`
`Rebuttal Declaration of Lester J. Kozlowski dated Jan. 19, 2016
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`TRW Automotive U.S. LLC: EXHIBIT 1071
`PETITION FOR INTER PARTES REVIEW
`OF U.S. PATENT NUMBER 8,599,001
`IPR2015-00436
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`Trials@uspto.gov
`571-272-7822
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`UNITED STATES PATENT AND TRADEMARK OFFICE
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`____________
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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
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`____________
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`TRW AUTOMOTIVE U.S. LLC
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`Petitioner
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`v.
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`MAGNA ELECTRONICS, INC.
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`Patent Owner
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` ____________
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`Case IPR2015-004361
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`Patent 8,599,001 B2
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`____________
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`REBUTTAL DECLARATION OF TRW’S EXPERT
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`LESTER J. KOZLOWSKI
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`1Cases IPR2015-00437, IPR2015-00438, and IPR2015-00439 have been
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`consolidated with this proceeding.
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`1071-001
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`TABLE OF CONTENTS
`TABLE OF CONTENTS
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` INTRODUCTION……………………………………………………1
`INTRODUCTION .......................................................... . . 1
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` QUALIFICATIONS…………………………………………………12
`QUALIFICATIONS ....................................................... . . 12
`
` DOCUMENTS REVIEWED ……………………………………….22
`DOCUMENTS REVIEWED ............................................ ..22
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` LAW GOVERNING OBVIOUSNESS…………………………….29
`LAW GOVERNING OBVIOUSNESS ................................ ..29
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`0
`I.
`!—l
`
`II.
`
`III.
`III.
`
`IV.
`IV.
`
`V.
` GLOSSARY OF TERMS USED TO DESCRIBE IMAGE
`GLOSSARY OF TERMS USED TO DESCRIBE IMAGE
` SENSORS……………………………………………………………31
`SENSORS ................................................................... ..31
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`VI.
`VI.
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` MOS-BASED IMAGE SENSING AND MOORE’S LAW.……...37
`MOS-BASED IMAGE SENSING AND MOORE’S LAW..........37
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`VI.A.
`VI.A.
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`VI.B.
`VI.B.
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`THE WORKINGS OF MOS-BASED IMAGE
`THE WORKINGS OF MOS-BASED IMAGE
`SENSORS…………………………………………………....37
`SENSORS ........................................................... ..37
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`THE EVOLUTION OF MOS-BASED SENSORS FROM
`THE EVOLUTION OF MOS-BASED SENSORS FROM
`1960’S TO THE TIME OF THE ‘001 PATENT AND
`1960’S TO THE TIME OF THE ‘001 PATENT AND
`BEYOND…………………………………………………….51
`BEYOND ........................................................... ..51
`
`VI.C.
`VI.C.
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`THE PASSIVE PIXEL TECHNOLOGY………………….63
`THE PASSIVE PIXEL TECHNOLOGY .................... ..63
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`VI.C.1.
`VI.C.1.
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`VI.C.2.
`VI.C.2.
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`THE EVOLUTION OF PASSIVE PIXEL SENSORS
`THE EVOLUTION OF PASSIVE PIXEL SENSORS
`LEADING UP THE FOUNDING OF VLSI VISION
`LEADING UP THE FOUNDING OF VLSI VISION
`LIMITED……………………………………………..63
`LIMITED ................................................... ..63
`
`LEVERAGING OF THE WORK OF THE PRIOR
`LEVERAGING OF THE WORK OF THE PRIOR
`ARTISANS BY DENYER AND RENSHAW TO
`ARTISANS BY DENYER AND RENSHAW TO
`FORMVVL AND EXPLOIT THE PASSIVE PIXEL
`FORMVVL AND EXPLOIT THE PASSIVE PIXEL
`TECHNOLOGY……………………………………..81
`TECHNOLOGY .......................................... ..81
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`VI.C.3.
`VI.C.3.
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`THE PASSIVE PIXEL SENSORS DEVELOPED BY
`THE PASSIVE PIXEL SENSORS DEVELOPED BY
`DR. DENYER’S TEAM MATCHED THE
`DR. DENYER’S TEAM MATCHED THE
`PERFORMANCE OF TYPICAL CCD’S………....90
`PERFORMANCE OF TYPICAL CCD’S.............90
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`VII.
`VII.
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`
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`REBUTTAL ARGUMENTS……………………………………..95
`REBUTTAL ARGUMENTS .......................................... ..95
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`VII.A.
`VII.A.
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`VISION SYSTEMS…………………………………...……95
`VISION SYSTEMS .............................................. ..95
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`VII.A.1. THE IMPUTER WAS A COMPLETELY GENERIC
`VII.A.1.
