Atty. Docket No. MIT-001-RX1
`
`IN THE UNITED STATES PATENT & TRADEMARK OFFICE
`
`IN RE REEXAMINATION APPL'N OF:
`
`Joseph BERNSTEIN et al.
`
`GROUP ART UNIT:
`
`APPLICATION NO: New Reexam. Request
`
`FILED: March 30,2011
`
`EXAMINER:
`
`FOR: LASER-INDUCED CUTTING OF METAL INTERCONNECT
`
`I hereby certify that this document is being transmitted to the USPTO or deposited with the United States Postal
`Service as first class mail in an envelope addressed to Commissioner for Patents, P.O. Box 1450, Alexandria, VA
`22313-1450, on April14, 2011.
`
`By: ___ /_J_e_n_n_l_· e_H_e_a_t_o_n_l ___ _
`Jennie Heaton
`
`CORRECTED PRE-AMENDMENT UNDER 37 C.P.R. 1.530
`
`Mail Stop: Ex Parte Reexam
`COMMISSIONER FOR PATENTS
`P.O. BOX 1450
`ALEXANDRIA, VA 22313-1450
`
`SIR:
`
`Prior to the re-examination of the above-identified application, Patentees submit herewith
`
`the following amendments to the claims. This corrected Pre-Amendment replaces the
`
`Amendment previously filed on March 30, 2011.
`
`IPR2015-01087 - Ex. 1012
`Micron Technology, Inc., et al., Petitioners
`1
`
`
`
`IN THE UNITED STATES PATENT & TRADEMARK OFFICE
`
`IN RE REEXAMINATION APPL'N OF:
`
`Joseph BERNSTEIN et al.
`
`GROUP ART UNIT:
`
`APPLICATION NO: New Reexam. Request
`
`FILED: March 30,2011
`
`EXAMINER:
`
`FOR: LASER-INDUCED CUTTING OF METAL INTERCONNECT
`
`I hereby certify that this document is being transmitted to the USPTO or deposited with the United States Postal
`Service as first class mail in an envelope addressed to Commissioner for Patents, P.O. Box 1450, Alexandria, VA
`22313-1450, on April14, 2011.
`
`By: ___ /_J_e_n_n_l_· e_H_e_a_t_o_n_l ___ _
`Jennie Heaton
`
`CORRECTED PRE-AMENDMENT UNDER 37 C.P.R. 1.530
`
`Mail Stop: Ex Parte Reexam
`COMMISSIONER FOR PATENTS
`P.O. BOX 1450
`ALEXANDRIA, VA 22313-1450
`
`SIR:
`
`Prior to the re-examination of the above-identified application, Patentees submit herewith
`
`the following amendments to the claims. This corrected Pre-Amendment replaces the
`
`Amendment previously filed on March 30, 2011.
`
`IPR2015-01087 - Ex. 1012
`Micron Technology, Inc., et al., Petitioners
`1
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`Amendments to the Claims
`
`3.
`
`(Amended) [The] A._method for cutting a link between interconnected circuits[ of claim
`
`1], comprising the following steps:
`
`directing a laser upon an electrically-conductive cutlink pad conductively bonded
`
`between a first electrically-conductive line and a second electrically-conductive
`
`line on a substrate, the cut-link pad having substantially less thermal resistance
`
`per unit length than each of the first and second lines, wherein the width of the
`
`cut-link pad is at least ten percent greater than the width of each of the first and
`
`second electrically-conductive lines; and
`
`maintaining the laser upon the cut-link pad until the laser infuses sufficient energy
`
`into the cut-link pad to break the conductive link across the cut-link pad between
`
`the pair of electrically-conductive lines, wherein the electrically-conductive cut(cid:173)
`
`link pad has an inner surface facing the substrate and an opposing outer surface
`
`facing away from the substrate, the first and second electrically-conductive lines
`
`extending from the inner surface into the substrate.
`
`4.
`
`(Original) The method of claim 3, wherein the laser beam extends across the entirety of
`
`the cut-link pad when the laser is directed upon the cut-link pad.
`
`6.
`
`(Amended) The method of claim [1].;l, wherein the width of the cut-link pad is at least
`
`twenty-five percent greater than the width of each of the first and second electrically(cid:173)
`
`conductive lines.
`
`7.
`
`(Amended) The method of claim [1].;l, wherein the width of the cut-link pad is at least
`
`fifty percent greater than the width of each of the first and second electrically-conductive
`
`lines.
`
`Page 2 of 11
`
`2
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`8.
`
`(Amended) The method of claim 7, wherein the cut-link pad [is comprised of] comprises
`
`a composition substantially identical to the composition of the first and second
`
`electrically-conductive lines.
`
`11.
`
`(Original) A method for cutting a link between interconnected circuits comprising the
`
`following steps:
`
`directing a laser upon an electrically-conductive cut-link pad conductively bonded
`
`between a first electrically-conductive line and a second electrically-conductive
`
`line on a substrate, the cut-link pad having substantially less thermal resistance
`
`per unit length than each of the first and second lines, wherein the cut-link pad is
`
`formed of a material that has greater thermal conductivity than the material that
`
`forms each of the first and second electrically-conductive lines; and
`
`maintaining the laser upon the cut-link pad until the laser infuses sufficient energy
`
`into the cut-link pad to break the conductive link across the cut-link pad between
`
`the pair of electrically-conductive lines.
