IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
`US008519973B1
`
`112' United States Patent
`XiaoPing
`
`110) Patent No. :
`145) Date of Patent:
`
`US 8,519,973 B1
`*Aug. 27, 2013
`
`154) APPARATUS AND METHODS FOR
`DETECTING A CONDUCTIVE OBJECT AT A
`LOCATION
`
`175)
`
`Inventor:
`
`Jiang XiaoPing, Shanghai 1CN)
`
`173) Assignee: Cypress Semiconductor Corporation,
`San Jose, CA 1US)
`
`* ) Notice:
`
`1
`
`the term of this
`Subject to any disclaimer,
`is extended or adjusted under 35
`patent
`U.S.C. 1541b) by 0 days.
`to a terminal
`is subject
`This patent
`claimer.
`
`dis-
`
`121) Appl. Noz 13/442, 716
`
`122) Filed:
`
`Apr. 9, 2012
`
`Related U.S.Application Data
`163) Continuation of application No. 13/204, 543, filed on
`Aug. 5, 2011, now Pat. No. 8, 174,507, which is a
`continuation of application No. 11/437, 517, filed on
`May 18, 2006, now Pat. No. 8,004,497.
`
`151)
`
`Int. Cl.
`G06F 3/041
`G06F 3/045
`G06F 3/033
`152) U.S. Cl.
`USPC ........ 345/173; 345/174; 345/179; 178/18.01;
`178/18.06
`
`12006.01)
`12006.01)
`12006.01)
`
`158) Field of ClassiTication Search
`345/173, 174
`USPC
`See application file for complete search history.
`
`156)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
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`OTHER PUBLICATIONS
`
`USPTO Non-Final Rejection for Application No. 11/437, 517 dated
`Aug. 5, 2009; 9 pages.
`
`1Continued)
`
`Primary Examiner
`Assistant Examiner
`
`Bipin Shalwala
`Benyam Ketema
`
`157)
`
`ABSTRACT
`
`A method and apparatus
`to determine capacitance variations
`of a first number of two or more sense elements of a touch
`screen device. A processing device is configured to detect a
`presence of a conductive object on any one of a second num-
`ber of three or more button areas of the touch screen device.
`The first number of sense elements
`is less than the second
`number of button areas. The processing
`device is further
`configured to recognize an activation of one of the three or
`capacitance varia-
`more button areas using the determined
`tions of the first number of two or more sense elements.
`
`20 Claims, 10 Drawing Sheets
`
`1"Per:ton
`
`2nrt Peluen
`
`6}3
`
`}
`
`606
`
`602
`
`Cepecnan e
`sensoi
`20}}0
`
`Capec}}ence
`Sensor
`20t(2}
`
`BLACKBERRY EX. 1001, pg. 1
`
`

`

`US 8,519,973 B1
`Page 2
`
`17g/18. 05
`
`... 345/173
`
`... 324/686
`
`(56)
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`
`l
`Bl
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`Bl
`B2
`Bl
`B2
`B2
`B2
`Bl
`Bl
`B2
`B2
`B2
`B2
`B2
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`Bl
`Bl
`Bl
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`B2
`Bl
`Bl
`B2
`Bl
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`B2*
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`Bl *
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`Bl
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`
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`5,323, 15g
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`5,518,07g
`5,541,580
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`5,801,340
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`5,942,733
`6,037,929
`6,060,957
`6, 145,850
`6, 184,871
`6, 1gg, 391
`6, 191,723
`6,297,811
`6,353,200
`6,366,099
`6,377, 129
`6,380,931
`6,448,911
`6,490,203
`6,535,200
`6,577, 140
`6,583,632
`6,700,392
`6,781,577
`6,806,693
`6,825,673
`6,83g, ggi
`6,859, 159
`6,879,930
`6,gg2, 33g
`6,ggg, 536
`6,891,531
`6,914,547
`6,933,873
`6,940,291
`6,946,853
`6,958,594
`6,970, 120
`6,970, 126
`7,006,07g
`7,031,gg6
`7,032,051
`7,046,230
`7,068,039
`7,075,316
`7,078,916
`7,098,675
`7, 129,935
`7, 148,704
`7, 158,125
`7,235,983
`7,253,643
`7,262,609
`7,2gg, 946
`7,301,350
`7,307,485
`7,323,gg6
`7,339,580
`7,359,816
`7,375,535
`7,381,031
`7,382, 139
`7,417,411
`7,417,441
`7,423,437
`
`7,449,895 B2
`7,450, 113 B2
`7,451,050 B2
`7,453,270 B2
`7,453,279 B2
`7,466,307 B2 *
`7,479,7gg B2
`7,495,659 B2
`7,499,040 B2
`7,521,941 B2
`7,548,073 B2
`7,59g, g22 B2
`7,683,641 B2
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`I-Tech Bluetooth/Serial Virtual Laser Key-
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`USPTO Advisory Action for Application No. 11/395,417 dated Jul. 6,
`2007; 3 pages.