`THE IMPUTER WAS A COMPLETELY GENERIC
`DEVELOPMENT PLATFORM FOR VISION
`DEVELOPMENT PLATFORM FOR VISION
`SYSTEMS…………………………………………… 95
`SYSTEMS ................................................. .. 95
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`ETIENNE-CUMMINGS’ REPEATED RELIANCE
`ETIENNE-CUMMINGS’ REPEATED RELIANCE
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`VII.A.2.
`VII.A.2.
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`1071-002
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`1071-002
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`ON MOINI (EX. 2005) IS IN INAPT……………..101
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`VEHICULAR VISION SYSTEMS……………………...108
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`VII.B.
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`VII.B.1. THE GOAL OF THE SKILLED ARTISAN AT THE
`TIME OF THE ALLEGED INNOVATION, AND
`ALSO TODAY, WAS TO BOLSTER—AND NOT
`DIMINISH—THE VERSATILITY OF
`VEHICULAR VISION SYSTEMS……………...108
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`VII.B.2.
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`THE FACT THAT AN “IDEAL SENSOR WAS NOT
`YET DISCOVERED” HAS LITTLE
`APPLICABILITY TO THE ISSUES AT
`HAND……………………………………………...112
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`VII.C.
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`IMAGE SENSORS………………………………………113
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`VII.C.1.
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`THE ACHILLES HEEL OF CCD WAS NOT THE
`CHARGE TRANSFER EFFICIENCY…………..113
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`VII.C.2. CMOS SENSORS………………………………….115
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`VII.C.2.i AT THE TIME OF THE ALLEGED
`INNOVATION, THE ARTISAN HAD MANY
`GOOD REASONS TO SELECT CMOS
`TECHNOLOGY—INCLUDING PASSIVE
`PIXEL CMOS TECHNOLOGY—FOR
`AUTOMOTIVE VISION SYSTEMS………115
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`VII.C.2.ii THE ‘001 PATENT, LIKE VELLACOTT,
`CLEARLY SPECIFIES VVL PASSIVE PIXEL
`SENSOR TECHNOLOGY…………………125
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`1071-003
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`VII.D.
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`ATTRIBUTES CHARACTERIZING IMAGE
`SENSORS………………………………………………..130
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`VII.E.
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`IMAGE INTENSIFIERS ………………………………133
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`VII.F.
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`SUMMARY OF THE ASSERTED REFERENCES….134
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`VII.F.1. VELLACOTT…………………………………….134
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`VII.F.2
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`KENUE……………………………………………140
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`VII.F.3 VENTURELLO…………………………………...142
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`VIIF.4.
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`SCHOFIELD……………………………………...145
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`VII.G.
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`THE APPLIED PRIOR ART RENDERS THE INSTITUTED
`CLAIMS INVALID……………………………………………..147
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`VII.G.1.
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`VII.G.2.
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`THE SKILLED ARTISAN WOULD HAVE FOUND IT
`OBVIOUS TO COMBINE VELLACOTT AND KENUE,
`AND THE PROPOSED MODIFICATION WOULD NOT
`RENDER VELLACOTT UNSUITABLE FOR ITS
`INTENDED PURPOSE …………………………………147
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`THE ARTISAN WOULD HAVE APPRECIATED THAT
`THE IMPUTER WAS CAPABLE OF DETECTING
`HEADLIGHTS IN THE FORWARD FIELD OF VIEW
`AND HE COULD AND WOULD HAVE USED THE
`IMPUTER IN THIS FASHION………………………..156
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`VII.G.2.i ETIENNE-CUMMINGS MISCALCULATES
`THE DYNAMIC RANGE OF THE
`IMPUTER…………………………………..159
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`VII.G.2.ii THE IMPUTER SENSOR HAS A GREATER
`NUMBER OF PIXELS THAN THE ‘001
`PATENT SENSOR, AND THE IMPUTER
`CAN BE PROGRAMMED SO AS TO USE
`ONLY A SUBSET OF THE 256 X 256
`ARRAY……………………………………….162
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`VII.G.2.iii THE FIELD OF VIEW OF THE IMPUTER IS
`NOT LIMITED TO “90° (DIRECTION NOT
`SPECIFIED)”…………………………….…..164
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`1071-004
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`VII.G.2.iv THE OPERATING FREQUENCY OF THE
`IMPUTER IS SUFFICIENT AND ETIENNE-
`CUMMINGS MAKES NO ARGUMENT TO
`THE CONTRARY…………………………165
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`VII.G.2v. THE IMPUTER HAD SUFFICIENT
`PROCESSING POWER TO DETECT
