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Jie Chen Hsien-Wei Chen Tzuan-Horng Liu Ying-Ju Chen

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Taiwan Semiconductor Manufacturing Co., Ltd.

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MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE

62/552,401 | U.S. Patent Application

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Location ELECTRONIC

Filed Aug. 31, 2017

Case Type Provisional

Status Provisional Application Expired

Child 15/884,328 Patented

Child 17/458,557 Pending

Last Updated: 3 years, 1 month ago

Date	#	Transaction
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MASK ASSEMBLY AND METHOD FOR FABRICATING A CHIP PACKAGE

62/552,401 | U.S. Patent Application

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