`
`11/200g
`11/200g
`11/200g
`11/200g
`11/200g
`12/200 g
`I/2009
`2/2009
`3/2009
`4/2009
`6/2009
`10/2009
`3/2010
`g/2010
`10/2010
`11/2010
`10/2011
`11/2011
`5/2003
`9/2004
`11/2004
`12/2004
`2/2005
`3/2005
`7/2005
`g/2005
`I/2006
`2/2006
`5/2006
`6/2006
`9/2006
`10/2006
`10/2006
`11/2006
`4/2007
`10/2007
`11/2007
`11/2007
`11/2007
`11/2007
`11/2007
`12/2007
`12/2007
`12/2007
`I/200 g
`I/200 g
`2/200 g
`2/200 g
`2/200 g
`2/200 g
`2/200 g
`2/200 g
`2/200 g
`2/200 g
`3/200 g
`5/200 g
`5/200 g
`6/200 g
`7/200 g
`11/200g
`5/2009
`
`......
`
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`Gillespie et al.
`Hargreaves
`et al.
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`...........
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`Won .....................
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`Proctor
`................
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`
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`
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`
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`
`... 341/33
`
`... 324/662
`..... 341/33
`
`Semiconductor
`
`BLACKBERRY EX. 1001, pg. 2
`
`

`

`US 8,519,973 B1
`Page 3
`
`USPTO Advisory Action for Application No. 11/437, 517 dated Apr.
`7, 2010; 3 pages.
`USPTO Advisory Action for Application No. 11/477, 179 dated Jun.
`7, 2010; 3 pages.
`USPTO Advisory Action for Application No. 12/367, 279 dated Jun.
`25, 2010; 3 pages.
`USPTO Final Rejection for Application No. 11/230719 dated Sep. 7,
`2007; 9 pages.
`USPTO Final Rejection for Application No. 11/273, 70g dated Jul. 5,
`2007; g pages.
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`24, 2007; 9 pages.
`USPTO Final Rejection for Application No. 11/437, 517 dated Jan.
`26, 2010; 11 pages.
`USPTO Final Rejection for Application No. 11/477, 179 dated Apr. 1,
`2010; 10 pages.
`USPTO Final Rejection for Application No. 11/477, 179 dated Nov.
`24, 2010; 10 pages.
`USPTO Final Rejection for Application No. 11/484, 085 dated Mar.
`16, 2010; 7 pages.
`USPTO Final Rej ection for Application No. 11/502267 dated Feb. 3,
`2009; 10 pages.
`USPTO Final Rejection for Application No. 11/600, 896 dated Sep.
`30, 2010; 19 pages.
`USPTO Final Rejection for Application No. 12/367, 279 dated Apr. 1,
`2010; 6 pages.
`USPTO Non-Final Rejection for Application No. 11/230,719 dated
`Jan. 16, 2007; g pages.
