•
`
`EXHIBIT 1018
`IPR Petition for U.S. Patent No. 6,012,103
`
`

`

`July, 1993
`
`PCMCIA © 1992, 1993
`
`PCMCIA © 1992, 1993
`
`July, 1993
`
`ii
`
`3.4.1.9 Shock .................................................................................................................................................. 3·7
`3.4. 1.8 Vibration and High Frequency ............................................................................................................ 3·7
`3.4.1.7 Single Socket Holding Force .............................................................................................................. 3·7
`3.4. 1.6 Single Pin Holding Force .................................................................................................................... 3·6
`3.4.1.5 Single Pin Pulling Force ..................................................................................................................... 3·6
`3.4.1 .4 Total Pulling Force .............................................................................................................................. 3·6
`3.4.1.3 Total insertion Force ........................................................................................................................... 3-6
`3.4.1.2 Harsh Environment ............................................................................................................................. 3-6
`3.4.1.1 Office Environment ............................................................................................................................. 3-6
`3.4.1 Mechanical Performance ............................................................................................................................... 3-6
`3.4 Connector Reliability ......................•..•...•••••••••••...••••......•.....••.•...•.....••••••••••••••••••.••.......••..........••...•••. 3-5
`
`3.3 PC Card Guldance .•...•••••••••••.....•..................•••••.•••••••••.•...........................••.......•.•••••.•••••••••••••••••••••.••• 3·5
`
`3.2.2 Host Connector .............................................................................................................................................. 3-4
`3.2.1 Card Connector ............................................................................................................................................. 3·4
`3.2 Connector ........................................................................................................................................... 3-4
`
`3.1 .3 Label .............................................................................................................................................................. 3·4
`3.1.2 Battery location ............................................................................................................................................. 3-3
`3.1. 1 Write Protect Switch (WPS) ........................................................................................................................... 3·3
`3.1 Card Dimenslons ••••••••••...•••..................•.....•••••..••••••••••••.............•.•..••••...••••••••••••.•••••....•....•••....••...••••. 3-3
`
`3. CARD PHYSICAL
`
`2.4 Card Software ..................................................................................................................................... 2·3
`
`2.3 Card Interface ••••...•••......•.....•.....•••••.•••••••••••..•.......••••......••.••.••.••••••••.........••..•.....•.............••................ 2·3
`
`2.2 Card Physical •••••.••••...•••.....•.........................•..•••••••••....•.......•••••.••......•••••.•••••.•.•••.................••••••..••••.. 2·3
`
`2.1 Elements of the Standard: Physical, Interface, Software .•••.................•••••••••••••..•.••...............•....•.• 2·3
`
`2. SCOPE
`
`1.5 Differences Between Release 1.0 and 2.0 ........................................................................................ 1-4
`
`1.4 Standardization Goals ...........•.....••....•••..••••••.••••........•••...••••••••••••••••••.............••••..••••••••••.•••...•.•••••••••• 1·3
`
`1.3 History ................................................................................................................................................. 1-3
`
`1.2 Relationship to Other Standard-Setting Bodles ••.•.........•..••••••••••••..••••....•....•...•••••.•••••••••••••••••.••••..• 1·3
`
`1.1 Introduction ........................................................................................................................................ 1·3
`
`•
`
`•
`
`JUL 28 1994.. ........................ ix
`
`SitlJ~
`...........................................................................................
`
`1. GENERAL
`
`List o !Tables ....••••.•••••••••••••••
`
`SCIENCE & TECHNOLOGY DEPT,
`
`C 0 n t e n t s CLEVELAND PUBLIC LIBRARY
`
`LIST OF TABLES
`
`'S"
`'f
`•. < .•.