`HEADLIGHTS IN THE FIELD OF
`VIEW….……………………………………166
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`VII.G.3
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`IMPLEMENTATION OF THE KENUE ALGORITHMS
`USING THE IMPUTER WAS OBVIOUS..……………168
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`VII.G.3.i THE ARTISAN COULD AND WOULD HAVE
`PROGRAMMED THE KENUE
`ALGORITHMS IN THE IMPUTER………168
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`VII.G.3.ii
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`IMPLEMENTATION OF THE KENUE
`ALGORITHMS USING THE IMPUTER WAS
`OBVIOUS.........................................................173
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`VII.G.4. VELLACOTT, IN COMBINATION WITH THE
`SECONDARY REFERENCES, RENDERS ALL
`INSTITUTED CLAIMS OBVIOUS……………………187
`
`VII.G.4.i VELLACOTT ALONE, AND VELLACOTT AND
`KENUE, TEACH A MODULE ATTACHED AT A
`WINDSHIELD (CLAIMS 1-14, 24, 28, 32, 34-40, 42-
`50, 53-55)……………………………………………187
`
`VII.G.4.ii. VELLACOTT TEACHES AN ARRAY WITH
`MORE COLUMNS THAN ROWS (CLAIMS 3, 4, 96-
`100, 102-109)………………………………………191
`
`VII.G.4.iii VELLACOTT SHOWS AN ARRAY HAVING AT
`LEAST 40 ROWS (CLAIMS 4, 59, 81, 93-100, 102-
`109)………………………………………………...194
`
`VII.G.4.iv. VELLACOTT AND KENUE TEACH THAT THE
`IMAGE DATA PROCESSING BY THE IMAGE
`PROCESSOR COMPRISES PATTERN
`RECOGNITION (CLAIM 28)………………..…195
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`1071-005
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`VII.G.v
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`VELLACOTT AND KENUE TEACH A CONTROL
`THAT DETERMINES A PEAK LIGHT LEVEL ON
`SUB-ARRAY (CLAIMS 35, 36)………………..…198
`
`VII.G.vi VELLACOTT RENDERS OBVIOUS A
`CONNECTOR FOR ELECTRICALLY
`CONNECTING TO A POWER SOURCE OF THE
`EQUIPPED VEHICLE (CLAIMS 52, 56-66, 69, 71,
`73-78)………………………………………………..202
`
`VII.G.vii KENUE, LIKE VELLACOTT, RENDERS
`OBVIOUS AN IMAGER WITH MORE ROWS
`THAN COLUMNS…………………………………203
`
`VII.G.viii VELLACOTT COMBINED WITH VENTURELLO
`TEACHES A VEHICULAR VISION SYSTEM
`DETERMINING PRESENCE OF FOG OR
`RECOGNIZING VEILING GLARE (CLAIMS 11-14,
`64, 65, 79, 80-85, 87- 95, 98, 99)……………………205
`
` VII.G.ix THE COMBINATION WITH SCHOFIELD
`TEACHES A RELEASABLY MOUNTED MOUDLE
`(CLAIMS 56-66, 69-71, 73-79, 81-85, 87-100, 102-
`108)…………………………………………………..216
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`1071-006
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`I.
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`INTRODUCTION
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`1.
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`
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`I, Lester J. Kozlowski, am an adult resident of the state of California
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`and make this declaration based on personal knowledge of image sensor
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`technology, experience in supporting the development of automotive camera
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`technology, and my clear understanding of what is known by a person of ordinary
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`skill in the art.
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`2.
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`I have been retained as an expert technical consultant by Lathrop and
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`Gage LLP, counsel to TRW Automotive US LLC (“TRW”), in support of the inter
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`partes review concerning U.S. Patent 8,599,001 (the ‘001 Patent) to Magna.
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`3.
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`
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`I agreed to provide my expert opinion regarding the invalidity of the
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`‘001 Patent due to its technical obsolescence and obviousness and can competently
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`testify in support of this action. It is also clear to me that the CMOS image sensor
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`of the preferred embodiment of the ‘001 Patent is of a passive pixel technology
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`that was supplied in the mid-1990s by VLSI Vision Limited (VVL).
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`4.
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`
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`The Board instituted trial (herein “the instituted claims” or “the
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`claims”) on the following claims for obviousness over the prior art references
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`listed below. Institution Decision. pp. 43-44.
