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Displaying 9-23 of
28 results
11 Reply: Response to Notice of Filing Date
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IPR2014-00114, No. 11 Reply - Response to Notice of Filing Date (P.T.A.B. Nov. 27, 2013)
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12 Reply: Corrected Petition for Inter Partes Review
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IPR2014-00114, No. 12 Reply - Corrected Petition for Inter Partes Review (P.T.A.B. Nov. 27, 2013)
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1 Petition: Petition for Inter Partes Review
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IPR2014-00114, No. 1 Petition - Petition for Inter Partes Review (P.T.A.B. Nov. 1, 2013)
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16 Notice: Ziptronix Patent Owner Updated Mandatory Notices
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IPR2014-00114, No. 16 Notice - Ziptronix Patent Owner Updated Mandatory Notices (P.T.A.B. May. 21, 2014)
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10 Notice: Related Matters
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IPR2014-00114, No. 10 Notice - Related Matters (P.T.A.B. Nov. 21, 2013)
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8 Power of Attorney: Power of Attorney
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IPR2014-00114, No. 8 Power of Attorney - Power of Attorney (P.T.A.B. Nov. 21, 2013)
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9 Power of Attorney: Power of Attorney
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IPR2014-00114, No. 9 Power of Attorney - Power of Attorney (P.T.A.B. Nov. 21, 2013)
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6 Power of Attorney: Power of Attorney
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IPR2014-00114, No. 6 Power of Attorney - Power of Attorney (P.T.A.B. Nov. 1, 2013)
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4 Petition: Certificate of Service
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IPR2014-00114, No. 4 Petition - Certificate of Service (P.T.A.B. Nov. 1, 2013)
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5 Petition: Exhibit List
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IPR2014-00114, No. 5 Petition - Exhibit List (P.T.A.B. Nov. 1, 2013)
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3 Petition: Power of Attorney
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IPR2014-00114, No. 3 Petition - Power of Attorney (P.T.A.B. Nov. 1, 2013)
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1006 Exhibit: TSMC1006 US Patent No 5,561,072 to Saito, Filed November 21, 199...
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IPR2014-00114, No. 1006 Exhibit - TSMC1006 US Patent No 5,561,072 to Saito, Filed November 21, 1994, Issued October 1, 1996 Saito (P.T.A.B. Nov. 1, 2013)
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1001 Exhibit: TSMC1001 US Patent No 6,563,133 B1 to Tong Filed August 9, 2000...
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IPR2014-00114, No. 1001 Exhibit - TSMC1001 US Patent No 6,563,133 B1 to Tong Filed August 9, 2000, Issued May 13, 2003 133 Patent (P.T.A.B. Nov. 1, 2013)
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1005 Exhibit: TSMC1005 US Patent No 6,534,381 to Cheung et al, Filed January 4,...
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IPR2014-00114, No. 1005 Exhibit - TSMC1005 US Patent No 6,534,381 to Cheung et al, Filed January 4, 2000, Issued March 18, 2003 Cheung (P.T.A.B. Nov. 1, 2013)
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1007 Exhibit: TSMC1007 Seiji Fujino et al, Silicon Wafer Direct Bonding through the...
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IPR2014-00114, No. 1007 Exhibit - TSMC1007 Seiji Fujino et al, Silicon Wafer Direct Bonding through the Amorphous Layer, 34 Japanese J Appl Phys 1322 15 October 1995 Fujino (P.T.A.B. Nov...
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