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Reexamination of Patent No. 7,124,927, Flip Chip Bonding Tool and Ball Placement Capillary

90/14,228 | U.S. Patent Application

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Location ELECTRONIC
Filed Nov. 1, 2018
Examiner KRISANNE MARIE JASTRZAB
Class 228
Art Group 3991
Case Type Re-Examination - 228/004500
Status Reexamination Certificate Issued
Original Case 11/107,308 Patented
Parent 10/942,311 Patented
Parent 10/943,151 Patented
Parent 10/650,169 Patented
Parent 10/36,579 Patented
Parent 60/288,203 Expired
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Last Updated: 1 year, 4 months ago
Date # Transaction