`
`13.
`
`(Amended) The method of claim [1]1, wherein a passivative layer covers the cut-link
`
`pad.
`
`14.
`
`(Original) A method for cutting a link between interconnected circuits comprising the
`
`following steps:
`
`directing a laser upon an electrically-conductive cut-link pad conductively bonded
`
`between a first electrically-conductive line and a second electrically-conductive
`
`line on a substrate, the cut-link pad having substantially less thermal resistance
`
`per unit length than each of the first and second lines, wherein the cut-link pad is
`
`covered with a passivative layer that is harder than the substrate; and
`
`Page 3 of 11
`
`3
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`maintaining the laser upon the cut-link pad until the laser infuses sufficient energy
`
`into the cut-link pad to break the conductive link across the cut-link pad between
`
`the pair of electrically-conductive lines.
`
`15.
`
`(Amended) The method of claim 14, wherein the passivation layer [is] comprises [of]
`
`silicon nitride.
`
`17.
`
`(Amended) [The] A._method for cutting a link between interconnected circuits[ of claim
`
`1], comprising the following steps:
`
`directing a laser upon an electrically-conductive cutlink pad conductively bonded
`
`between a first electrically-conductive line and a second electrically-conductive
`
`line on a substrate, the cut-link pad having substantially less thermal resistance
`
`per unit length than each of the first and second lines, wherein the width of the
`
`cut-link pad is at least ten percent greater than the width of each of the first and
`
`second electrically-conductive lines; and
`
`maintaining the laser upon the cut-link pad until the laser infuses sufficient energy
`
`into the cut-link pad to break the conductive link across the cut-link pad between
`
`the pair of electrically-conductive lines, wherein a passivative layer covers the
`
`cut-link pad, and the electrically-conductive cut-link pad has an inner surface
`
`facing the substrate and an opposing outer surface facing away from the substrate,
`
`the first and second electrically-conductive lines extending from the inner surface
`
`into the substrate.
`
`18.
`
`(Original) The method of claim 17, wherein the laser beam extends across the entirety of
`
`the cut-link pad when the laser is directed upon the cut-link pad.
`
`Page 4 of 11
`
`4
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`21.
`
`(Amended) The method of claim 13, wherein the cut-link pad [is comprised of]
`
`comprises a material with greater thermal conductivity than the material comprising each
`
`of the first and second electrically-conductive lines.
`
`22.
`
`(New) The method of claim 21, wherein the cut-link pad comprises aluminum.
`
`23.
`
`(New) The method of claim 3, wherein the cut-link pad has a greater cross-sectional area
`
`than the first and second electrically-conductive lines, wherein the cross-sectional area of
`
`the cut-link pad is the product of a width and a height of the cut-link pad, the first and
`
`second electrically-conductive lines comprise vias, and the cross-sectional area of each of
`
`the first and second electrically-conductive lines is defined by a width of the
`
`corresponding via.
`
`24.
`
`(New) The method of claim 13, wherein the passivative layer comprises silicon nitride.
`
`25.
`
`(New) The method of claim 4, wherein the cut-link pad has a length of 2-3 microns, and
`
`the first and second electrically-conductive lines each have a diameter of about 0.5
`
`microns.
`
`26.
`
`(New) The method of claim 11, wherein the electrically-conductive cut-link pad has an
`
`inner surface facing the substrate and an opposing outer surface facing away from the
`
`substrate, the first and second electrically-conductive lines extending from the inner
`
`surface into the substrate.
`
`27.
`
`(New) The method of claim 26, further comprising a passivative silicon nitride layer that
`
`covers the cut-link pad.
`
`28.
`
`(New) The method of claim 11, wherein the cut-link pad comprises aluminum.
`
`Page 5 of 11
`
`5
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`29.
`
`(New) The method of claim 14, wherein the width of the cut-link pad is at least fifty
`
`percent greater than the width of each of the first and second electrically-conductive
`
`lines.
`
`Page 6 of 11
`
`6
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`Remarks
`
`Patentees' undersigned representative respectfully submits the above amendments to the
`
`Claims in an ex parte re-examination request under 35 U.S.C. 302. No new matter is introduced
`
`by the present Amendment.
`
`The status of the claims and support for amendments made to the claims are as follows:
`
`Claim 1:
`
`Status: Canceled
`
`Claim 2:
`
`Status: Canceled
`
`Claim 3:
`
`Status: Pending, Amended
`
`Support: Claim 3 has been amended to be in independent form, and now incorporates the
`
`limitations of Claim 1. Support for this amendment can be found at col. 8, 11.
`
`20-41 of the above-identified patent, and in FIGS. 10-11 and Claims 20 and
`
`22 as originally filed.
