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Displaying 114-126 of 126 results

1004 Exhibit: Ex 1004 US Patent No 5,323,060 Fogal

Document IPR2023-00073, No. 1004 Exhibit - Ex 1004 US Patent No 5,323,060 Fogal (P.T.A.B. Oct. 28, 2022)

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1001 Exhibit: Ex 1001 US Patent No 6,352,879

Document IPR2023-00073, No. 1001 Exhibit - Ex 1001 US Patent No 6,352,879 (P.T.A.B. Oct. 28, 2022)

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1014 Exhibit: Ex 1014 US6100594 File History

Document IPR2023-00073, No. 1014 Exhibit - Ex 1014 US6100594 File History (P.T.A.B. Oct. 28, 2022)

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1002 Exhibit: Ex 1002 Declaration of Jeffrey Suhling

Document IPR2023-00073, No. 1002 Exhibit - Ex 1002 Declaration of Jeffrey Suhling (P.T.A.B. Oct. 28, 2022)

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1023 Exhibit: Ex 1023 Tummala, Ch 16 Package to Board Interconnections

Document IPR2023-00073, No. 1023 Exhibit - Ex 1023 Tummala, Ch 16 Package to Board Interconnections (P.T.A.B. Oct. 28, 2022)

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1031 Exhibit: Ex 1031 US5411921 Negoro

Document IPR2023-00073, No. 1031 Exhibit - Ex 1031 US5411921 Negoro (P.T.A.B. Oct. 28, 2022)

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1015 Exhibit: Ex 1015 JP Unexamined App Pub 1997 121002 Aoki

Document IPR2023-00073, No. 1015 Exhibit - Ex 1015 JP Unexamined App Pub 1997 121002 Aoki (P.T.A.B. Oct. 28, 2022)

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1033 Exhibit: Ex 1033 US5110388 Komiyama

Document IPR2023-00073, No. 1033 Exhibit - Ex 1033 US5110388 Komiyama (P.T.A.B. Oct. 28, 2022)

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1030 Exhibit: Ex 1030 US4688075 Phy

Document IPR2023-00073, No. 1030 Exhibit - Ex 1030 US4688075 Phy (P.T.A.B. Oct. 28, 2022)

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1028 Exhibit: Ex 1028 US5804004 Tuckerman

Document IPR2023-00073, No. 1028 Exhibit - Ex 1028 US5804004 Tuckerman (P.T.A.B. Oct. 28, 2022)

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1006 Exhibit: Ex 1006 US Patent No 5,790,384 Ahmad

Document IPR2023-00073, No. 1006 Exhibit - Ex 1006 US Patent No 5,790,384 Ahmad (P.T.A.B. Oct. 28, 2022)

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1020 Exhibit: Ex 1020 Tummala, Ch 8 Chip to Package Interconnections

Document IPR2023-00073, No. 1020 Exhibit - Ex 1020 Tummala, Ch 8 Chip to Package Interconnections (P.T.A.B. Oct. 28, 2022)

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1017 Exhibit: Ex 1017 Tummala, Ch 1 Microelectronics Packaging An Overview

Document IPR2023-00073, No. 1017 Exhibit - Ex 1017 Tummala, Ch 1 Microelectronics Packaging An Overview (P.T.A.B. Oct. 28, 2022)

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