`
`
`
`
`
`
`
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`__________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`___________________
`
`INTELLECTUAL VENTURES MANAGEMENT, LLC
`Petitioner
`
`v.
`
`Patent of XILINX, INC.
`Patent Owner
`___________________
`
`Case IPR2012-00018
`Patent 7,566,960
`Title: INTERPOSING STRUCTURE
`_____________________
`
`Proposed Claim Amendments
`
`
`
`In accordance with 37 C.F.R. 42.121(b), the following claim listing shows
`
`the proposed changes, with markings indicating changes in each proposed
`
`substitute claim relative to its corresponding original claim. Congruent with the
`
`Patent Trial and Appeal Board’s guidance, the amendments are presented
`
`following the example format provided in the Official Trial Practice Guide,
`
`Section II.G.
`
`
`
`
`
`–1–
`
`XLNX-2009
`
`
`
`Claim Listing
`
`Claims 1-13 (replaced by proposed substitutes).
`
`14.
`
`(Proposed substitute for original claim 1) An assembly, comprising:
`
`an integrated circuit die having an array of micro-bumps disposed on a
`
`surface of the integrated circuit die in a first pattern;
`
`an integrated circuit package having an array of landing pads disposed on an
`
`inside surface of the integrated circuit package in a second pattern and an array of
`
`solder balls disposed on an outside surface of the integrated circuit package,
`
`wherein the first pattern and the second pattern are substantially identical
`
`patterns; and
`
`[[an]] a plurality of tiled interposing structure structures disposed inside the
`
`integrated circuit package between the integrated circuit die and the inside surface
`
`of the integrated circuit package, at least one of the interposer interposing
`
`structures electrically coupling a respective first micro-bump in a first position in
`
`the array of micro-bumps to a respective first landing pad located opposite to the
`
`first position and to a second landing pad in the array of landing pads.
`
`Claim 15 (Proposed substitute for original claim 2): The assembly of claim [[1]]
`
`14, wherein the interposing structures are held together using an elastomer a line
`
`extending through the first micro-bump in a direction orthogonal to the surface of
`
`
`
`
`
`–2–
`
`XLNX-2009
`
`
`
`the integrated circuit does not extend through the second landing pad of the
`
`integrated circuit package.
`
`Claim 16 (Proposed substitute for original claim 3): The assembly of claim [[2]]
`
`14, wherein the surface of the integrated circuit die is a major surface of the
`
`integrated circuit die, and wherein the interposing structure has structures have a
`
`collective major surface, and wherein the major surface of the integrated circuit die
`
`and the collective major surface of the interposing structure structures have
`
`roughly identical surface areas.
`
`Claim 17 (Proposed substitute for original claim 4): The assembly of claim [[3]]
`
`14, wherein at least one of the interposing structure structures includes comprises a
`
`first conductive layer corresponding to a first capacitor for a first power supply and
`
`a second conductive layer corresponding to a second capacitor for a second power
`
`supply different from the first power supply no transistor and no PN junction.
`
`Claim 18 (Proposed substitute for original claim 5): The assembly of claim [[4]]
`
`14, wherein at least one of the interposing structure includes structures comprises a
`
`first conductive layer for a first ground and a second conductive layer for a second
`
`ground different from the first ground an array of micro-bumps, wherein the array
`
`of micro-bumps of the interposing structure has a pattern that is substantially
`
`
`
`
`
`–3–
`
`XLNX-2009
`
`
`
`identical to the second pattern of the landing pads on the inside surface of the
`
`integrated circuit package.
`
`Claim 19 (Proposed substitute for original claim 6): The assembly of claim [[5]]
`
`14, wherein at least one of the interposing structure structures comprises an AC
`
`load structure to match a characteristic impedance includes a layer comprising
`
`epoxy and fiberglass.
`
`Claim 20 (Proposed substitute for original claim 7): The assembly of claim [[5]]
`
`14, wherein at least one of the interposing structure structures comprises a DC load
`
`structure to match a characteristic impedance includes a bypass capacitor.
`
`Claim 21 (Proposed substitute for original claim 8): The assembly of claim [[5]]
`
`14, wherein the first micro-bump is coupled to the first second landing pad at least
`
`in part by a conductor disposed in a corresponding interposing structure selected
`
`from the interposing structure structures, wherein the conductor disposed in the
`
`corresponding interposing structure extends in a direction parallel to the surface of
`
`the integrated circuit.
`
`Claim 22 (Proposed substitute for original claim 9): An assembly, comprising:
`
`an integrated circuit die having an array of micro-bumps disposed on a
`
`surface of the integrated circuit die in a first pattern;
`
`
`
`
`
`–4–
`
`XLNX-2009
`
`
`
`an integrated circuit package having an array of landing pads disposed on an
`
`inside surface of the integrated circuit package in a second pattern and an array of
`
`solder balls disposed on an outside surface of the integrated circuit package,
`
`wherein the first pattern and the second pattern are substantially identical patterns;
`
`and
`
`a plurality of tiled means for electrically coupling the array of landing pads
`
`and the array of solder balls, the plurality of means being disposed inside the
`
`integrated circuit package between the integrated circuit die and the inside surface
`
`of the integrated circuit package;
`
`wherein at least one of the plurality of means for electrically coupling
`
`couples a respective first micro-bump in a first position in the array of micro-
`
`bumps to a respective first landing pad disposed opposite the first position and to a
`
`second landing pad located in a different position in the array of landing pads, the
`
`means being disposed inside the integrated circuit package between the integrated
`
`circuit die and the inside surface of the integrated circuit package.
`
`Claim 23 (Proposed substitute for original claim 10): The assembly of claim [[9]]
`
`22, wherein the plurality of means are held together using an elastomer means is
`
`also for providing a bypass current to the integrated circuit die.
`
`
`
`
`
`–5–
`
`XLNX-2009
`
`
`
`Claim 24 (Proposed substitute for original claim 11): The assembly of claim [[9]]
`
`22, wherein the surface of the integrated circuit die is a major surface of the
`
`integrated circuit die, and wherein the plurality of means has a collective major
`
`surface, and wherein the major surface of the integrated circuit die and the
`
`collective major surface of the plurality of means have roughly identical surface
`
`areas.
`
`Claim 25 (Proposed substitute for original claim 12): The assembly of claim [[9]]
`
`22, wherein at least one of the plurality of means comprises a first conductive layer
`
`corresponding to a first capacitor for a first power supply and a second conductive
`
`layer corresponding to a second capacitor for a second power supply different from
`
`the first power supply has a planar form and is less than 500 microns thick.
`
`Claim 26 (Proposed substitute for original claim 13): The assembly of claim [[9]]
`
`22, wherein at least one of the plurality of means comprises an AC load structure
`
`to match a characteristic impedance the integrated circuit die is an application
`
`specific integrated circuit (ASIC).
`
`
`
`
`
`
`
`–6–
`
`XLNX-2009
`
`