If DRAMs were non-volatile, computers, cell phones and other electronic systems could start up and wake up more quickly, and if Flash memory was faster and did not wear out, it could be used as a device's mass storage.
Also, various different three dimensional (3D) packaging techniques maybe used to inter connect the dice within the hybrid memory device including, for example and without limitation, die-to-die wire bonding, flip-chip-interconnect or wire-bond-interconnect through conductive structures in the package substrate, thru-silicon vias, flex-tape, die-in-substrate encapsulation, direct wafer bonding, proximity interconnect ( e.g., inductively coupled or capacitively coupled interconnects), and so forth.
In alternative embodiments, the total size of the shadowed memory space may be fixed so that only the end-of-overlap or start-of-overlap addresses need be explic itly provided, with the unspecified bound arithmetically determinable.
[0030] It should be noted that the various circuits disclosed herein may be described using computer aided design tools and expressed (or represented), as data and/or instructions embodied in various computer-readable media, in terms of their behavioral, register transfer, logic component, transis- tor, layout geometries, and/or other characteristics.
[0034] While the invention has been described with refer ence to specific embodiments thereof, it will be evident that various modifications and changes may be made thereto with out departing from the broader spirit and scope of the inven tion.