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`1
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`1071-007
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`Instituted claims
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`Prior art references
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`1-5,15, 28, 35-40, 42-
`50, 53, and 55
`6-10, 32, and 34
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`Vellacott and Kenue
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`Vellacott, Kenue, and Yanagawa
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`54
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`Vellacott, Kenue, and Denyer
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`Vellacott, Kenue, and Schofield
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`24, 56-60, 66, 73-76,
`96, 97, 100, and 102-
`06
`61-63, 69, 71, and 77 Vellacott, Kenue, Schofield, and
`Yanagawa
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`64, 65, 79, 81-85, 88-
`93, 98, and 99
`78
`
`Vellacott, Kenue, Schofield, and
`Venturello
`Vellacott, Kenue, Schofield, and
`Denyer
`Vellacott, Kenue, Schofield,
`Venturello, and Yanagawa
`94, 95, 107, and 108 Vellacott, Kenue, Schofield,
`Venturello, and Denyer
`Vellacott, Kenue and Venturello
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`87
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`11-14
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`
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`5.
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`I have reviewed the declaration of Dr. Ralph Etienne-Cummings (Ex.
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`2003). I find that Dr. Etienne-Cummings’ review of the prior art is incomplete,
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`selective, and replete with factual inaccuracies, and that he does not properly
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`interpret the prior art on which trial was instituted from the perspective of one of
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`ordinary skill in the art at the time of the invention (herein, the “artisan”, or the
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`“skilled artisan”). Indeed, it appears that Etienne-Cummings is simply trying to
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`obfuscate the issues through a series of irrelevant arguments and hand-waving in
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`the hope that the Board will somehow agree with his unsupportable overarching
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`2
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`1071-008
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`contention that the skilled artisan would not and could not use the passive pixel
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`CMOS sensor for automotive vision systems, even when the Vellacott prior art
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`shows that this is precisely what the patent owner’s predecessor corporation was
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`doing itself. I disagree with Etienne-Cummings’s opinions. I herein rebut his
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`declaration and assert, in agreement with the Miller declaration (Ex. 1011), that the
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`‘001 Patent claims are obvious in view of the prior art cited by TRW. The ‘001
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`Patent is clearly invalid to a person of ordinary skill in the art at the time of the
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`alleged invention.
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`6.
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`In preparation for writing this declaration, I formulated my review of
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`the ‘001 Patent; my opinions based on my personal knowledge of many types of
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`image sensors, semiconductors and solid state physics; my direct hands-on
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`experience designing and evaluating charge coupled devices for about ten years;
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`and my direct hands-on experience designing, evaluating and offering for
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`commercial, military and scientific sale many PMOS, NMOS and CMOS-based
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`image sensors for nearly three decades. My conclusions are the direct result of my
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`era-specific analysis of the technical facts and relevant documents.
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`7.
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`I have considered the time before, during and after the prosecution of
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`the ‘001 Patent in preparing my expert opinion. The era prior to the mid-1990s is
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`especially critical because of the evolutionary improvements in image sensors
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`occurring prior to the filing of the ‘001 Patent. I actually was a design engineer of
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`3
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`1071-009
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`ordinary skill in the art throughout the time relevant to the ‘001 Patent. I have at
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`hand the technical documents, personal recollections and appropriate mind-set to
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`accurately revisit the skill-set and knowledge of a practitioner of ordinary skill in
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`the art including the time before, during and after the ‘001 Patent. I submit that I
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`am qualified to provide expert opinions in this case.
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`8.
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`In order to reproduce for the Patent Trial and Appeal Board what was
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`known by a person of ordinary skill in the art, I will herein discuss the well
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`understood engineering principles of imaging sensors and the prior art image
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`sensor technology that a skilled artisan in the field would have known based on his
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`formal education and subsequent work experience.
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`9.
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`I agree with Dr. Miller’s contentions about the level of ordinary skill
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`(Ex. 1011, at ¶ 8), as also adopted by the Board in the Institution Decision at pp.
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`12-13. I apply this level of ordinary skill throughout the declaration. Dr. Etienne-
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`Cummings’s definition of one of skill in the art is set forth in Ex. 2003 at ¶ 24, and
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`I submit that my analysis does not change and that the claims are also obvious to
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`the skilled artisan as defined by Dr. Etienne-Cummings.
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`10.
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`The expert declaration provided by Dr. Etienne-Cummings of the
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`Johns-Hopkins University ignores the image sensor design details prior to
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`Vellacott in 1994 that would have been learned by a skilled artisan to best perform
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`4
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`1071-010
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`his job. The additional technical details are not extraordinary, would have been
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`practiced by a skilled artisan and further refute Etienne-Cummings’ conclusions.
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`11.