`USPTO Non-Final Rejection for Application No. 11/230,719 dated
`May 11, 2006; 5 pages.
`Uspto Non-Final Rejection for Application No. 11/230, 719 dated
`May 25, 2007; 6 pages.
`USPTO Non-Final Rejection for Application No. 11/230,719 dated
`Aug. 2g, 2006; 7 pages.
`USPTO Non-Final Rejection for Application No. 11/273, 70g dated
`Mar. 19, 2007; 16 pages.
`USPTO Non-Final Rejection for Application No. 11/395,417 dated
`Apr. 25, 200g; 7 pages.
`USPTO Non-Final Rejection for Application No. 11/395,417 dated
`Oct. 26, 2006; 13 pages.
`USPTO Non-Final Rejection for Application No. 11/395,417 dated
`Nov. 1, 2007; g pages.
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`Aug. 3, 2010; 10 pages.
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`Feb. 25, 2011; 13 pages.
`
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`Jun. 9, 2009; 13 pages.
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`Jul. 20, 2010; 10 pages.
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`lg, 2009; 10 pages.
`Nov.
`USPTO Non-Final Rejection
`Sep. 17, 2009; g pages.
`USPTO Non-Final Rejection
`Jun. 16, 2010; g pages.
`USPTO Non-Final Rejection
`Nov. 9, 2010; 9 pages.
`USPTO Non-Final Rejection
`Aug. 11, 200g; 10 pages.
`USPTO Non-Final Rejection
`Mar. 29, 2010; 10 pages.
`USPTO Non-Final Rejection
`Jan 26, 2011; 12 pages.
`USPTO Non-Final Rejection
`May 14, 2010; 15 pages.
`USPTO Non-Final Rejection
`Dec. 16, 2009; 13 pages.
`USPTO Non-Final Rejection
`Mar. 26, 2010; 7 pages.
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`Oct. 29, 2009; g pages.
`USPTO Notice of Allowance
`Jan. 16, 200g; 4 pages.
`USPTO Notice of Allowance
`Aug. 9, 2007; 4 pages.
`USPTO Notice of Allowance
`Nov. 6, 200g; 7 pages.
`USPTO Notice of Allowance
`Feb. 3, 2011; 10 pages.
`USPTO Notice of Allowance
`May 19, 2011; 9 pages.
`USPTO Notice of Allowance
`Jun. 16, 2011; 9 pages.
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`Apr. 9, 2007; 7 pages.
`* cited by examiner
`
`for Application No. 11/477, 179 dated
`
`for Application No. 11/477, 179 dated
`
`for Application No. 11/477, 179 dated
`
`for Application No. 11/484, 085 dated
`
`for Application No. 11/493,350 dated
`
`for Application No. 11/493,350 dated
`
`for Application No. 11/502, 267 dated
`
`for Application No. 11/600, 255 dated
`
`for Application No. 11/600, 896 dated
`
`for Application No. 11/600, 896 dated
`
`for Application No. 11/600, 896 dated
`
`for Application No. 11/700,314 dated
`
`for Application No. 12/367, 279 dated
`
`for Application No. 11/230,719 dated
`
`for Application No. 11/273, 70g dated
`
`for Application No. 11/395,417 dated
`
`for Application No. 11/437, 517 dated
`
`for Application No. 11/437, 517 dated
`
`for Application No. 11/437, 517 dated
`
`for Application No. 11/484, 085 dated
`
`for Application No. 11/489, 944 dated
`
`BLACKBERRY EX. 1001, pg. 3
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 1 of 10
`
`US 8,519,973 B1
`
`C8P8CPi8ACe
`, .@eA'30f
`
`BLACKBERRY EX. 1001, pg. 4
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 2 of 10
`
`US 8,519,973 B1
`
`BLACKBERRY EX. 1001, pg. 5
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 3 of 10
`
`US 8,519,973 B1
`
`303
`
`BLACKBERRY EX. 1001, pg. 6
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
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`Aug. 27, 2013
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`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 6 of 10
`
`US 8,519,973 B1
`
`BLACKBERRY EX. 1001, pg. 9
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
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`

`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 8 of 10
`
`US 8,519,973 B1
`
`BLACKBERRY EX. 1001, pg. 11
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
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`BLACKBERRY EX. 1001, pg. 12
`
`

`

`U.S. Patent
`
`Aug. 27, 2013
`
`Sheet 10 of 10
`
`US 8,519,973 B1
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`BLACKBERRY EX. 1001, pg. 13
`
`

`

`US 8,519,973 B1
`
`1
`APPARATUS AND METHODS FOR
`DETECTING A CONDUCTIVE OBJECT AT A
`LOCATION
`
`RELATED APPLICATIONS
`
`This application is a continuation of U.S. patent applica-
`tion Ser. No. 13/204, 543, filed Aug. 5, 2011, now U.S. Pat.
