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IPR2022-00650, No. 2028 Exhibit - IPR2022 00417 VDW Declaration (P.T.A.B. Apr. 26, 2023)
In my opinion, a person of ordinary skill in the art in the August 2010 timeframe (“POSA”) would have had a Bachelor’s degree in electrical engineering or a similar field, and 1-2 years of experience researching and developing antennas used in RFID applications.
Ayala further confirms a POSA’s knowledge that “wire embedding”—using a single “conductive wire [that] ensures that the electrical and magnetic characteristics are constant and homogenous all along the whole conductive path”—was “a fast, effective and well known manufacturing process” for creating the “complex” multi-coil designs.
I understand (and a POSA would have understood) that this would beneficially ensure that the stamping/embossing process in the embossing areas would not damage or otherwise negatively impact the components (e.g., wiring) of the smart card’s booster antenna, as discussed infra ¶¶ 88-90.
Moreover, I understand (and a POSA would have understood) that forming the inner coils in an upper portion of the card substrate would have provided the result I discuss in ¶ 87 above while avoiding known, adverse effects AmaTech Group Limited Exhibit 2028 Page 51 of 154
A reading of claim 1 in which the upper and lower portions of the card can be identified in a portrait orientation is consistent with the ’250 patent’s specification, which includes no attempt to define the terms “card body,” AmaTech Group Limited Exhibit 2028 Page 61 of 154
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IPR2022-00650, No. 2028 Exhibit - IPR2022 00417 VDW Declaration (P.T.A.B. Apr. 26, 2023)
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