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`I will follow the logical evolutionary path globally practiced over the
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`thirty year span by the skilled artisans of numerous semiconductor companies. I
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`will sometimes refer to the successive image sensors by their specific fabrication
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`technologies. I will describe that the era-specific monikers may change, but the
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`circuit elements and operating principles of the sensors largely remain unchanged.
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`While the size of the resulting amplifiers in the 1960s used relatively enormous
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`areas spanning thousands of square microns, similar designs in 1995 used tens of
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`square microns and today may use only a few square microns.
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`12.
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`I will incontrovertibly show that MOS technology benefitted from
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`numerous evolutionary advances starting in 1965, continuing through 1995 (the
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`alleged effective filing date of the ‘001 Patent is June 7, 1995) and even today.
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`Relative to the ‘001 Patent, MOS image sensors designs benefitted and gradually
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`evolved over the prior three decades due to the relentless micro-miniaturization
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`reported by Gordon Moore and documented as “Moore’s Law” in 19652. At the
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`time of the ‘001 Patent the imaging community’s transition from NMOS to CMOS
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`in order to develop the latest “MOS-based” sensors was already underway by
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`
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`2 G. Moore, “Cramming more components onto integrated circuits,”
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`Electronics, Vol. 38, No. 8, April 19, 1965, Ex. 1013.
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`5
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`1071-011
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`about a decade with the prior two decades of intellectual property already in the
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`tool chest.
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`13.
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`
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`It is important to note that image sensors, which first detect various
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`wavelengths of light, subsequently process the electronic signal, and eventually
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`deliver a video signal in various forms, have been referred to by many era-
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`appropriate names over their fifty years of development from about 1965 to 2015.
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`14.
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`
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`The first such devices introduced in the mid-1960s were successively
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`described as: “monolithic mosaic of photon sensors” and “self-scanned integrated
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`photodiode arrays” in 1965; “integrated arrays for image detection” and “thin film
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`solid-state image sensor” in 1966; “integrated arrays of silicon photodetectors for
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`image sensing” in 1967; “monolithic phototransistor mosaic” in 1968; and, “high-
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`speed, word-organized, photodetecting array” and “monolithic imaging array” in
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`1969. The key to the underlying technical element enabling this explosion of
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`technical and descriptive creativity was articulated by Peter Noble in the opening
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`paragraph of one of his seminal papers on metal-oxide-semiconductor (MOS)
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`imaging:
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`With the advent of the integrated circuit and the inherent
`light sensitivity of the p-n junction, it was only a matter
`of time before solid-state image detection would be
`realized. However, not until the metal oxide silicon
`transistor
`(MOST) was developed could
`the
`full
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`6
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`1071-012
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`possibilities
`determined.3
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`of
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`solid-state
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`image
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`detection
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`be
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`
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`Mr. Noble was recently acknowledged by the International Image Sensor Society
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`(IISS). On March 17th 2015, he was awarded the 2015 IISS Pioneering
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`Achievement Award for "seminal contributions to early years of MOS image
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`sensors" and gave the Keynote Speech at the IISS’ world conference on image
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`sensors in early June. Passive pixel CMOS sensors and Active pixel CMOS
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`sensors at the time of the ‘001 Patent were both the logical evolution of the
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`contributions Peter Noble and others made to MOS devices several decades prior
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`to the ‘001 Patent.
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`15.
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` Nevertheless, contrary to Noble’s unbridled enthusiasm at the time,
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`the path to the nascent MOS technology’s eventual dominance of image sensors
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`proved to be a long, winding and hard fought road for all succeeding image sensor
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`designers after Noble to this day. MOS-based image sensors lost the initial battles
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`through the mid-1980s and then began to dominate starting in the late-1980s
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`when CMOS process technology hit the 1.5µm to 1µ m lithography nodes.
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`16.
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`
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`It is not a coincidence that Noble’s observations and seminal work
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`occurred at about the same time as Gordon Moore, a founder of Intel, identified
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`
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`3 P. Noble, “Self-Scanned Silicon Image Detector Arrays,” IEEE Trans. ED,
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`Vol. ED-15, No. 4, April 1968, attached here as Ex. 1018.
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`7
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`1071-013
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`and reported the MOS technology evolution later coined as “Moore’s Law.” The
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`common theme shared by Noble and Moore is the leveraging of the full possibility
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`of MOS technology. Moore understood the bigger picture that the integration
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`would be incremental along with integrated circuit evolution. Noble’s sensor-
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`oriented vision would not be fully realized until at least twenty years later, but lots
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`of products and revenues were generated along the way.
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`17.
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`
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`Early along on the path to the ‘001 Patent and beyond, a competing
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`technology, the charge coupled device (CCD), was invented. The CCD began to
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`dominate in the early 1980s, after a decade of development. CCD technology
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`remains competitive even today
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`18.
