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IPR2023-00073, No. 4 Notice Power of Attorney - Notice Power of Attorney (P.T.A.B. Dec. 23, 2022)
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IPR2023-00073, No. 4 Notice Power of Attorney - Notice Power of Attorney (P.T.A.B. Dec. 23, 2022)
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IPR2023-00073, No. 2 Notice Power of Attorney - Notice Power of Attorney (P.T.A.B. Oct. 28, 2022)
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IPR2023-00073, No. 2 Notice Power of Attorney - Notice Power of Attorney (P.T.A.B. Oct. 28, 2022)
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IPR2023-00073, No. 1 Petition as filed - Petition as filed (P.T.A.B. Oct. 28, 2022)
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IPR2023-00073, No. 1 Petition as filed - Petition as filed (P.T.A.B. Oct. 28, 2022)
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IPR2023-00073, No. 2026 Exhibit - Ex 2026 The Smithsonian Chip Collection (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2026 Exhibit - Ex 2026 The Smithsonian Chip Collection (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2022 Exhibit - Ex 2022 Worldcat Webpage for Materials for Advanced Packaging (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2022 Exhibit - Ex 2022 Worldcat Webpage for Materials for Advanced Packaging (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2021 Exhibit - Ex 2021 SpringerLink Webpage for Materials for Advanced Packaging (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2021 Exhibit - Ex 2021 SpringerLink Webpage for Materials for Advanced Packaging (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2019 Exhibit - Ex 2019 IEEE Xplore Webpage for Triple Chip Stacked CSP Conference Publication (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2019 Exhibit - Ex 2019 IEEE Xplore Webpage for Triple Chip Stacked CSP Conference Publication (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2020 Exhibit - Ex 2020 About Content in IEEE Xplore (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2020 Exhibit - Ex 2020 About Content in IEEE Xplore (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2029 Exhibit - Ex 2029 Declaration of H Lim ISO Patent Owners Opposition to Petitioners Motion to Exclude (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2029 Exhibit - Ex 2029 Declaration of H Lim ISO Patent Owners Opposition to Petitioners Motion to Exclude (P.T.A.B. Jan. 29, 2024)
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IPR2023-00073, No. 2007 Exhibit - Corrected Ex 2007 Eric Bogatin, Ch 12, Multichip Modules MCMs, in Roadmaps of Packaging Technology (P.T.A.B. Oct. 17, 2023)
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IPR2023-00073, No. 2007 Exhibit - Corrected Ex 2007 Eric Bogatin, Ch 12, Multichip Modules MCMs, in Roadmaps of Packaging Technology (P.T.A.B. Oct. 17, 2023)
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IPR2023-00073, No. 2016 Exhibit - Corrected Ex 2016 Katana Silicon Technologies LLC v Western Digital Technologies ED Tex 2021 – Western Digital’s Opening Claim Construction Brief (P.T.A....
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IPR2023-00073, No. 2016 Exhibit - Corrected Ex 2016 Katana Silicon Technologies LLC v Western Digital Technologies ED Tex 2021 – Western Digital’s Opening Claim Construction Brief (P.T.A.B. Oct. 17, 2
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IPR2023-00073, No. 2008 Exhibit - Corrected Ex 2008 Eric Bogatin, Ch 13, Next Generation Technologies, in Roadmaps of Packaging Technology (P.T.A.B. Oct. 17, 2023)
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IPR2023-00073, No. 2008 Exhibit - Corrected Ex 2008 Eric Bogatin, Ch 13, Next Generation Technologies, in Roadmaps of Packaging Technology (P.T.A.B. Oct. 17, 2023)
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IPR2023-00073, No. 2027 Exhibit - Ex 2027 The Smithsonian Media Fact Sheet (P.T.A.B. Sep. 4, 2023)
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IPR2023-00073, No. 2027 Exhibit - Ex 2027 The Smithsonian Media Fact Sheet (P.T.A.B. Sep. 4, 2023)
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IPR2023-00073, No. 2020 Exhibit - Ex 2020 About Content in IEEE Xplore (P.T.A.B. Sep. 4, 2023)
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IPR2023-00073, No. 2020 Exhibit - Ex 2020 About Content in IEEE Xplore (P.T.A.B. Sep. 4, 2023)
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IPR2023-00073, No. 2026 Exhibit - Ex 2026 The Smithsonian Chip Collection (P.T.A.B. Sep. 4, 2023)
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IPR2023-00073, No. 2026 Exhibit - Ex 2026 The Smithsonian Chip Collection (P.T.A.B. Sep. 4, 2023)
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