`
`Release 2.1
`PCMCIA PC CARD STANDARD
`
`II
`~ ':
`
`\I d
`
`,'J,'\ \' f: ';
`
`~ I
`
`Release 2.1
`PCMCIA PC CARD STANDARD
`
`

`

`iii
`
`July, 1993
`
`PCMCIA © 1992, 1993
`
`PCMCIA © 1992, 1993
`
`July, 1993
`
`ii
`
`4.9 Timing Functions ····························----·-····································-·-------·--·-------··-································4-19
`
`4.8.9 Write Protect Function ................................................................................................................................. 4-18
`4.8.8 Attribute Memory Write Function for Dual Supply OTPROM, EPROM and Flash Cards ............................ 4-17
`4.8.7 Attribute Memory Write Function for SRAM, EEPROM and Single-Supply Flash Cards ............................ 4-17
`4.8.6 Attribute Memory Read Function ................................................................................................................. 4-17
`4.8.5 Attribute Memory Function ........................................................................................................................... 4-16
`4.8.4 Common Memory Write Function for OTPROM, EPROM and Flash-Memory ............................................ 4-16
`4.8.3 Common Memory Write Function for SRAM, EEPROM and Single-Supply Flash Cards ........................... 4-16
`4.8.2 Common Memory Read Function ................................................................................................................ 4-15
`4.8.1 Common Memory Function ......................................................................................................................... 4-15
`4.8 Memory Function ............................................................................................................................. 4-15
`
`4.7.1 Default Conditions and Card Identification .................................................................................................. 4-15
`4.7 Operating Condltlons ....................................................................................................................... 4-15
`
`4.6.4 Status Changed (-STSCHG) [replaces BVD1] ............................................................................................ 4-14
`4.6.3 Audio Digital Waveform (-SPKR) [replaces BVD2] ...................................................................................... 4-14
`4.6.2.51nterrupts and +RDY/-BSY ............................................................................................................... 4-14
`4.6.2.4 Level-Mode Interrupt Signal .......................................... : .................................................................. 4-14
`4.6.2.3 Pulsed-Mode Interrupt Signal ........................................................................................................... 4-14
`4.6.2.2 Pulsed-and Level-Mode Interrupt Support ....................................................................................... 4-13
`4.6.2.11nterrupt Request Routing ................................................................................................................ 4~13
`4.6.2 Interrupt Request (-IREQ) [replaces +RDY/-BSY) ....................................................................................... 4-13
`4.6.1 1/0 IS 16 Bit Port (-IOIS16) [replaces WP] ................................................................................................... 4-13
`4.61/0 Interface Signals Replacing Memory Interface Slgnals .......................................................... 4-13
`
`4.5.31nput Acknowledge (-INPACK) [1/0 Operation] ............................................................................................ 4-12
`4.5.21/0 Write (-IOWR) ........................................................................................................................................ 4-12
`4.5.1 1/0 Read (-lORD) ......................................................................................................................................... 4-12
`4.5 l/0 Interface Signals Replacing RFU Pins ...................................................................................... 4-12
`
`4.4.2 Extend Bus Cycle (-WAIT) ........................................................................................................................... 4-12
`4.4.1 Card Reset (RESET) ................................................................................................................................... 4-11
`4.4 Release 2 Signals Affecting Both Memory Only and 1/0 Interfaces ............................................ 4-11
`
`4.3.14 Reserved Pins (RFU) ................................................................................................................................. 4-11
`4.3.13 Refresh (RFSH) ......................................................................................................................................... 4-11
`4.3.12 Card Voltage and Ground (Vee & GND) .................................................................................................... 4-11
`4.3.11 Program and Peripheral Voltages (Vpp1 & Vpp2) ..................................................................................... 4-11
`4.3.10 Battery Voltage Detect (BVD1 & BVD2) .................................................................................................... 4-10
`4.3.9 Attribute Memory Select (-REG) .................................................................................................................. 4-10
`4.3.8 Write Protect ( +WP) ..................................................................................................................................... 4-10
`4.3.7 Card Detect (-CD1 & -CD2) ......................................................................................................................... 4-10
`4.3.6 Ready/Busy (+RDY/-BSY) ............................................................................................................................. 4-8
`4.3.5 Write Enable/Program (-WE/-PGM) ............................................................................................................... 4-8
`4.3.4 Output Enable (-OE) ...................................................................................................................................... 4-8
`4.3.3 Card Enable (-CE1 & -CE2) ........................................................................................................................... 4-8
`4.3.2 Data BUS (DO-D15) ....................................................................................................................................... 4-8
`4.3.1 Address BUS (AO-A25) .................................................................................................................................. 4-7
`4.3 Signal Descrlptlon .............................................................................................................................. 4-7
`
`4.2.8 Compatibility Between Revision Levels of this Standard ............................................................................... 4-6
`4.2.7 Configurable Cards ........................................................................................................................................ 4-6
`4.2.6 Custom Interfaces .......................................................................................................................................... 4-6
`
`Release 2.1
`PCMCIA PC CARD STANDARD
`
`,~t ('i lTLi: 17
`~,:/,TE::r •.t r}tY B~
`
`•
`
`,.