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`
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`The CCD’s strongest solid-state competitor in the early- to mid-
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`1980s was the “MOS Imaging Device” or “MOS Area Sensor” best
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`commercialized by Hitachi. The work of Hitachi’s engineers evolved Noble’s
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`seminal work by leveraging the available micro-miniaturization at that time, from
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`the late 1970s through the mid-1980s. Hitachi gradually integrated onto the image
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`sensor substrate a few of the peripheral components, such as charge amplifiers and
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`current buffering amplifiers in the column buffer. However, with the onslaught at
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`the time of CCDs from several different manufacturers, Hitachi abandoned its
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`image sensor segment in favor of other components of its much broader business
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`menu.
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`
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`8
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`1071-014
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`19.
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` However, the research labs of that era did undertake the migration to
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`CMOS, including my believing that I had to further my career by moving from
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`CCDs at Hughes Aircraft to CMOS-based image sensors at Rockwell Science
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`Center in 1987. Despite the enthusiasm of a Hughes Student Fellow I was
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`mentoring at the time (Eric Fossum, who also later saw the “light” and abandoned
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`CCDs sometime after completing his Ph.D. studies at Columbia University), I left
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`for Rockwell Science Center. Soon after my joining and leading a nascent CMOS
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`team, we won our first contract in 1988 on the way to crafting the CMOS-based
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`256x256 infrared-sensing image sensor now orbiting Earth since 1992. I was not
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`alone in seeing the near future. At the same time University of Edinburgh staff
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`began forming their fabless company, VLSI Vision Limited, also using a CMOS
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`foundry to fabricate their CMOS visible light sensors and eventually capture
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`Donnelly as an automotive customer.
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`20.
`
`
`
`In the late 1980s through the 1990s, the relentless micro-
`
`miniaturization reported by Moore’s Law hence enabled this next evolutionary
`
`step: imaging sensors designed using even smaller complementary MOS
`
`transistors. At a global level, the technology was described by many names and
`
`acronyms, including focal plane arrays (FPAs) with CMOS readout, MOS single-
`
`chip imager, passive pixel sensor, active pixel sensor, CMOS image sensor, CCD-
`
`MOS, CCD/CMOS sensor, Base-Stored Image Sensor (BASIS), Direct Readout
`
`
`
`9
`
`1071-015
`
`
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`(DRO) Image Sensor, Processor A/D Converter Sensor Integrated Circuit (PASIC)
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`Sensor, and Amplified MOS Imager, among others.
`
`21.
`
`
`
` The incontrovertible fact that MOS-based image sensors gradually
`
`evolved over the last fifty years, and continue to evolve today, is critical to the
`
`understanding of the prior art, including Vellacott. All along, while the evolution
`
`of microprocessors and image sensors continued over the years, commitments were
`
`made, products developed, specific inventions patented and revenue generated.
`
`The skilled artisan s made choices, such as those made in the specification and
`
`claims of the ‘001 Patent. Those choices have expiration dates. As discussed
`
`below, the development team responsible for crafting the ‘001 Patent knowingly
`
`approved the passive pixel image sensor technology of the era because it had not
`
`only sufficiently evolved after nearly 30 years of development, but readily met the
`
`known requirements at that time. Today, 20 years after that commitment was
`
`made, the specification is being ignored in attempt to further post-date the patent to
`
`leverage additional sensor improvements.
`
`22.
`
`
`
`I will therefore briefly describe key pieces of the prior art while
`
`simultaneously describing the recurring techniques for reading the video output
`
`from the various types of MOS, PMOS, NMOS and CMOS image sensors. Some
`
`of the sensors were passive and others active. In doing so, I will explain how
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`photo-generated signals are read from each picture element, or pixel, of a two-
`
`
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`10
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`1071-016
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`
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`dimensional image sensor array, and how the data stream from all the pixels is
`
`serially multiplexed to form each line of video.
`
`23.
`
` My objective is to aid the interested parties in understanding how
`
`imaging sensors were used to read each pixel at the time of the ‘001 Patent. I will
`
`hence contextually support Miller’s correct assertions regarding the invalidity of
`
`the various claims. Consequently, I will also rebut the erroneous assertions
`
`proffered by Etienne-Cummings in his declaration.
`
`24.
`
`
`
`I have not previously testified in court as an expert witness in any
`
`other case, but have been deposed and supplied expert declarations multiple times.
`
`My company does not compete with either TRW or Magna. My hourly rate for my
`
`research, analysis and testimony in connection with this matter is $500 per hour.