`No. 8, 174,507, issued May 8, 2012, which is a continuation of
`U.S. patent application Ser. No. 11/437, 517, filed May 18,
`2006, now U.S. Pat. No. 8,004,497, issued Aug. 23, 2011.
`
`TECHNICAL FIELD
`
`This invention relates to the field of user interface devices
`devices.
`to touch-sensing
`in particular,
`and,
`
`BACKGROUND
`
`20
`
`Computing devices, such as notebook computers, personal
`(PDAs), and mobile handsets, have user inter-
`data assistants
`face devices, which are also known as human interface device
`is common is a touch-
`(HID). One user interface device that
`the func-
`sensor button. A basis touch-sensor button emulates
`tion of a mechanical
`buttons may be 26
`button. Touch-sensor
`types of operational panels of elec-
`embedded into different
`tronic devices. For example,
`buttons may be
`touch-sensor
`or control panels of household
`used on operational
`appli-
`electronics, mechanical
`devices, and the
`ances, consumer
`like. Touch-sensor buttons may also be used in conjunction
`with, or in place of, other user input devices,
`such as key-
`boards, mice, trackballs, or the like.
`FIG. 1A illustrates
`sensing device having
`a conventional
`sensing device 100
`three touch-sensor buttons. Conventional
`includes button 101, button 102, and button 103.These but-
`touch-sensor buttons. These three but-
`tons are conventional
`tons may be used for user input using a conductive object,
`such as a finger.
`FIG. 1B illustrates
`sensing device of three
`a conventional
`touch-sensor buttons 101-103coupled to a processing device
`110.Processing device 110 is used to detect whether a con-
`is present on either, or none, of the touch-
`ductive object
`sensor buttons 101-103.To detect the presence ofthe conduc-
`110 may
`device
`the
`include
`object,
`processing
`tive
`sensors 104-106, which are coupled to buttons
`capacitance
`101-103, respectively. The capacitance
`sensors of the pro-
`cessing device are coupled to the touch-sensor
`in a
`buttons
`one-to-one configuration. Accordingly,
`the processing device
`110scans the touch-sensor buttons 101-103using the capaci-
`tance sensors 104-106, and measures
`the capacitance on the
`touch-sensor buttons 101-103.
`buttons 101-103
`Each of the conventional
`touch-sensor
`may be made of a sensor element of conductive material,
`such
`as copper-clad. The conductive material may be form shaped
`in FIG. 1A), or even in a 66
`in a circular
`(illustrated
`shape
`shape (illustrated in FIG. 1B).The touch-sensor
`rectangular
`buttons may be capacitance
`sensor buttons, which may be
`used as non-contact
`switches. These switches, when pro-
`layer, offer resistance to severe envi-
`tected by an insulating
`ronments.