`
`••••
`
`'\'<
`i'[
`
`••
`
`4.2.51/0 Interface .................................................................................................................................................. 4-5
`4.2.4 1/0 Address Space ......................................................................................................................................... 4-5
`4.2.3 Memory Only Interface .................................................................................................................................. 4-5
`4.2.2 Memory Address Space ................................................................................................................................ 4-4
`4.2.1 Memory Types and Speed Version ............................................................................................................... 4-4
`4.2 Memory Card Features ............................................................................ ·---· ................... -----· ............ 4-4
`4.1 Pin Assignments ··········--·---------············---···---····-·-···--·---·--·---·-------·----··--··············· ... -···---··-··········-··---·4-2
`
`4. CARD INTERFACE
`
`3.6.2.18 SRAM Data Retention .................................................................................................................... 3-14
`3.6.2.17 PC Card Warpage .......................................................................................................................... 3-13
`3.6.2.16 Torque Test .................................................................................................................................... 3-13
`3.6.2.15 Drop Test ........................................................................................................................................ 3-13
`3.6.2.14 Bend Test ....................................................................................................................................... 3-13
`3.6.2.13 Shock .............................................................................................................................................. 3-13
`3.6.2.12 Vibration and High Frequency ........................................................................................................ 3-13
`3.6.2.11 Card Inverse Insertion .................................................................................................................... 3-12
`3.6.2.10 Electromagnetic Field Interference ................................................................................................. 3-12
`3.6.2.9 Ultraviolet Ught Exposure ................................................................................................................. 3-12
`3.6.2.8 X-ray Exposure ................................................................................................................................. 3-12
`3.6.2.7 Electrostatic Discharge ..................................................................................................................... 3-12
`3.6.2.6 Moisture Resistance ......................................................................................................................... 3-12
`3.6.2.5 Thermal Shock .................................................................................................................................. 3-11
`3.6.2.4 Low Operating Temperature ............................................................................................................. 3-11
`3.6.2.3 High Operating Temperature ............................................................................................................ 3-11
`3.6.2.2 Low Storage Temperature ................................................................................................................ 3-11
`3.6.2.1 High Storage Temperature ............................................................................................................... 3-11
`3.6.2 Environmental Resistance ........................................................................................................................... 3-11
`3.6.1.2 Storage Environment ........................................................................................................................ 3-10
`3.6.1.1 Operating Environment .................................................................................................................... 3-10
`3.6.1 Environmental Performance ........................................................................................................................ 3-10
`3.6 PC Card Environmental ................................................................................................................... 3-10
`
`3.5.2 Harsh Environment ...................................................................................................................................... 3-1 0
`3.5.1 Office Environment ........................................................................................................................................ 3-9
`3.5 Connector Durability ····---··---·························-·----------··-···························-·······················-·------······----·3-9
`
`3.4.4.7 Salt Water Spray ................................................................................................................................. 3-9
`3.4.4.6 Hydrogen Sulfide ............................................................................................................................... 3-9
`3.4.4.5 Humidity (Normal Condition) ............................................................................................................... 3-9
`3.4.4.4 Cold Resistance ................................................................................................................................. 3-9
`3.4.4.3 Durability (High Temperature) ............................................................................................................ 3-8
`3.4.4.2 Thermal Shock .................................................................................................................................... 3-8
`3.4.4.1 Moisture Resistance ........................................................................................................................... 3-8
`3.4.4 Environmental Resistance ............................................................................................................................. 3-8
`3.4.3.2 Storage Environment .......................................................................................................................... 3~8
`3.4.3.1 Operating Environment ....................................................................................................................... 3~8