`
`Claim 4:
`
`Status: Pending, Original
`
`Claim 5:
`
`Status: Canceled
`
`Claim 6:
`
`Status: Pending, Amended
`
`Support: Claim 3 has been amended to be in independent form, and now incorporates the
`
`limitations of Claim 1. Claim 6 formerly depended from Claim 1, and has
`
`Page 7 of 11
`
`7
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`been amended to depend from Claim 3. Support for the amendment can be
`found at col. 2, 11. 36-44, and in Claim 26 as originally filed.
`
`Claim 7:
`
`Status: Pending, Amended
`
`Support: Claim 3 has been amended to be in independent form, and now incorporates the
`
`limitations of Claim 1. Claim 7 formerly depended from Claim 1, and has
`
`been amended to depend from Claim 3. Support for the amendment can be
`found at col. 2, 11. 36-46, and in originally filed Claim 27.
`
`Claim 8:
`
`Status: Pending, Amended
`
`Support: Claim 8 has been amended to replace the transitional phrase "is comprised of'
`
`with the more commonly used transitional term "comprises." Support for the
`amendment can be found at col. 5, 11. 24-30, and in originally filed Claim 28.
`
`Claim 9:
`
`Status: Canceled
`
`Claim 10:
`
`Status: Canceled
`
`Claim 11:
`
`Status: Pending, Original
`
`Claim 12:
`
`Status: Canceled
`
`Claim 13:
`
`Status: Pending, Amended
`
`Page 8 of 11
`
`8
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`Support: Claim 3 has been amended to be in independent form, and now incorporates the
`
`limitations of Claim 1. Claim 13 formerly depended from Claim 1, and has
`
`been amended to depend from Claim 3. Support for the amendment can be
`
`found at col. 6, 11. 19-29, col. 8, 11. 53-60, and in Claim 33 as originally filed.
`
`Claim 14:
`
`Status: Pending, Original
`
`Claim 15:
`
`Status: Pending, Amended
`
`Support: Claim 15 has been amended to replace the grammatically erroneous transitional
`
`phrase "is comprises of' with the transitional term "comprises." Support for the
`
`amendment can be found at col. 6, 11. 45-56, col. 8, 11. 54-65, and in Claim 35 as
`
`originally filed.
`
`Claim 16:
`
`Status: Canceled
`
`Claim 17:
`
`Status: Pending, Amended
`
`Support: Claim 17 has been rewritten in independent form, and now includes the limita(cid:173)
`
`tions of Claim 1 and 13. Support for the amendment can be found at col. 6, 11.
`
`19-29, col. 8, 11. 20-41 and 53-60 of the above-identified patent, and in FIGS.
`
`10-11 and Claims 20, 22 and 37 as originally filed.
`
`Claim 18:
`
`Status: Pending, Original
`
`Claim 19:
`
`Status: Pending, Original
`
`Page 9 of 11
`
`9
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`Claim 20:
`
`Status: Canceled
`
`Claim 21:
`
`Status: Pending, Amended
`
`Support: Claim 21 has been amended to replace the transitional phrase "is comprised of'
`
`with the transitional term "comprises." Support for the amendment can be
`
`found at col. 5, 11. 24-30, and in Claim 41 as originally filed.
`
`Claim 22:
`
`Status: New
`
`Support: Support for Claim 22 can be found at col. 5, 11. 24-30.
`
`Claim 23:
`
`Status: New
`
`Support: Support for Claim 23 can be found at col. 5, 11. 20-35, and col. 8, 11. 25-35.
`
`Claim 24:
`
`Status: New
`
`Support: Support for Claim 24 can be found at col. 6, 11. 19-29, and col. 8, 11. 53-56.
`
`Claim 25:
`
`Status: New
`
`Support: Support for Claim 25 can be found at col. 5, 11. 9-12, and col. 8, 11. 30-35.
`
`Claim 26:
`
`Status: New
`
`Support: Support for Claim 26 can be found at col. 7, 11. 25-26, col. 8, 11. 20-28, and FIG.
`
`10 as originally filed.
`
`Page 10 of 11
`
`10
`
`
`
`Atty. Docket No. MIT-001-RX1
`Application No.: New Reexamination Application
`
`Claim 27:
`
`Status: New
`
`Support: Support for Claim 27 can be found at col. 6, 11. 19-29, and col. 8, 11. 53-56.
`
`Claim 28:
`
`Status: New
`
`Support: Support for Claim 28 can be found at col. 5, 11. 24-30.
`
`Claim 29:
`
`Status: New
`
`Support: Support for Claim 29 can be found at col. 2, 11. 44-46.
`
`In view of the above amendments and remarks, the application is in condition for re(cid:173)
`
`examination on the merits. Early notice to that effect is earnestly requested.
`
`Respectfully submitted,
`
`/Sherrie M. Flynn/
`
`Sherrie M. Flynn
`Reg. No. 62,066
`
`Andrew D. Fortney, Ph.D.
`Reg. No. 34,600
`
`THE LAW OFFICES OF ANDREW D. FORTNEY, PH.D., P.C.
`215 W. Fallbrook Ave., Suite 203
`Fresno, CA 93711-5835
`Phone:559-432-6847
`
`ADF:wkn
`
`Page 11 of 11
`
`11
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`
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