`configuration of
`It should be noted that
`the conventional
`FIG. 1Bincludes a one-to-one configuration of touch-sensor
`to capacitance sensors. There are other conventional
`buttons
`that may use less capacitance sensors to mea-
`configurations
`sure the capacitance on the three touch-sensor buttons. These
`still require a one-to-
`configurations,
`conventional
`however,
`one configuration of pins to touch-sensor
`buttons. Accord-
`
`3o
`
`36
`
`40
`
`46
`
`60
`
`60
`
`66
`
`the processing device needs to
`ingly, by adding more buttons,
`have more pins to correspond to the one-to-one configuration
`of pins to touch-sensor buttons. Similarly, by increasing the
`pin count, the scan time to scan the sensor elements
`increases.
`the memory of the processing device, which may
`In addition,
`temporary data (e.g., raw
`be used to store program data and/or
`data, differential counts, baseline measurement
`measurement
`data, and the like), increases by increasing the pin count.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`sensing device having
`
`invention is illustrated by way of example, and
`The present
`in the figures of the accompanying
`not by way of limitation,
`drawings.
`FIG. 1A illustrates
`a conventional
`three touch-sensor buttons.
`FIG. 1B illustrates
`sensing device of three
`a conventional
`touch-sensor buttons coupled to a processing device.
`FIG. 2 illustrates a block diagram of one embodiment of an
`electronic system having a processing device for detecting a
`presence of a conductive object.
`FIG. 3A illustrates
`a varying switch capacitance.
`FIG. 3B illustrates one embodiment of a relaxation oscil-
`lator.
`a block diagram of one embodiment of a
`FIG. 4 illustrates
`capacitance sensor including a relaxation oscillator and digi-
`tal counter.
`FIG. 5A illustrates a top-side view of one embodiment of a
`sensor array having a plurality of sensor elements
`for detect-
`ing a presence of a conductive object on the sensor array of a
`touch-sensor pad.
`FIG. 5B illustrates a top-side view of one embodiment of a
`sensor array having a plurality of sensor elements
`for detect-
`ing a presence of a conductive object on the sensor array of a
`touch-sensor
`slider
`FIG. 5C illustrates a top-side view of one embodiment of a
`touch-sensor pad.
`two-layer
`a side view of one embodiment of the
`FIG. 5D illustrates
`touch-sensor pad of FIG. 5C.
`two-layer
`one embodiment of a sensing device
`FIG. 6A illustrates
`having three touch-sensor buttons.
`FIG. 6B illustrates one embodiment of the sensing device
`of FIG. 6A coupled to a processing device.
`FIG. 6C illustrates another embodiment ofa sensing device
`having three touch-sensor buttons.
`FIG. 6D illustrates
`another
`embodiment
`device having three touch-sensor buttons.
`FIG. 7A illustrates
`another
`embodiment
`device having four touch-sensor buttons.
`FIG. 7B illustrates another embodiment ofa sensing device
`having five touch-sensor buttons.
`
`of a sensing
`
`of a sensing
`
`DETAILED DESCRIPTION
`
`and method for detecting
`Described herein is an apparatus
`a presence of a conductive object on a sensing device, and
`recognizing three or more button operations performed by the
`object using two sensing areas of the sensing
`conductive
`device. The following description
`spe-
`sets forth numerous
`such as examples of specific systems,
`cific details
`compo-
`to provide
`in order
`and so forth,
`a good
`nents, methods,
`of several embodiments of the present
`inven-
`understanding
`tion. It will be apparent
`to one skilled in the art, however,
`that
`of the present
`invention may be
`at least some embodiments
`practiced without
`these specific details.
`In other
`instances,
`or methods
`are not described in
`well-known
`components
`in simple block diagram format
`detail or are presented
`in
`
`BLACKBERRY EX. 1001, pg. 14
`
`

`

`US 8,519,973 B1
`
`order to avoid unnecessarily
`obscuring the present
`invention.
`set forth are merely exemplary.
`the specific details
`Thus,
`implementations may vary from these exemplary
`Particular
`details and still be contemplated
`to be within the spirit and
`scope of the present
`invention.
