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Displaying 84-98 of 126 results

1009 Exhibit: Ex 1009 US Patent No 6,682,954 Ma

Document IPR2023-00073, No. 1009 Exhibit - Ex 1009 US Patent No 6,682,954 Ma (P.T.A.B. Oct. 28, 2022)

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1010 Exhibit: Ex 1010 EP0590598A1 Mita

Document IPR2023-00073, No. 1010 Exhibit - Ex 1010 EP0590598A1 Mita (P.T.A.B. Oct. 28, 2022)

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1021 Exhibit: Ex 1021 Tummala, Ch 9 Ceramic Packaging

Document IPR2023-00073, No. 1021 Exhibit - Ex 1021 Tummala, Ch 9 Ceramic Packaging (P.T.A.B. Oct. 28, 2022)

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1007 Exhibit: Ex 1007 US Patent No 4,821,944 Tsumura

Document IPR2023-00073, No. 1007 Exhibit - Ex 1007 US Patent No 4,821,944 Tsumura (P.T.A.B. Oct. 28, 2022)

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1013 Exhibit: Ex 1013 US6229217 File History

Document IPR2023-00073, No. 1013 Exhibit - Ex 1013 US6229217 File History (P.T.A.B. Oct. 28, 2022)

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1008 Exhibit: Ex 1008 US Patent No 6,014,586 Weinberg

Document IPR2023-00073, No. 1008 Exhibit - Ex 1008 US Patent No 6,014,586 Weinberg (P.T.A.B. Oct. 28, 2022)

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1019 Exhibit: Ex 1019 Tummala, Ch 5 Package Reliability

Document IPR2023-00073, No. 1019 Exhibit - Ex 1019 Tummala, Ch 5 Package Reliability (P.T.A.B. Oct. 28, 2022)

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1026 Exhibit: Ex 1026 Al Sarawi, A Review of 3 D Packaging Technology

Document IPR2023-00073, No. 1026 Exhibit - Ex 1026 Al Sarawi, A Review of 3 D Packaging Technology (P.T.A.B. Oct. 28, 2022)

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1029 Exhibit: Ex 1029 Rochat, COB and COC for Low Cost and High Density Packa...

Document IPR2023-00073, No. 1029 Exhibit - Ex 1029 Rochat, COB and COC for Low Cost and High Density Package 1995 (P.T.A.B. Oct. 28, 2022)

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1018 Exhibit: Ex 1018 Tummala, Ch 2 Package Wiring and Terminals

Document IPR2023-00073, No. 1018 Exhibit - Ex 1018 Tummala, Ch 2 Package Wiring and Terminals (P.T.A.B. Oct. 28, 2022)

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1011 Exhibit: Ex 1011 RE38806 File History

Document IPR2023-00073, No. 1011 Exhibit - Ex 1011 RE38806 File History (P.T.A.B. Oct. 28, 2022)

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1003 Exhibit: Ex 1003 International Publication WO 1996 13066 Mostafazadeh

Document IPR2023-00073, No. 1003 Exhibit - Ex 1003 International Publication WO 1996 13066 Mostafazadeh (P.T.A.B. Oct. 28, 2022)

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1027 Exhibit: Ex 1027 Tuckerman, Laminated Memory IEEE 1994

Document IPR2023-00073, No. 1027 Exhibit - Ex 1027 Tuckerman, Laminated Memory IEEE 1994 (P.T.A.B. Oct. 28, 2022)

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1025 Exhibit: Ex 1025 Massenat, High density package, cofired, multi chip module,...

Document IPR2023-00073, No. 1025 Exhibit - Ex 1025 Massenat, High density package, cofired, multi chip module, 3 D, (P.T.A.B. Oct. 28, 2022)

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1032 Exhibit: Ex 1032 US5762744 Shibata

Document IPR2023-00073, No. 1032 Exhibit - Ex 1032 US5762744 Shibata (P.T.A.B. Oct. 28, 2022)

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