`
`
`
`
`
`
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`11
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`1071-017
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`
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`II. QUALIFICATIONS
`
`
`
`25.
`
`
`
`In this section, I will establish that I was familiar with the state of the
`
`art at the time of the alleged invention and am qualified to opine as an expert
`
`thereon. Attached to this report as Exhibit 1014 is a true and correct copy of my
`
`curriculum vitae.
`
`26.
`
`
`
`I am currently employed as President, Chief Executive Officer and
`
`Chief Technology Officer of AltaSens, Inc., a Delaware corporation. I was the
`
`founder of AltaSens upon its inception in February of 2004 when the startup
`
`company was jointly venture funded by Rockwell International and ITX, a venture
`
`capital company now owned by Olympus. AltaSens has proven to be a successful
`
`startup under my technical and executive leadership and will soon celebrate its 12th
`
`year of operation.
`
`27.
`
` AltaSens is currently a wholly owned subsidiary of JVC Kenwood of
`
`Yokohama, Japan. We develop and offer for sale imaging sensors and prototype
`
`high-definition camera development kits for commercial products including
`
`broadcast and consumer cameras spanning high-definition through ultra-high
`
`definition (UHD) formats, UHD camcorders, security cameras and
`
`videoconferencing systems. Our imaging sensors are electro-optical sensors
`
`configured as two-dimensional arrays with integrated electronics in a single
`
`integrated circuit that we refer to as an imaging System-on-Chip.
`
`
`
`12
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`1071-018
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`
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`28.
`
` Our customers and camera development partners are leading
`
`commercial companies including Hitachi, Panasonic Ikegami, JVC, Kenwood,
`
`Johnson & Johnson and Cisco-Tandberg, among others.
`
`29.
`
`
`
`Prior to founding and successfully leading AltaSens, I was employed
`
`for seventeen years at the Imaging division of Rockwell Scientific and its
`
`predecessor corporate entity, Rockwell Science Center, where I led or was a major
`
`contributor in the development of over sixty infrared FPAs and a dozen visible
`
`imaging sensors, including both passive pixel and active pixel CMOS image
`
`sensors. Successively in my career at Rockwell, I was Chief Technologist of the
`
`Imaging Division of Rockwell Scientific, Principal Scientist of the Imaging
`
`Function within Rockwell Science Center, Principal Scientist of the Electronic
`
`Devices Laboratory, Manager of the Mixed-Signal VSLI Department and Member
`
`of the Technical Staff.
`
`30.
`
`
`
`I led the development of numerous focal plane arrays and imaging
`
`sensors in both the infrared and visible spectral bands for Rockwell Scientific,
`
`Rockwell Science Center, Conexant Systems, Inc., and Rockwell Semiconductor
`
`Systems, Rockwell Automation, Rockwell Collins, Meritor Automotive Systems
`
`and various Rockwell Defense & Aerospace Groups. Our external customers
`
`included the United States Air Force, United States Navy, United States Army,
`
`DARPA, NASA, Jet Propulsion Laboratory, Sandia National Laboratory,
`
`
`
`13
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`1071-019
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`
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`Lockheed, Northrup Grumman, University of Arizona, University of California at
`
`Los Angeles, and European Southern Observatory, among others.
`
`31.
`
`
`
`The various image sensors were also successfully developed for
`
`commercial cameras, strategic and tactical infrared focal planes and systems,
`
`surveillance cameras, ground- and space-based infrared observatories, and orbiting
`
`instruments.
`
`32.
`
` At Rockwell, I led the
`
`development of the world’s largest infrared
`
`image sensors. My publication and oral
`
`presentation describing my 1024 x 1024 pixel
`
`sensor for ground-based astronomy4 was
`
`“Best Paper” of the 1994 IRIS Conference on
`
`Infrared Detectors.
`
`33.
`
`
`
`Throughout my career, I have
`
`developed imaging sensors having ever
`
`Figure 1: 1994 IRIS Best Paper
`Award for one of my 1024 x
`1024 imaging sensors
`
`larger resolution and higher performance, leading to my giving many invited talks
`
`throughout the imaging community at conferences throughout the United States,
`
`Poland and Ukraine. The majority of the image sensors were called by various
`
`
`
`4L. Kozlowski et al., “2.5µm PACE-I HgCdTe 1024x1024 FPA,” Proc. IRIS
`
`Detector Specialty, August 1994, attached here as Ex. 1015.
`
`
`
`14
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`1071-020
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`
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`technical names, but most of them could today be called either Passive or Active
`
`Pixel Image Sensors with CMOS readout.
`
`34.