`Embodiments of a method and apparatus
`are described to
`recognize three or more button operations performed by the
`conductive object on three or more sensor elements
`that are
`coupled to two pins of a processing device. In one embodi-
`the apparatus may include a sensing device (e.g., touch-
`ment,
`that has first, second, and third sensor ele-
`sensor button)
`ments. The third sensor element has a first portion coupled to
`the first sensor element, and a second portion coupled to the
`second sensor element. These portions of the third sensor
`element are electrically isolated from one another.
`the expansion of
`describe herein permit
`The embodiments
`(e.g. , three or more total buttons)
`to the
`additional
`buttons
`sensing device, while using only two pins on the processing
`device. Conversely,
`since the conventional
`configuration has
`a one-to-one configuration of sensor elements
`implemented
`to pins of the processing device, each button added requires
`pin on the processing device. Using only two
`an additional
`the scan time does not
`increase by adding additional
`pins,
`three or more buttons on the sensing
`to implement
`buttons
`two pins for three or more buttons,
`device. By maintaining
`the
`is not increased. In other
`scan time to scan the sensor elements
`words, more buttons may be implemented without
`increasing
`scan time of the sensing device. Similarly,
`the total
`the
`memory of the processing device is not increased to accom-
`temporary data (e.g.,
`modate additional program data and/or
`counts, baseline measure-
`data, differential
`raw measurement
`ment data, and the like) for the additional buttons.
`The sensing device may use two capacitive switch relax-
`(CSR) pins of a processing device to realize
`ation oscillator
`more than two buttons on the sensing device. For example,
`the
`three or more buttons may be realized by using two sensing
`a bar of conductive
`areas. Each sensing area may include
`sub-bars. The sub-bars of
`interconnected
`material and several
`and are electrically
`the two sensing areas are interleaved
`In other words, one set of interconnected
`isolated.
`sub-bars
`are connected to one pin, while the other set is coupled to the
`other pin. The two sensing areas make up three or more sensor
`that are used to form the touch-sensor buttons. The
`elements
`different buttons contain different percentages of surface area
`of the sensing areas. Alternatively,
`each sensing area may
`two or more bars of conductive material with or
`include
`sub-bars.
`interconnected
`without
`several
`For example,
`a three-button
`scheme
`two pins
`using
`that has 100%ofthe first sensing
`includes one sensor element
`area, the second sensor element has 50% of the first sensing
`area and 50% of the second sensing area, and the third sensor
`element has 100% of the second sensing area. Accordingly,
`by scanning and measuring the capacitance (e.g. , capacitance
`variation of the capacitance minus the baseline, as described
`below) on the two pins to detect the presence of the conduc-
`tive object, the proces sing device can distinguish between the
`presence of the conductive object on the first, second, and
`if the capacitance varia-
`third sensor elements. For example,
`tion 6„measured on the first pin, is greater than zero, and the
`capacitance variation 62, measured on the second pin is equal
`zero, then the first button has been pressed.
`to approximately
`if the capacitance variation 6„measured on the
`Similarly,
`first pin, is equal to the capacitance variation 62, measured on
`the second pin, then the second button has been pressed. Ifthe
`capacitance variation 6„measured on the first pin, is equal to
`
`6
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`10
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`16
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`20
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`30
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`40
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`60
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`66
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`zero, and the capacitance variation 62, mea-
`approximately
`sured on the second pin is greater
`then the third
`than zero,
`button has been pressed.
`The embodiments
`herein may be beneficial
`to help reduce
`the pin count of the processing device. This may decrease the
`complexity of the processing device, or allow the processing
`such as cursor
`device to support
`additional
`functionality,
`keyboard functional-
`positioning and selecting functionality,
`or the like. Furthermore,
`the embodi-
`ity, slider functionality,
`to help reduce the scan time of the
`ments may be beneficial
`sensing device. Using two pins of the processing device to
`measure the capacitance on two sensing areas to realize three
`or more buttons
`the capacitance on
`is faster than measuring
`three or more touch-sensor buttons of the conventional
`con-
`figuration (e.g., one-to-one configuration).