`3.4.3 Environmental Performance .......................................................................................................................... 3~8
`3.4.2.5 Insulation Material .............................................................................................................................. 3~8
`3.4.2.4 Current Capacity ................................................................................................................................. 3-8
`3.4.2.3 Insulation Resistance ......................................................................................................................... 3-8
`3.4.2.2 Withstandable Voltage ........................................................................................................................ 3-7
`3.4.2.1 Contact Resistance (low level) ........................................................................................................... 3-7
`3.4.2 Electrical Performance ................................................................................................................................... 3-7
`
`Release 2.1
`PCMCIA PC CARD STANDARD
`
`

`

`5.3 Data Recording Formats (Layer 2) .................................................................................................. 5·36
`
`5.2.9 Use of Additional Tuples .............................................................................................................................. 5-36
`5.2.8.6 Additional I/O Feature Definitions within Entry ................................................................................. 5·36
`5.2.8.5 STCE_PD: Physical Device Name Subtuple .................................................................................... 5-36
`5.2.8.4 STCE_EV: Environment Descriptor Subtuple .................................................................................. 5-35
`5.2.8.3.10 TPCE_MI: Miscellaneous Features Field .............................................................................................. 5-34
`5.2.8.3.9 TPCE_MS: Memory Space Description Structure .................................................................................. 5-33
`5.2.8.3.8 TPCE_IR: Interrupt Request Description Structure ................................................................................ 5-32
`5.2.8.3.7 TPCE_IO: 1/0 Space Addresses Required For This Configuration ....................................................... 5-30
`5.2.8.3.6 TPCE_ TO: Configuration Timing lnformation ....................................................................................... 5-29
`5.2.8.3.5 TPCE_PD: Power Description Structure ................................................................................................. S-27
`5.2.8.3.4 TPCE_FS: Feature Selection Byte .......................................................................................................... 5-25
`5.2.8.3.3 TPCE_INFO: Configuration Table Entry lnformation ........................................................................... 5-25
`5.2.8.3.2 TPCE_IF: Table Entry Interface Description Ficld ................................................................................ 5-25
`5.2.8.3.1 TPCE_INDX: The Configuration Table Index Byte ............................................................................... 5-24
`5.2.8.3 CISTPL_CFTABLE_ENTRY: Card Configuration Table Entry Tuple ............................................... 5-23
`5.2.8.2 Card Configuration Table ................................................................................................................. 5-23
`5.2.8.1.6 CCST _ CIF: Custom Interface Subluples ................................................................................................. 5-22
`5.2.8.1.5 TPCC_SBTPL: Additional Information Stored in Tuple Format.. .......................................................... 5-22
`5.2.8.1.4 TPCC_RMSK: Configuration Register Presence Mask Field for Interface Tuple .................................. 5-22
`5.2.8.1.3 TPCC_RADR: Configuration Registers Base Address in REG Space ................................................... 5-21
`5.2.8.1.2 TPCC_LAST: Card Configuration Table Last Entry Index ............................ : ....................................... 5-21
`5.2.8.1.1 TPCC_SZ: Size of Fields Byte ............................................................................................................... 5-21
`5.2.8.1 CISTPL_CONFIG: Configuration Tuple ......................................................................................... 5-19.s
`5.2.8 Configuration Tuples ................................................................................................................................. 5-19.s
`5.2.7.8.1 Device Geometry Info Field ........................................................................................................ 5-19.q
`5.2. 7.8 Device Geometry Tuple ................................................................................................................. 5-19.p
`5.2.7.7.2 Disk Device Function Extension Tuples ..................................................................................... 5-19.p
`5.2.7. 7.1.5 Voice Function Extension ........................................................................................................ 5-19.n
`5.2.7.7.1.4 Document Facsimile Function Extension .......................................................................................... 5-19.k
`5.2.7.7.1.3 Data Modem Function Extension ...................................................................................................... 5-19.g
`5.2.7.7.1.2 Modem Interface Function Extension ................................................................................................ 5-19.e
`5.2.7. 7.1.1 Serial Port Interface Function Extension .......................................................................................... 5-19.d
`5.2.7.7.1 Modem Function Extension Tuples ............................................................................................ 5-19.c
`5.2.7.7 Function Extension Tuple .............................................................................................................. 5-19.b
`5.2.7.6 Function Identification Tuple .......................................................................................................... 5-19.a
`5.2.7.5 Manufacturer Identification Tuple ..................................................................................................... 5-19
`5.2.7.4 CISTPL_DEVICE_OC, CISTPL_DEVICE_OA: The Other Conditions Device Information Tuples .. 5-18
`5.2.7.3 CISTPL_JEDEC_C, CISTPL_JEDEC_A: The JEDEC Identifier Tuples .......................................... 5-16