`
` My first employer after leaving graduate school (when my advisor
`
`told me he was leaving for Bell Labs) was Hughes Aircraft Company, at the
`
`Missile Systems Division in Canoga Park, CA. There, I quickly became an
`
`integral part of a multi-divisional team directing the CCD R&D center in Carlsbad,
`
`CA and the infrared detector R&D center in Santa Barbara, CA. The team
`
`demonstrated the world’s first high-performance infrared sensors at resolutions of
`
`64 x 64 and 128 x 128 pixels. Both major projects culminated in my presenting the
`
`team’s progress at the leading symposium for infrared sensor research at that time,
`
`the Infrared Imaging Symposium (IRIS). I was awarded Outstanding Paper of the
`
`Year Awards for 1984 and 1985 for two of my papers at Hughes Aircraft’s Missile
`
`Systems Group.
`
`35.
`
`
`
`I continued much of the trail setting work in the infrared sensor
`
`community after moving to Rockwell where I led the development of the world’s
`
`largest infrared sensors at 256 x 256, 640 x 480, 1024 x 1024, 2048 x 2048 and
`
`4096 x 4096 resolution.
`
`36.
`
` While much of my work was either often classified by the US
`
`government or is esoteric to most people, my 1024 x 1024 and 2048 x 2048
`
`infrared sensors for infrared astronomy are today the most widely used imaging
`
`
`
`15
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`1071-021
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`
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`infrared sensors in observatories all over the world; they have been instrumental in
`
`greatly enhancing man’s understanding of the universe. Another important focal
`
`plane array I developed, whose scientific impact is readily familiar all over the
`
`world, is the infrared sensor that became the infrared imaging work-horse of the
`
`Hubble Space Telescope starting in February 1997 when it was installed during the
`
`2nd Space Shuttle Servicing Mission (STS-82).
`
`37.
`
` Originally designed for Hubble’s Near Infrared Camera Multi-Object
`
`Spectrometer (NICMOS) instrument, the so-called NICMOS sensor enabled
`
`NASA and astronomers to more accurately date the age of the universe at 13.7
`
`billion years. After spending over 10 years to date orbiting Earth, tirelessly
`
`acquiring images, and benefiting from a cooling system replacement performed by
`
`Space Shuttle Servicing Mission 3B (STS-109) in 1999, Hubble’s infrared sensors
`
`continue to operate today. Hubble’s various instruments were deemed so critical to
`
`man’s understanding of the universe that Shuttle Servicing Mission 4 was
`
`commissioned and launched as STS-125 late 2008 to extend Hubble’s life and
`
`capabilities through today. The new infrared camera with higher resolution, the
`
`Hubble Wide Field Camera 3 (WFC3), uses a 1024 x 1024 imaging sensor that was
`
`built using an updated version of the Rockwell 1024 x 1024 pixel infrared focal
`
`plane array (FPA) that I first developed in 1994.
`
`
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`16
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`1071-022
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`38.
`
`
`
`The last astronomical work I was involved in at Rockwell led to both
`
`a 4096 x 4096 mosaic sensor and a
`
`supporting application specific integrated
`
`circuit (ASIC) that will be launched in the
`
`James Webb Space Telescope (JWST) in
`
`2018 to further improve on Hubble’s
`
`capability by about an order of magnitude.
`
`In launching this project and striving to
`
`maximize the probability of delivering the
`
`next-in-line of world’s largest infrared
`
`sensors, I convinced UMC, the 2nd largest
`
`CMOS foundry in the world, to support our
`
`sensor development by producing these
`
`extremely large devices using a specialized
`
`Figure 2: Cover of October
`2007 issue of Laser Focus
`World magazine with “my”
`4096 x 4096 IR imaging
`sensor for the James
`Webb Space Telescope
`
`photo-composition technique that UMC would develop at its own cost.5 At that
`
`time the JWST was called the Next Generation Space Telescope. Figure 2 shows
`
`this sensor highlighted on a magazine cover of a periodical reporting the
`
`
`
`5Business Wire, “Rockwell Scientific and UMC Develop Ultra Large
`
`Readout IC for Infrared Astronomy,” Aug. 22, 2002, attached here as Ex. 1016.
`
`
`
`17
`
`1071-023
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`
`
`significant advances in the imaging community.6 The cover picture shows the
`
`4096x4096 pixel FPA assembled in a large mosaic spanning over 3 inches per side
`
`with a picture one of the observatories located on Mauna Kea in the background.
`
`39.
`
` Many of my accomplishments were achieved as a member of the
`
`infrared community for numerous scientific and defense applications; some remain
`
`classified. The size of my teams ranged from several scientists to, at most, less than
`
`a dozen colleagues per project;
`
`occasionally