`In addition, using
`two pins reduces the RAM/FLASH space needed in the sens-
`ing device, as compared to the conventional
`configuration.
`described herein may be used in differ-
`The embodiments
`types of operational
`panels of electronic devices. For
`ent
`touch-sensor buttons may be used on operational or
`example,
`control panels of household appliances,
`consumer electron-
`ics, mechanical devices, and the like. Touch-sensor buttons
`may also be used in conjunction with, or in place of, other user
`input devices, such as keyboards, mice, trackballs, or the like.
`FIG. 2 illustrates a block diagram of one embodiment of an
`electronic system having a processing device for detecting a
`presence of a conductive
`system 200
`object. Electronic
`includes processing device 210, touch-sensor pad 220, touch-
`sensor slider 230, touch-sensor
`buttons 240, host processor
`250, embedded controller 260, and non-capacitance
`sensor
`elements 270. The processing device 210 may include analog
`("GPIO") ports
`and/or digital general purpose
`input/output
`207. GPIO ports 207 may be programmable. GPIO ports 207
`may be coupled to a Programmable
`and Logic
`Interconnect
`("PIL"), which acts as an interconnect between GPIO ports
`207 and a digital block array ofthe proces sing device 210 (not
`illustrated). The digital block array may be configured
`to
`a variety of digital
`logic circuits (e.g., DAC, digi-
`implement
`tal filters, digital control systems, etc.) using,
`in one embodi-
`("UMs"). The digital block
`ment, configurable user modules
`array may be coupled to a system bus. Processing device 210
`such as random access memory
`may also include memory,
`(RAM) 205 and program flash 204. RAM 205 may be static
`RAM (SRAM), and program flash 204 may be a non-volatile
`(e.g., control
`storage, which may be used to store firmware
`executable by processing core 202 to implement
`algorithms
`operations described herein). Processing device 210 may also
`(MCU) 203 coupled to
`controller unit
`a memory
`include
`memory and the processing core 202.
`device 210 may also include
`The processing
`an analog
`block array (not illustrated). The analog block array is also
`coupled to the system bus. Analog block array also may be
`a variety of analog circuits
`(e.g. ,
`configured to implement
`ADC, analog filters, etc.) using,
`in one embodiment,
`config-
`urable UMs. The analog block array may also be coupled to
`the GPIO 207.
`sensor 201 may be integrated
`capacitance
`As illustrated,
`device 210. Capacitance
`sensor 201 may
`into processing
`include analog I/O for coupling to an external component,
`slider 230, touch-
`such as touch-sensor pad 220, touch-sensor
`sensor buttons 240, and/or other devices. Capacitance sensor
`201 and processing device 202 are described in more detail
`below.
`It should be noted that
`described herein
`the embodiments
`are not limited to touch-sensor pads for notebook implemen-
`tations, but can be used in other capacitive sensing implemen-
`the sensing device may be a touch-
`for example,
`tations,
`
`BLACKBERRY EX. 1001, pg. 15
`
`

`

`US 8,519,973 B1
`
`slider 230, or a touch-sensor
`240 (e.g. ,
`sensor
`button
`capacitance
`operations
`the
`button).
`sensing
`Similarly,
`limited to notebook cursor opera-
`described herein are not
`such as lighting con-
`tions, but can include other operations,
`control, graphic
`control,
`trol
`equalizer
`volume
`(dimmer),
`speed control, or other control operations
`requiring
`gradual
`It should also be noted that these embodiments
`adjustments.
`of capacitive sensing implementations may be used in con-
`junction with non-capacitive
`sensing elements,
`including but
`sliders (ex. display brightness
`not limited to pick buttons,
`and
`(ex. volume,
`scroll-wheels, multi-media
`control
`contrast),
`track advance, etc) handwriting
`recognition and numeric key-
`pad operation.
