to the gate electrode of transistor
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`15
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`5
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`In one of its aspects, while the prior art used narrow and
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`wide lines or rails each carrying a LATCHN signal,
`the
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`present invention uses narrow and wide lines in connection
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`with the LATCHN signal but connects them differently.
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`Additionally,
`the present invention in one of its aspects
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`includes narrow and wide lines or rails for the LATCHP
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`supply signal. Thus,
`in the preferred embodiment, each
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`sense amplifier has a respective N channel transistor having
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`its source-drain path coupled to VSS or a signal LATCHN
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`10
`via the wide line. The gate electrodes of those N channel
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`drive transistors are gated by the narrow drive line which
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`preferably carries the complement LNB of the LATCHN
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`signal.
`Correspondingly, in another aspect of the invention, each
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`includes a respective P channel drive
`sense amplifier
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`transistor,
`the source-drain path of which couples the P
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`channel transistors of the sense amplifier latch to the high
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`voltage such as VCC or LATCHP. That high voltage is
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`carried by one of the wide drive lines. The narrower of the
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`drive lines associated with LATCHP is coupled to the gate
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`electrodes of these P channel drive transistors and carries a
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`complement LPB of the LATCHP s