`5.2.7.2 CISTPL_VERS_1: The Level1 Version/ Product Information Tuple ................................................ 5-16
`5.2.7.1.5 The Device Size Byte ............................................................................................................................... 5-16
`5.2.7.1.4 Device Type Field .................................................................................................................................... 5-15
`5.2.7.1.3 Device Speed Field .................................................................................................................................. 5-14
`5.2.7.1.2 Device ID ................................................................................................................................................. 5-14
`5.2.7.1.1 The Device Info Field .............................................................................................................................. 5-13
`5.2.7.1 CISTPL_DEVICE, CISTPL_DEVICE_A: The Device Information Tuples ........................................ 5-13
`5.2.7 Basic Compatibility Tuples ........................................................................................................................... 5-13
`5.2.6 Tuple Processing Recommendations .......................................................................................................... 5-12
`5.2.5.7 CISTPL_ALTSTR: The Alternate-Language String Tuple ................................................................ 5-12
`5.2.5.6 CISTPL_CHECKSUM: The Checksum Control Tuple ...................................................................... 5-11
`5.2.5.5 CISTPL_END: The End-Of-Ust Tuple ............................................... : .............................................. 5-10
`5.2.5.4 CISTPL_NO_LINK: The No-Unk Control Tuple ............................................................................... 5-10
`5.2.5.3 CISTPL_LINKTARGET: The Unk-Target Control Tuple .................................................................. 5-10
`5.2.5.2 CISTPL_LONGLINK_A, CISTPL_LONGLINK_C: The Long-Link Control Tuples .............................. 5-9
`5.2.5.1 CISTPL_NULL: The Null Control Tuple .............................................................................................. 5-9
`5.2.5 Control Tuples ............................................................................................................................................... 5-9
`5.2.4 Use of Common Memory Space for Attribute Memory Storage .................................................................... 5·8
`
`Release 2.1
`PCMCIA PC CARD STANDARD
`
`)
`
`... ,, Dt t"KUTECTED BY
`
`·-
`
`COPYRIGHT u~·:·, (TiTLE 17 U.S. CODE)
`
`v
`
`July, 1993
`
`PCMCIA © 1992, 1993
`
`PCMCIA © 1992, 1993
`
`July, 1993
`
`iv
`
`5.2.3 Tuple Format in Attribute Memory Space ...................................................................................................... 5-8
`5.2.2 Byte Order on Wide Cards ............................................................................................................................. 5-8
`
`5.2.1 Byte Order Within Tuples ............................................................................................................................... 5·8
`
`5.2 Basic Compatibility (Layer 1) ............................................................... , ............................................ 5-5
`
`5-3
`5.1 The Metaformat ................................................................................................................................... 5·3
`
`5.1.4 System Rejection of Unsupported Cards ....................................................................................................... 5-5
`5.1.3 Vendor-Specific Information .......................................................................................................................... 5·5
`5.1.2 Overview ........................................................................................................................................................ 5-3
`5.1.1 Goals of This Standard
`
`4.16.4 1/0 Functionality ......................................................................................................................................... 4-37
`4.16.3 Wide Operating Voltage ............................................................................................................................. 4-37
`
`5. CARD METAFORMAT
`
`4-37
`4-37
`4.16 Future Tasks And Remarks ........................................................................................................... 4·37
`
`4.16.2 Standardization of EPROM and EEPROM Programming
`4.16.1 Insertion/Removal with Power Active
`
`·'
`
`'
`
`4.15.4 Socket and Copy Register ......................................................................................................................... 4-36
`
`4.15.3 Pin Replacement Register Organization .................................................................................................... 4-36
`4.15.2 Card Configuration and Status Register .................................................................................................... 4-35
`4.15.1 Configuration Option Register
`
`4.15 Card Conflguratlon ......................................................................................................................... 4--34
`
`4.14.5 1/0 Write (Output) Timing Specification ..................................................................................................... 4-33
`4.14.4 1/0 Read (Input) Timing Specification ........................................................................................................ 4-32
`4.14.3 1/0 Output Function for 1/0 Cards .............................................................................................................. 4-31
`4.14.2 1/0 Input Function for 1/0 Cards ......... : ....................................................................................................... 4-31
`4.14.1 1/0 Transfer Function ................................................................................................................................. 4-30
`4.14 1/0 Function .................................................................................................................................... 4·30
`
`4.13.3 Supplement. ............................................................................................................................................... 4-30
`4.13.2 Data Retention ........................................................................................................................................... 4-30
`4.13.1 Power-up/Power-down Timin