`the electronic system 200 includes a
`In one embodiment,
`touch-sensor pad 220 coupled to the processing device 210
`via bus 221. Touch-sensor
`pad 220 may include
`a multi-
`sensor array. The multi-dimension
`sensor array
`dimension
`comprises a plurality of sensor elements, organized as rows
`the electronic system
`and columns.
`In another embodiment,
`200 includes
`slider 230 coupled to the pro-
`a touch-sensor
`cessing device 210 via bus 231.Touch-sensor
`slider 230 may
`sensor array. The single-dimen-
`include a single-dimension
`a plurality of sensor elements,
`sion sensor array comprises
`organized as rows, or alternatively,
`In another
`as columns.
`system 200 includes
`a touch-
`the electronic
`embodiment,
`sensor button 240 coupled to the processing device 210 via
`bus 241. Touch-sensor button 240 may include a single-di-
`mension or multi-dimension
`sensor array. The single- or
`sensor array comprises a plurality of sensor
`multi-dimension
`the plurality of sensor
`elements. For a touch-sensor
`button,
`to detect a presence of a
`elements may be coupled together
`surface of the sensing
`object over
`conductive
`the entire
`the touch-sensor button 240 has a single
`device. Alternatively,
`the presence of the conductive
`to detect
`sensor
`element
`the touch-sensor button 240 may
`object. In one embodiment,
`sensor ele-
`be a capacitance
`sensor element. Capacitance
`ments may be used as non-contact
`switches. These switches,
`layer, offer resistance
`to
`when protected by an insulating
`severe environments.
`The electronic system 200 may include any combination of
`one or more of the touch-sensor pad 220, touch-sensor
`slider
`touch-sensor button 240. In another embodiment,
`230, and/or
`the electronic system 200 may also include non-capacitance
`sensor elements 270 coupled to the processing device 210 via
`bus 271. The non-capacitance
`270 may
`sensor
`elements
`light emitting diodes (LEDs), and other user
`include buttons,
`or other
`interface devices,
`a keyboard,
`such as a mouse,
`In
`keys that do not require capacitance
`functional
`sensing.
`buses 271, 241, 231, and 221 may be a
`one embodiment,
`these buses may be configured into
`single bus. Alternatively,
`any combination of one or more separate buses.
`The processing device may also provide value-added func-
`integration, LEDs, battery
`tionality such as keyboard control
`I/O, as illustrated as non-capaci-
`charger and general purpose
`tance sensor elements 270. Non-capacitance
`sensor elements
`270 are coupled to the GPIO 207.
`device 210 may include
`Processing
`oscillator/
`internal
`block 20S. The oscillator/
`clocks 206 and communication
`clocks block 206 provides clock signals to one or more ofthe
`components ofprocessing device 210.Communication
`block
`20S may be used to communicate with an external compo-
`nent, such as a host processor 250, via host interface (I/F) line
`251.Alternatively,
`processing block 210 may also be coupled
`to embedded controller 260 to communicate with the external
`such as host 250. Interfacing to the host 250 can
`components,
`be through various methods.
`In one exemplary embodiment,
`interfacing with the host 250 may be done using a standard
`
`6
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`10
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`16
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`20
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`66
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`controller 260,
`PS/2 interface to connect
`to an embedded
`which in turn sends data to the host 250 via low pin count
`it may be beneficial
`for
`In some instances,
`(LPC) interface.
`the processing device 210 to do both touch-sensor pad and
`thereby freeing up the embed-
`keyboard control operations,
`260 for other housekeeping
`ded controller
`functions.
`In
`interfacing may be done
`another
`embodiment,
`exemplary
`serial bus (USB) interface directly coupled
`using a universal
`to the host 250 via host interface line 251.Alternatively,
`the
`processing device 210 may communicate
`to external compo-
`nents, such as the host 250 using industry standard interfaces,
`such as USB, PS/2,
`circuit